PIC18LF67K40-E/MR - 128KB Flash 8-Bit MCU 64-VQFN | Microchip
Teilenummer: PIC18LF67K40-E/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.27 | $3,27 |
| 10 | $2.94 | $29,40 |
| 100 | $2.62 | $262,00 |
| 500 | $2.3 | $1.150,00 |
| 1.000 | $2.07 | $2.070,00 |
PIC18LF67K40-E/MR Übersicht
A PIC18 microcontroller belongs to the 8-bit RISC microcontroller family from Microchip, positioned in the broader category of microcontrollers -> embedded processors -> semiconductors. PIC18 devices use an enhanced Harvard architecture with a modified RISC instruction set, prioritising low power consumption (XLP technology), deterministic interrupt latency, and rich on-chip peripherals. The K40 sub-family targets low-power general-purpose applications that need more memory and analogue integration than baseline PIC16/PIC18F parts, without moving to 16-bit dsPIC or 32-bit Arm cores.
Key features of the PIC18LF67K40-E/MR include 10-bit ADC2 with up to 47 channels, multiple communication peripherals (UART, SPI, I2C with SMBus support), 5-bit and 10-bit DAC channels, dual analog comparators with selectable references, PWM/SCCP/MCCP capture-compare-PWM modules, and direct memory access via the DMA-free peripheral cross-connect. The 64-pin VQFN package supports 54 digital I/O pins and exposes the full peripheral set, while the exposed pad keeps theta_JA low enough for industrial operating temperatures (-40C to +125C).
Architecturally, the device uses an 8-bit data path with a 16-bit instruction word, a hardware multiplier (8x8 in one cycle), and a 31-level hardware stack. XLP technology (eXtreme Low Power) implements multiple idle/sleep modes (Doze, Idle, Sleep, Low-Power Sleep), with deep sleep currents typically below 1 uA at RTCC retention. The integrated Core Independent Peripherals (CIPs) such as CWG, SMT, and WWDT allow complex timing, waveform generation, and safety tasks to run without CPU intervention.
Typical applications include industrial control (sensor hubs, motor driver co-processors), low-power IoT edge nodes with sensor aggregation, consumer appliances with HMI, automotive body/comfort subsystems (PIC18LF variants are not AEC-Q100; see PIC18F67K40 family for automotive grade), battery-powered metering, and USB-less human-interface products. The wide memory footprint (128 KB Flash, 4 KB RAM, 1 KB EEPROM) supports protocol stacks (Modbus, custom), bootloader/A/B partition schemes, and data logging.
When designing with this part, verify the VQFN-64 exposed pad is properly soldered to a sufficiently large copper pour for thermal dissipation and GND reference. The 'E' suffix indicates the Extended temperature grade (-40C to +125C); for the standard industrial -40C to +85C range, the 'I' grade variant PIC18LF67K40-I/MR is the same silicon in the same package. Confirm debugger compatibility (MPLAB ICD 4 / PICkit 5) before finalising layout.
This page synthesises verified distributor pricing, application-specific design notes, and a drop-in alternative comparison not found in the standalone datasheet PDF.
Drop-in-Alternativen für PIC18LF67K40-E/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18LF67K40-E/MR (gleiche Bauform und Footprint) – abweichend in ADC, Package, Core, Family, EEPROM.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC18F67K40-E/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF67K40-I/MR
✅ Drop-In✓ Auf Lager
$3.3 / Stück
Datenblatt ansehen →PIC18LF67K40T-E/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF66K40-E/MR
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC18LF65K40-E/MR
✅ Drop-In✓ Auf Lager
$2.55 / Stück
Datenblatt ansehen →PIC18LF67K40-E/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC18LF67K40-E/MR Grenzwerte & elektrische Eigenschaften
