PIC18LF55K42-E/MV - 8-bit 64MHz XLP MCU 32KB Flash | Microchip
부품 번호: PIC18LF55K42-E/MV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.45 | $3.45 |
| 10 | $3.1 | $31.00 |
| 100 | $2.8 | $280.00 |
| 500 | $2.48 | $1,240.00 |
| 1,000 | $2.2 | $2,200.00 |
PIC18LF55K42-E/MV 개요
What is an 8-bit microcontroller? An 8-bit MCU is a single-chip computer whose internal data path, registers, and ALU operate on 8 bits at a time. The PIC18 family sits in the hierarchy: microcontroller -> 8-bit MCU -> PIC18 -> PIC18F/LF K-series -> XLP low-power family, where the LF prefix denotes the wide-voltage F-version variant. 8-bit MCUs are widely used for deterministic real-time control, sensor interfacing, and low-power IoT edge nodes where simplicity, cost, and predictable latency matter more than raw throughput.
Key features include a 12-bit ADC2 with up to 35 external channels and automated post-processing (averaging, filtering, oversampling, threshold compare), a 5-bit DAC, dual comparators, a hardware Capacitive Voltage Divider (CVD) for touch sensing, vector interrupts, DMA, Zero-Cross Detection (ZCD), and a Peripheral Pin Select (PPS) module that remaps digital peripherals to any I/O. The K-series integrates an HFINTOSC up to 64 MHz and a low-power 32 kHz LFINTOSC.
Typical applications include battery-powered IoT sensor nodes, capacitive touch user interfaces, home appliances and white goods, industrial control panels, automotive body/comfort modules (non-AEC), and USB-CDC/HID human-interface devices.
Design considerations: operate from 1.8 V to 3.6 V on the LF part (down to 5.5 V on the F variant). Place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pair and route the exposed pad (EP) to a continuous ground plane for thermal sinking.
This page consolidates distributor pricing, parameter comparison with 48-pin K42/K40 family variants, and drop-in guidance not always shown on the manufacturer product page.
드롭인 대체품: PIC18LF55K42-E/MV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18LF55K42-E/MV (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Comparators, Program Memory (Flash), Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18LF47K42-I/MV
✅ 드롭인✓ 재고 있음
$2.75 / 개
데이터시트 보기 →PIC18LF46K42-E/MV
✅ 드롭인✓ 재고 있음
$1.92 / 개
데이터시트 보기 →PIC18LF45K42-E/MV
✅ 드롭인✓ 재고 있음
$1.82 / 개
데이터시트 보기 →PIC18F55K42-E/MV
✅ 드롭인✓ 재고 있음
$1.82 / 개
데이터시트 보기 →PIC18LF45K40-E/MV
✅ 드롭인✓ 재고 있음
$1.55 / 개
데이터시트 보기 →PIC18LF55K42-E/MV 최대 정격 & 전기적 특성
| Core Architecture | PIC18, 8-bit RISC |
| CPU Speed | 64 MHz max |
| Instruction Set | PIC18, 75 instructions |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| Data SRAM | 2 KB |
| Data EEPROM | 256 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| 동작 온도 | -40 C to +125 C (E = Extended) |
| ADC | 12-bit ADC2, up to 35 external channels, with Computation |
| DAC | 5-bit DAC |
| Comparators | 2 x analog comparators |
| PWM | Multiple CCP/ECCP PWM channels |
| Timers | Multiple 8/16-bit timers |
| Communication | EUSART, SPI, I2C (all via PPS) |
| Touch Sensing | Hardware CVD (Capacitive Voltage Divider) |
| DMA | Yes |
| Zero-Cross Detection (ZCD) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Watchdog | WWDT (Windowed WDT) |
| 패키지 | 48-UQFN (MV), 6x6 mm, with exposed pad |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 1 |
| RoHS 상태 | ROHS3 Compliant |
| Lead-Free / Halogen-Free | Yes |
PIC18LF55K42-E/MV 핀 구성
| 핀 1 | RA0 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 2 | RA1 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 3 | RA2 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 4 | RA3 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 5 | RA4 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 6 | RA5 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 7 | RA6 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 8 | RA7 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 9 | VSS — Ground reference |
| 핀 10 | RA8 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 11 | RA9 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 12 | RA10 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 13 | RA11 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 14 | VDD — Positive supply (1.8-3.6 V) |
| 핀 15 | RA12 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 16 | RA13 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 17 | RA14 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 18 | RA15 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 19 | VSS — Ground reference |
| 핀 20 | RB0 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| 핀 21 | RB1 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| 핀 22 | RB2 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| 핀 23 | RB3 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| 핀 24 | RB4 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| 핀 25 | RB5 — Bidirectional I/O (PPS-mappable, INT-on-change) |
| 핀 26 | RB6 — Bidirectional I/O (PPS-mappable, ICSPCLK) |
| 핀 27 | RB7 — Bidirectional I/O (PPS-mappable, ICSPDAT) |
| 핀 28 | VDD — Positive supply (1.8-3.6 V) |
| 핀 29 | RC0 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 30 | RC1 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 31 | RC2 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 32 | RC3 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 33 | RC4 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 34 | RC5 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 35 | RC6 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 36 | RC7 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 37 | VSS — Ground reference |
| 핀 38 | RD0 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 39 | RD1 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 40 | RD2 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 41 | RD3 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 42 | RD4 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 43 | RD5 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 44 | RD6 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 45 | RD7 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 46 | RE0 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 47 | RE1 — Bidirectional I/O (PPS-mappable analog/digital) |
| 핀 48 | RE2 — Bidirectional I/O (PPS-mappable analog/digital) |
일반적인 애플리케이션
PIC18LF55K42-E/MV 적합 용도: 6 애플리케이션s: Battery-Powered IoT Sensor Nodes, Capacitive Touch User Interface, Home Appliance and White Goods Control, Industrial Control Panel / HMI, LED Lighting and Smart Driver Control, Automotive Body and Comfort Modules (Non-AEC).
