PIC24EP256GU810T-I/BG - 16-bit 60 MIPS MCU, 256KB Flash | Microchip
Teilenummer: PIC24EP256GU810T-I/BG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.45 | $84,50 |
| 100 | $7.3 | $730,00 |
| 500 | $6.55 | $3.275,00 |
| 1.000 | $5.8 | $5.800,00 |
PIC24EP256GU810T-I/BG Übersicht
An LDO (Low-Dropout) linear regulator is a type of voltage regulator that maintains a stable output voltage even when the input voltage approaches the output voltage; similarly, this MCU belongs to the wider microcontroller taxonomy: MCU -> 16-bit MCU -> PIC24 family -> PIC24EP "General Purpose" sub-family -> semiconductor. The PIC24E architecture uses a 16-bit modified Harvard bus with single-cycle MAC, hardware DSP extensions, and a 16 x 16-bit multiply, giving it signal-processing capability uncommon in general-purpose parts.
Key features include a 60 MHz core clock, 32-channel 10-bit/12-bit ADC (configurable resolution), USB 2.0 full-speed On-The-Go, two CAN 2.0B modules, 15 DMA channels, and nine 16-bit timers plus nine general purpose timers, four 32-bit timers and nine capture inputs. The device operates from 3.0 V to 3.6 V, supports -40C to +85C industrial temperature range, and integrates a chargeable real-time clock calendar, hardware crypto accelerators and JTAG/ICSP debug interfaces.
The PIC24EP256GU810 uses Microchip's enhanced 70 MIPS core with DSP instructions and 16-bit wide data paths, enabling real-time control loops (motor control, power conversion) and audio/signal processing in software. The 15-channel DMA offloads CPU bandwidth from peripheral transactions, while the 32-channel ADC supports up to 500 ksps conversions for precision analog acquisition.
Typical applications include industrial motor control (BLDC, PMSM, ACIM), USB peripherals, CAN-based automotive/industrial networking, digital signal processing front-ends, and high-density graphic display HMI systems. The wide peripheral mix also suits medical instrumentation, factory automation, and IoT edge nodes requiring robust connectivity.
Design consideration: when using the on-chip USB OTG controller, ensure the VUSB 3.3V rail is clean and the 0.1uF + 1uF decoupling network is placed within 5 mm of the VUSB pin to maintain USB compliance. The 121-ball TFBGA requires careful PCB layout with via-in-pad recommended for proper thermal dissipation and ground return.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für PIC24EP256GU810T-I/BG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24EP256GU810T-I/BG (gleiche Bauform und Footprint) – abweichend in Package, ADC, I/O Pins, Core, DMA Channels.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24EP256GU810-I/BG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP256GU810T-E/BG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP512GU810T-I/BG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256MU810T-I/BG
✅ Drop-In✓ Auf Lager
$5.25 / Stück
Datenblatt ansehen →PIC24EP256GU810-I/PT
✅ Drop-In✓ Auf Lager
$8.05 / Stück
Datenblatt ansehen →PIC24EP256GU810T-I/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP256GU810T-I/BG Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24E (16-bit modified Harvard) |
| Core Performance | 60 MIPS (70 MIPS peak) |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data Memory (SRAM) | 28 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 83 |
| ADC | 32-channel, 10/12-bit selectable |
| Timers | 9 x 16-bit + 4 x 32-bit + 9 x capture |
| DMA Channels | 15 |
| Communication | USB 2.0 FS OTG, 2 x CAN 2.0B, UART, SPI, I2C |
| Gehäuse | 121-ball TFBGA (10x10 mm), 0.80 mm pitch |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Montageart | Surface Mount |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
PIC24EP256GU810T-I/BG 121-ball tfbga (10x10 mm), 0.80 mm pitch Pinbelegungsleitfaden
Pinbelegung für PIC24EP256GU810T-I/BG (121-ball tfbga (10x10 mm), 0.80 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC24EP256GU810T-I/BG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC24EP256GU810T-I/BG ist geeignet für 7 Anwendungs: Industrial Motor Control (BLDC/PMSM/ACIM), USB Peripheral Devices (HID, CDC, MSD), CAN-Based Industrial Fieldbus Nodes, Digital Signal Processing Front-Ends, Graphical HMI Display Controllers, IoT Edge Sensor Hubs with USB/CAN Connectivity, Automotive Body and Chassis Controllers.
