DSPIC33EP256MU810T-I/BG - 16-bit 60MIPs DSC 256KB USB | Microchip
MPN: DSPIC33EP256MU810T-I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.25 | $72.50 |
| 100 | $6.4 | $640.00 |
| 500 | $5.8 | $2,900.00 |
| 1,000 | $5.25 | $5,250.00 |
DSPIC33EP256MU810T-I/BG Overview
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripherals and ease of use of a microcontroller (MCU). DSCs sit within the broader embedded processing hierarchy between general-purpose MCUs and dedicated DSPs, offering single-cycle MAC, DSP instruction support, and deterministic interrupt latency for real-time control loops.
Key features include the dsPIC33E core running at 60 MIPs, on-chip USB connectivity for direct host/device communication, high-speed PWM peripherals for precision motor control, and advanced analog integration that reduces external component count. The 121-TFBGA (10x10) ball-grid-array footprint saves board area versus TQFP alternatives while supporting dense, high-pin-count applications.
Architecturally, the dsPIC33EP family pairs a modified Harvard 16-bit core with 24-bit instruction words, hardware DSP multiply-accumulate units, and up to 512KB Flash across family members. The MU810 variant targets systems needing both heavy digital signal processing and rich peripheral sets, with industrial 3.0V to 3.6V supply operation and industrial temperature rating for the -I grade.
Typical applications include brushless DC and PMSM motor control drives, USB-enabled industrial instrumentation, digital power conversion, and embedded audio or sensor-fusion signal processing where DSP math and MCU control must coexist.
Design consideration: BGA packages require controlled-impedance PCB fabrication and X-ray inspection capability for rework; verify your manufacturing line supports 0.8 mm-pitch BGA assembly before committing to this package option.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP256MU810T-I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256MU810T-I/BG (same form factor and footprint) — differing in Core, USB, Mounting Type, Packaging, Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256MU810T-E/BG
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →DSPIC33EP512MU810T-I/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.55 / Unit
View Datasheet →DSPIC33EP128MU810T-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MU810-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MU810T-I/BG Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC core |
| Performance | 60 MIPs |
| Flash Program Memory | 256KB (85.5K x 24) |
| RAM | 12K x 16 |
| Operating Voltage | 3.0 V to 3.6 V |
| USB | USB 2.0 full-speed module |
| Package | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount (BGA) |
| I/O Count | 83 I/O |
| Peripherals | High-Speed PWM, USB, Advanced Analog |
| Packaging | Tape & Reel (T suffix) |
| Temperature Grade | -I (industrial) |
| Lifecycle Stage | ACTIVE |
| Family Flash Range | up to 512KB Flash and 52KB SRAM (dsPIC33EP MU family) |
DSPIC33EP256MU810T-I/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256MU810T-I/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256MU810T-I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256MU810T-I/BG is suitable for 6 applications: Precision Motor Control Drives, USB-Connected Industrial Instrumentation, Digital Power Conversion, Embedded Audio and Signal Processing, Robotics and Automation Controllers, Battery-Powered Portable and IoT Edge Devices.
Precision Motor Control Drives
The DSPIC33EP256MU810T-I/BG fits brushless DC, PMSM, and stepper drive systems because its 60 MIPs dsPIC33E core executes field-oriented control current loops with deterministic latency, while high-speed PWM peripherals generate complementary inverter gate signals with fine duty resolution. The advanced analog front end samples phase currents and bus voltage for closed-loop commutation. Placed as the sole controller on a 3.3V rail, it eliminates a separate DSP plus MCU pairing; the trade-off is that the 121-BGA package demands controlled-fabrication PCBs, so simple hobby drives may prefer the TQFP family members instead.
Recommended
USB-Connected Industrial Instrumentation
Data loggers, test fixtures, and bench instruments benefit from the integrated USB 2.0 full-speed module, which connects the DSPIC33EP256MU810T-I/BG directly to PC hosts without an external USB interface chip. The 256KB Flash holds both the application and USB class firmware (CDC/HID via Microchip Harmony), while the 60 MIPs core processes sensor streams in real time. The industrial -I grade supports factory-floor ambient ranges. Design consideration: keep the USB D+/D- pair routed at 90 ohm differential impedance on the BGA breakout, and budget RAM carefully since the 12K x 16 buffer space is modest for high-rate streaming.
Recommended
Digital Power Conversion
Digitally controlled AC-DC and DC-DC converters use the DSPIC33EP256MU810T-I/BG for its combination of high-speed PWM with dead-time control, fast ADC sampling of output voltage and current, and DSP math for compensator execution at 60 MIPs. The DSC closes voltage-mode or current-mode loops in software, enabling adaptive compensation that analog controllers cannot match. The 3.0V-3.6V supply fits standard controller rails isolated via optocouplers or digital isolators. Quantified benefit: 60 MIPs allows compensator update rates in the hundreds of kilohertz, supporting switching frequencies above 100 kHz, though loop bandwidth remains bounded by ADC and PWM latency.