Battery-Powered IoT Sensor Nodes
The PIC18LF55K42-E/MV's XLP architecture (nanoWatt XLP) and 1.8-3.6 V operation make it well suited to coin-cell or Li-ion powered wireless sensor nodes. The integrated 12-bit ADC2 with automated averaging/threshold compare lets the MCU wake, sample, and return to Sleep in microseconds; the on-chip DMA offloads peripherals from the CPU, so quiescent current stays in the sub-uA range. Designers typically pair this part with an external sub-GHz or BLE radio on the EUSART/SPI PPS pins.
추천
Capacitive Touch User Interface
The hardware Capacitive Voltage Divider (CVD) peripheral of the PIC18LF55K42-E/MV automates touch sampling on up to 35 channels, eliminating the need for an external touch controller. Combined with DMA and the 12-bit ADC2 charge pump, the MCU supports buttons, sliders, and proximity detection running while the core sleeps. The PPS module lets you remap I/O for flexible PCB routing under a front-panel overlay.
추천
Home Appliance and White Goods Control
For washing machines, dishwashers, induction cooktops and HVAC controls, the PIC18LF55K42-E/MV delivers 64 MHz performance with the Zero-Cross Detection (ZCD) peripheral for triac/SCR phase-angle control, plus dual comparators for sensor conditioning. The extended -40 to +125 C temperature range (E suffix) supports behind-panel mounting, and the 32 KB Flash accommodates complex user-interface state machines.
추천
Industrial Control Panel / HMI
The PIC18LF55K42-E/MV's PPS module lets designers route EUSART, SPI, and I2C onto any I/O, simplifying PCB layout for industrial HMIs with mixed connectors. The hardware CRC and DMA accelerate Modbus RTU or custom serial protocols, while the 12-bit ADC2 with oversampling enables precision 4-20 mA loop readback. The UQFN-48 package's exposed pad keeps the die cool at full 64 MHz operation.
추천
LED Lighting and Smart Driver Control
The PIC18LF55K42-E/MV's CCP/ECCP PWM channels plus the 5-bit DAC enable multi-channel constant-current LED driving with smooth dimming curves. The ZCD peripheral synchronizes dimming to the AC line for flicker-free phase-cut dimmers. The XLP core ensures standby power stays below regulatory limits (Energy Star, ErP) when the light is off.
추천
Automotive Body and Comfort Modules (Non-AEC)
Although the -E suffix is industrial-grade, designers use the PIC18LF55K42-E/MV in non-safety automotive subsystems such as interior lighting, mirror controllers and accessory hubs. The 32 KB Flash supports LIN or CAN scripting, DMA offloads message buffering from the core, and the ZCD peripheral handles AC motor commutation for window lift or seat positioning. Choose an AEC-Q100 qualified variant for under-hood applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18LF55K42-E/MV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18LF47K42-I/MV | PIC18LF46K42-E/MV | PIC18LF45K42-E/MV | PIC18F55K42-E/MV | PIC18LF45K40-E/MV |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (MV) 6x6 mm | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Flash Memory | 32 KB | 128 KB | 64 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 2 KB | 8 KB | 4 KB | 2 KB | 2 KB | 2 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.7 V to 5.5 V | 1.8 V to 3.6 V |
| ADC2 with Computation | Yes | Yes | Yes | Yes | Yes | No (basic 10-bit ADC) |
| Capacitive Touch (CVD) | Yes | Yes | Yes | Yes | Yes | No (CVD is K42 feature) |
| DMA + ZCD | Yes | Yes | Yes | Yes | Yes | No |
주요 차별점
- ADC2 with on-chip computation engine (averaging, oversampling, threshold compare) (vs PIC18LF45K40-E/MV)
- Integrated DMA controller (vs PIC18F46K22-I/ML)
- Peripheral Pin Select (PPS) on every digital I/O (vs PIC18F4550-I/P)
설계 노트
Place a 100 nF low-ESR ceramic decoupling capacitor within 5 mm of every VDD/VSS pair on PIC18LF55K42-E/MV. For battery-powered designs, add a 10 uF bulk capacitor on VDD to handle peak ADC and CCP bursts. The LF variant draws less than 1 uA in Sleep with RTCC running, so the regulator quiescent current often dominates total idle power - choose a low-Iq LDO like MCP1700 for the rail.
The UQFN-48 (MV) package has an exposed thermal pad that must be soldered to a continuous ground plane with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch) directly under the EP. This serves both thermal dissipation and electrical ground - any cut in the ground plane beneath the EP can cause erratic ADC2 readings above 200 ksamples/s due to ground bounce.
PIC18LF55K42-E/MV PPS remapping is unlocked only after writing the correct sequence to IOLOCK - a common pitfall is forgetting this, which silently disables PPS assignment on next POR. Also note the LF variant will not start above 3.6 V on VDD; the F variant must be used for 5 V designs. Above 16 MIPS, ensure VDD is greater than 2.7 V per the datasheet 30010038D electrical characteristics.
For capacitive-touch (CVD) layouts, keep the sense trace capacitance to ground balanced across channels and minimize trace length to less than 100 mm. Add a guard trace driven low between adjacent touch electrodes to prevent cross-talk. Avoid routing digital signals under touch electrodes on the opposite PCB layer.
규정 준수 정보
ROHS3 Compliant per Microchip USA listing. Lead-free finish. Industrial-grade (E) operating temperature -40 to +125 C. Not AEC-Q100 qualified; use automotive PIC18F/LF K42-AEC variants for vehicle applications.
