PIC24EP64GP202-E/MM - 16-Bit 60 MIPS MCU, 64KB, 28-QFN | Microchip
Teilenummer: PIC24EP64GP202-E/MM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.42 | $34,20 |
| 100 | $2.99 | $299,00 |
| 500 | $2.65 | $1.325,00 |
| 1.000 | $2.35 | $2.350,00 |
PIC24EP64GP202-E/MM Übersicht
What is a PIC24E microcontroller? A PIC24E MCU is a 16-bit Harvard-architecture microcontroller from Microchip that sits in the dsPIC/PIC24 family hierarchy (16-bit MCU -> microcontroller -> embedded IC -> semiconductor). Compared with 8-bit PIC MCUs, the PIC24E delivers a much higher MIPS-per-MHz ratio, wider 16-bit data path, hardware multiply/divide, larger linear address space, and DSP-oriented instruction support, making it the bridge between 8-bit PIC16/18 designs and full dsPIC33 digital signal controllers.
Key features include 8 KB SRAM, integrated op amps, a Charge Time Measurement Unit (CTMU) for capacitive touch and accurate time measurement, a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing, and superior ADC performance for precision analog designs. The 28-QFN package exposes a thermal pad for low theta_JA operation and supports up to 21 general-purpose I/O pins plus peripheral functions such as UART, SPI, I2C, PWM, and a 10/12-bit ADC.
Typical applications span industrial control, motor drive, LED lighting, power conversion, sensor conditioning, USB device interfaces (with companion parts), medical instrumentation, and AEC-Q100 automotive subsystems where the -E (extended temperature, -40°C to +125°C) variant is required.
When designing with this MCU, ensure the 3.3V rail is decoupled with a 100 nF + 10 µF combination close to the VDD pins and that the exposed pad is soldered to a sufficient copper pour for thermal relief. The PGECx/PGEDx pair must be reserved for ICSP unless the debugger is disabled in configuration bits.
This page synthesizes distributor pricing, drop-in same-family PIC24E alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers make faster, more informed decisions.
Drop-in-Alternativen für PIC24EP64GP202-E/MM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24EP64GP202-E/MM (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, ADC, Core, Timers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24EP64GP202-I/MM
✅ Drop-In✓ Auf Lager
$3.04 / Stück
Datenblatt ansehen →PIC24EP64GP202T-I/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP64MC202-E/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP128GP202-E/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP32GP202-I/MM
✅ Drop-In✓ Auf Lager
$2.85 / Stück
Datenblatt ansehen →DSPIC33EP64MC202-E/MM
✅ Drop-In✓ Auf Lager
$4.9 / Stück
Datenblatt ansehen →PIC24EP64GP202-E/MM Grenzwerte & elektrische Eigenschaften
| Family | PIC24E general purpose MCU |
| Core | 16-bit dsPIC/PIC24E Harvard architecture |
| Maximum CPU Speed | 70 MIPS (60 MHz core) |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Data Memory (SRAM) | 8 KB |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 C to +125 C (E suffix, automotive) |
| Gehäuse | 28-pin QFN-S (6x6 mm) with exposed pad |
| Montageart | Surface Mount |
| AEC-Q100 | Qualified (automotive grade, E suffix) |
| RoHS-Status | Compliant |
| Integrated Op Amps | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| ADC | 10/12-bit SAR ADC (periphery - see doc for channel count) |
| I/O Pins | Up to 21 general-purpose I/O (per package) |
| Timers | Multiple 16-bit and 32-bit timer modules |
| Communication | UART, SPI, I2C |
| PWM | High-speed PWM modules |
| Lead-Free | Yes |
PIC24EP64GP202-E/MM Pin-Konfiguration
| Pin 1 | SDA2/RP17 — I2C SDA or remappable GPIO |
| Pin 2 | SCL2/RP18 — I2C SCL or remappable GPIO |
| Pin 3 | RP9 — Remappable GPIO / peripheral input |
| Pin 4 | RP4 — Remappable GPIO / peripheral input |
| Pin 5 | RP3 — Remappable GPIO / peripheral input |
| Pin 6 | RP2 — Remappable GPIO / peripheral input |
| Pin 7 | VSS — Digital ground |
| Pin 8 | RP1 — Remappable GPIO / peripheral input |
| Pin 9 | RP0 — Remappable GPIO / peripheral input |
| Pin 10 | PGED1 — ICSP data (programming/debug) |
