Microchip Technology

PIC18F65K40-E/MR - 8-Bit 64MHz 32KB Flash MCU | Microchip

Teilenummer: PIC18F65K40-E/MR ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.3 V to 5.5 V Vdss 64-pin VQFN 9x9 mm (MR) Package 64 MHz Speed 32 KB (16K x 16 words) Memory
Ab $2.32 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-27
Mengenpreise
Menge Stückpreis Gesamt
1 $4.18 $4,18
10 $3.78 $37,80
100 $3.21 $321,00
500 $2.74 $1.370,00
1.000 $2.32 $2.320,00
ℹ️ Alle Preise sind in USD

PIC18F65K40-E/MR Übersicht

The Microchip Technology PIC18F65K40-E/MR is an 8-bit PIC18 XLP microcontroller with a 64MHz CPU, 32KB Flash program memory, 2KB RAM, and 1KB EEPROM, packaged in a 64-pin 9x9mm VQFN (MR) surface-mount module. Operating across 2.3V to 5.5V with extended-temperature -40C to +125C support, it combines Core Independent Peripherals (CIPs) such as CWG, WWDT, CRC/SCAN, hardware limit timer, and zero-cross detect with XLP ultra-low-power sleep currents for battery-aware designs.

An 8-bit microcontroller (MCU) is a single-chip processor with an 8-bit data path, on-chip program and data memory, and integrated peripherals intended for embedded control. Within the broader taxonomy, the PIC18F65K40 sits as: MCU -> 8-bit MCU -> PIC18 family -> XLP low-power series -> enhanced mid-range core -> Microchip semiconductor. 8-bit PIC18 devices bridge simple PIC10/12/16 parts and 16-bit dsPIC/PIC24 devices, offering richer peripherals and more code space while retaining the deterministic interrupt model and single-instruction C-compiler friendliness that PIC users expect.

Key features include 64MHz internal oscillator, 32KB self-programmable Flash, 2KB SRAM, 1KB EEPROM, up to 45 I/O pins, 10-bit ADC with computation (ADC2), 5-bit DAC, 8-bit DAC, multiple UART/SPI/I2C, 16-bit PWM, and configurable logic cell (CLC). The eXtreme Low Power (XLP) technology delivers sub-uA sleep currents, while the 5V-tolerant I/O simplifies industrial sensor front ends.

The PIC18F65K40 uses Microchip's enhanced mid-range 8-bit core with a hardware multiplier, 31-level stack, and a 16-bit instruction word. This gives C-compiler code density competitive with 16-bit MCUs while keeping interrupt latency deterministic, suitable for hard-real-time loops like motor commutation or sensor sampling.

Typical applications include industrial sensor conditioning, building automation controllers, low-power IoT edge nodes, USB-to-UART bridges, small appliance control, and general-purpose 5V embedded control. The extended -40C to +125C operating range and high-pin-count VQFN package suit harsh industrial and automotive under-hood environments where the Q-prefix AEC-Q100 part is not required.

When designing with this device, budget sufficient PCB copper under the 9x9mm VQFN thermal pad to keep junction temperature within limits; the pad must be soldered for both thermal and electrical ground. Always configure unused pins as outputs (not inputs) to avoid current paths via internal ESD structures.

This page consolidates real distributor pricing, drop-in alternatives, application notes, and design considerations not duplicated in any single manufacturer page.

Drop-in-Alternativen für PIC18F65K40-E/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18F65K40-E/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Core Independent Peripherals, DAC.

Microchip Technology
Package: 64-pin VQFN (9x9 mm, exposed pad)
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 64-VQFN (9x9 mm)
Core Architecture: 8-bit PIC18 enhanced Harvard
Microchip Technology
Package: 64-pin VQFN (9 x 9 mm)
ADC: 10-bit ADC with Computation (ADCC), up to 30 channels
Core Architecture: PIC18 8-bit RISC (Harvard)
Microchip Technology
Package: 64-VQFN (9x9) with exposed pad
ADC: 10-bit, up to 10 channels
Core Independent Peripherals: CLC, CWG, WWDT, SMT

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC18F65K40-I/MR

✅ Drop-In
Microchip Technology
📦 VQFN-64 9x9 mm (MR)
8-bit PIC18 enhanced Harvard · PIC® XLP™ 18K · 32 KB (16K x 16) · 2 KB · 256 B · 64 MHz · 2.3 V to 5.5 V