Recommended
Embedded Audio and Signal Processing
The dsPIC33E core's hardware DSP multiply-accumulate instructions suit audio filtering, spectral analysis, and sensor-fusion pipelines where the DSPIC33EP256MU810T-I/BG processes microphone, accelerometer, or ultrasound data on the same chip that manages system control. The 256KB Flash stores codec tables and FIR/IIR coefficient sets with room for USB or serial interfaces to external audio codecs. Running DSP primitives from the 12K x 16 RAM keeps cycles deterministic. Trade-off: for studio-grade 24-bit/192 kHz audio, a dedicated audio DSP outperforms this DSC; the part targets cost-sensitive embedded audio, not audiophile signal chains.
Recommended
Robotics and Automation Controllers
Multi-axis robotic joints and automation nodes pair the DSPIC33EP256MU810T-I/BG's 60 MIPs control core with its high-speed PWM outputs for per-axis motor drives, while its rich I/O count (up to 83 on package variants) reads encoders, limit switches, and communication buses. The USB module simplifies configuration and firmware updates from host PCs on the factory floor. Deterministic interrupt response keeps safety-relevant fault handling inside tight time windows. Design note: the 121-BGA footprint suits compact joint PCBs, but qualification teams should prefer the AEC-Q100-qualified -E/BG grade when vibration and ambient extremes exceed industrial ratings.
Recommended
Battery-Powered Portable and IoT Edge Devices
Portable analyzers and IoT edge nodes leverage the DSPIC33EP256MU810T-I/BG's single 3.3V supply, integrated USB for charging and data offload, and DSP capability for on-device signal analysis that reduces raw-data transmission. The 10x10 mm BGA package conserves board area in handheld enclosures, and power-management modes allow sleep states between sampling bursts. Engineers must balance the BGA's area savings against rework difficulty in low-volume prototypes; the TQFP-packaged MU806 sibling is a pragmatic development vehicle, with the BGA reserved for the production layout once firmware is frozen.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256MU810T-I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256MU810T-E/BG | DSPIC33EP512MU810T-I/BG | DSPIC33EP128MU810T-I/BG | DSPIC33EP256MU810-I/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 60 MIPs 16-bit | 60 MIPs 16-bit | 60 MIPs 16-bit | 60 MIPs 16-bit | 60 MIPs 16-bit |
| Flash Memory | 256KB (85.5K x 24) | 256KB (85.5K x 24) | 512KB (171.5K x 24) | 128KB (43K x 24) | 256KB (85.5K x 24) |
| Temperature Grade | -I (industrial) | -E extended, AEC-Q100 qualified | -I (industrial) | -I (industrial) | -I (industrial) |
| USB Module | USB 2.0 full-speed | USB 2.0 full-speed | USB 2.0 full-speed | USB 2.0 full-speed | USB 2.0 full-speed |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Packaging Format | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tray/Tube (non-T) |
Key Differentiators
- Integrated USB 2.0 full-speed in a 16-bit DSC (vs DSPIC33EP256MC504T-I/TL)
- Automotive-grade sibling available on identical footprint (vs DSPIC33EP256MU810T-E/BG)
- Flash scalability without PCB respin (vs DSPIC33EP512MU810T-I/BG)
Design Notes
The 121-TFBGA (10x10 mm) package requires a fine-pitch BGA land pattern and typically a minimum 4-layer board with dedicated ground plane for ball escape routing. Plan dog-bone or via-in-pad escapes from the outset; retrofitting via-in-pad after fab requires filled and plated vias. Specify X-ray or acoustic microscopy inspection with your CM, since BGA solder joints are hidden after reflow. Estimated: at 0.8 mm ball pitch, standard non-filled via-in-pad is generally not reflow-reliable - confirm with your fabricator before release.
Route the USB D+/D- differential pair at 90 ohm differential impedance, keep it under approximately 10 cm total length, and avoid crossing plane splits between the BGA breakout and the USB connector. Add a common-mode choke and ESD array at the connector per Microchip USB reference designs for dsPIC33EP. Keep the 3.3V rail decoupled with 100 nF ceramics distributed across the BGA power balls plus at least 10 uF bulk per Microchip layout guidelines for the dsPIC33EP family.
Do not exceed the 3.6V maximum supply voltage - the dsPIC33EP MU family is not 5V tolerant on general I/O, and USB VBUS must be divided or regulated before sensing. The -I grade covers industrial temperatures only; for automotive or extended-ambient designs select the DSPIC33EP256MU810T-E/BG, which is AEC-Q100 qualified per Microchip USA. Finally, verify the ball map revision of your PCB footprint against the latest datasheet before reflow - Microchip has historically offered pin-compatible migrations across the MU family, but full 512KB devices should be re-verified per datasheet.
Compliance Information
The standard -I/BG device is not AEC-Q100 qualified; the DSPIC33EP256MU810T-E/BG variant is AEC-Q100 qualified per Microchip USA. RoHS/REACH status must be confirmed on Microchip's official product page.