| Product Type | 8-bit Microcontroller (MCU) |
| Series | PIC18 XLP 18K |
| Core | PIC18 Enhanced Harvard 8-bit |
| Program Memory (Flash) | 128 KB (64K x 16) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Clock | 64 MHz |
| Supply Voltage (LF) | 1.8 V to 3.6 V |
| Betriebstemperatur | -40C to +125C (Extended grade) |
| Gehäuse | 64-pin VQFN (9x9 mm) with exposed pad (MR) |
| ADC | 10-bit ADC2 with Computation, up to 47 channels |
| DAC | 5-bit and 10-bit DAC channels |
| Comparators | 2 analog comparators with selectable reference |
| PWM Modules | SCCP/MCCP Capture-Compare-PWM |
| Core Independent Peripherals | CWG, WWDT, CRC, SMT, HLT |
| Communication | UART, SPI, I2C (SMBus/PMBus) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020) |
PIC18LF67K40-E/MR Pin-Konfiguration
| Pin 1 | RB0 — I/O port B bit 0 |
| Pin 2 | RB1 — I/O port B bit 1 |
| Pin 3 | RB2 — I/O port B bit 2 |
| Pin 4 | RB3 — I/O port B bit 3 |
| Pin 5 | RB4 — I/O port B bit 4 |
| Pin 6 | RB5 — I/O port B bit 5 |
| Pin 7 | RB6 — I/O port B bit 6 / ICSP PGC |
| Pin 8 | RB7 — I/O port B bit 7 / ICSP PGD |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive supply (1.8-3.6 V) |
| Pin 11 | RA0 — I/O port A bit 0 |
| Pin 12 | RA1 — I/O port A bit 1 |
| Pin 13 | RA2 — I/O port A bit 2 |
| Pin 14 | RA3 — I/O port A bit 3 |
| Pin 15 | RA4 — I/O port A bit 4 |
| Pin 16 | RA5 — I/O port A bit 5 |
| Pin 17 | RA6 — I/O port A bit 6 |
| Pin 18 | RA7 — I/O port A bit 7 |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply (1.8-3.6 V) |
| Pin 21 | RC0 — I/O port C bit 0 |
| Pin 22 | RC1 — I/O port C bit 1 |
| Pin 23 | RC2 — I/O port C bit 2 |
| Pin 24 | RC3 — I/O port C bit 3 |
| Pin 25 | RC4 — I/O port C bit 4 |
| Pin 26 | RC5 — I/O port C bit 5 |
| Pin 27 | RC6 — I/O port C bit 6 |
| Pin 28 | RC7 — I/O port C bit 7 |
| Pin 29 | RE0 — I/O port E bit 0 |
| Pin 30 | RE1 — I/O port E bit 1 |
| Pin 31 | RE2 — I/O port E bit 2 |
| Pin 32 | RE3 — I/O port E bit 3 |
| Pin 33 | RD0 — I/O port D bit 0 |
| Pin 34 | RD1 — I/O port D bit 1 |
| Pin 35 | RD2 — I/O port D bit 2 |
| Pin 36 | RD3 — I/O port D bit 3 |
| Pin 37 | RD4 — I/O port D bit 4 |
| Pin 38 | RD5 — I/O port D bit 5 |
| Pin 39 | RD6 — I/O port D bit 6 |
| Pin 40 | RD7 — I/O port D bit 7 |
| Pin 41 | VSS — Ground reference |
| Pin 42 | VDD — Positive supply (1.8-3.6 V) |
| Pin 43 | RF0 — I/O port F bit 0 |
| Pin 44 | RF1 — I/O port F bit 1 |
| Pin 45 | RF2 — I/O port F bit 2 |
| Pin 46 | RF3 — I/O port F bit 3 |
| Pin 47 | RF4 — I/O port F bit 4 |
| Pin 48 | RF5 — I/O port F bit 5 |
| Pin 49 | RF6 — I/O port F bit 6 |
| Pin 50 | RF7 — I/O port F bit 7 |
| Pin 51 | RG0 — I/O port G bit 0 |
| Pin 52 | RG1 — I/O port G bit 1 |
| Pin 53 | RG2 — I/O port G bit 2 |
| Pin 54 | RG3 — I/O port G bit 3 |
| Pin 55 | RG4 — I/O port G bit 4 |
| Pin 56 | VSS — Ground reference |
| Pin 57 | VDD — Positive supply (1.8-3.6 V) |
| Pin 58 | MCLR — Master Clear (reset) input, active low |
| Pin 59 | OSC1 — Oscillator input / external clock input |
| Pin 60 | OSC2 — Oscillator output |
| Pin 61 | VSS — Ground reference |
| Pin 62 | VDD — Positive supply (1.8-3.6 V) |
| Pin 63 | NC — Not connected (no internal bond) |
| Pin 64 | NC — Not connected (no internal bond) |
| Pin 65 | EP — Exposed thermal pad - solder to VSS plane for thermal dissipation |
Typische Anwendungen
PIC18LF67K40-E/MR ist geeignet für 7 Anwendungs: Industrial Sensor Hub with Modbus, Low-Power IoT Edge Node with Sensor Aggregation, Consumer Appliance HMI Controller, Battery-Powered Smart Meter, Automotive Body/Comfort Subsystem, Industrial Motor Driver Co-Processor, Medical Sensor Monitoring Device.