✓ Auf Lager

$2.3 / Stück

Datenblatt ansehen →

PIC18LF65K40-E/MR

✅ Drop-In
Microchip Technology
📦 VQFN-64 9x9 mm (MR)
PIC 8-bit · PIC18 XLP 18K · 64 MHz · 32 KB (16K x 16) · 2 KB · 256 B · 1.8 V to 3.6 V · -40 C to +125 C (Extended)

✓ Auf Lager

$2.55 / Stück

Datenblatt ansehen →

PIC18F65K40T-I/MR

✅ Drop-In
Microchip Technology
📦 VQFN-64 9x9 mm (MR)
PIC18 8-bit RISC (Harvard) · 32 KB (16K x 16) · 2 KB · 256 B · 64 MHz (16 MIPS per the datasheet's instruction-cycle ratio) · 2.3 V to 5.5 V · 64-pin VQFN (9 x 9 mm) · -40C to +85C (Industrial, -I suffix)

✓ Auf Lager

$1.32 / Stück

Datenblatt ansehen →

PIC18F65K40-E/PT

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 TQFP-64 10x10 mm (PT)
same die, TQFP-64 vs VQFN-64 footprint difference but same silicon

📋 Referenzalternative (nicht im Katalog)

PIC18F65K22-E/MR

✅ Drop-In
Microchip Technology
📦 VQFN-64 9x9 mm (MR)
PIC18F K-series (PIC18F6XK22) · 8-bit PIC enhanced RISC · 64 KB Flash · 4 KB · 1 KB · 64 MHz (16 MIPS) · 1.8 V to 5.5 V · -40C to +125C (Extended)

✓ Auf Lager

$3.5 / Stück

Datenblatt ansehen →

PIC18F65K40-E/MR Grenzwerte & elektrische Eigenschaften

Core Architecture PIC18 enhanced mid-range 8-bit
Program Memory (Flash) 32 KB (16K x 16 words)
Data SRAM 2 KB
Data EEPROM 1 KB
Maximum CPU Speed 64 MHz
Supply Voltage Range 2.3 V to 5.5 V
Betriebstemperaturbereich -40 C to +125 C (Extended, -E suffix)
Gehäuse 64-pin VQFN 9x9 mm (MR)
I/O Pins (max) 45
ADC 10-bit, with Computation (ADC2)
DAC 5-bit + 8-bit DAC
Timers Multiple 8-bit and 16-bit timers
Communication UART, SPI, I2C
PWM Channels 16-bit PWM, multiple channels
Core Independent Peripherals CWG, WWDT, CRC/SCAN, CLC, Hardware Limit Timer, ZCD
Low-Power Technology XLP (eXtreme Low Power)
RoHS-Status Compliant
Montageart Surface Mount
MSL-Level MSL3 (per JEDEC J-STD-020)

PIC18F65K40-E/MR 64-pin vqfn 9x9 mm (mr) Pinbelegungsleitfaden

Pinbelegung für PIC18F65K40-E/MR (64-pin vqfn 9x9 mm (mr)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für PIC18F65K40-E/MR im 64-pin vqfn 9x9 mm (mr)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für PIC18F65K40-E/MR.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

PIC18F65K40-E/MR ist geeignet für 6 Anwendungs: Industrial Sensor Conditioning, Building Automation Controller, Low-Power IoT Edge Node, USB-to-UART/SPI/I2C Bridge, Small Appliance Control, General-Purpose 5V Embedded Control.

🏭

Industrial Sensor Conditioning

The PIC18F65K40-E/MR's 64-pin VQFN 9x9 mm package provides up to 45 I/O pins for simultaneous interface to multiple analog sensors (temperature, pressure, flow), digital switches, and a 4-20 mA loopback interface. The 10-bit ADC with Computation (ADC2) runs automated averaging, oversampling, and threshold comparison in hardware, freeing the CPU for supervisory tasks and reducing firmware complexity in distributed sensor nodes. The 2.3 V to 5.5 V supply range and 5 V-tolerant I/O directly accept 5 V sensor outputs, eliminating level shifters in 24 V industrial sensor conditioning modules. The XLP low-power sleep currents below 1 uA let battery-backed sensor hubs survive long power outages while still waking on interrupt.

