PIC18F26K80-H/MM - 64KB Flash 8-bit MCU with ECAN, 28-QFN | Microchip
MPN: PIC18F26K80-H/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.92 | $5.92 |
| 10 | $5.45 | $54.50 |
| 100 | $4.98 | $498.00 |
| 500 | $4.52 | $2,260.00 |
| 1,000 | $4.1 | $4,100.00 |
PIC18F26K80-H/MM Overview
An 8-bit microcontroller (MCU) is a single-chip computer containing a CPU, program memory (Flash/ROM), data memory (RAM), and programmable peripherals in one package. The PIC18F family sits within Microchip's 8-bit XLP (eXtreme Low Power) portfolio, itself a branch of the broader microcontroller taxonomy (MCU -> microcontroller -> embedded controller -> semiconductor). PIC18F devices target automotive, industrial, and consumer applications that need deterministic interrupt latency, CAN connectivity, and low sleep current below 100 nA in some modes.
Key features of the PIC18F26K80-H/MM include the integrated ECAN module supporting CAN 2.0B active/passive, an on-chip 12-bit ADC with up to 11 channels and CTMU support, multiple PWM and capture/compare modules, an internal 16MHz oscillator with PLL to 64MHz, and nanoWatt XLP technology for sleep currents under 100 nA. A 64-pin variant extends I/O count, but this 28-QFN-S version retains 24 I/O pins - sufficient for most sensor and actuator nodes.
Architecturally the device uses an enhanced Harvard bus with separate program Flash (64KB) and data EEPROM (1KB), a hardware multiplier, and a 32-level stack. The ECAN peripheral implements the full CAN 2.0B specification including bus diagnostic features, making the chip suitable for in-vehicle networks such as body controllers, lighting modules, and HVAC systems.
Typical applications include automotive ECAN body control, CAN node endpoints in industrial sensor networks, building automation (HVAC, lighting control), 12-bit data acquisition with USB/CAN bridging, and low-power remote sensor nodes. The wide 1.8V to 5.5V supply range lets a single part run from a 3.3V regulated rail or directly from a 5V automotive bus.
When designing, place decoupling capacitors (100nF + 10uF) within 5mm of each VDD pin, tie MCLR through a 10k pull-up, and ensure the exposed pad is soldered to a continuous ground plane for thermal dissipation. Use Microchip's MPLAB X IDE with the XC8 compiler and the PIC18F-K80 device pack for firmware development.
This page synthesizes Microchip datasheet specifications, real-time distributor pricing, and same-family alternatives - information not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for PIC18F26K80-H/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F26K80-H/MM (same form factor and footprint) — differing in ADC, Package, Timers, Program Memory (Flash), CTMU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F26K80-H/MM
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →PIC18F26K80-I/MM
✅ Drop-In✓ In Stock
$2.86 / Unit
View Datasheet →PIC18F26K80-E/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25K80-I/MM
✅ Drop-In✓ In Stock
$1.8 / Unit
View Datasheet →PIC18F26K80-H/MM Maximum Ratings & Electrical Characteristics
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM Size | 3.6 KB (3.6K x 8) |
| EEPROM Size | 1 KB |
| CPU Core | PIC18 (8-bit Harvard) |
| Maximum CPU Frequency | 64 MHz (16 MIPS) |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Operating Temperature Range | -40 C to +150 C (H-grade, extended) |
| Number of I/O Pins | 24 |
| Package | 28-pin QFN-S (6 x 6 mm) with exposed pad |
| Oscillator | Internal 16 MHz with 4x PLL to 64 MHz |
| ADC | 12-bit, up to 11 channels, CTMU support |
| CAN Interface | ECAN 2.0B active/passive |
| PWM Modules | Multiple CCP/ECCP |
| Timers | 8-bit and 16-bit timers |
| Communication Interfaces | ECAN, I2C, SPI, UART, LIN |
| XLP Sleep Current | Sub-100 nA (nanoWatt XLP) |
| AEC-Q100 Qualification | Qualified (H temperature grade) |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
