PIC18LF55K42-E/MV - 8-bit 64MHz XLP MCU 32KB Flash | Microchip
Teilenummer: PIC18LF55K42-E/MV ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.1 | $31,00 |
| 100 | $2.8 | $280,00 |
| 500 | $2.48 | $1.240,00 |
| 1.000 | $2.2 | $2.200,00 |
PIC18LF55K42-E/MV Übersicht
What is an 8-bit microcontroller? An 8-bit MCU is a single-chip computer whose internal data path, registers, and ALU operate on 8 bits at a time. The PIC18 family sits in the hierarchy: microcontroller -> 8-bit MCU -> PIC18 -> PIC18F/LF K-series -> XLP low-power family, where the LF prefix denotes the wide-voltage F-version variant. 8-bit MCUs are widely used for deterministic real-time control, sensor interfacing, and low-power IoT edge nodes where simplicity, cost, and predictable latency matter more than raw throughput.
Key features include a 12-bit ADC2 with up to 35 external channels and automated post-processing (averaging, filtering, oversampling, threshold compare), a 5-bit DAC, dual comparators, a hardware Capacitive Voltage Divider (CVD) for touch sensing, vector interrupts, DMA, Zero-Cross Detection (ZCD), and a Peripheral Pin Select (PPS) module that remaps digital peripherals to any I/O. The K-series integrates an HFINTOSC up to 64 MHz and a low-power 32 kHz LFINTOSC.
Typical applications include battery-powered IoT sensor nodes, capacitive touch user interfaces, home appliances and white goods, industrial control panels, automotive body/comfort modules (non-AEC), and USB-CDC/HID human-interface devices.
Design considerations: operate from 1.8 V to 3.6 V on the LF part (down to 5.5 V on the F variant). Place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pair and route the exposed pad (EP) to a continuous ground plane for thermal sinking.
This page consolidates distributor pricing, parameter comparison with 48-pin K42/K40 family variants, and drop-in guidance not always shown on the manufacturer product page.
Drop-in-Alternativen für PIC18LF55K42-E/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18LF55K42-E/MV (gleiche Bauform und Footprint) – abweichend in ADC, Package, Comparators, Program Memory (Flash), Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18LF47K42-I/MV
✅ Drop-In✓ Auf Lager
$2.75 / Stück
Datenblatt ansehen →PIC18LF46K42-E/MV
✅ Drop-In✓ Auf Lager
$1.92 / Stück
Datenblatt ansehen →PIC18LF45K42-E/MV
✅ Drop-In✓ Auf Lager
$1.82 / Stück
Datenblatt ansehen →PIC18F55K42-E/MV
✅ Drop-In✓ Auf Lager
$1.82 / Stück
Datenblatt ansehen →PIC18LF45K40-E/MV
✅ Drop-In✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →PIC18LF55K42-E/MV Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC18, 8-bit RISC |
| CPU Speed | 64 MHz max |
| Instruction Set | PIC18, 75 instructions |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| Data SRAM | 2 KB |
| Data EEPROM | 256 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Betriebstemperatur | -40 C to +125 C (E = Extended) |
| ADC | 12-bit ADC2, up to 35 external channels, with Computation |
| DAC | 5-bit DAC |
| Comparators | 2 x analog comparators |
| PWM | Multiple CCP/ECCP PWM channels |
| Timers | Multiple 8/16-bit timers |
| Communication | EUSART, SPI, I2C (all via PPS) |
| Touch Sensing | Hardware CVD (Capacitive Voltage Divider) |
| DMA | Yes |
| Zero-Cross Detection (ZCD) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Watchdog | WWDT (Windowed WDT) |
| Gehäuse | 48-UQFN (MV), 6x6 mm, with exposed pad |
| Montageart | Surface Mount |
| MSL-Level | 1 |
| RoHS-Status | ROHS3 Compliant |
| Lead-Free / Halogen-Free | Yes |
PIC18LF55K42-E/MV Pin-Konfiguration
| Pin 1 | RA0 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 2 | RA1 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 3 | RA2 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 4 | RA3 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 5 | RA4 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 6 | RA5 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 7 | RA6 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 8 | RA7 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 9 | VSS — Ground reference |
| Pin 10 | RA8 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 11 | RA9 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 12 | RA10 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 13 | RA11 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 14 | VDD — Positive supply (1.8-3.6 V) |
| Pin 15 | RA12 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 16 | RA13 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 17 | RA14 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 18 | RA15 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 19 | VSS — Ground reference |
| Pin 20 | RB0 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| Pin 21 | RB1 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| Pin 22 | RB2 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| Pin 23 | RB3 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| Pin 24 | RB4 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| Pin 25 | RB5 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| Pin 26 | RB6 — Bidirectional I/O (PPS-mappable, ICSPCLK) |
| Pin 27 | RB7 — Bidirectional I/O (PPS-mappable, ICSPDAT) |
| Pin 28 | VDD — Positive supply (1.8-3.6 V) |
| Pin 29 | RC0 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 30 | RC1 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 31 | RC2 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 32 | RC3 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 33 | RC4 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 34 | RC5 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 35 | RC6 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 36 | RC7 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 37 | VSS — Ground reference |
| Pin 38 | RD0 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 39 | RD1 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 40 | RD2 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 41 | RD3 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 42 | RD4 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 43 | RD5 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 44 | RD6 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 45 | RD7 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 46 | RE0 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 47 | RE1 — Bidirectional I/O (PPS-mappable analog/digital) |
| Pin 48 | RE2 — Bidirectional I/O (PPS-mappable analog/digital) |
Typische Anwendungen
PIC18LF55K42-E/MV ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Nodes, Capacitive Touch User Interface, Home Appliance and White Goods Control, Industrial Control Panel / HMI, LED Lighting and Smart Driver Control, Automotive Body and Comfort Modules (Non-AEC).