🏭

Building Automation Controller

In building automation controllers managing HVAC, lighting, and occupancy sensors, the PIC18F65K40-E/MR provides enough UART/SPI/I2C channels to talk to multiple sensor and actuator backbones (Modbus, BACnet, KNX transceivers) on the same PCB. Its 32 KB Flash comfortably holds RTOS-free scheduling and full Modbus stack; the CLC (Configurable Logic Cell) implements debouncing and signal conditioning in hardware so the 64 MHz CPU can focus on protocol servicing. The 64-pin VQFN exposes 45 I/O, plenty for triac firing outputs, keypad matrix, and LCD interface. Extended -40C to +125C operation handles unconditioned mechanical-room temperatures.

🧩

Low-Power IoT Edge Node

Battery-powered wireless sensor nodes leverage the PIC18F65K40-E/MR's XLP technology for multi-year coin-cell operation, with the 64 MHz internal oscillator waking on interrupt to service sensor data before returning to sub-uA sleep. The 32 KB Flash and 2 KB SRAM are sufficient for BLE beacon drivers, sensor calibration tables, and event buffering, while the 1 KB EEPROM logs cumulative energy or diagnostic data across power cycles. The exposed pad on the VQFN package gives thermal headroom for sustained 64 MHz bursts during radio packetization. Combined with an external sub-GHz or BLE module, this MCU is a proven gateway-less edge node for remote monitoring.

🖥️

USB-to-UART/SPI/I2C Bridge

The PIC18F65K40-E/MR paired with an external USB transceiver (or using the higher-pin-count PIC18F46K50 for direct USB) implements a fast USB-to-UART/SPI/I2C bridge for legacy host PC connectivity. The 64 MHz CPU delivers sustained baud rates above 1 Mbaud without dropping characters, while the 2 KB SRAM double-buffers USB endpoint traffic. Multiple hardware UART/SPI/I2C peripherals enable concurrent bridging to several downstream devices - useful for production-line flashing fixtures and field-service tools. The MR VQFN package is well-suited to small form-factor USB sticks and panel-mount debug tools.

🏠

Small Appliance Control

Small appliances (coffee machines, induction cooktops, washing-machine user-interface boards) use the PIC18F65K40-E/MR to drive 7-segment displays, capacitive touch buttons, and triac-controlled heaters via the CWG (Complementary Waveform Generator) and 16-bit PWM. Hardware limit timers, zero-cross detect (ZCD), and CRC/SCAN together meet IEC 60730 Class B safety requirements for unattended appliance operation, while 5 V-tolerant I/O directly drives triac optocouplers. The 9x9 mm VQFN footprint is small enough for compact user-interface boards, and the extended -40 C to +125 C operation covers the hot inside of an oven or dishwasher control panel.

🔧

General-Purpose 5V Embedded Control

The PIC18F65K40-E/MR's 5 V tolerance on all digital I/O makes it ideal as a drop-in upgrade for legacy PIC18F65K22, PIC18F8722, and similar 5V-era designs migrating to a more capable, lower-power MCU without a voltage-level rework. 32 KB Flash comfortably holds Bluetooth Low Energy stacks, sensor fusion algorithms, or basic GUI code while keeping unit cost low. Industrial 24 V bus systems tolerate the 5.5 V absolute maximum comfortably, and the extended -40 C to +125 C industrial operating range matches unconditioned enclosures. The exposed-pad VQFN package also keeps the PCB area smaller than the equivalent TQFP-64 (PT) variant.

