PIC18LF26K42-I/ML - 8-Bit 64MHz 64KB Flash MCU | Microchip
Teilenummer: PIC18LF26K42-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.69 | $36,90 |
| 100 | $3.28 | $328,00 |
| 500 | $2.94 | $1.470,00 |
| 1.000 | $2.62 | $2.620,00 |
PIC18LF26K42-I/ML Übersicht
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data-path CPU, integrating Flash program memory, RAM, EEPROM, peripherals (ADC, timers, UART, SPI, I2C), and interrupt logic into one package. PIC18 devices sit in the middle of Microchip's 8-bit portfolio, above the PIC16 and below the dsPIC/PIC24, offering C-compilable MIPS-class cores with CIP (Core Independent Peripherals). The LF part number prefix denotes low-voltage operation specifically optimized for 3.3 V and below.
Key features include 64 KB Flash, 4 KB RAM, 1 KB EEPROM, 24 analog-capable I/O pins, a 12-bit ADC with Computation, multiple UART/SPI/I2C interfaces, and Microchip's eXtreme Low Power (XLP) technology enabling nanoWatt sleep currents below 50 nA typical. The 28-QFN package is the most compact option in the K42 family, ideal for space-constrained designs.
Architecturally, the PIC18FxxK42 family introduces hardware-smart peripherals such as the CLC (Configurable Logic Cell), NCO (Numerically Controlled Oscillator), and DMA-to-memory, allowing autonomous operation without CPU intervention. This dramatically reduces active-mode runtime and overall system power.
Typical applications include IoT sensor nodes, consumer wearables, battery-powered medical devices, automotive body and interior ECUs, and industrial wireless HMI controls. The QFN-28 footprint supports miniaturized PCBs common in these segments.
When designing, ensure adequate thermal relief under the exposed pad is soldered to a ground copper pour for heat dissipation. The LF variant must not exceed 3.6 V on VDD; for 5 V rails use the PIC18F26K42 (without LF). Verify the Programming/ Debug pin assignments against the chosen debugger (ICD 4 or PICKit 4).
This page synthesizes distributor pricing, drop-in Microchip same-family variants, and practical design notes that go beyond what is found in the bare manufacturer datasheet.
Drop-in-Alternativen für PIC18LF26K42-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18LF26K42-I/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Operating Temperature, Timers, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18LF26K42-E/ML
✅ Drop-In✓ Auf Lager
$1.94 / Stück
Datenblatt ansehen →PIC18LF26K42T-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F26K42-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF26K22-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18F26K42-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC18LF26K42-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC18 8-bit RISC |
| Family | PIC® XLP™ 18K (K42) |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Operating Voltage (VDD) | 1.8 V to 3.6 V (LF variant) |
| I/O Pins | 24 |
| ADC | 12-bit with Computation |
| Timers | 8-bit / 16-bit (multiple) |
| Communication | UART, SPI, I2C |
| Low-Power Technology | eXtreme Low Power (XLP), nanoWatt |
| Core Independent Peripherals | CLC, NCO, DMA, Hardware CRC |
| Gehäuse | 28-pin QFN (6x6 mm) with EP |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (Industrial) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC18LF26K42-I/ML Pin-Konfiguration
| Pin 1 | RA5 — GPIO / ADC / CLC |
| Pin 2 | RA4 — GPIO / ADC |
| Pin 3 | RA3 — GPIO / MCLR |
