PIC24EP64GP204T-I/MV - 16-bit 70 MIPS MCU, 64KB Flash | Microchip
Teilenummer: PIC24EP64GP204T-I/MV ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.6225 | $2,62 |
| 10 | $2.35 | $23,50 |
| 100 | $2.05 | $205,00 |
| 500 | $1.82 | $910,00 |
| 1.000 | $1.65 | $1.650,00 |
PIC24EP64GP204T-I/MV Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of peripherals (ADC, timers, communication interfaces, I/O) into one device. Within the broader semiconductor taxonomy, MCUs belong to the microcontrollers and digital signal controllers category, sitting under the Integrated Circuits family. The PIC24EP family further specializes in high-performance 16-bit control with DSP-like instructions, advanced analog peripherals (12-bit ADC, op amps, CTMU), and the Peripheral Trigger Generator (PTG) for hardware-state-machine automation.
Key features include a 70 MIPS core at 70 MHz CPU clock, 64 KB self-programmable Flash, 8 KB SRAM, integrated op amps and CTMU for touch and sensor signal conditioning, a 12-bit ADC with up to 1.1 Msps, USB, UART, SPI, I2C, and CAN peripherals. The MV package measures 6x6 mm with an exposed pad that must be soldered to a ground pour for thermal dissipation and electrical performance.
The architecture uses a 16-bit modified-Harvard CPU with DSP instructions, dual-bus Flash and SRAM, and dedicated peripheral engines. The combination of high CPU throughput, integrated analog front-end blocks, and the PTG makes this MCU suitable for closed-loop control, sensor fusion, and motor-control pre-processing on a single device, eliminating external analog components.
Typical applications include industrial sensor signal conditioning, BLDC and PMSM motor control, LED lighting controllers, USB-enabled embedded devices, and human-machine interface (HMI) front-ends. The wide operating temperature range and on-chip op amps reduce external component count in analog-heavy designs.
When designing with this part, allocate a continuous ground copper pour under the exposed pad and stitch vias to inner ground planes. Ensure MCLR is tied to Vdd through the proper configuration circuit, and follow Microchip's MPLAB X IDE and XC16 compiler toolchain for code development.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical PCB design notes not found in the manufacturer datasheet alone, giving engineers a faster path from concept to prototype.
Drop-in-Alternativen für PIC24EP64GP204T-I/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24EP64GP204T-I/MV (gleiche Bauform und Footprint) – abweichend in ADC, Package, CTMU, Program Memory (Flash), CPU Speed.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24EP128GP204T-I/MV
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP64GP204-I/MV
✅ Drop-In✓ Auf Lager
$2.88 / Stück
Datenblatt ansehen →PIC24EP64GP204-E/MV
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP64GP204-H/MV
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24EP512GP204T-I/MV
✅ Drop-In✓ Auf Lager
$4.95 / Stück
Datenblatt ansehen →PIC24EP64GP204T-I/MV Grenzwerte & elektrische Eigenschaften
| Manufacturer | Microchip Technology |
| Series | PIC® 24EP |
| Core | PIC24 16-bit |
| Core Size | 16-Bit |
| CPU Speed | 70 MIPS (max) |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Data RAM | 8 KB |
| Operating Frequency | 70 MHz max |
| Gehäuse | 48-UQFN (MV) 6x6 mm with exposed pad |
| Betriebstemperaturbereich | -40 C to +85 C (Industrial, I grade) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| ADC | 12-bit, up to ~1.1 Msps |
| Integrated Op Amps | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| Communication Interfaces | UART, SPI, I2C, USB, CAN |
| Peripheral Trigger Generator (PTG) | Yes |
| Tape and Reel Suffix | T (e.g., /MV in T&R packaging) |
PIC24EP64GP204T-I/MV Pin-Konfiguration
| Pin 1 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 2 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 3 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 4 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 5 | VREF+/ANn — ADC positive reference / analog input |
| Pin 6 | VREF-/ANn — ADC negative reference / analog input |
| Pin 7 | AVDD — Analog supply voltage |
| Pin 8 | AVSS — Analog ground |
| Pin 9 | OSC1/CLKI — Crystal oscillator input or external clock input |
| Pin 10 | OSC2/CLKO — Crystal oscillator output or clock output |
| Pin 11 | MCLR — Master clear reset (active low) |
