PIC24EP128GP206-H/MR - 16-bit 70 MIPS MCU 128KB Flash 64-pin VQFN | Microchip
Référence : PIC24EP128GP206-H/MR ✓ ActifPIC24EP128GP206-H/MR Présentation
What is a PIC24E general-purpose microcontroller? The PIC24E family sits in the 16-bit MCU segment of Microchip's product hierarchy (16-bit MCU -> microcontroller -> embedded computing -> semiconductor), offering a 16-bit modified Harvard architecture with DSP-oriented instructions. The 'E' series pushes performance to 70 MIPS (versus 16 MIPS on the older PIC24F), while preserving the deterministic interrupt model and rich peripheral set that makes PIC microcontrollers a workhorse for real-time embedded designs. The /MR suffix indicates a 64-pin VQFN package, the /H suffix denotes an extended temperature grade (-40C to +150C), and the -GP variant targets general-purpose applications without on-chip DSC (digital signal controller) features.
Key features of the PIC24EP128GP206-H/MR include a 70 MIPS CPU core with single-cycle 16x16 MAC, dual 36/40/48 KB Flash options in the family, 10-bit/12-bit ADC with multiple conversion modes, up to 53 general-purpose I/O pins, multiple communication peripherals (UART, SPI, I2C), enhanced PWM with up to 9 channels, Peripheral Trigger Generator (PTG) for complex timing, and a CTMU for capacitive touch and time measurement. The 64-pin VQFN package provides a compact 9x9 mm footprint with an exposed thermal pad that lowers thermal resistance for high-MIPS continuous operation.
Typical applications include industrial motor control and variable-frequency drives, advanced sensor signal conditioning, LED lighting controllers, UPS and power conversion, automotive body and chassis subsystems (with proper qualification), digital power conversion, and high-performance consumer appliances. The 70 MIPS performance and DSP instructions also support audio processing and real-time control loops where deterministic execution is critical.
When designing with the PIC24EP128GP206-H/MR, observe the -40C to +150C extended operating temperature, which requires PCB layout that ensures the exposed pad is soldered for proper heat dissipation. The device supports 3.0V to 3.6V single-supply operation; pair the MCU with a low-noise LDO such as the MCP1700 or TPS7A4700 family and decouple every VDD/AVDD pair with 100 nF ceramic capacitors placed within 3 mm of the pins. The H/MR suffix combination indicates a specialized extended-temperature part; verify lead time through authorized distributors before committing to production schedules.
Alternatives de remplacement direct pour PIC24EP128GP206-H/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP128GP206-H/MR (même facteur de forme et même empreinte) — différant par Core Architecture, PWM Channels, Package, Program Memory (Flash).
PIC24EP128GP206-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP128GP206-E/MR
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →PIC24EP128MC206-H/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP256GP206-H/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP128GP206-H/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit PIC24E enhanced CPU |
| CPU Performance | 70 MIPS |
| Program Memory (Flash) | 128 KB |
| Data Memory (RAM) | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC Resolution | 12-bit |
| ADC Sample Rate | 1.1 Msps (maximum, per family datasheet) |
| Plage de température de fonctionnement | -40 C to +150 C (extended grade, -H suffix) |
| Boîtier | 64-pin VQFN (MR), 9 x 9 mm with EP |
| I/O Pins (max) | 53 |
| PWM Channels | Up to 9 (family maximum) |
| Communication Peripherals | UART, SPI, I2C |
| Special Peripherals | CTMU, on-chip op-amps, Peripheral Trigger Generator (PTG) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC24EP128GP206-H/MR
| Broche 1 | RB0 — Port B I/O pin 0 / AN0 |
| Broche 2 | RB1 — Port B I/O pin 1 / AN1 |
| Broche 3 | RB2 — Port B I/O pin 2 / AN2 |
| Broche 4 | RB3 — Port B I/O pin 3 / AN3 |
| Broche 5 | VSS — Ground reference |
| Broche 6 | RB4 — Port B I/O pin 4 / AN4 |
| Broche 7 | RB5 — Port B I/O pin 5 / AN5 |
| Broche 8 | RB6 — Port B I/O pin 6 / AN6 |
| Broche 9 | RB7 — Port B I/O pin 7 / AN7 |
| Broche 10 | RB8 — Port B I/O pin 8 / AN8 |
| Broche 11 | RB9 — Port B I/O pin 9 / AN9 |
| Broche 12 | RB10 — Port B I/O pin 10 / AN10 |
| Broche 13 | RB11 — Port B I/O pin 11 / AN11 |