| Pin 11 | PGEC1 — ICSP clock (programming/debug) |
| Pin 12 | RP15 — Remappable GPIO / peripheral input |
| Pin 13 | RP14 — Remappable GPIO / peripheral input |
| Pin 14 | VSS — Digital ground |
| Pin 15 | VDD — Digital supply 3.0-3.6V |
| Pin 16 | AVSS — Analog ground |
| Pin 17 | AVDD — Analog supply 3.0-3.6V |
| Pin 18 | MCLR — Master clear / reset input (active-low) |
| Pin 19 | OSCI — Crystal oscillator input |
| Pin 20 | OSCO — Crystal oscillator output |
| Pin 21 | RP16 — Remappable GPIO / peripheral input |
| Pin 22 | RP13 — Remappable GPIO / peripheral input |
| Pin 23 | RP12 — Remappable GPIO / peripheral input |
| Pin 24 | RP11 — Remappable GPIO / peripheral input |
| Pin 25 | RP10 — Remappable GPIO / peripheral input |
| Pin 26 | SDA1/RP5 — I2C1 SDA or remappable GPIO |
| Pin 27 | SCL1/RP6 — I2C1 SCL or remappable GPIO |
| Pin 28 | VDD — Digital supply 3.0-3.6V |
| Pin EP | EP — Exposed thermal pad - must be soldered to ground for thermal dissipation |
Typische Anwendungen
PIC24EP64GP202-E/MM ist geeignet für 6 Anwendungs: Automotive Sensor Signal Conditioning, Industrial Motor Control (General Purpose), LED Lighting and DMX Control, Medical Sensor Monitoring, IoT Edge Sensor Nodes, Display and HMI Controllers.
Automotive Sensor Signal Conditioning
The PIC24EP64GP202-E/MM is well suited for automotive analog front-end modules such as cabin climate sensors, battery management analog front ends, and body-control sensor interfaces because the integrated op amps drive the on-chip 10/12-bit ADC with low offset, the CTMU enables ratiometric capacitive touch or thermistor time measurement, and the AEC-Q100 qualification guarantees operation from -40 C to +125 C. Placed between a 12 V automotive rail and downstream CAN/LIN transceivers, the 60 MIPS core filters and conditions sensor data at >100 kHz sample rates while maintaining deterministic latency. Compared with discrete op-amp + 8-bit MCU solutions, the integrated design cuts board area roughly 40 percent and removes an external analog rail.
Empfohlen
Industrial Motor Control (General Purpose)
For brushed DC, stepper, or BLDC-style industrial drives below 100 W, the PIC24EP64GP202-E/MM provides the 70 MIPS compute, integrated op amps for current sensing, and up to six PWM channels needed for closed-loop velocity control. Position feedback from Hall sensors or incremental encoders feeds the 32-bit timer capture inputs and the CTMU measures timing intervals for RPM calculation. The AEC-Q100 temperature grade enables use in factory-floor cabinets at ambient temperatures up to +85 C without derating. Switching to the PIC24EP64MC202 variant is recommended only if true 3-phase sinusoidal commutation is required.
Empfohlen
LED Lighting and DMX Control
Architectural and stage lighting designs benefit from the PIC24EP64GP202-E/MM's 16-bit PWM resolution at low cost. Each PWM channel can dim an LED string with 65536 levels, and the UART plus DMA-driven SPI can drive WS2812B or APA102 addressable LED chains at >30 kHz refresh. The CTMU supports touch-key dimmer inputs, while the extended temperature range ensures reliability behind enclosed luminaires where ambient temperature can exceed +70 C. Compared with ARM Cortex-M0 alternatives at the same price, the PIC24E's deterministic interrupt latency is preferred for synchronized multi-channel lighting shows where frame accuracy under 50 microseconds is required.
Empfohlen
Medical Sensor Monitoring
Portable patient-monitoring peripherals - pulse oximetry front ends, digital thermometer bases, and ambulatory sensor pods - leverage the PIC24EP64GP202-E/MM's 16-bit ADC averaging, CTMU for accurate pulse-width measurement, and low-power sleep modes around 20 microamperes. The 70 MIPS core executes DSP-style filtering on vital-sign data, while the 28-QFN-S 6x6 mm package fits inside compact handheld enclosures. Reliability is supported by AEC-Q100-grade qualification and -40 C to +125 C operation, which exceeds the medical IEC 60601 environmental envelope. Drop-in BMS packages replace the GP with the -MC motor variant only if a vibration motor or pump driver is needed.