| Mounting Type | Surface Mount (QFN) |
PIC18F26K80-H/MM Pin Configuration
| Pin 1 | RA2 — Port A bit 2 / analog input |
| Pin 2 | RA3 — Port A bit 3 / analog input |
| Pin 3 | RA4 — Port A bit 4 / analog input |
| Pin 4 | RA5 — Port A bit 5 / analog input |
| Pin 5 | VSS — Ground |
| Pin 6 | RA7 — Port A bit 7 / oscillator input |
| Pin 7 | RA6 — Port A bit 6 / oscillator output |
| Pin 8 | RC1 — Port C bit 1 / PWM output |
| Pin 9 | RC2 — Port C bit 2 / PWM output |
| Pin 10 | RC3 — Port C bit 3 / SPI clock |
| Pin 11 | RC4 — Port C bit 4 / SPI data |
| Pin 12 | RC5 — Port C bit 5 / analog input |
| Pin 13 | RC6 — Port C bit 6 / UART TX |
| Pin 14 | RC7 — Port C bit 7 / UART RX |
| Pin 15 | VSS — Ground (second VSS pin) |
| Pin 16 | VDD — Positive supply voltage |
| Pin 17 | RB0 — Port B bit 0 / interrupt-on-change |
| Pin 18 | RB1 — Port B bit 1 / analog input |
| Pin 19 | RB2 — Port B bit 2 / analog input |
| Pin 20 | RB3 — Port B bit 3 / analog input |
| Pin 21 | RB4 — Port B bit 4 / analog input |
| Pin 22 | RB5 — Port B bit 5 / analog input |
| Pin 23 | RB6 — Port B bit 6 / ICSP clock |
| Pin 24 | RB7 — Port B bit 7 / ICSP data |
| Pin 25 | MCLR — Master Clear reset (active low) |
| Pin 26 | RC0 — Port C bit 0 / analog input |
| Pin 27 | RA1 — Port A bit 1 / analog input |
| Pin 28 | RA0 — Port A bit 0 / analog input |
Typical Applications
PIC18F26K80-H/MM is suitable for 7 applications: Automotive ECAN Body Control Module, Industrial CAN Sensor Node, Building Automation HVAC Controller, Automotive Lighting Control Module, 12-bit Data Acquisition System, Low-Power Remote Sensor Node, LIN/CAN Gateway Bridge.
Automotive ECAN Body Control Module
The PIC18F26K80-H/MM is ideal for automotive body control modules that require CAN 2.0B connectivity and AEC-Q100 high-temperature reliability. With its integrated ECAN peripheral handling arbitration and error detection in hardware, the MCU offloads bit-stuffing from software so the 16-MIPS core can run lighting, door-lock, and HVAC actuator logic. The H-grade -40 C to +150 C range covers under-hood and dashboard environments, and the 1.8V-5.5V supply lets it run from a 12V automotive bus through a small LDO. Pair with an MCP2561 or TJA1050 CAN transceiver to complete the node.
Recommended
Industrial CAN Sensor Node
For industrial sensor nodes on a CAN bus, the PIC18F26K80-H/MM delivers 64 KB Flash, 3.6 KB RAM, and a 12-bit ADC - sufficient for periodic transducer reads with calibration tables and DSP-style filtering. The nanoWatt XLP sleep mode (sub-100 nA) lets battery-powered nodes run for years between charges. The 24 I/O pins accept multiple digital inputs (limit switches, encoders) plus analog channels for temperature, pressure, and 4-20 mA loop sensing. The integrated ECAN peripheral streams sensor data onto the bus at 125 kbps to 1 Mbps.
Recommended
Building Automation HVAC Controller
The PIC18F26K80-H/MM fits building-automation HVAC controllers that combine CAN bus connectivity with mixed-signal I/O. The 12-bit ADC (up to 11 inputs) handles thermistor and humidity-sensor reads, the CCP/ECCP modules drive TRIAC phases for fan-speed control, and the ECAN peripheral ties the unit to a centralized building-management system. Running from a 24VAC-derived 5V rail, the 1.8-5.5V supply range simplifies power design. The 64 KB Flash stores scheduling, PID, and fault-logging firmware without external memory.
Recommended
Automotive Lighting Control Module
In automotive lighting modules (headlamp leveling, adaptive driving beam, interior RGB-LED controllers), the PIC18F26K80-H/MM's 16 MIPS performance and 24 I/O pins drive multiple PWM channels for LED current control while the ECAN peripheral receives commands from the body controller. AEC-Q100 H-grade qualification and -40 C to +150 C operation support under-hood and headlamp mounting. The 3.6 KB RAM handles LIN/CAN message buffers and LED-fade state machines without external memory.
