PIC24EP128GP206-H/MR - 16-bit 70 MIPS MCU 128KB Flash 64-pin VQFN | Microchip
Teilenummer: PIC24EP128GP206-H/MR ✓ AktivPIC24EP128GP206-H/MR Übersicht
What is a PIC24E general-purpose microcontroller? The PIC24E family sits in the 16-bit MCU segment of Microchip's product hierarchy (16-bit MCU -> microcontroller -> embedded computing -> semiconductor), offering a 16-bit modified Harvard architecture with DSP-oriented instructions. The 'E' series pushes performance to 70 MIPS (versus 16 MIPS on the older PIC24F), while preserving the deterministic interrupt model and rich peripheral set that makes PIC microcontrollers a workhorse for real-time embedded designs. The /MR suffix indicates a 64-pin VQFN package, the /H suffix denotes an extended temperature grade (-40C to +150C), and the -GP variant targets general-purpose applications without on-chip DSC (digital signal controller) features.
Key features of the PIC24EP128GP206-H/MR include a 70 MIPS CPU core with single-cycle 16x16 MAC, dual 36/40/48 KB Flash options in the family, 10-bit/12-bit ADC with multiple conversion modes, up to 53 general-purpose I/O pins, multiple communication peripherals (UART, SPI, I2C), enhanced PWM with up to 9 channels, Peripheral Trigger Generator (PTG) for complex timing, and a CTMU for capacitive touch and time measurement. The 64-pin VQFN package provides a compact 9x9 mm footprint with an exposed thermal pad that lowers thermal resistance for high-MIPS continuous operation.
Typical applications include industrial motor control and variable-frequency drives, advanced sensor signal conditioning, LED lighting controllers, UPS and power conversion, automotive body and chassis subsystems (with proper qualification), digital power conversion, and high-performance consumer appliances. The 70 MIPS performance and DSP instructions also support audio processing and real-time control loops where deterministic execution is critical.
When designing with the PIC24EP128GP206-H/MR, observe the -40C to +150C extended operating temperature, which requires PCB layout that ensures the exposed pad is soldered for proper heat dissipation. The device supports 3.0V to 3.6V single-supply operation; pair the MCU with a low-noise LDO such as the MCP1700 or TPS7A4700 family and decouple every VDD/AVDD pair with 100 nF ceramic capacitors placed within 3 mm of the pins. The H/MR suffix combination indicates a specialized extended-temperature part; verify lead time through authorized distributors before committing to production schedules.
Drop-in-Alternativen für PIC24EP128GP206-H/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24EP128GP206-H/MR (gleiche Bauform und Footprint) – abweichend in Core Architecture, PWM Channels, Package, Program Memory (Flash).
PIC24EP128GP206-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP128GP206-E/MR
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →PIC24EP128MC206-H/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP256GP206-H/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP128GP206-H/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit PIC24E enhanced CPU |
| CPU Performance | 70 MIPS |
| Program Memory (Flash) | 128 KB |
| Data Memory (RAM) | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC Resolution | 12-bit |
| ADC Sample Rate | 1.1 Msps (maximum, per family datasheet) |
| Betriebstemperaturbereich | -40 C to +150 C (extended grade, -H suffix) |
| Gehäuse | 64-pin VQFN (MR), 9 x 9 mm with EP |
| I/O Pins (max) | 53 |
| PWM Channels | Up to 9 (family maximum) |
| Communication Peripherals | UART, SPI, I2C |
| Special Peripherals | CTMU, on-chip op-amps, Peripheral Trigger Generator (PTG) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC24EP128GP206-H/MR Pin-Konfiguration
| Pin 1 | RB0 — Port B I/O pin 0 / AN0 |
| Pin 2 | RB1 — Port B I/O pin 1 / AN1 |
| Pin 3 | RB2 — Port B I/O pin 2 / AN2 |
| Pin 4 | RB3 — Port B I/O pin 3 / AN3 |
| Pin 5 | VSS — Ground reference |
| Pin 6 | RB4 — Port B I/O pin 4 / AN4 |
| Pin 7 | RB5 — Port B I/O pin 5 / AN5 |
| Pin 8 | RB6 — Port B I/O pin 6 / AN6 |
| Pin 9 | RB7 — Port B I/O pin 7 / AN7 |
| Pin 10 | RB8 — Port B I/O pin 8 / AN8 |
| Pin 11 | RB9 — Port B I/O pin 9 / AN9 |
| Pin 12 | RB10 — Port B I/O pin 10 / AN10 |