| Pin 4 | RA2 — GPIO / ADC |
| Pin 5 | RA1 — GPIO / ADC / DAC |
| Pin 6 | RA0 — GPIO / ADC / DAC |
| Pin 7 | VSS — Ground |
| Pin 8 | VDD — Positive supply (1.8V to 3.6V) |
| Pin 9 | RB7 — GPIO / I2C / ADC |
| Pin 10 | RB6 — GPIO / I2C / ADC |
| Pin 11 | RB5 — GPIO / ADC |
| Pin 12 | RB4 — GPIO / ADC |
| Pin 13 | RB3 — GPIO / ADC |
| Pin 14 | RB2 — GPIO / ADC |
| Pin 15 | RB1 — GPIO / ADC / INT |
| Pin 16 | RB0 — GPIO / INT / programming clock |
| Pin 17 | RC7 — GPIO / UART RX |
| Pin 18 | RC6 — GPIO / UART TX |
| Pin 19 | RC5 — GPIO / I2C / SPI |
| Pin 20 | RC4 — GPIO / SPI / I2C |
| Pin 21 | RC3 — GPIO / SPI / I2C |
| Pin 22 | RC2 — GPIO / SPI / I2C |
| Pin 23 | RC1 — GPIO / SPI / I2C / DAC |
| Pin 24 | RC0 — GPIO / SPI / I2C / DAC |
| Pin 25 | RA7 — GPIO / ADC / CLK |
| Pin 26 | RA6 — GPIO / ADC / CLK |
| Pin 27 | OSC1 — Crystal oscillator input |
| Pin 28 | OSC2 — Crystal oscillator output |
Typische Anwendungen
PIC18LF26K42-I/ML ist geeignet für 6 Anwendungs: IoT Sensor Node / Battery Telemetry, Wearable Health Monitor, Automotive Body Electronics ECU, Industrial Wireless HMI / Remote Control, Smart Home Sensor / Actuator Hub, Consumer Audio Peripheral / Toy Electronics.
IoT Sensor Node / Battery Telemetry
The PIC18LF26K42-I/ML's nanoWatt XLP sleep currents below 50 nA and 64 KB Flash make it ideal for coin-cell powered IoT sensor nodes transmitting BLE or LoRa telemetry. Its 1.8 V to 3.6 V VDD range matches Li-ion and alkaline chemistries directly. The Core Independent Peripherals (CLC, NCO, DMA) allow autonomous sensor sampling and wake-up without CPU intervention, reducing average power by 30-50 percent versus interrupt-driven polling. The 28-QFN (6x6 mm) footprint supports miniaturized sensor packages common in industrial IoT.
Empfohlen
Wearable Health Monitor
Wearable fitness and medical-grade monitoring devices benefit from the PIC18LF26K42-I/ML's 12-bit ADC with Computation, allowing hardware-averaged biosignal sampling for heart rate, SpO2, and galvanic skin response. The 64 KB program space accommodates sensor fusion and BLE protocol stacks. Sleep current under 1 µA in Idle mode extends battery life to weeks on a single 100 mAh Li-Po cell. The 28-QFN exposed pad provides effective thermal dissipation during continuous BLE transmissions without overheating the wrist.
Empfohlen
Automotive Body Electronics ECU
The PIC18LF26K42-I/ML (industrial -40C to +85C grade) suits interior automotive body modules such as ambient lighting controllers, seat occupancy detectors, and HVAC panel drivers. The 28-QFN footprint drops onto existing PCB land patterns designed for K22 family migration. Hardware CIP peripherals (CLC, NCO) handle LIN bus timing and PWM dimming autonomously, freeing the CPU for diagnostic and CAN-LIN gateway tasks. For under-hood deployments exceeding 85C ambient, migrate to the PIC18LF26K42-E/ML (-40C to +125C extended grade) drop-in replacement.
Empfohlen
Industrial Wireless HMI / Remote Control
Handheld industrial remote controls and HMI panels benefit from the PIC18LF26K42-I/ML's 24 GPIO pins supporting matrix keypads, LCD segment drivers, and PWM backlight control. The 64 KB Flash hosts USB device stacks, custom protocols, and encrypted pairing. CLC peripherals implement reliable debounce and PWM generation without software jitter. The 28-QFN exposed pad allows direct PCB bottom-side mounting for slim handheld enclosures typical of construction and warehouse equipment.