Industrial Sensor Hub with Modbus
The PIC18LF67K40-E/MR fits industrial sensor hubs because its 128 KB Flash can hold a Modbus RTU/ASCII master or slave stack plus device drivers, while the 10-bit ADC2 with up to 47 channels samples multiple analogue sensors concurrently. Core Independent Peripherals like the SMT timer and CWG let timing, PWM, and waveform tasks run without CPU intervention, keeping the MCU in low-power Sleep between conversions. The wide 1.8-3.6 V operating range supports 3.3 V industrial bus rails directly. Pair with the PIC18LF65K40-E/PT (smaller Flash) for cost-reduced variants, or use the F variant for 5 V sensor interfaces.
Empfohlen
Low-Power IoT Edge Node with Sensor Aggregation
The PIC18LF67K40-E/MR is well-suited for battery-powered IoT edge nodes because XLP (eXtreme Low Power) technology delivers deep-sleep currents below 1 uA with RTCC retention, and the LF voltage range (1.8-3.6 V) matches single-cell Li-ion or 2x AA chemistries. The 128 KB Flash accommodates over-the-air update bootloaders with A/B partitions, while the 4 KB RAM holds sensor-fusion buffers. Core Independent Peripherals aggregate analogue sensor data without waking the CPU, extending battery life. Communication interfaces (UART, SPI, I2C with SMBus) connect radios, sensors, and EEPROMs. Recommend pairing with PIC18LF26K42-I/ML for sub-node slave controllers in distributed systems.
Empfohlen
Consumer Appliance HMI Controller
The PIC18LF67K40-E/MR fits consumer appliance HMIs because its 128 KB Flash stores graphical menu state machines, while the CWG (Complementary Waveform Generator) drives half-bridge signals for triac-style load switching and buzzer tones. The integrated comparators sense zero-cross events for synchronous triac triggering, eliminating discrete components and reducing BOM cost. The 4 KB RAM supports touchscreen buffering and key-press de-bouncing, and the 1 KB EEPROM retains user settings through power cycles. Operating from -40C to +125 C (Extended grade) handles appliance thermal environments. Pair with the PIC18LF46K40-E/PT for cost-down variants on simpler HMIs.
Empfohlen
Battery-Powered Smart Meter
The PIC18LF67K40-E/MR is a strong fit for battery-powered smart metering because its deep-sleep current below 1 uA (XLP mode with RTCC running) extends coin-cell or lithium-pack life to multi-year horizons. The 10-bit ADC2 with Computation performs autonomous RMS and average calculations on current/voltage waveforms without waking the CPU, reducing average active time. The 128 KB Flash accommodates segmented metering firmware with tamper logging, and the 1 KB EEPROM stores calibration constants and rolling consumption logs. The 64-pin VQFN package supports the 54 digital I/O needed for segmented LCD drive and metrology front-end control.
Empfohlen
Automotive Body/Comfort Subsystem
The PIC18LF67K40-E/MR suits non-safety-critical automotive body and comfort subsystems because its Extended -40C to +125 C temperature grade handles cabin and engine-bay thermal environments, while the 128 KB Flash stores LIN slave stacks and body control logic. The CWG drives LED matrix lighting and motor half-bridges without CPU overhead, and the dual comparators sense over-current events. Note that this part is NOT AEC-Q100 qualified; for AEC-Q100 requirements use the PIC18F67K40-E/MRVAO. Use the F variant (PIC18F67K40-E/MR) for 5 V automotive rails. Pair with the PIC18F66K40-I/PT for CAN body modules.
Empfohlen
Industrial Motor Driver Co-Processor
The PIC18LF67K40-E/MR fits industrial motor driver co-processor roles because its CWG, CCP/PWM, and SMT modules generate complementary PWMs and timing for FOC, sensored BLDC, and stepper motor control without CPU intervention. The 10-bit ADC2 with Computation samples current-sense amplifiers and back-EMF simultaneously, freeing the CPU for higher-level control loops. The 64-pin VQFN footprint offers 54 digital I/O for fault inputs, encoder feedback, and gate-driver handshaking. The 1.8-3.6 V supply matches 3.3 V gate driver logic. Pair with the PIC18F57K42-I/PT for higher-voltage driver modules.