| Broche 14 | RB12 — Port B I/O pin 12 / AN12 |
| Broche 15 | RB13 — Port B I/O pin 13 / AN13 |
| Broche 16 | RB14 — Port B I/O pin 14 / AN14 |
| Broche 17 | RB15 — Port B I/O pin 15 / AN15 |
| Broche 18 | VSS — Ground reference |
| Broche 19 | VDD — Digital supply voltage (3.0-3.6 V) |
| Broche 20 | RC1 — Port C I/O pin 1 |
| Broche 21 | RC2 — Port C I/O pin 2 |
| Broche 22 | RC3 — Port C I/O pin 3 |
| Broche 23 | RC4 — Port C I/O pin 4 |
| Broche 24 | OSCI — Primary oscillator input |
| Broche 25 | OSCO — Primary oscillator output |
| Broche 26 | RC13 — Port C I/O pin 13 |
| Broche 27 | RC14 — Port C I/O pin 14 |
| Broche 28 | RC15 — Port C I/O pin 15 |
| Broche 29 | RD0 — Port D I/O pin 0 |
| Broche 30 | RD1 — Port D I/O pin 1 |
| Broche 31 | RD2 — Port D I/O pin 2 |
| Broche 32 | RD3 — Port D I/O pin 3 |
| Broche 33 | RD4 — Port D I/O pin 4 |
| Broche 34 | RD5 — Port D I/O pin 5 |
| Broche 35 | RD6 — Port D I/O pin 6 |
| Broche 36 | RD7 — Port D I/O pin 7 |
| Broche 37 | RD8 — Port D I/O pin 8 |
| Broche 38 | RD9 — Port D I/O pin 9 |
| Broche 39 | RD10 — Port D I/O pin 10 |
| Broche 40 | RD11 — Port D I/O pin 11 |
| Broche 41 | RD12 — Port D I/O pin 12 |
| Broche 42 | RD13 — Port D I/O pin 13 |
| Broche 43 | RD14 — Port D I/O pin 14 |
| Broche 44 | RD15 — Port D I/O pin 15 |
| Broche 45 | VSS — Ground reference |
| Broche 46 | VDD — Digital supply voltage (3.0-3.6 V) |
| Broche 47 | RE0 — Port E I/O pin 0 |
| Broche 48 | RE1 — Port E I/O pin 1 |
| Broche 49 | RE2 — Port E I/O pin 2 |
| Broche 50 | RE3 — Port E I/O pin 3 |
| Broche 51 | RE4 — Port E I/O pin 4 |
| Broche 52 | RE5 — Port E I/O pin 5 |
| Broche 53 | RE6 — Port E I/O pin 6 |
| Broche 54 | RE7 — Port E I/O pin 7 |
| Broche 55 | RF0 — Port F I/O pin 0 |
| Broche 56 | RF1 — Port F I/O pin 1 |
| Broche 57 | RF2 — Port F I/O pin 2 |
| Broche 58 | RF3 — Port F I/O pin 3 |
| Broche 59 | RF4 — Port F I/O pin 4 |
| Broche 60 | RF5 — Port F I/O pin 5 |
| Broche 61 | RF6 — Port F I/O pin 6 |
| Broche 62 | RF7 — Port F I/O pin 7 |
| Broche 63 | RF8 — Port F I/O pin 8 |
| Broche 64 | RG9 — Port G I/O pin 9 |
Applications typiques
PIC24EP128GP206-H/MR convient pour 6 applications: Industrial Motor Control and Variable Frequency Drives, Automotive Body and Chassis Subsystems, Digital Power Conversion and UPS Systems, Advanced Sensor Signal Conditioning Hubs, LED Lighting and Architectural Controllers, Medical Patient Monitoring and Diagnostic Devices.
Industrial Motor Control and Variable Frequency Drives
The PIC24EP128GP206-H/MR suits motor control and VFD designs thanks to its 70 MIPS core, 12-bit ADC at 1.1 Msps, and up to 9 enhanced PWM channels. Place it as the central control unit for sensorless FOC or trapezoidal commutation of BLDC and PMSM motors in industrial VFDs up to several kW. The extended -40C to +150C temperature grade supports under-hood or cabinet-mounted deployments. Pair with external gate drivers such as the MCP8024 or UCC27714 to drive IGBT/MOSFET bridges, and use the on-chip op-amps for current-sense amplification before ADC sampling.
Recommandé
Automotive Body and Chassis Subsystems
The PIC24EP128GP206-H/MR fits automotive body controllers, lighting modules, HVAC actuators, and chassis subsystems because of its +150C extended temperature grade and 70 MIPS deterministic real-time performance. The CTMU peripheral enables capacitive touch sensing for door handles and control panels, while the multiple UART/SPI/I2C ports interface with LIN, CAN bus controllers, and sensor clusters. The 64-pin VQFN package is footprint-compatible with other PIC24EP family members, easing platform reuse across vehicle programs. Note that automotive safety-critical applications typically require the AEC-Q100-qualified dsPIC33EP variant instead.
Recommandé
Digital Power Conversion and UPS Systems
The PIC24EP128GP206-H/MR drives digital PFC, LLC, and full-bridge converter topologies where the 70 MIPS core runs control loops at 50 to 200 kHz with margin. Its 12-bit ADC samples voltage and current feedback within microseconds, while the PWM peripherals generate phase-shifted gate signals for bridgeless PFC and resonant LLC stages. The extended temperature grade supports inside the UPS enclosure near power components. Use the CTMU and op-amps for current-mode control feedback paths; this device is paired with digital isolators such as the Si8271 for gate drive isolation.
