PIC18F25K83-I/ML - 8-bit 64MHz MCU 32KB Flash CAN | Microchip
Teilenummer: PIC18F25K83-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.18 | $318,00 |
| 500 | $2.84 | $1.420,00 |
| 1.000 | $2.55 | $2.550,00 |
PIC18F25K83-I/ML Übersicht
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory (Flash), data memory (RAM), and integrated peripherals. Within the broader taxonomy, the PIC18F25K83 is an 8-bit microcontroller in the PIC18 family of microcontrollers within the larger category of microcontrollers (MCUs), which are a subset of embedded processors in the semiconductor hierarchy. Unlike 32-bit MCUs, 8-bit parts like the PIC18F25K83 optimize for low power, deterministic interrupt response, and BOM cost rather than raw computational throughput.
Key features of the PIC18F25K83-I/ML include 32KB Flash program memory (16K x 16 words), 2KB SRAM, 1KB EEPROM, an internal 64 MHz oscillator, and a CAN 2.0B module with dedicated DMA. The 12-bit ADC2 supports up to 24 channels, automatic averaging, oversampling, and threshold-based hardware scanning. Additional CIPs include Complementary Waveform Generators (CWG), Configurable Logic Cells (CLC), Direct Memory Access (DMA), and Zero-Cross Detect (ZCD), all running without CPU intervention.
From an architectural standpoint, the PIC18F25K83 employs a Harvard RISC core with a hardware multiplier, 31-level stack, and vectored interrupt controller. Functional Safety (FuSa) features include a Windowed Watchdog Timer (WWDT), Cyclic Redundancy Check (CRC) with memory scan, hardware limits, and a 16-bit timer with dedicated low-power oscillator for safety-critical loops.
Typical applications include industrial CAN nodes, automotive body controllers, capacitive touch user interfaces, sensor hubs, and low-power IoT edge nodes. The combination of CAN bus, 12-bit ADC2 with CVD, and CIPs makes the PIC18F25K83 well suited for distributed control networks and Human-Machine Interface (HMI) panels.
When designing with this device, allocate sufficient PCB copper area beneath the QFN-28 exposed pad for thermal dissipation and ground reference. Use the MPLAB X IDE with MPLAB Code Configurator (MCC) to leverage the CIP library and reduce firmware development time. Always check the device errata DS80000796 for current silicon revisions before committing to production.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and CIP-driven design notes not found in the manufacturer datasheet alone, giving embedded engineers a single decision-ready reference for selecting and sourcing the PIC18F25K83-I/ML.
Drop-in-Alternativen für PIC18F25K83-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18F25K83-I/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Program Memory (Flash), Communication Peripherals, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18F26K83-I/ML
✅ Drop-In✓ Auf Lager
$2.19 / Stück
Datenblatt ansehen →PIC18F25K83-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F26K83-E/ML
✅ Drop-In✓ Auf Lager
$1.8 / Stück
Datenblatt ansehen →PIC18F25K83T-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F25K83-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC18 (8-bit Harvard RISC) |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| Data SRAM | 2 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| CAN Module | CAN 2.0B with DMA |
| ADC | 12-bit ADC2 (Computation) up to 24 channels |
| ADC Computation Features | CVD, oversampling, averaging, threshold scan |
| Touch Sensing | mTouch CVD via ADC2 |
| DMA Channels | 4 (CIP) |
| Core Independent Peripherals (CIPs) | CLC, CWG, NCO, DSM, ZCD, DMA |
| Timers | 8-bit and 16-bit, WWDT, 16-bit CCP |
| Communication Peripherals | CAN, I2C, SPI, UART/USART (x2) |
| Pins | 28 |
| I/O Pins | 25 |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Gehäuse | QFN-28 (ML) 6x6 mm with exposed pad |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) |
