PIC18F26K80-I/MM - 64KB Flash 8-bit MCU w/ ECAN | Microchip
Teilenummer: PIC18F26K80-I/MM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.36 | $4,36 |
| 10 | $3.93 | $39,30 |
| 100 | $3.52 | $352,00 |
| 500 | $3.18 | $1.590,00 |
| 1.000 | $2.86 | $2.860,00 |
PIC18F26K80-I/MM Übersicht
A PIC (Peripheral Interface Controller) is a family of 8-bit microcontrollers built on Harvard architecture, with separate program and data buses. The PIC18F family is the high-performance tier, offering C-friendly instruction set, hardware multiplier, and linear addressing up to 2MB. The PIC18F26K80 specifically adds integrated CAN (Controller Area Network) hardware, eliminating the need for an external CAN controller and making it well suited for in-vehicle networks and industrial automation backbones.
Key differentiating features of this part include its nanoWatt XLP sleep current that extends battery life in always-on applications, hardware ECAN with DMA, and an integrated 12-bit ADC with acquisition timer. It also includes multiple serial interfaces (SPI, I2C, USART with LIN), two analog comparators, and a charge time measurement unit (CTMU) for capacitive touch or precise timing measurements.
The architecture uses a modified Harvard core with a 16-bit instruction word and 8-bit data path, a hardware 8x8 multiplier, and prioritized interrupt handling. The flash program memory supports self-programming in-circuit, allowing field firmware updates without chip removal. ECAN hardware conforms to CAN 2.0B active specification with masking and filtering.
Typical applications include automotive body and chassis ECAN nodes, building automation and HVAC control, industrial sensor networks, low-power remote battery-powered telemetry, and CAN-based lighting control. Its wide voltage range and ECAN make it especially compelling for 12V automotive and 24V industrial environments where a single IC handles both compute and bus termination.
When designing with this MCU, ensure the exposed pad is soldered to a sufficient copper pour to meet thermal and electrical ground requirements. For ECAN nodes, use a CAN transceiver such as the MCP2561/MCP2562 and verify bus termination per ISO 11898. Programming is supported via MPLAB X IDE and ICD3/PICKit 4 debuggers.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design notes not typically assembled in the manufacturer datasheet, helping engineers select and source the PIC18F26K80-I/MM with confidence.
Drop-in-Alternativen für PIC18F26K80-I/MM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18F26K80-I/MM (gleiche Bauform und Footprint) – abweichend in Package, Timers, Operating Temperature, ADC, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18F25K80-I/MM
✅ Drop-In✓ Auf Lager
$2.89 / Stück
Datenblatt ansehen →PIC18F26K80-E/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F26K80-H/MM
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →PIC18F25K80T-I/SS
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.46 / Stück
Datenblatt ansehen →PIC18F26K80-I/MM Grenzwerte & elektrische Eigenschaften
| Core | PIC18 (8-bit Harvard) |
| Program Memory Size | 64 KB (32K x 16) |
| RAM Size | 3.6 KB (3648 bytes) |
| EEPROM Size | 1024 bytes |
| Maximum CPU Frequency | 64 MHz |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Number of I/O Pins | 24 |
| Gehäuse | 28-VQFN Exposed Pad (6x6 mm) |
| ADC | 12-bit, up to 11 channels |
| CAN | ECAN 2.0B active integrated |
| Timers | 8-/16-bit, multiple CCP/ECCP |
| Communication | SPI, I2C, EUSART (LIN) |
| Betriebstemperaturbereich | -40 C to +85 C (Industrial, "I") |
| Low-Power Mode | nanoWatt XLP |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC18F26K80-I/MM Pin-Konfiguration
| Pin 1 | RA0 — PORTA0 / analog AN0 |
| Pin 2 | RA1 — PORTA1 / analog AN1 |
| Pin 3 | RA2 — PORTA2 / analog AN2 |
| Pin 4 | RA3 — PORTA3 / analog AN3 / VREF+ |
| Pin 5 | RA4 — PORTA4 / analog AN4 |
| Pin 6 | RA5 — PORTA5 / analog AN5 / VREF- |
| Pin 7 | RA6 — PORTA6 / OSC2 |
| Pin 8 | RA7 — PORTA7 / OSC1 |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive supply voltage |
| Pin 11 | RB0 — PORTB0 / interrupt-on-change |
| Pin 12 | RB1 — PORTB1 / interrupt-on-change |
| Pin 13 | RB2 — PORTB2 / interrupt-on-change |
| Pin 14 | RB3 — PORTB3 / interrupt-on-change |
| Pin 15 | RB4 — PORTB4 / interrupt-on-change |
| Pin 16 | RB5 — PORTB5 / interrupt-on-change / PG |
| Pin 17 | RB6 — PORTB6 / PGC (ICSP clock) |
| Pin 18 | RB7 — PORTB7 / PGD (ICSP data) |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage |
| Pin 21 | RC0 — PORTC0 |
| Pin 22 | RC1 — PORTC1 |
| Pin 23 | RC2 — PORTC2 |
| Pin 24 | RC3 — PORTC3 / SCL |
| Pin 25 | RC4 — PORTC4 / SDA |
| Pin 26 | RC5 — PORTC5 |
| Pin 27 | RC6 — PORTC6 / TX |
| Pin 28 | RC7 — PORTC7 / RX |
Typische Anwendungen
PIC18F26K80-I/MM ist geeignet für 6 Anwendungs: Automotive ECAN Body Control Module, Building Automation and HVAC Control, Battery-Powered Remote Telemetry, CAN-Based Industrial Lighting Control, Low-Cost ECAN Sensor Nodes, Portable Medical Monitoring Devices.
