PIC24HJ32GP202-E/MM - 16-bit 40MIPS MCU, 32KB Flash | Microchip
Teilenummer: PIC24HJ32GP202-E/MM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.62 | $5,62 |
| 10 | $5.05 | $50,50 |
| 100 | $4.49 | $449,00 |
| 500 | $4.03 | $2.015,00 |
| 1.000 | $3.6 | $3.600,00 |
PIC24HJ32GP202-E/MM Übersicht
A 16-bit microcontroller (MCU) is a microprocessor core that processes data in 16-bit words, sitting between 8-bit MCUs (lower cost, lower throughput) and 32-bit MCUs (higher performance, larger code). Within the broader microcontroller family, the PIC24H belongs to the Microchip 16-bit PIC24 MCU family -> 16-bit MCU class -> microcontroller -> embedded processor hierarchy. The PIC24HJ32GP202-E/MM is part of the PIC24HJ32GP202/204 sub-family that is pin-compatible with the dsPIC33F DSC family, enabling easy migration when DSP capability is later required.
Key features of this part include one 16-bit timer, two UARTs, one SPI, one I2C, a 10-bit ADC with up to 9 channels, a comparator, and 21 digital I/O pins. It uses a 16-bit modified Harvard architecture with a 24-bit instruction word and a variable-length opcode field, achieving 40 MIPS at 40 MHz. Internal Phase-Locked Loop (PLL) support lets a low-frequency external crystal generate the full 40 MIPS CPU clock while reducing system cost.
Typical end products are high-friction op-amp driver circuits, motor-control sensor interfaces, automotive body modules, industrial sensor hubs, and low-power instrumentation. When designing with this part, ensure VDDCORE decoupling uses a low-ESR 10 uF bulk + 0.1 uF ceramic pair, and route the exposed thermal pad to a continuous ground plane for thermal dissipation.
Drop-in-Alternativen für PIC24HJ32GP202-E/MM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24HJ32GP202-E/MM (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, ADC, Core Architecture, Timers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24HJ32GP202-I/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24HJ32GP202-I/SP
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.5 / Stück
Datenblatt ansehen →PIC24HJ32GP202-H/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
dsPIC33FJ16GP304-I/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24HJ32GP204-I/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
dsPIC33FJ32GP202-I/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24HJ32GP202-E/MM Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit PIC24H (modified Harvard) |
| Program Memory | 32 KB Flash (11K x 24) |
| RAM | 2 KB |
| Auxiliary Flash | 1 KB |
| Maximum CPU Performance | 40 MIPS at 40 MHz |
| Operating Voltage | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 C to +125 C (Extended, -E suffix) |
| Gehäuse | 28-pin QFN-S (6x6 mm) with exposed pad |
| I/O Pins | 21 |
| ADC | 10-bit, up to 9 channels |
| Timers | One 16-bit timer/counter |
| UART | 2 |
| SPI | 1 |
| I2C | 1 |
| Comparators | 1 |
| PLL | Internal PLL with 4x, 8x, 16x options |
| AEC-Q100 | Qualified (automotive grade via -E suffix) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC24HJ32GP202-E/MM Pin-Konfiguration
| Pin 1 | MCLR — Master Clear (reset) input |
| Pin 2 | RA0/VREF+/AN0 — GPIO RA0 / Vref+ / analog input 0 |
| Pin 3 | RA1/VREF-/AN1 — GPIO RA1 / Vref- / analog input 1 |
| Pin 4 | RA2/AN2 — GPIO RA2 / analog input 2 |
| Pin 5 | RA3/AN3 — GPIO RA3 / analog input 3 |
| Pin 6 | RA4 — GPIO RA4 |
| Pin 7 | RA5/AN4 — GPIO RA5 / analog input 4 |