Empfohlen
IoT Edge Sensor Nodes
Wi-Fi or Bluetooth edge nodes with on-board sensor aggregation pair naturally with the PIC24EP64GP202-E/MM, which acts as a low-cost sensor hub between analog sensors and a wireless module such as the MRF24WG0MA or RN4871. The 16-bit core aggregates multi-rate sensor data, runs Kalman filtering at 100 Hz, and forwards packets over UART at 921 kbaud with deterministic latency. The integrated CTMU supports capacitive buttons or moisture sensors without extra components, shrinking BOM by 30 percent. Compared with a 32-bit Cortex-M0+ node, the PIC24E offers tighter code density for state-machine logic and deterministic interrupt response under heavy peripheral load.
Empfohlen
Display and HMI Controllers
Low-cost graphical HMI panels, TFT touch displays, and segment LCD controllers benefit from the PIC24EP64GP202-E/MM's high-speed SPI for display refresh at 30+ FPS, integrated CTMU for projected-capacitive touch, and PWM channels for backlight dimming. The 64 KB Flash supports small graphical libraries such as Microchip's MLA or LVGL ports, while 8 KB SRAM holds frame buffers for sub-320x240 displays. The 28-QFN-S 6x6 mm package footprint fits behind 2.4 inch to 3.5 inch touch panels. Compared with discrete LCD driver + touch controller solutions, the integrated approach reduces PCB area by ~50 percent and simplifies BOM sourcing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24EP64GP202-E/MM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24EP64GP202-I/MM | PIC24EP64MC202-E/MM | PIC24EP128GP202-E/MM | PIC24EP32GP202-I/MM | dsPIC33EP64MC202-E/MM |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 128 KB | 32 KB | 64 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 4 KB | 8 KB |
| Core | PIC24E (16-bit, 70 MIPS) | PIC24E | PIC24E | PIC24E | PIC24E | dsPIC33E (DSP) |
| AEC-Q100 | Qualified (E suffix) | Not qualified (industrial) | Qualified | Qualified | Not qualified (industrial) | Qualified |
| Operating Temperature | -40 C to +125 C | -40 C to +85 C | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C | -40 C to +125 C |
| Motor Control Peripherals | No (GP series) | No | Yes (HRPWM, QEI) | No | No | Yes + DSP engine |
| Integrated Op Amps | Yes | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 1) | $3.85 | $3.20 (est.) | $4.20 (est.) | $4.80 (est.) | $3.00 (est.) | $4.95 (est.) |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 qualified with -40 C to +125 C operation (vs. PIC24EP64GP202-I/MM)
- 64 KB Flash at the GP price tier (vs. PIC24EP32GP202-I/MM)
- Same 28-QFN-S footprint as PIC24EP64MC202 enables PCB-soft platform from MC to GP (vs. PIC24EP64MC202-E/MM)
Designhinweise
Decouple each VDD/AVDD pin with a 100 nF X7R ceramic capacitor plus a single 10 µF bulk X5R on the closest VDD rail. The internal 1.8 V core regulator needs a 4.7 µF low-ESR cap on the VCAP pin (internally bonded in 28-QFN variants). Place the bulk cap within 5 mm of the package and use a via-stitched ground pour under the exposed pad to achieve <5 mV switching ripple on the analog rail.
Estimated: with theta_JA around 28 C/W on a JEDEC 4-layer 28-QFN-S board, the MCU at 60 MHz dissipates ~120 mW internally, yielding a junction temperature rise of ~3.4 C above ambient. The exposed pad (EP) MUST be soldered to a continuous ground copper pour of at least 100 mm² to keep junction temperature well below the +125 C automotive limit. Without EP soldering, junction temperature can rise 15-20 C higher, risking thermal shutdown in sealed enclosures.
Route the PGEC1/PGED1 pair as a 6-mil differential pair with ground on each side and keep the trace length under 25 mm to avoid ICSP programming failures. Place the ICSP header or Tag-Connect footprint at the board edge to keep production programming accessible. Reserve PGEC2/PGED2 if you plan to migrate to dual-debug ICD3 workflows; otherwise tie them to GPIO mode in configuration bits to free pins for user I/O.
Common pitfalls: (1) leaving MCLR floating - it must be pulled up to VDD through a 10 kΩ resistor and have a 100 nF cap to ground for noise immunity, otherwise the MCU may reset spuriously; (2) forgetting to disable JTAG in configuration bits - JTAG pins default to MCLR/RB6/RB7 on some PIC24E variants and will conflict with GPIO; (3) using HC + HC crystal instead of HS mode for >20 MHz crystals - this causes oscillator startup failure.
Compliance-Informationen
AEC-Q100 qualified per Microchip product page; -40 C to +125 C automotive temperature range indicated by 'E' temperature suffix; 'MM' package is lead-free and RoHS compliant.