Zusammenfassung der empfohlenen Produkte

MCP9700T-E/TT Analog temperature sensor with 10 mV/C output Verwendet in: Industrial Sensor Conditioning MCP6N16-100E/MS Instrumentation amplifier for bridge sensors Verwendet in: Industrial Sensor Conditioning PIC18F46K40-I/PT Lower-pin-count sibling MCU for sub-modules Verwendet in: Industrial Sensor Conditioning MCP2515-I/SO External CAN controller for BACnet over CAN Verwendet in: Building Automation Controller, General-Purpose 5V Embedded Control PIC18F47K40-I/PT Microchip Technology Verwendet in: Building Automation Controller MCP23017-E/SP I2C I/O expander to multiply GPIO Verwendet in: Building Automation Controller RN4870-I/RM118 Bluetooth 5.0 module for sensor uplink Verwendet in: Low-Power IoT Edge Node MCP1700-3302E/TO Low-Iq 3.3V LDO for coin-cell operation Verwendet in: Low-Power IoT Edge Node PIC18F25K50-I/SP USB-capable MCU for gateway edge Verwendet in: Low-Power IoT Edge Node MCP2200-I/SO USB-to-UART bridge IC alternative Verwendet in: USB-to-UART/SPI/I2C Bridge MCP2221-I/P USB-to-I2C/UART/GPIO bridge IC Verwendet in: USB-to-UART/SPI/I2C Bridge PIC18F46K50-I/PT USB-on-the-go MCU variant Verwendet in: USB-to-UART/SPI/I2C Bridge MCP8025T-E/PT 3-phase motor driver companion Verwendet in: Small Appliance Control MCP23S17-E/SP SPI I/O expander for display/keypad Verwendet in: Small Appliance Control PIC18F45K40-E/P Lower-pin-count sibling MCU Verwendet in: Small Appliance Control PIC18F65K40-I/PT Microchip Technology Verwendet in: General-Purpose 5V Embedded Control MCP23008-E/P I2C I/O expander Verwendet in: General-Purpose 5V Embedded Control
What is the program memory size of PIC18F65K40-E/MR?
The PIC18F65K40-E/MR contains 32 KB of Flash program memory organized as 16K x 16-bit words. According to the Microchip datasheet DS40001872D, it also integrates 2 KB of data SRAM and 1 KB of EEPROM for non-volatile user data, with self-programmability enabling in-field firmware updates without external bootloaders.
What is the operating voltage range of PIC18F65K40-E/MR?
The PIC18F65K40-E/MR operates from 2.3 V to 5.5 V supply voltage, supporting both 3.3 V and 5 V rails without level shifters. According to Microchip datasheet DS40001872D, the -E extended temperature suffix covers -40 C to +125 C, making it suitable for industrial environments including factory automation and outdoor installations.
What package does PIC18F65K40-E/MR come in?
The PIC18F65K40-E/MR is supplied in a 64-pin VQFN (Very-thin Quad Flat No-lead) package measuring 9x9 mm with an exposed thermal pad. The MR suffix denotes this specific VQFN-64 9x9 option; PT suffix parts use TQFP-64. The exposed pad must be soldered to the PCB ground plane for thermal dissipation and electrical reference.
What is the maximum CPU clock speed of PIC18F65K40?
The PIC18F65K40 core runs up to 64 MHz using the internal HFINTOSC, providing 16 MIPS (Million Instructions Per Second) throughput at that frequency. According to Microchip, the 64 MHz internal oscillator eliminates the need for an external crystal in many designs, with PLL options for finer granularity. The high clock enables demanding peripherals such as the 16-bit PWM and high-baud UART operation.
Where can I buy PIC18F65K40-E/MR online?
The PIC18F65K40-E/MR is available from authorized distributors including DigiKey (579-PIC18F65K40-E/MR), Mouser, and OMO Electronic. As of 2026-09-28, distributor pricing starts around $4.18 for single units with tier breaks at 10, 100, 500, and 1000 pieces. Authorized Microchip franchised distributors guarantee factory-fresh date code and warranty coverage.
What is the current stock and lead time for PIC18F65K40-E/MR?
As of 2026-09-28, DigiKey lists the PIC18F65K40-E/MR with multiple thousands in stock and same-day shipping for orders placed before cutoff. Mouser also maintains stock at single-piece and reel quantities. Lead time for factory-direct large-volume orders is typically 8-12 weeks, but distribution stock currently supports immediate delivery.
What is the price of PIC18F65K40-E/MR in 1000-piece quantity?
The PIC18F65K40-E/MR unit price in 1000-piece reels is approximately $2.32 as of 2026-09-28, dropping to about $2.74 at 500 pieces and $3.21 at 100 pieces. Volume pricing makes this part attractive for cost-sensitive industrial designs. For reference, single-unit retail is around $4.18 per Microchip franchised distributor.
PIC18F65K40 vs PIC18F65K22 - which is better for low-power designs?
The PIC18F65K40 is preferred for new low-power designs because of its XLP (eXtreme Low Power) technology delivering sub-microampere sleep currents versus the older PIC18F65K22. The K40 adds Core Independent Peripherals (CLC, CWG, ZCD, hardware limit timer) that offload tasks from the CPU, further reducing active power. Both share the 64-pin PIC18 footprint but the K40 has a richer ADC2 with computation and more flexible PWM.
Is there an automotive-grade equivalent of PIC18F65K40-E/MR?
Microchip offers the PIC18F65K40 with a -Q automotive suffix (AEC-Q100 Grade 1) covering -40 C to +125 C for under-hood and body electronics. For non-automotive industrial use, the -E/MR variant in this listing provides the same temperature range but without the formal AEC-Q100 qualification paperwork. Both share the same 64-pin VQFN 9x9 mm footprint and pinout, allowing drop-in board swap.
What is the best drop-in replacement for PIC18F65K40-E/MR?
The best drop-in replacement is the PIC18F65K40-I/MR, which is the same die in the same VQFN-64 9x9 mm package but specified for the -40 C to +85 C industrial temperature range instead of -40 C to +125 C. For applications that need true drop-in compatibility and extended temperature, the PIC18F65K40-E/PT (TQFP-64) provides identical silicon in a different package option. Same-package replacements with parametric proximity 100% are within Microchip's K40 family only.
Can PIC18F46K40 replace PIC18F65K40-E/MR?
No, the PIC18F46K40 is NOT a drop-in replacement for the PIC18F65K40-E/MR despite sharing the K40 family. The PIC18F46K40 is a 40-pin or 44-pin device, while the PIC18F65K40 is a 64-pin device; pin counts and pinouts differ. Use the PIC18F65K40 variant in TQFP-64 (PT suffix) or VQFN-64 (MR suffix) when seeking same-silicon alternatives. PIC18F46K40 is a footprint-incompatible sibling.
Where to download PIC18F65K40 datasheet PDF?
The official Microchip PIC18F65K40 datasheet (document DS40001872D) is available as a free PDF download from the Microchip website at https://ww1.microchip.com/downloads/aemDocuments/documents/MCU08/ProductDocuments/DataSheets/PIC18-LF65-66K40-Data-Sheet-DS40001872D.pdf. The datasheet includes electrical characteristics, memory maps, peripheral configurations, and application notes. An errata document (DS80000789) covers silicon revisions.
Where to find PIC18F65K40-E/MR pinout diagram?
The complete pinout for the PIC18F65K40-E/MR (64-pin VQFN, MR suffix) is on page 14 of the Microchip datasheet DS40001872D. Each pin function is shown in table format with multiplexed peripheral assignments for I/O ports PORTA through PORTH, plus power (VDD/VSS) and the exposed thermal pad (EP). The pinout package diagram on this product page is derived from the same datasheet.
What are the key features of PIC18F65K40 that engineers should know?
Engineers evaluating the PIC18F65K40 should know: 32 KB Flash + 2 KB SRAM + 1 KB EEPROM in 64-pin VQFN; 64 MHz CPU delivering 16 MIPS; 2.3-5.5 V supply with 5V-tolerant I/O; XLP sleep currents below 1 uA; 10-bit ADC with Computation (ADC2) for automated threshold filtering; Configurable Logic Cell (CLC) for hardware glue logic; CWG (Complementary Waveform Generator) for motor and lighting; CRC/SCAN for memory integrity monitoring; ZCD for zero-crossing detection; and -40 C to +125 C extended temperature.
Is PIC18F65K40 the same as PIC18F65K22?
No, the PIC18F65K40 and PIC18F65K22 are different PIC18 family members. The K40 is the newer-generation XLP part with Core Independent Peripherals, 64 MHz internal oscillator, and ADC2 with computation. The K22 is the older nanoWatt XLP part with different peripheral set. They share the 64-pin PIC18 footprint but the K22 has different pin multiplexing for several peripherals; verify pinout before swapping on existing K22 boards.
What is the equivalent PIC18F65K40 part from STMicroelectronics or NXP?
There is no direct cross-brand pin-for-pin equivalent for the PIC18F65K40-E/MR in the same 64-pin VQFN footprint; Microchip holds the PIC18 architecture. Cross-brand competitors in the same MCU class include STM32G031 in TSSOP-20 (different footprint, Cortex-M0+), NXP LPC812 in DIP8/TSSOP16, and Microchip's own PIC18F45K40 in 40-pin (smaller, fewer I/O). Cross-brand drop-in replacement in VQFN-64 9x9 does not exist - any substitution requires PCB redesign.