Recommandé
Advanced Sensor Signal Conditioning Hubs
The PIC24EP128GP206-H/MR serves as a multi-sensor hub in industrial IoT edge nodes thanks to its 12-bit ADC, CTMU for time-of-flight and capacitive sensing, and the on-chip op-amps for analog front-end filtering. Connect it to thermistor bridges, strain-gauge load cells, and 4-20 mA current loops for process automation. The 70 MIPS performance runs FFT-based vibration analysis and predictive-maintenance algorithms locally before forwarding alerts via UART/SPI/I2C to a wireless co-processor. The +150C grade supports outdoor or under-hood sensor deployment.
Recommandé
LED Lighting and Architectural Controllers
The PIC24EP128GP206-H/MR drives DMX512, DALI, and architectural LED controllers where 9 PWM channels generate smooth 16-bit dimming curves at frequencies above 1 kHz to avoid flicker. Its 128 KB Flash stores large color-mixing lookup tables, while the CTMU enables capacitive touch sliders and proximity sensors on lighting fixtures. The 70 MIPS core runs scripting engines for pixel-mapping and zone control, and the extended temperature grade supports outdoor architectural installations. Pair with constant-current LED drivers such as the CL88030 or TPS92515 for high-brightness strings.
Recommandé
Medical Patient Monitoring and Diagnostic Devices
The PIC24EP128GP206-H/MR fits non-critical patient-monitoring peripherals such as pulse oximetry front-ends, digital thermometers, and ambulatory Holter monitors where 70 MIPS provides DSP headroom for FIR/IIR filtering of bioelectric signals. The on-chip 12-bit ADC combined with external 16/24-bit delta-sigma ADCs captures ECG and SpO2 waveforms; the 64-pin VQFN keeps the device footprint compact for wearable form factors. Note that IEC 60601-1 patient-isolated designs require additional isolation barriers and the user must verify medical-device regulatory requirements per jurisdiction.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP128GP206-H/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP128GP206-I/MR | PIC24EP128GP206-E/MR | PIC24EP128MC206-H/MR | PIC24EP256GP206-H/MR |
|---|---|---|---|---|---|
| Package | VQFN-64 (MR), 9x9 mm | VQFN-64 (MR) - same | VQFN-64 (MR) - same | VQFN-64 (MR) - same | VQFN-64 (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB |
| Data RAM | 16 KB | 16 KB | 16 KB | 16 KB | 24 KB |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40 C to +150 C | -40 C to +85 C | -40 C to +125 C | -40 C to +150 C | -40 C to +150 C |
| Variant Type | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) | General Purpose (GP) |
Principaux différenciateurs
- Extended +150 C operating temperature vs industrial-grade peers (vs PIC24EP128GP206-I/MR)
- 70 MIPS core vs older PIC24F at 16 MIPS (vs PIC24FJ64GA002 family)
- On-chip op-amps and CTMU for analog front-end integration (vs PIC24EP128MC206-H/MR)
Notes de conception
Use a low-noise 3.3 V LDO such as the MCP1700 to power AVDD and VDD from the same source within 0.3 V. Place a 10 uF bulk capacitor and a 0.1 uF ceramic decoupling capacitor within 3 mm of each VDD/AVDD pair. Avoid using switching regulators directly to supply the MCU; ripple above 50 mVpk can couple into the ADC and degrade conversion accuracy. The /H grade part consumes approximately 80 mA peak at 70 MIPS operation, so verify the LDO can source at least 120 mA with thermal margin.
Estimated: at 70 MIPS continuous execution with all peripherals active, power dissipation is approximately 0.265 W (3.3 V x 80 mA). With VQFN-64 theta_JA of approximately 24 C/W on a 4-layer JEDEC PCB, junction temperature rise above ambient is approximately 6.4 C. The /H grade silicon is rated to +150 C junction, providing ample thermal margin in industrial and under-hood environments. Always solder the central exposed pad to a continuous ground copper pour with multiple thermal vias for best thermal performance.
Use a 4-layer PCB with a dedicated ground plane beneath the VQFN-64 footprint to minimize EMI and provide thermal relief. Stitch the perimeter of the QFN land pattern with a ground ring connected by 0.5 mm spaced vias. Route the OSCI/OSCO traces as short as possible with a continuous ground reference on the adjacent layer. Keep ADC analog traces (AN0-AN15) routed away from PWM and switching signals to preserve 12-bit conversion accuracy.
Do not assume the 64-pin VQFN package is pin-compatible with the 64-pin TQFP variant; the QFN has a different land pattern and pin-1 indicator location. Also note that the PIC24EP128GP206-H/MR is a special-order /H extended-temperature part with longer lead times; for prototypes where 85 C ambient is sufficient, the /I grade reduces cost and lead time. Verify the latest errata document from Microchip before committing to production; some silicon revisions have known ADC and PWM timing anomalies.
Informations de conformité
RoHS and REACH compliance per Microchip product page. The /H temperature grade is not equivalent to AEC-Q100 automotive qualification; for AEC-Q100 qualified parts, choose the dsPIC33EP variant explicitly listed as automotive-grade.