| Pin 8 | AVDD — Analog supply voltage |
| Pin 9 | AVSS — Analog ground |
| Pin 10 | RB0/AN5 — GPIO RB0 / analog input 5 |
| Pin 11 | RB1/AN6 — GPIO RB1 / analog input 6 |
| Pin 12 | RB2/AN7 — GPIO RB2 / analog input 7 |
| Pin 13 | RB3/AN8 — GPIO RB3 / analog input 8 |
| Pin 14 | RB4 — GPIO RB4 |
| Pin 15 | RB5 — GPIO RB5 |
| Pin 16 | RB6 — GPIO RB6 / programming clock |
| Pin 17 | RB7 — GPIO RB7 / programming data |
| Pin 18 | RC0 — GPIO RC0 |
| Pin 19 | RC1 — GPIO RC1 |
| Pin 20 | RC2 — GPIO RC2 |
| Pin 21 | RC3 — GPIO RC3 |
| Pin 22 | RC4 — GPIO RC4 |
| Pin 23 | RC5 — GPIO RC5 |
| Pin 24 | RC6 — GPIO RC6 |
| Pin 25 | RC7 — GPIO RC7 |
| Pin 26 | RC8 — GPIO RC8 |
| Pin 27 | RC9 — GPIO RC9 |
| Pin 28 | VSS — Digital ground |
Typische Anwendungen
PIC24HJ32GP202-E/MM ist geeignet für 6 Anwendungs: Automotive Body Control Modules, Industrial Sensor Hubs, Motor Control Sensor Interfaces, Battery-Operated Instrumentation, LED Lighting Controllers, IoT Edge Sensor Nodes.
Automotive Body Control Modules
The PIC24HJ32GP202-E/MM's AEC-Q100 qualification (via -E suffix) and 40 MIPS throughput make it a strong fit for automotive body controllers that read switches, drive LEDs and small relays, and run LIN/CAN-style protocol bridging. With 21 GPIO and 32 KB program memory, it can host a state-machine-based BCM firmware with multiple PWM outputs for interior lighting and motor control. The 28-QFN-S 6x6 mm footprint drops onto compact PCBAs used in door modules, mirror controllers, and seat-position units, while the 10-bit ADC handles battery-voltage monitoring and thermistor inputs.
Empfohlen
Industrial Sensor Hubs
The PIC24HJ32GP202-E/MM's 40 MIPS CPU, 10-bit ADC with up to 9 channels, and dual UART interfaces fit industrial sensor hubs that aggregate multiple analog/digital sensors and forward data to a PLC or gateway. The 16-bit modified Harvard core handles oversampling and digital filtering in real time, while the 32 KB Flash stores protocol stacks for Modbus RTU, IO-Link, or vendor-specific fieldbus variants. The extended -40C to +125C temperature range ensures operation in factory-floor environments, and the 28-QFN-S package survives high-vibration mounting on DIN-rail PCBAs.
Empfohlen
Motor Control Sensor Interfaces
The PIC24HJ32GP202-E/MM's 40 MIPS throughput and pin compatibility with the dsPIC33FJ16GP304 make it ideal as a sensor-interface MCU in BLDC and stepper motor systems where encoder feedback, Hall sensors, and current-sense amplifiers must be sampled precisely. It captures Hall-sensor edges, runs a PID loop on the host DSP, and reports telemetry over UART or SPI without taxing the main controller. With 32 KB Flash and 2 KB RAM, it comfortably hosts custom commutation tables and tuning firmware; the 28-QFN-S exposed pad ensures reliable thermal dissipation at extended temperature.
Empfohlen
Battery-Operated Instrumentation
The PIC24HJ32GP202-E/MM's 3.0-3.6 V operating range and 40 MIPS performance fit battery-powered measurement instruments such as portable multimeters, data loggers, and handheld analyzers where MCU throughput must be balanced against battery life. The 16-bit Harvard core executes oversampling algorithms and digital filters in real time, while the 10-bit ADC handles multi-channel sensor inputs from thermocouples, RTDs, or strain gauges. The 32 KB Flash stores calibration constants and lookup tables; the 28-QFN-S exposed pad helps dissipate heat from high duty-cycle ADC sampling.