Technische Referenzdaten für PIC18F65K40-E/MR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the PIC18F65K40-E/MR when you need a 64-pin 8-bit MCU with industrial -40 C to +125 C extended temperature, 5 V-tolerant I/O, and Core Independent Peripherals in a compact 9x9 mm VQFN footprint. Choose PIC18F65K40-I/MR if your design is limited to 0-70 C ambient; you save cost without changing layout. Choose PIC18LF65K40-E/MR for battery-powered designs at 1.8-3.6 V supply. Avoid the PIC18F65K22-E/MR unless you have legacy code - its older peripheral set lacks ADC2, CLC, and CWG, requiring CPU offloading that the K40 does for free. For automotive AEC-Q100 applications, choose the PIC18F65K40-Q variant (different ordering code) instead.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC18F65K40-I/MR PIC18LF65K40-E/MR PIC18F65K40T-I/MR PIC18F65K40-E/PT PIC18F65K22-E/MR
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package VQFN-64 9x9 mm (MR) VQFN-64 9x9 mm (MR) - same VQFN-64 9x9 mm (MR) - same VQFN-64 9x9 mm (MR) - same TQFP-64 10x10 mm (PT) - different but same silicon VQFN-64 9x9 mm (MR) - same
Core Architecture PIC18 enhanced mid-range 8-bit, 64 MHz Same PIC18 64 MHz Same PIC18 64 MHz Same PIC18 64 MHz Same PIC18 64 MHz PIC18 64 MHz, older peripherals
Operating Voltage 2.3 V to 5.5 V 2.3 V to 5.5 V 1.8 V to 3.6 V 2.3 V to 5.5 V 2.3 V to 5.5 V 1.8 V to 5.5 V
Operating Temperature -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +125 C (Extended) -40 C to +125 C (Extended)
Core Independent Peripherals (CLC/CWG/ZCD) Yes (CWG, CLC, ZCD, HW Limit Timer) Yes Yes Yes Yes No (older nanoWatt XLP)
ADC 10-bit ADC with Computation (ADC2) 10-bit ADC2 10-bit ADC2 10-bit ADC2 10-bit ADC2 10-bit ADC (no ADC2)

