PIC18F65K40-E/MR - 8-Bit 64MHz 32KB Flash MCU | Microchip
부품 번호: PIC18F65K40-E/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.18 | $4.18 |
| 10 | $3.78 | $37.80 |
| 100 | $3.21 | $321.00 |
| 500 | $2.74 | $1,370.00 |
| 1,000 | $2.32 | $2,320.00 |
PIC18F65K40-E/MR 개요
An 8-bit microcontroller (MCU) is a single-chip processor with an 8-bit data path, on-chip program and data memory, and integrated peripherals intended for embedded control. Within the broader taxonomy, the PIC18F65K40 sits as: MCU -> 8-bit MCU -> PIC18 family -> XLP low-power series -> enhanced mid-range core -> Microchip semiconductor. 8-bit PIC18 devices bridge simple PIC10/12/16 parts and 16-bit dsPIC/PIC24 devices, offering richer peripherals and more code space while retaining the deterministic interrupt model and single-instruction C-compiler friendliness that PIC users expect.
Key features include 64MHz internal oscillator, 32KB self-programmable Flash, 2KB SRAM, 1KB EEPROM, up to 45 I/O pins, 10-bit ADC with computation (ADC2), 5-bit DAC, 8-bit DAC, multiple UART/SPI/I2C, 16-bit PWM, and configurable logic cell (CLC). The eXtreme Low Power (XLP) technology delivers sub-uA sleep currents, while the 5V-tolerant I/O simplifies industrial sensor front ends.
The PIC18F65K40 uses Microchip's enhanced mid-range 8-bit core with a hardware multiplier, 31-level stack, and a 16-bit instruction word. This gives C-compiler code density competitive with 16-bit MCUs while keeping interrupt latency deterministic, suitable for hard-real-time loops like motor commutation or sensor sampling.
Typical applications include industrial sensor conditioning, building automation controllers, low-power IoT edge nodes, USB-to-UART bridges, small appliance control, and general-purpose 5V embedded control. The extended -40C to +125C operating range and high-pin-count VQFN package suit harsh industrial and automotive under-hood environments where the Q-prefix AEC-Q100 part is not required.
When designing with this device, budget sufficient PCB copper under the 9x9mm VQFN thermal pad to keep junction temperature within limits; the pad must be soldered for both thermal and electrical ground. Always configure unused pins as outputs (not inputs) to avoid current paths via internal ESD structures.
This page consolidates real distributor pricing, drop-in alternatives, application notes, and design considerations not duplicated in any single manufacturer page.
드롭인 대체품: PIC18F65K40-E/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18F65K40-E/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Core Independent Peripherals, DAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18F65K40-I/MR
✅ 드롭인✓ 재고 있음
$2.3 / 개
데이터시트 보기 →PIC18LF65K40-E/MR
✅ 드롭인✓ 재고 있음
$2.55 / 개
데이터시트 보기 →PIC18F65K40T-I/MR
✅ 드롭인✓ 재고 있음
$1.32 / 개
데이터시트 보기 →PIC18F65K40-E/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC18F65K22-E/MR
✅ 드롭인✓ 재고 있음
$3.5 / 개
데이터시트 보기 →PIC18F65K40-E/MR 최대 정격 & 전기적 특성
| Core Architecture | PIC18 enhanced mid-range 8-bit |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| Data SRAM | 2 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Supply Voltage Range | 2.3 V to 5.5 V |
| 동작 온도 범위 | -40 C to +125 C (Extended, -E suffix) |
| 패키지 | 64-pin VQFN 9x9 mm (MR) |
| I/O Pins (max) | 45 |
| ADC | 10-bit, with Computation (ADC2) |
| DAC | 5-bit + 8-bit DAC |
| Timers | Multiple 8-bit and 16-bit timers |
| Communication | UART, SPI, I2C |
| PWM Channels | 16-bit PWM, multiple channels |
| Core Independent Peripherals | CWG, WWDT, CRC/SCAN, CLC, Hardware Limit Timer, ZCD |
| Low-Power Technology | XLP (eXtreme Low Power) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
| MSL 레벨 | MSL3 (per JEDEC J-STD-020) |
PIC18F65K40-E/MR 64-pin vqfn 9x9 mm (mr) 핀 구성 가이드
PIC18F65K40-E/MR(64-pin vqfn 9x9 mm (mr) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC18F65K40-E/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC18F65K40-E/MR 적합 용도: 6 애플리케이션s: Industrial Sensor Conditioning, Building Automation Controller, Low-Power IoT Edge Node, USB-to-UART/SPI/I2C Bridge, Small Appliance Control, General-Purpose 5V Embedded Control.