Empfohlen
LED Lighting Controllers
The PIC24HJ32GP202-E/MM's 40 MIPS CPU and 21 GPIO fit commercial and architectural LED lighting controllers that drive multi-channel LED strings, manage DMX512 input, and execute dimming curves. With 32 KB Flash it stores lookup-table-driven dimming profiles and color-mixing algorithms, while dual UARTs handle DMX in/out and a debug port. The 16-bit timer drives PWM dimming with high resolution; the 28-QFN-S package is small enough for in-fixture PCBs in track lights and stage lighting where board area is constrained.
Empfohlen
IoT Edge Sensor Nodes
The PIC24HJ32GP202-E/MM's 32 KB Flash, 2 KB RAM, and dual UARTs make it a capable host for IoT edge sensor nodes that aggregate sensor data and forward it via UART-attached Wi-Fi/BLE modules. The 40 MIPS throughput handles protocol translation between I2C/SPI sensors and a serial radio, while the 10-bit ADC monitors battery voltage and environmental sensors. The 16-bit Harvard core runs deterministic control loops for HVAC, agriculture, or smart-building applications where response time matters more than raw compute power.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24HJ32GP202-E/MM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24HJ32GP202-I/MM | dsPIC33FJ16GP304-I/MM | PIC24HJ32GP204-I/MM |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Program Flash | 32 KB | 32 KB | 16 KB | 44 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB |
| CPU Performance | 40 MIPS at 40 MHz | 40 MIPS at 40 MHz | 40 MIPS at 40 MHz + DSP | 40 MIPS at 40 MHz |
| AEC-Q100 Qualified | Yes (-E suffix, -40C to +125C) | No (-40C to +85C industrial) | No (-40C to +85C industrial) | No (-40C to +85C industrial) |
| DSP Engine | No | No | Yes | No |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Approximate Unit Price (qty 1) | $5.62 | Lower (no AEC-Q100) | Slightly higher (DSP engine) | Slightly higher (44 KB Flash) |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 automotive qualification with extended -40C to +125C temperature range (vs. PIC24HJ32GP202-I/MM)
- Pin-compatible upgrade path to dsPIC33 DSP family without PCB rework (vs. dsPIC33FJ16GP304-I/MM)
- Higher Flash density at same footprint for richer firmware (vs. PIC24HJ32GP204-I/MM)
Designhinweise
Estimated: At 40 MIPS full load with VDD = 3.3 V, the PIC24HJ32GP202-E/MM draws roughly 30 mA (about 0.1 W). Place a 10 uF bulk + 0.1 uF ceramic pair on each of VDD/AVDD within 5 mm of the pins, and tie AVSS/VSS to a single ground star. Use a ferrite bead between VDD and AVDD when the digital I/O switching current would otherwise inject noise into the analog rail.
Estimated: The 28-QFN-S package with exposed thermal pad has a junction-to-ambient thermal resistance (theta_JA) of approximately 33 C/W on a 4-layer JEDEC test board. At +125C ambient and 0.1 W dissipation, junction rise is only +3.3 C - well within limits. The exposed pad must be soldered to a continuous ground plane; skipped solder lands increase theta_JA dramatically and may push the junction beyond AEC-Q100 thermal limits.
Route the 40 MHz system trace (OSC1/OSC2) short and symmetric, with a ground guard on both sides. Keep the analog traces (AN0-AN8) away from digital switching signals, and place the ADC reference decoupling cap within 2 mm of AVDD. The exposed thermal pad of the QFN-S must be stitched with 0.3 mm vias on a 1 mm grid to a continuous ground plane, with the via count tuned to the application's thermal dissipation target.
Do not program the PLL with a non-standard ratio without checking the datasheet pass-section on PLL lock time; a misconfigured PLL prevents startup. The MCLR pin must be pulled high through a 10 kohm resistor and decoupled with a 100 nF cap for proper reset behavior. Avoid using PIOOC3 (pin 33) as an analog channel unless AVDD is present, or ADC readings will be invalid; per the datasheet section on ADC configuration, all analog channels require AVDD within the rated 3.0-3.6 V window before any conversion starts.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified via -E ordering suffix for automotive deployments. Halogen-free status not explicitly stated in retrieved data.