Automotive ECAN Body Control Module
The PIC18F26K80-I/MM fits automotive body-control ECAN nodes thanks to its integrated ECAN 2.0B controller with acceptance filtering and DMA support, removing the need for an external CAN controller. The 64 KB Flash and 3.6 KB RAM are sufficient for typical BCM task schedules with LIN sub-bus control, while the 1.8 V to 5.5 V supply range tolerates direct 12 V automotive rail regulation. The -40 C to +85 C industrial range covers cabin ECUs; for under-hood ECUs consider the PIC18F26K80-E/MM extended-temperature variant instead.
Empfohlen
Building Automation and HVAC Control
In BACnet or Modbus gateway nodes, the PIC18F26K80-I/MM provides 64 MHz performance and a 12-bit ADC for sensor interfaces such as NTC thermistors, duct pressure transducers, and humidity probes. The ECAN peripheral supports daisy-chained industrial sensor networks common in HVAC plant rooms, while the nanoWatt XLP mode allows battery-backed smoke or CO2 detectors to run for years on a single cell. Its 24 GPIO lines also drive triacs, relays, and LED indicators without external I/O expanders.
Empfohlen
Battery-Powered Remote Telemetry
The nanoWatt XLP technology in the PIC18F26K80-I/MM delivers typical sleep currents in the sub-microamp range, making it suitable for remote telemetry units powered by 2 x AA cells or LiSOCl2 batteries. The integrated 12-bit ADC samples environmental sensors while the EUSART and SPI ports link to LoRa or sub-GHz radio modules; ECAN supports inter-device coordination over industrial backbone wiring. Self-programming Flash also enables secure over-the-air firmware updates when the radio link is available.
Empfohlen
CAN-Based Industrial Lighting Control
DMX512 alternatives and architectural lighting control increasingly use CAN for noise immunity and addressable node counts. The PIC18F26K80-I/MM handles DMX-to-CAN bridging, PWM dimming via its ECCP modules (up to 10-bit resolution), and per-channel current monitoring through the 12-bit ADC. Its small 6x6 mm QFN package and exposed pad provide adequate thermal dissipation at 64 MHz, while the 24 I/O can drive 16 LED driver channels directly via shift registers.
Empfohlen
Low-Cost ECAN Sensor Nodes
For industrial sensor aggregation over CANopen or DeviceNet, the PIC18F26K80-I/MM combines the bus interface, ADC, and digital I/O in one chip, reducing BOM cost versus multi-chip solutions. Its hardware ECAN DMA offloads message handling from the CPU, leaving cycles for sensor conditioning and CTMU-based capacitive touch or proximity sensing. The wide 1.8 V to 5.5 V supply supports direct connection to 24 V industrial rails with simple zener regulation.
Empfohlen
Portable Medical Monitoring Devices
Battery-powered portable medical monitors benefit from the PIC18F26K80-I/MM's nanoWatt XLP sleep current, 12-bit ADC for biosignal sampling, and EUSART for wired data transfer to a host display. The wide operating voltage (1.8 V to 5.5 V) accommodates single-cell Li-ion power with no additional regulator, and the QFN-28 package allows compact PCB layouts. ECAN support enables multi-parameter bedside monitor interconnection in clinical environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18F26K80-I/MM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18F25K80-I/MM | PIC18F26K80-E/MM | PIC18F26K80-H/MM | PIC18F25K80T-I/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN Exposed Pad (6x6 mm) | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same | 28-VQFN Exposed Pad (6x6 mm) - same | 28-SSOP (different footprint) |
| Flash Program Memory | 64 KB | 32 KB (-50%) | 64 KB (same) | 64 KB (same) | 32 KB (-50%) |
| RAM | 3.6 KB | 3.6 KB (same) | 3.6 KB (same) | 3.6 KB (same) | 3.6 KB (same) |
| Maximum CPU Frequency | 64 MHz | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (same) | -40 C to +125 C (Extended) | -40 C to +150 C (High) | -40 C to +85 C (same) |
| Hardware ECAN | Yes (ECAN 2.0B active) | Yes (ECAN 2.0B active) | Yes (same) | Yes (same) | Yes (same) |
Wichtigste Unterscheidungsmerkmale
- Same die in same package, with double the Flash (vs. PIC18F25K80-I/MM)
- Industrial temperature in MM package (vs. PIC18F26K80-E/MM)
- nanoWatt XLP extreme low-power sleep (vs. PIC18F26K80-E/MM)
Designhinweise
The 28-VQFN exposed pad is the primary thermal path. A minimum of 25 mm^2 of 1 oz copper pour connected to the EP must be provided on the PCB; without it, junction temperature rise may exceed Microchip's recommended limits at full 64 MHz operation. Stitching vias under the pad to the ground plane further reduces thermal resistance and improves electrical grounding for ADC accuracy.
Place a 100 nF decoupling capacitor within 3 mm of each VDD pin (pins 10 and 20), plus a bulk 10 uF tantalum or ceramic capacitor at the MCU power entry. For ADC accuracy, isolate analog VREF traces from switching digital lines and add a small ferrite bead on AVDD when using the internal voltage reference. Keep ECAN TX/RX traces short and matched to within a few millimetres.
Do not confuse the "I/MM" (industrial temperature, MM package) suffix with the "E/MM" (extended temperature) or "H/MM" (high temperature) variants when ordering; the temperature grade dramatically affects qualification. When migrating from PIC18F25K80 designs, verify the firmware size since Flash drops from 64 KB to 32 KB on the 25K80. ICSP programming requires RB6/RB7 to be free of components that load the lines.
Compliance-Informationen
RoHS and lead-free compliant per Microchip product page and DigiKey listing. AEC-Q100 qualification is not_applicable for this industrial-grade part; the PIC18F26K80-E/MM extended-temperature variant is recommended for AEC-Q100 use cases.