Industrial Sensor Conditioning
The PIC18F65K40-E/MR's 64-pin VQFN 9x9 mm package provides up to 45 I/O pins for simultaneous interface to multiple analog sensors (temperature, pressure, flow), digital switches, and a 4-20 mA loopback interface. The 10-bit ADC with Computation (ADC2) runs automated averaging, oversampling, and threshold comparison in hardware, freeing the CPU for supervisory tasks and reducing firmware complexity in distributed sensor nodes. The 2.3 V to 5.5 V supply range and 5 V-tolerant I/O directly accept 5 V sensor outputs, eliminating level shifters in 24 V industrial sensor conditioning modules. The XLP low-power sleep currents below 1 uA let battery-backed sensor hubs survive long power outages while still waking on interrupt.
추천
Building Automation Controller
In building automation controllers managing HVAC, lighting, and occupancy sensors, the PIC18F65K40-E/MR provides enough UART/SPI/I2C channels to talk to multiple sensor and actuator backbones (Modbus, BACnet, KNX transceivers) on the same PCB. Its 32 KB Flash comfortably holds RTOS-free scheduling and full Modbus stack; the CLC (Configurable Logic Cell) implements debouncing and signal conditioning in hardware so the 64 MHz CPU can focus on protocol servicing. The 64-pin VQFN exposes 45 I/O, plenty for triac firing outputs, keypad matrix, and LCD interface. Extended -40C to +125C operation handles unconditioned mechanical-room temperatures.
추천
Low-Power IoT Edge Node
Battery-powered wireless sensor nodes leverage the PIC18F65K40-E/MR's XLP technology for multi-year coin-cell operation, with the 64 MHz internal oscillator waking on interrupt to service sensor data before returning to sub-uA sleep. The 32 KB Flash and 2 KB SRAM are sufficient for BLE beacon drivers, sensor calibration tables, and event buffering, while the 1 KB EEPROM logs cumulative energy or diagnostic data across power cycles. The exposed pad on the VQFN package gives thermal headroom for sustained 64 MHz bursts during radio packetization. Combined with an external sub-GHz or BLE module, this MCU is a proven gateway-less edge node for remote monitoring.
추천
USB-to-UART/SPI/I2C Bridge
The PIC18F65K40-E/MR paired with an external USB transceiver (or using the higher-pin-count PIC18F46K50 for direct USB) implements a fast USB-to-UART/SPI/I2C bridge for legacy host PC connectivity. The 64 MHz CPU delivers sustained baud rates above 1 Mbaud without dropping characters, while the 2 KB SRAM double-buffers USB endpoint traffic. Multiple hardware UART/SPI/I2C peripherals enable concurrent bridging to several downstream devices - useful for production-line flashing fixtures and field-service tools. The MR VQFN package is well-suited to small form-factor USB sticks and panel-mount debug tools.
추천
Small Appliance Control
Small appliances (coffee machines, induction cooktops, washing-machine user-interface boards) use the PIC18F65K40-E/MR to drive 7-segment displays, capacitive touch buttons, and triac-controlled heaters via the CWG (Complementary Waveform Generator) and 16-bit PWM. Hardware limit timers, zero-cross detect (ZCD), and CRC/SCAN together meet IEC 60730 Class B safety requirements for unattended appliance operation, while 5 V-tolerant I/O directly drives triac optocouplers. The 9x9 mm VQFN footprint is small enough for compact user-interface boards, and the extended -40 C to +125 C operation covers the hot inside of an oven or dishwasher control panel.