Industrial Motor Control (BLDC/PMSM/ACIM)
The PIC24EP256GU810T-I/BG fits industrial motor control because its 60 MIPS PIC24E core runs field-oriented control (FOC) loops at the 20 kHz PWM rates typical of BLDC/PMSM drives without leaving headroom for housekeeping. Its nine 16-bit plus four 32-bit timers supply the six PWMs, quadrature encoder input, and sample timing needed for three-phase sensorless or sensored FOC. The 32-channel 10/12-bit ADC handles current shunt, BEMF, and DC-bus sensing simultaneously, while the 256 KB Flash stores field tables and the 28 KB SRAM keeps PI-state and Park/Clarke transform buffers resident. Engineers use this part in compact TFBGA-121 motor drive modules where the 10x10 mm footprint and on-chip CAN enable fieldbus integration without external glue logic.
Empfohlen
USB Peripheral Devices (HID, CDC, MSD)
The PIC24EP256GU810T-I/BG fits USB peripheral designs because its integrated USB 2.0 full-speed OTG controller with on-chip transceiver eliminates external PHY chips, reducing BOM cost and PCB area. The 256 KB Flash and 28 KB SRAM comfortably host USB device stacks (CDC, HID, MSD, vendor class) with room for application logic, while the 60 MIPS core handles enumeration, interrupt-driven transfers, and protocol overhead without throttling user code. Its 83 I/O pins expose ample GPIO for buttons, LEDs, LCDs, and sensors, and the 121-ball TFBGA-121 fits consumer-grade compact enclosures.
Empfohlen
CAN-Based Industrial Fieldbus Nodes
The PIC24EP256GU810T-I/BG fits CAN-based industrial fieldbus because its dual CAN 2.0B modules handle two independent bus segments simultaneously, useful for bridging CANopen and DeviceNet or running redundant bus topology. The 15-channel DMA offloads CAN RX buffer draining from the CPU, and the 256 KB Flash stores CANopen object dictionaries plus the application stack. Its 60 MIPS core sustains 1 Mbit/s CAN throughput while servicing 83 I/O for sensor/actuator interfaces. The industrial -40C to +85C rating and TFBGA-121 footprint suit factory-automation I/O modules and PLC expansion cards.
Empfohlen
Digital Signal Processing Front-Ends
The PIC24EP256GU810T-I/BG fits DSP front-end processing because its PIC24E core includes single-cycle MAC and 16x16-bit multiply instructions capable of running FIR, IIR, and FFT algorithms in software. The 28 KB SRAM accommodates 256-point FFT working buffers, and the 32-channel 10/12-bit ADC streams audio or vibration data at 500 ksps while DMA feeds it into processing pipelines without CPU intervention. Engineers use this part in vibration analyzers, condition-monitoring sensors, and audio processing nodes where deterministic low-latency response matters.
Empfohlen
Graphical HMI Display Controllers
The PIC24EP256GU810T-I/BG fits graphical HMI designs because its PIC24E core plus parallel master port can drive TFT LCD panels at QVGA resolution, and the 256 KB Flash stores fonts, icons, and screen templates. The 28 KB SRAM holds display frame buffers or double-buffered graphics, while 83 I/O provides abundant pins for touch sensing, keypad scanning, and LED status indicators. Designers choose this part for industrial operator panels, appliance controls, and medical device front panels requiring responsive color graphics in a compact 10x10 mm BGA footprint.
Empfohlen
IoT Edge Sensor Hubs with USB/CAN Connectivity
The PIC24EP256GU810T-I/BG fits IoT edge sensor hubs because its 256 KB Flash and 28 KB SRAM support edge-side aggregation, filtering, and decision logic before upstream transmission over USB or CAN. The 15-channel DMA enables simultaneous sensor sampling without CPU loading, while the dual CAN and USB OTG provide flexible field-area-network uplinks. With 83 I/O and 32 ADC channels, this MCU aggregates data from many analog/digital sensors in industrial IoT nodes, predictive-maintenance sensors, and smart-factory gateways. The industrial -40C to +85C rating ensures field deployment reliability.