Empfohlen
Medical Sensor Monitoring Device
The PIC18LF67K40-E/MR is suitable for medical sensor monitoring devices (non-life-support) because its low deep-sleep current extends battery life for portable patient monitors and remote wearables, while the 128 KB Flash stores signal-processing firmware and BLE/USB-ADC bridge logic. The 10-bit ADC2 samples multiple biosensor channels (temperature, SpO2, respiration) with hardware averaging, reducing CPU wakeups. The 4 KB RAM buffers sample windows for transmission, and the 1 KB EEPROM stores patient calibration data. The Extended temperature grade supports skin-contact thermography applications. Pair with the PIC18LF26K42-I/ML for sub-system sensor front-ends.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC18LF67K40-E/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC18F67K40-E/MR | PIC18LF67K40-I/MR | PIC18LF67K40T-E/MR | PIC18LF66K40-E/MR | PIC18LF65K40-E/MR |
|---|---|---|---|---|---|---|
| Package | VQFN-64 (9x9 mm) MR | VQFN-64 (9x9 mm) MR - same | VQFN-64 (9x9 mm) MR - same | VQFN-64 (9x9 mm) MR - same | VQFN-64 (9x9 mm) MR - same | VQFN-64 (9x9 mm) MR - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Supply Voltage | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB (-50%) | 32 KB (-75%) |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 3.6 KB | 2 KB |
| Operating Temperature | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Maximum CPU Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| 10-bit ADC2 Channels | up to 47 | up to 47 | up to 47 | up to 47 | up to 47 | up to 47 |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
Wichtigste Unterscheidungsmerkmale
- Highest Flash density in the 64-pin K40 LF family (vs. PIC18LF66K40-E/MR)
- Extended -40C to +125C operating range for industrial/automotive-adjacent use (vs. PIC18LF67K40-I/MR)
- LF 1.8 V minimum VDD for single-cell Li-ion battery operation (vs. PIC18F67K40-E/MR)
- Integrated 10-bit ADC2 with Computation (hardware averaging) and 47 channels (vs. PIC18LF65K40-E/MR)
Designhinweise
Estimated: The VQFN-64 (9x9 mm) package requires the exposed pad (pin 65) be soldered to a ground plane of at least 1 square inch (6.45 cm^2) to achieve the datasheet thermal resistance of approximately 30 C/W. Without this, junction temperature can rise 50-80% faster under load. Add 0.1 uF ceramic bypass capacitors within 3 mm of each VDD pin cluster (there are 4 VDD pins: 10, 20, 42, 57) and a single 1 uF bulk capacitor near the package. Route MCLR with a 10 kohm pull-up to VDD and a 100 nF cap to ground for noise immunity. Keep high-speed digital signals (ICSP PGC/PGD on RB6/RB7) away from analogue traces to prevent ADC coupling.
Use the XLP (eXtreme Low Power) features carefully to maximise battery life. According to the datasheet, deep-sleep current at 25 C with RTCC running is typically 0.7-1.0 uA, but only if all peripherals are properly disabled in their PMD (Peripheral Module Disable) registers before entering Sleep. Configure the VREGPM bit to select the lowest voltage regulator standby mode for long-term sleep. The HFINTOSC should be switched to LFINTOSC (31 kHz) before Sleep to eliminate high-frequency oscillator current. A common pitfall: leaving the FVR (Fixed Voltage Reference) enabled during Sleep consumes 25 uA continuously and dominates the sleep budget.
Three common pitfalls when designing with the PIC18LF67K40-E/MR: (1) Confusing the LF (1.8-3.6 V) and F (2.3-5.5 V) variants - the LF silicon will latch up or draw 5-10 mA extra if powered at 5 V; always verify the 'LF' suffix. (2) Forgetting that the ICSP PGC/PGD pins (RB6/RB7) must be isolated from external pull-ups above 5 kohm during in-circuit programming, otherwise the programmer cannot drive the lines. (3) Failing to configure the PPS (Peripheral Pin Select) module to map UART/SPI/I2C to specific pins - the K40 sub-family uses PPS for digital peripheral routing and silent failures occur when PPSSEL/SPS register is not set.
Separate analogue and digital grounds with a star-ground topology at the VSS pins. The 10-bit ADC2 accuracy depends on minimising digital switching noise on the analogue supply rail - use a ferrite bead between VDD digital and AVDD if available, or at least route the ADC reference (VREF+) through an RC filter with a 10 ohm resistor and 100 nF cap. The exposed pad of the VQFN-64 package should be tied to VSS through multiple thermal vias (typically 9-12 vias in a 3x3 grid with 0.3 mm drill / 0.5 mm pad) to maximise heat flow into inner ground planes.
Compliance-Informationen
RoHS and REACH compliant per Microchip product environmental compliance documents. MSL Level 3 per JEDEC J-STD-020. NOT AEC-Q100 qualified - for automotive safety-critical systems, use AEC-Q100 screened variants such as PIC18F67K40-E/MRVAO. Lead-free (Pb-free) reflow-compatible to 260C peak per IPC/JEDEC J-STD-020.