| Pin 13 | RB11 — Port B I/O pin 11 / AN11 |
| Pin 14 | RB12 — Port B I/O pin 12 / AN12 |
| Pin 15 | RB13 — Port B I/O pin 13 / AN13 |
| Pin 16 | RB14 — Port B I/O pin 14 / AN14 |
| Pin 17 | RB15 — Port B I/O pin 15 / AN15 |
| Pin 18 | VSS — Ground reference |
| Pin 19 | VDD — Digital supply voltage (3.0-3.6 V) |
| Pin 20 | RC1 — Port C I/O pin 1 |
| Pin 21 | RC2 — Port C I/O pin 2 |
| Pin 22 | RC3 — Port C I/O pin 3 |
| Pin 23 | RC4 — Port C I/O pin 4 |
| Pin 24 | OSCI — Primary oscillator input |
| Pin 25 | OSCO — Primary oscillator output |
| Pin 26 | RC13 — Port C I/O pin 13 |
| Pin 27 | RC14 — Port C I/O pin 14 |
| Pin 28 | RC15 — Port C I/O pin 15 |
| Pin 29 | RD0 — Port D I/O pin 0 |
| Pin 30 | RD1 — Port D I/O pin 1 |
| Pin 31 | RD2 — Port D I/O pin 2 |
| Pin 32 | RD3 — Port D I/O pin 3 |
| Pin 33 | RD4 — Port D I/O pin 4 |
| Pin 34 | RD5 — Port D I/O pin 5 |
| Pin 35 | RD6 — Port D I/O pin 6 |
| Pin 36 | RD7 — Port D I/O pin 7 |
| Pin 37 | RD8 — Port D I/O pin 8 |
| Pin 38 | RD9 — Port D I/O pin 9 |
| Pin 39 | RD10 — Port D I/O pin 10 |
| Pin 40 | RD11 — Port D I/O pin 11 |
| Pin 41 | RD12 — Port D I/O pin 12 |
| Pin 42 | RD13 — Port D I/O pin 13 |
| Pin 43 | RD14 — Port D I/O pin 14 |
| Pin 44 | RD15 — Port D I/O pin 15 |
| Pin 45 | VSS — Ground reference |
| Pin 46 | VDD — Digital supply voltage (3.0-3.6 V) |
| Pin 47 | RE0 — Port E I/O pin 0 |
| Pin 48 | RE1 — Port E I/O pin 1 |
| Pin 49 | RE2 — Port E I/O pin 2 |
| Pin 50 | RE3 — Port E I/O pin 3 |
| Pin 51 | RE4 — Port E I/O pin 4 |
| Pin 52 | RE5 — Port E I/O pin 5 |
| Pin 53 | RE6 — Port E I/O pin 6 |
| Pin 54 | RE7 — Port E I/O pin 7 |
| Pin 55 | RF0 — Port F I/O pin 0 |
| Pin 56 | RF1 — Port F I/O pin 1 |
| Pin 57 | RF2 — Port F I/O pin 2 |
| Pin 58 | RF3 — Port F I/O pin 3 |
| Pin 59 | RF4 — Port F I/O pin 4 |
| Pin 60 | RF5 — Port F I/O pin 5 |
| Pin 61 | RF6 — Port F I/O pin 6 |
| Pin 62 | RF7 — Port F I/O pin 7 |
| Pin 63 | RF8 — Port F I/O pin 8 |
| Pin 64 | RG9 — Port G I/O pin 9 |
Typische Anwendungen
PIC24EP128GP206-H/MR ist geeignet für 6 Anwendungs: Industrial Motor Control and Variable Frequency Drives, Automotive Body and Chassis Subsystems, Digital Power Conversion and UPS Systems, Advanced Sensor Signal Conditioning Hubs, LED Lighting and Architectural Controllers, Medical Patient Monitoring and Diagnostic Devices.
Industrial Motor Control and Variable Frequency Drives
The PIC24EP128GP206-H/MR suits motor control and VFD designs thanks to its 70 MIPS core, 12-bit ADC at 1.1 Msps, and up to 9 enhanced PWM channels. Place it as the central control unit for sensorless FOC or trapezoidal commutation of BLDC and PMSM motors in industrial VFDs up to several kW. The extended -40C to +150C temperature grade supports under-hood or cabinet-mounted deployments. Pair with external gate drivers such as the MCP8024 or UCC27714 to drive IGBT/MOSFET bridges, and use the on-chip op-amps for current-sense amplification before ADC sampling.
Empfohlen
Automotive Body and Chassis Subsystems
The PIC24EP128GP206-H/MR fits automotive body controllers, lighting modules, HVAC actuators, and chassis subsystems because of its +150C extended temperature grade and 70 MIPS deterministic real-time performance. The CTMU peripheral enables capacitive touch sensing for door handles and control panels, while the multiple UART/SPI/I2C ports interface with LIN, CAN bus controllers, and sensor clusters. The 64-pin VQFN package is footprint-compatible with other PIC24EP family members, easing platform reuse across vehicle programs. Note that automotive safety-critical applications typically require the AEC-Q100-qualified dsPIC33EP variant instead.
Empfohlen
Digital Power Conversion and UPS Systems
The PIC24EP128GP206-H/MR drives digital PFC, LLC, and full-bridge converter topologies where the 70 MIPS core runs control loops at 50 to 200 kHz with margin. Its 12-bit ADC samples voltage and current feedback within microseconds, while the PWM peripherals generate phase-shifted gate signals for bridgeless PFC and resonant LLC stages. The extended temperature grade supports inside the UPS enclosure near power components. Use the CTMU and op-amps for current-mode control feedback paths; this device is paired with digital isolators such as the Si8271 for gate drive isolation.