Empfohlen
Automotive Body and Chassis Controllers
The PIC24EP256GU810T-I/BG fits automotive body/chassis ECUs because its dual CAN 2.0B modules handle body-controller bus topologies common in modern vehicles, and its 60 MIPS core runs multiplexed switch/lighting debounce, dimming, and fault-detection algorithms. The 83 I/O drives body loads (door locks, lights, mirrors) directly or via smart drivers, while the 32-channel ADC monitors battery voltage, current, and analog sensor inputs. Although the "-I" variant is industrial grade (-40C to +85C), the PIC24EP256GU810T-E/BG extended-temperature variant on the same footprint targets harsher under-hood or cabin installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24EP256GU810T-I/BG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24EP256GU810-I/BG | PIC24EP256GU810T-E/BG | PIC24EP512GU810T-I/BG | dsPIC33EP256MU810T-I/BG | PIC24EP256GU810-I/PT | PIC24EP256GU810T-I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-ball TFBGA (10x10 mm) | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | TQFP-100 (12x12 mm) - different | TQFP-100 (12x12 mm) - different |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 28 KB | 28 KB | 28 KB | 48 KB | 28 KB | 28 KB | 28 KB |
| Core Performance | 60 MIPS (70 peak) | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS + DSP extensions | 60 MIPS | 60 MIPS |
| I/O Pins | 83 | 83 | 83 | 83 | 83 | 65 | 65 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| USB OTG | Yes (USB 2.0 FS) | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN Modules | 2 x CAN 2.0B | 2 | 2 | 2 | 2 | 2 | 2 |
Wichtigste Unterscheidungsmerkmale
- Dual CAN 2.0B plus USB OTG on a single MCU (vs. PIC24EP256GP206 (no USB))
- 15-channel DMA for low-CPU-overhead peripheral streaming (vs. PIC24EP256MC206)
- 121-ball TFBGA-121 with 0.80 mm pitch for compact industrial modules (vs. PIC24EP256GP204 (TQFP-44))
Designhinweise
The 121-ball TFBGA-121 package with 0.80 mm ball pitch requires via-in-pad PCB technology for proper ground and thermal dissipation. Per Microchip's layout guidelines, place a 6x6 ball-grid thermal via array under the center balls stitched to an inner ground plane. Use 0.4 mm drill / 0.2 mm pad micro-vias with filled-and-capped plating to maintain BGA coplanarity. Standard 4-layer FR4 stack-up (sig/gnd/pwr/sig) is sufficient for 60 MHz operation.
Provide separate analog and digital supplies: VDDCORE for the MCU core, VDDIO for digital I/O, AVDD/AVSS for the ADC analog section, and VUSB for the USB transceiver. Place 0.1 uF + 1 uF X7R ceramic decoupling on each VDD pin within 3 mm trace length. The USB VUSB pin specifically requires 0.1 uF + 1 uF + 10 uF bulk capacitance per USB 2.0 specification for full-speed OTG compliance. A ferrite bead between digital and analog rails prevents ADC reference contamination.
Estimated: at 60 MHz with all peripherals active, core current is approximately 60-80 mA from VDDCORE; designers must budget 100 mA for VDDCORE regulation headroom. Do not use the internal LDO as the sole analog supply; tie AVDD to VDDIO through a ferrite bead plus 10 uF cap to avoid ADC gain errors. The TFBGA-121 package cannot be hand-soldered - plan for reflow or hot-air rework with X-ray inspection. Configure unused I/O as outputs low, not inputs, to avoid shoot-through current.
Route 32-channel ADC analog inputs in a separate layer from digital signals, with ground-fill between analog and digital regions. Keep ADC traces <50 mm and pair each analog input with its own ground return to avoid common-mode noise pickup. For USB data lines (D+/D-), use 90-ohm differential impedance with matched-length routing and do not route over ground-plane splits; the USBLC6-2SC6 ESD protection array should be placed within 5 mm of the USB connector.
Compliance-Informationen
RoHS and REACH compliance per Microchip product page and JLCPCB listing. AEC-Q100 not qualified for the -I/BG variant; choose -E/BG extended temperature variant for harsh environments. Halogen-free status not explicitly stated in available data.