Battery-Powered IoT Sensor Nodes
The PIC18LF55K42-E/MV's XLP architecture (nanoWatt XLP) and 1.8-3.6 V operation make it well suited to coin-cell or Li-ion powered wireless sensor nodes. The integrated 12-bit ADC2 with automated averaging/threshold compare lets the MCU wake, sample, and return to Sleep in microseconds; the on-chip DMA offloads peripherals from the CPU, so quiescent current stays in the sub-uA range. Designers typically pair this part with an external sub-GHz or BLE radio on the EUSART/SPI PPS pins.
Empfohlen
Capacitive Touch User Interface
The hardware Capacitive Voltage Divider (CVD) peripheral of the PIC18LF55K42-E/MV automates touch sampling on up to 35 channels, eliminating the need for an external touch controller. Combined with DMA and the 12-bit ADC2 charge pump, the MCU supports buttons, sliders, and proximity detection running while the core sleeps. The PPS module lets you remap I/O for flexible PCB routing under a front-panel overlay.
Empfohlen
Home Appliance and White Goods Control
For washing machines, dishwashers, induction cooktops and HVAC controls, the PIC18LF55K42-E/MV delivers 64 MHz performance with the Zero-Cross Detection (ZCD) peripheral for triac/SCR phase-angle control, plus dual comparators for sensor conditioning. The extended -40 to +125 C temperature range (E suffix) supports behind-panel mounting, and the 32 KB Flash accommodates complex user-interface state machines.
Empfohlen
Industrial Control Panel / HMI
The PIC18LF55K42-E/MV's PPS module lets designers route EUSART, SPI, and I2C onto any I/O, simplifying PCB layout for industrial HMIs with mixed connectors. The hardware CRC and DMA accelerate Modbus RTU or custom serial protocols, while the 12-bit ADC2 with oversampling enables precision 4-20 mA loop readback. The UQFN-48 package's exposed pad keeps the die cool at full 64 MHz operation.
Empfohlen
LED Lighting and Smart Driver Control
The PIC18LF55K42-E/MV's CCP/ECCP PWM channels plus the 5-bit DAC enable multi-channel constant-current LED driving with smooth dimming curves. The ZCD peripheral synchronizes dimming to the AC line for flicker-free phase-cut dimmers. The XLP core ensures standby power stays below regulatory limits (Energy Star, ErP) when the light is off.
Empfohlen
Automotive Body and Comfort Modules (Non-AEC)
Although the -E suffix is industrial-grade, designers use the PIC18LF55K42-E/MV in non-safety automotive subsystems such as interior lighting, mirror controllers and accessory hubs. The 32 KB Flash supports LIN or CAN scripting, DMA offloads message buffering from the core, and the ZCD peripheral handles AC motor commutation for window lift or seat positioning. Choose an AEC-Q100 qualified variant for under-hood applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18LF55K42-E/MV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18LF47K42-I/MV | PIC18LF46K42-E/MV | PIC18LF45K42-E/MV | PIC18F55K42-E/MV | PIC18LF45K40-E/MV |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (MV) 6x6 mm | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Flash Memory | 32 KB | 128 KB | 64 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 2 KB | 8 KB | 4 KB | 2 KB | 2 KB | 2 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.7 V to 5.5 V | 1.8 V to 3.6 V |
| ADC2 with Computation | Yes | Yes | Yes | Yes | Yes | No (basic 10-bit ADC) |
| Capacitive Touch (CVD) | Yes | Yes | Yes | Yes | Yes | No (CVD is K42 feature) |
| DMA + ZCD | Yes | Yes | Yes | Yes | Yes | No |
Wichtigste Unterscheidungsmerkmale
- ADC2 with on-chip computation engine (averaging, oversampling, threshold compare) (vs. PIC18LF45K40-E/MV)
- Integrated DMA controller (vs. PIC18F46K22-I/ML)
- Peripheral Pin Select (PPS) on every digital I/O (vs. PIC18F4550-I/P)
Designhinweise
Place a 100 nF low-ESR ceramic decoupling capacitor within 5 mm of every VDD/VSS pair on PIC18LF55K42-E/MV. For battery-powered designs, add a 10 uF bulk capacitor on VDD to handle peak ADC and CCP bursts. The LF variant draws less than 1 uA in Sleep with RTCC running, so the regulator quiescent current often dominates total idle power - choose a low-Iq LDO like MCP1700 for the rail.
The UQFN-48 (MV) package has an exposed thermal pad that must be soldered to a continuous ground plane with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch) directly under the EP. This serves both thermal dissipation and electrical ground - any cut in the ground plane beneath the EP can cause erratic ADC2 readings above 200 ksamples/s due to ground bounce.
PIC18LF55K42-E/MV PPS remapping is unlocked only after writing the correct sequence to IOLOCK - a common pitfall is forgetting this, which silently disables PPS assignment on next POR. Also note the LF variant will not start above 3.6 V on VDD; the F variant must be used for 5 V designs. Above 16 MIPS, ensure VDD is greater than 2.7 V per the datasheet 30010038D electrical characteristics.
For capacitive-touch (CVD) layouts, keep the sense trace capacitance to ground balanced across channels and minimize trace length to less than 100 mm. Add a guard trace driven low between adjacent touch electrodes to prevent cross-talk. Avoid routing digital signals under touch electrodes on the opposite PCB layer.
Compliance-Informationen
ROHS3 Compliant per Microchip USA listing. Lead-free finish. Industrial-grade (E) operating temperature -40 to +125 C. Not AEC-Q100 qualified; use automotive PIC18F/LF K42-AEC variants for vehicle applications.