Empfohlen
Smart Home Sensor / Actuator Hub
Smart-home edge devices such as wireless door/window sensors, smart thermostats, and motorized valve actuators leverage the PIC18LF26K42-I/ML's 1.8 V minimum VDD to operate directly from single-cell alkaline or 2xAA supplies. The 12-bit ADC provides accurate readings from thermistor, photo, and humidity bridges, while the 1 KB EEPROM stores calibration and pairing data. Low sleep current allows multi-year battery operation typical of Z-Wave or ZigBee sensor endpoints in residential deployments.
Empfohlen
Consumer Audio Peripheral / Toy Electronics
Cost-sensitive consumer audio peripherals such as Bluetooth speakers, novelty toys, and educational electronics benefit from the PIC18LF26K42-I/ML's low unit price (~$4 at qty 1) and 64 KB Flash for audio DSP and BLE pairing logic. The CLC peripherals generate PWM audio carriers without CPU load, while the 12-bit ADC samples potentiometer volume controls. The 28-QFN package supports miniaturized product designs typical of consumer audio accessories and USB-powered toys.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18LF26K42-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18LF26K42-E/ML | PIC18LF26K42T-I/ML | PIC18F26K42-I/ML | PIC18LF26K22-I/ML |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6) | 28-QFN (6x6) | 28-QFN (6x6) | 28-QFN (6x6) | 28-QFN (6x6) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Max CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Core Independent Peripherals | CLC, NCO, DMA, CRC | CLC, NCO, DMA, CRC | CLC, NCO, DMA, CRC | CLC, NCO, DMA, CRC | Limited (no CLC/NCO) |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 256 B |
Wichtigste Unterscheidungsmerkmale
- Higher Flash density and CIP peripherals versus older K22 generation (vs. PIC18LF26K22-I/ML)
- Lower minimum voltage than F (full-range) variant (vs. PIC18F26K42-I/ML)
- Extended temperature grade availability on same die (vs. PIC18LF26K42T-I/ML)
- Core Independent Peripherals reduce CPU active time (vs. PIC18LF26K22-I/ML)
Designhinweise
The PIC18LF26K42-I/ML requires a decoupling capacitor of 100 nF ceramic placed within 5 mm of the VDD pin (pin 8). Add a bulk 10 µF tantalum or aluminum-polymer capacitor at the supply entry point. The LF variant must NOT exceed 3.6 V on VDD - reverse-polarity protection or TVS clamping is recommended at the battery terminal. For USB-powered designs, ensure the 3.3 V LDO has <50 mV peak-to-peak ripple to avoid ADC reference noise.
The 28-QFN package has an exposed thermal pad (EP) on the bottom center that MUST be soldered to a ground copper pour of at least 1 square inch (645 mm²) for thermal dissipation. At 64 MHz with all peripherals active, the MCU dissipates approximately 30-40 mW - not thermally critical but the EP also serves as a low-impedance ground return. Use 6-9 thermal vias (0.3 mm drill) under the EP to inner ground planes.
Route the ICSP (In-Circuit Serial Programming) signals PGD (RB7) and PGC (RB6) as direct 50 ohm traces to a 6-pin header with no series resistors. Place a 4.7 kΩ pull-up on MCLR (RA3) per Microchip ICD 4 specifications. Avoid routing high-frequency signals (SPI clocks, PWM) across the QFN exposed pad area to prevent coupling into ground reference. Keep crystal traces (OSC1/OSC2) within 10 mm and shield with ground pour.
Do not confuse the LF (low-voltage) variant with the F (full-range) variant - firmware compiled for 64 MHz at 5 V will not work on LF at 3.3 V without reconfiguration. The configuration words (CONFIG1L through CONFIG5L) must explicitly set the Fosc, WDT, and BOR settings for LF operation. The WDT can pull up to 20 µA if left enabled in Sleep mode - disable WDT in DS configuration when not needed.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page and DigiKey listing. AEC-Q100 not applicable for the industrial-grade -I variant; choose automotive AEC-Q100 qualified PIC18F26K42-E/ML or similar -E/-Q variants for automotive designs. Halogen-free PIN System per JEDEC JS709B.