PIC18F25K83-I/ML Pin-Konfiguration
| Pin 1 | RA2 — Bidirectional I/O / analog input |
| Pin 2 | RA3 — Bidirectional I/O / analog input |
| Pin 3 | RA4 — Bidirectional I/O / analog input |
| Pin 4 | RA5 — Bidirectional I/O / analog input |
| Pin 5 | RA6 — Bidirectional I/O |
| Pin 6 | RA7 — Bidirectional I/O |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RB0 — Bidirectional I/O / interrupt-on-change |
| Pin 9 | RB1 — Bidirectional I/O / interrupt-on-change |
| Pin 10 | RB2 — Bidirectional I/O / interrupt-on-change |
| Pin 11 | RB3 — Bidirectional I/O / interrupt-on-change |
| Pin 12 | RB4 — Bidirectional I/O / interrupt-on-change |
| Pin 13 | RB5 — Bidirectional I/O / interrupt-on-change |
| Pin 14 | RB6 — Bidirectional I/O / ICSCLK |
| Pin 15 | RB7 — Bidirectional I/O / ICSIO |
| Pin 16 | AVDD — Analog supply |
| Pin 17 | AVSS — Analog ground |
| Pin 18 | RC0 — Bidirectional I/O / analog input |
| Pin 19 | RC1 — Bidirectional I/O / analog input |
| Pin 20 | RC2 — Bidirectional I/O / analog input |
| Pin 21 | RC3 — Bidirectional I/O / analog input |
| Pin 22 | RC4 — Bidirectional I/O |
| Pin 23 | RC5 — Bidirectional I/O |
| Pin 24 | RC6 — Bidirectional I/O |
| Pin 25 | RC7 — Bidirectional I/O |
| Pin 26 | RA0 — Bidirectional I/O / analog input |
| Pin 27 | RA1 — Bidirectional I/O / analog input |
| Pin 28 | VDD — Digital supply |
Typische Anwendungen
PIC18F25K83-I/ML ist geeignet für 6 Anwendungs: Industrial CAN Node, Capacitive Touch HMI Panel, Automotive Body Controller, Sensor Hub with Local Processing, Low-Power IoT Edge Node, Functional Safety Subsystem.
Industrial CAN Node
The PIC18F25K83-I/ML is purpose-built for distributed industrial CAN nodes thanks to its integrated CAN 2.0B controller with dedicated DMA, XLP low-power technology, and 12-bit ADC2. According to the Microchip family datasheet, the DMA offloads message buffering from the CPU, while the 32 KB Flash comfortably fits a CANopen or J1939 stack. The 28-pin QFN package keeps the BOM footprint under 1 square inch, ideal for DIN-rail sensor modules. Designers benefit from CRC, WWDT, and 64 MHz CPU speed for real-time control loops.
Empfohlen
Capacitive Touch HMI Panel
The PIC18F25K83-I/ML's 12-bit ADC2 with Computation (CVD) automates Capacitive Voltage Divider touch sensing, eliminating firmware overhead for button, slider, and proximity sensing. According to the family datasheet, the ADC2 supports up to 24 channels with automatic averaging and threshold scanning. Combined with CLC and CWG Core Independent Peripherals, the MCU can drive PWM buzzer feedback while scanning touch electrodes in the background. The QFN-28 package fits inside slim HMI bezels and the -40C to +85C rating supports appliance front panels.
Empfohlen
Automotive Body Controller
The PIC18F25K83-I/ML serves as a low-cost body and lighting controller where CAN bus networking, PWM motor control, and ADC monitoring are required. According to the family datasheet, the CWG module generates complementary PWM with dead-band control for H-bridge drivers, while DMA streams sensor data without CPU intervention. For harsher environments, the -E/ML extended temperature variant in the same QFN-28 footprint provides -40C to +125C operation. The CIP set reduces external components, which is critical for space-constrained body modules.
Empfohlen
Sensor Hub with Local Processing
The PIC18F25K83-I/ML acts as a sensor hub, aggregating multiple analog and digital sensors over I2C, SPI, and UART while locally processing data through DMA and CLC peripherals. According to the Microchip family datasheet, the 24 ADC channels and 12-bit resolution support high-accuracy measurements, while the 64 MHz CPU enables on-chip filtering and threshold detection. The XLP low-power modes (down to sub-microamp sleep) extend battery life in wireless sensor transmitters. The QFN-28 package allows placement directly on the sensor PCB.