추천
General-Purpose 5V Embedded Control
The PIC18F65K40-E/MR's 5 V tolerance on all digital I/O makes it ideal as a drop-in upgrade for legacy PIC18F65K22, PIC18F8722, and similar 5V-era designs migrating to a more capable, lower-power MCU without a voltage-level rework. 32 KB Flash comfortably holds Bluetooth Low Energy stacks, sensor fusion algorithms, or basic GUI code while keeping unit cost low. Industrial 24 V bus systems tolerate the 5.5 V absolute maximum comfortably, and the extended -40 C to +125 C industrial operating range matches unconditioned enclosures. The exposed-pad VQFN package also keeps the PCB area smaller than the equivalent TQFP-64 (PT) variant.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18F65K40-E/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18F65K40-I/MR | PIC18LF65K40-E/MR | PIC18F65K40T-I/MR | PIC18F65K40-E/PT | PIC18F65K22-E/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 9x9 mm (MR) | VQFN-64 9x9 mm (MR) - same | VQFN-64 9x9 mm (MR) - same | VQFN-64 9x9 mm (MR) - same | TQFP-64 10x10 mm (PT) - different but same silicon | VQFN-64 9x9 mm (MR) - same |
| Core Architecture | PIC18 enhanced mid-range 8-bit, 64 MHz | Same PIC18 64 MHz | Same PIC18 64 MHz | Same PIC18 64 MHz | Same PIC18 64 MHz | PIC18 64 MHz, older peripherals |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) |
| Core Independent Peripherals (CLC/CWG/ZCD) | Yes (CWG, CLC, ZCD, HW Limit Timer) | Yes | Yes | Yes | Yes | No (older nanoWatt XLP) |
| ADC | 10-bit ADC with Computation (ADC2) | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC (no ADC2) |
주요 차별점
- Extended -40 C to +125 C industrial temperature range in 64-pin VQFN (vs PIC18F65K40-I/MR)
- Wide 2.3 V to 5.5 V supply range with 5V-tolerant I/O (vs PIC18LF65K40-E/MR)
- Core Independent Peripherals for CPU-offload automation (vs PIC18F65K22-E/MR)
설계 노트
The 9x9 mm VQFN package dissipates heat primarily through the exposed thermal pad (EP) on the underside. For reliable operation at 64 MHz full speed with all peripherals active, the EP must be soldered to a copper pour of at least 1 square inch connected to a continuous ground plane. Without this thermal path, junction temperature can exceed the +125 C extended limit in enclosed industrial environments. Use thermal vias in the EP pad to conduct heat into inner PCB copper layers.
Place the 0.1 uF VDD decoupling capacitor within 1-2 mm of each power pin pair (VDD/VSS), with bulk 1-10 uF tantalum or ceramic on the supply rail entry point. For 64 MHz operation, add a ferrite bead or pi-filter on the analog AVDD supply to prevent digital switching noise from coupling into the ADC. The exposed pad ground must be connected directly to the digital ground (DGND) plane under the MCU; do not split analog and digital ground unless you have a clear star-ground architecture.
Configure all unused I/O pins as outputs driving low (not inputs) to prevent floating-pin current paths through internal ESD structures that can draw 10-100 uA per pin and violate low-power sleep budgets. Verify configuration bits in code: WDT, BOR, and PWRT enable/disable affects reset behavior and sleep current by orders of magnitude. The ADC2 module's computation feature requires initialization of the ADCON registers in a specific order - refer to datasheet section on ADC2 before enabling threshold interrupts. The CLC, CWG, and PPS (Peripheral Pin Select) features must be unlocked via the PPSLOCK register sequence before configuration.
규정 준수 정보
RoHS compliant per Microchip product page. -E temperature grade is industrial -40 C to +125 C but NOT AEC-Q100 qualified; choose -Q suffix variant for automotive.