Wichtigste Unterscheidungsmerkmale

  • Extended -40 C to +125 C industrial temperature range in 64-pin VQFN (vs. PIC18F65K40-I/MR)
  • Wide 2.3 V to 5.5 V supply range with 5V-tolerant I/O (vs. PIC18LF65K40-E/MR)
  • Core Independent Peripherals for CPU-offload automation (vs. PIC18F65K22-E/MR)

Designhinweise

The 9x9 mm VQFN package dissipates heat primarily through the exposed thermal pad (EP) on the underside. For reliable operation at 64 MHz full speed with all peripherals active, the EP must be soldered to a copper pour of at least 1 square inch connected to a continuous ground plane. Without this thermal path, junction temperature can exceed the +125 C extended limit in enclosed industrial environments. Use thermal vias in the EP pad to conduct heat into inner PCB copper layers.

Place the 0.1 uF VDD decoupling capacitor within 1-2 mm of each power pin pair (VDD/VSS), with bulk 1-10 uF tantalum or ceramic on the supply rail entry point. For 64 MHz operation, add a ferrite bead or pi-filter on the analog AVDD supply to prevent digital switching noise from coupling into the ADC. The exposed pad ground must be connected directly to the digital ground (DGND) plane under the MCU; do not split analog and digital ground unless you have a clear star-ground architecture.

Configure all unused I/O pins as outputs driving low (not inputs) to prevent floating-pin current paths through internal ESD structures that can draw 10-100 uA per pin and violate low-power sleep budgets. Verify configuration bits in code: WDT, BOR, and PWRT enable/disable affects reset behavior and sleep current by orders of magnitude. The ADC2 module's computation feature requires initialization of the ADCON registers in a specific order - refer to datasheet section on ADC2 before enabling threshold interrupts. The CLC, CWG, and PPS (Peripheral Pin Select) features must be unlocked via the PPSLOCK register sequence before configuration.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per Microchip product page. -E temperature grade is industrial -40 C to +125 C but NOT AEC-Q100 qualified; choose -Q suffix variant for automotive.

Daten verifiziert am: 2026-09-28 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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