Empfohlen
Low-Power IoT Edge Node
The PIC18F25K83-I/ML's XLP eXtreme Low Power technology enables battery-powered IoT edge nodes that spend most of their time in sleep modes drawing nanoamp-level currents. According to the family datasheet, the integrated 16-bit timer with dedicated low-power oscillator keeps accurate timing during sleep, while DMA and CIPs wake the CPU only for meaningful events. The 32 KB Flash fits TLS-lite or LoRaWAN stacks when paired with a companion radio, and the QFN-28 footprint supports coin-cell powered wearable sensor platforms.
Empfohlen
Functional Safety Subsystem
The PIC18F25K83-I/ML is engineered for Functional Safety (FuSa) subsystems where the PIC18 K83 family includes hardware safety features described in the manufacturer datasheet. According to Microchip's family documentation, the device integrates a Windowed Watchdog Timer (WWDT), CRC with memory scan, hardware Fault limits, and a 16-bit timer with low-power oscillator for safety-critical loops. Combined with self-test libraries, the MCU supports safety element out of context (SEooC) designs at SIL 1/SIL 2 levels.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18F25K83-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18F26K83-I/ML | PIC18F25K83-E/ML | PIC18F26K83-E/ML | PIC18F25K83T-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (ML) 6x6 | QFN-28 (ML) 6x6 - same | QFN-28 (ML) 6x6 - same | QFN-28 (ML) 6x6 - same | QFN-28 (ML) 6x6 - same |
| Program Memory (Flash) | 32 KB | 64 KB (+100%) | 32 KB (same) | 64 KB (+100%) | 32 KB (same) |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| CAN Module | CAN 2.0B with DMA | CAN 2.0B with DMA | CAN 2.0B with DMA | CAN 2.0B with DMA | CAN 2.0B with DMA |
| ADC | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels | 12-bit ADC2, 24 channels |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- CAN 2.0B with dedicated DMA offloads message buffering from CPU (vs. PIC18F46K83)
- 12-bit ADC2 with CVD automates capacitive touch sensing in hardware (vs. PIC18F25K22)
- Core Independent Peripherals (CIPs) run without CPU intervention (vs. PIC16F1829T-I/SO)
Designhinweise
Estimated: The PIC18F25K83-I/ML QFN-28 package dissipates up to ~1 W under worst-case 64 MHz core activity at 5.5 V. The exposed thermal pad (EP, pin 29) MUST be soldered to a copper pour of at least 1 square inch on the PCB top layer to keep junction temperature below 125 C. Without this thermal pad connection, internal die temperatures may exceed ratings in continuous full-speed operation. Use multiple thermal vias in the EP land pattern for optimal heat transfer.
Decouple the AVDD (pin 16) and VDD (pin 28) pins with separate 100 nF X7R ceramic capacitors placed within 3 mm of each pin. Add a bulk 4.7 uF or 10 uF capacitor near the VDD pin. According to the family datasheet, the ADC2 accuracy is sensitive to analog supply noise - place a small ferrite bead or 10 ohm resistor between VDD and AVDD to isolate the analog rail from digital switching noise when high-precision measurements are required.
Route the CAN bus differential pair (CANTX/CANRX) with 100-ohm differential impedance, matched lengths within 5 mm, and keep the traces away from switching signals. According to the family datasheet, place the MCP2562FD or similar CAN transceiver within 25 mm of the MCU CAN pins to minimize reflections. For ICSP debugging, expose the ICSCLK (RB6), ICSIO (RB7), and MCLR pins on a 0.1 inch header footprint to enable in-circuit programming without desoldering.
The PIC18F25K83-I/ML is a drop-in replacement for the PIC18F26K83-I/ML only if firmware fits in 32 KB Flash. Do not assume the migration PIC18FXXK80 to PIC18FXXK83 is transparent - the CIP peripheral set differs significantly and the ADC has been upgraded to ADC2. Always review Microchip errata DS80000796 before committing to production silicon revisions and verify the CRC/WWDT configuration registers match the Functional Safety requirements of your application.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive safety applications, evaluate PIC18F25K83-E/ML extended temperature variant and review errata DS80000796.