Recommended
12-bit Data Acquisition System
For 12-bit data-acquisition systems the PIC18F26K80-H/MM combines an internal 12-bit ADC (up to 11 channels), CTMU for capacitance touch or time-of-flight sensing, and 64 KB Flash for calibration tables. Sample rates up to 100 ksps are achievable with DMA-style sequencing via the ADC's auto-conversion mode. ECAN or UART can stream data to a host, while 24 I/O pins handle trigger inputs and digital control. The wide supply range lets the board run from USB-derived 5V or a battery.
Recommended
Low-Power Remote Sensor Node
The PIC18F26K80-H/MM's nanoWatt XLP technology drops sleep current below 100 nA with RTCC and WDT active, enabling years of battery life on a single CR2032 cell when duty-cycled. Wake on interrupt from Timer1 (1 Hz from 32.768 kHz crystal) reads a sensor, transmits via ECAN or UART, then returns to sleep. The 64 KB Flash holds LoRa-style driver stacks or application firmware, while 3.6 KB RAM buffers sensor readings. The H-grade -40 to +150 C tolerance suits outdoor and industrial deployments.
Recommended
LIN/CAN Gateway Bridge
A LIN/CAN gateway needs an MCU with both peripherals - the PIC18F26K80-H/MM integrates ECAN and a UART-based LIN master/slave capability, plus 64 KB Flash and 3.6 KB RAM for protocol translation tables. Hardware ECAN offloads bus timing so the CPU handles only message routing. The 28-QFN-S small footprint suits distributed gateway modules mounted near body-control harnesses, and the H-grade AEC-Q100 qualification supports automotive deployment.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F26K80-H/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F26K80-I/MM | PIC18F26K80-E/MM | PIC18F25K80-I/MM |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) |
| Flash Memory | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 2 KB (-44%) |
| Max CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| ECAN 2.0B Support | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +150 C (H) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +85 C (I) |
| AEC-Q100 Qualified | Yes (H-grade) | No (industrial) | Yes (E-grade) | No (industrial) |
| I/O Pins | 24 | 24 | 24 | 24 |
Key Differentiators
- Highest temperature grade in the K80 QFN family (vs PIC18F26K80-I/MM)
- Full 64 KB Flash for firmware-heavy designs (vs PIC18F25K80-I/MM)
- AEC-Q100 H-grade qualification (vs PIC18F26K80-E/MM)
Design Notes
The PIC18F26K80-H/MM operates from 1.8 V to 5.5 V and requires both VDD pins (16 and the exposed pad) to be decoupled with a 100 nF ceramic plus a bulk 10 uF capacitor within 5 mm of the package. The exposed thermal pad must be soldered to a continuous ground plane on the PCB for thermal dissipation and electrical ground - missing the pad connection can cause thermal stress and erratic behavior at high temperature.
MCLR must be tied to VDD through a 10 kohm pull-up resistor for normal operation; leaving MCLR floating causes intermittent resets. For in-circuit serial programming (ICSP), place a resistor-capacitor network on MCLR that allows the programmer to drive the line low without fighting the pull-up. Use Microchip's recommended 4.7 kohm series resistor between RB6/RB7 ICSP lines to allow in-circuit debug without removing the part.
Estimated: at 64 MHz, VDD = 5.0 V, the PIC18F26K80-H/MM core draws approximately 15 mA active, dissipating ~75 mW. In the 28-QFN-S (6 x 6 mm) package with a properly soldered exposed pad, thermal resistance theta_JA is roughly 30 C/W, giving a 2.3 C rise above ambient - well within the +150 C H-grade limit. If the exposed pad is NOT soldered, theta_JA may exceed 80 C/W and the part will overheat at sustained active operation.
Route the ECAN bus traces (CANTX/CANRX on RC6/RC7 area) as a short differential pair with 120 ohm characteristic impedance. Keep bus traces away from clock lines and add TVS diodes such as PESD1CAN for ESD protection. Place the CAN transceiver (MCP2561 or TJA1050) within 50 mm of the MCU CAN pins to minimize stub length. The exposed thermal pad's ground plane should extend continuously under the CAN bus area for a low-impedance return path.
Compliance Information
AEC-Q100 qualified per the H temperature suffix. RoHS compliant per Microchip product declaration. Lead-free and halogen-free per Microchip environmental compliance data.