Empfohlen
Advanced Sensor Signal Conditioning Hubs
The PIC24EP128GP206-H/MR serves as a multi-sensor hub in industrial IoT edge nodes thanks to its 12-bit ADC, CTMU for time-of-flight and capacitive sensing, and the on-chip op-amps for analog front-end filtering. Connect it to thermistor bridges, strain-gauge load cells, and 4-20 mA current loops for process automation. The 70 MIPS performance runs FFT-based vibration analysis and predictive-maintenance algorithms locally before forwarding alerts via UART/SPI/I2C to a wireless co-processor. The +150C grade supports outdoor or under-hood sensor deployment.
Empfohlen
LED Lighting and Architectural Controllers
The PIC24EP128GP206-H/MR drives DMX512, DALI, and architectural LED controllers where 9 PWM channels generate smooth 16-bit dimming curves at frequencies above 1 kHz to avoid flicker. Its 128 KB Flash stores large color-mixing lookup tables, while the CTMU enables capacitive touch sliders and proximity sensors on lighting fixtures. The 70 MIPS core runs scripting engines for pixel-mapping and zone control, and the extended temperature grade supports outdoor architectural installations. Pair with constant-current LED drivers such as the CL88030 or TPS92515 for high-brightness strings.
Empfohlen
Medical Patient Monitoring and Diagnostic Devices
The PIC24EP128GP206-H/MR fits non-critical patient-monitoring peripherals such as pulse oximetry front-ends, digital thermometers, and ambulatory Holter monitors where 70 MIPS provides DSP headroom for FIR/IIR filtering of bioelectric signals. The on-chip 12-bit ADC combined with external 16/24-bit delta-sigma ADCs captures ECG and SpO2 waveforms; the 64-pin VQFN keeps the device footprint compact for wearable form factors. Note that IEC 60601-1 patient-isolated designs require additional isolation barriers and the user must verify medical-device regulatory requirements per jurisdiction.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24EP128GP206-H/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24EP128GP206-I/MR | PIC24EP128GP206-E/MR | PIC24EP128MC206-H/MR | PIC24EP256GP206-H/MR |
|---|---|---|---|---|---|
| Package | VQFN-64 (MR), 9x9 mm | VQFN-64 (MR) - same | VQFN-64 (MR) - same | VQFN-64 (MR) - same | VQFN-64 (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB |
| Data RAM | 16 KB | 16 KB | 16 KB | 16 KB | 24 KB |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40 C to +150 C | -40 C to +85 C | -40 C to +125 C | -40 C to +150 C | -40 C to +150 C |
| Variant Type | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) | General Purpose (GP) |
Wichtigste Unterscheidungsmerkmale
- Extended +150 C operating temperature vs industrial-grade peers (vs. PIC24EP128GP206-I/MR)
- 70 MIPS core vs older PIC24F at 16 MIPS (vs. PIC24FJ64GA002 family)
- On-chip op-amps and CTMU for analog front-end integration (vs. PIC24EP128MC206-H/MR)
Designhinweise
Use a low-noise 3.3 V LDO such as the MCP1700 to power AVDD and VDD from the same source within 0.3 V. Place a 10 uF bulk capacitor and a 0.1 uF ceramic decoupling capacitor within 3 mm of each VDD/AVDD pair. Avoid using switching regulators directly to supply the MCU; ripple above 50 mVpk can couple into the ADC and degrade conversion accuracy. The /H grade part consumes approximately 80 mA peak at 70 MIPS operation, so verify the LDO can source at least 120 mA with thermal margin.
Estimated: at 70 MIPS continuous execution with all peripherals active, power dissipation is approximately 0.265 W (3.3 V x 80 mA). With VQFN-64 theta_JA of approximately 24 C/W on a 4-layer JEDEC PCB, junction temperature rise above ambient is approximately 6.4 C. The /H grade silicon is rated to +150 C junction, providing ample thermal margin in industrial and under-hood environments. Always solder the central exposed pad to a continuous ground copper pour with multiple thermal vias for best thermal performance.
Use a 4-layer PCB with a dedicated ground plane beneath the VQFN-64 footprint to minimize EMI and provide thermal relief. Stitch the perimeter of the QFN land pattern with a ground ring connected by 0.5 mm spaced vias. Route the OSCI/OSCO traces as short as possible with a continuous ground reference on the adjacent layer. Keep ADC analog traces (AN0-AN15) routed away from PWM and switching signals to preserve 12-bit conversion accuracy.
Do not assume the 64-pin VQFN package is pin-compatible with the 64-pin TQFP variant; the QFN has a different land pattern and pin-1 indicator location. Also note that the PIC24EP128GP206-H/MR is a special-order /H extended-temperature part with longer lead times; for prototypes where 85 C ambient is sufficient, the /I grade reduces cost and lead time. Verify the latest errata document from Microchip before committing to production; some silicon revisions have known ADC and PWM timing anomalies.
Compliance-Informationen
RoHS and REACH compliance per Microchip product page. The /H temperature grade is not equivalent to AEC-Q100 automotive qualification; for AEC-Q100 qualified parts, choose the dsPIC33EP variant explicitly listed as automotive-grade.