| Pin 12 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 13 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 14 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 15 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 16 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 17 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 18 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 19 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 20 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 21 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 22 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 23 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 24 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 25 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 26 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 27 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 28 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 29 | D+/USB — USB D+ data line (when USB enabled) |
| Pin 30 | D-/USB — USB D- data line (when USB enabled) |
| Pin 31 | VBUS/USBDP — USB VBUS detect / USB pull-up control |
| Pin 32 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 33 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 34 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 35 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 36 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 37 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 38 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 39 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 40 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 41 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 42 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 43 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 44 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 45 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 46 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pin 47 | VDD — Digital supply voltage |
| Pin 48 | VSS — Digital ground |
Typische Anwendungen
PIC24EP64GP204T-I/MV ist geeignet für 6 Anwendungs: Industrial Sensor Signal Conditioning, BLDC and PMSM Motor Control, USB-Enabled Embedded Devices, LED Lighting and Color-Mixing Controllers, Human-Machine Interface (HMI) Front-Ends, Automotive Sensor Nodes (Non-Safety).
Industrial Sensor Signal Conditioning
The PIC24EP64GP204T-I/MV is well-suited for industrial sensor signal conditioning because its integrated op amps and 12-bit ADC form a complete analog front end on-chip. With 70 MIPS of CPU throughput, the MCU can run calibration and digital filtering in real time without external DSP components. The CTMU provides precise charge-time measurements for capacitive, RTD, and humidity sensors, while the CTMU and 8 KB RAM enable moving-average and FIR filter stacks up to several hundred taps. The 48-UQFN package fits into compact sensor modules, and the exposed pad enables reliable operation across the -40C to +85C industrial range, where factory-floor thermal stress would otherwise force derating. The PTG further reduces CPU overhead by sequencing ADC and CTMU triggers autonomously.
Empfohlen
BLDC and PMSM Motor Control
The PIC24EP64GP204T-I/MV fits BLDC and PMSM motor control because the 70 MIPS core handles sinusoidal commutation and field-oriented control (FOC) algorithms in real time. The PTG sequences ADC sampling on phase currents synchronously with PWM edges, eliminating CPU latency in critical control loops. The 12-bit ADC with up to 1.1 Msps captures back-EMF and current waveforms at high PWM frequencies, while the integrated op amps condition analog feedback directly at the MCU pins. With USB and CAN on-chip, the same MCU drives the motor and exposes the drive telemetry to a host controller or industrial bus. The 48-UQFN (MV) 6x6 mm package enables compact motor-drive PCB layouts alongside the gate-driver stages.
Empfohlen
USB-Enabled Embedded Devices
The PIC24EP64GP204T-I/MV fits USB-enabled embedded devices because the PIC24EP family integrates a USB 2.0 full-speed peripheral with on-chip transceiver, eliminating external PHY components. The 70 MIPS CPU handles USB stacks (HID, CDC, vendor classes) alongside application code, and 8 KB of RAM is sufficient for typical composite-USB device firmware. The 64 KB Flash accommodates both bootloader and application images with in-application programming support. The 48-UQFN package enables small-form-factor USB dongles and HMI panels, while the -40C to +85C range covers consumer and industrial deployment scenarios. PTG offloads repetitive USB endpoint servicing from the CPU, improving sustained throughput.
Empfohlen
LED Lighting and Color-Mixing Controllers
The PIC24EP64GP204T-I/MV is appropriate for LED lighting and color-mixing controllers because the 12-bit ADC and PWM outputs enable fine-grained current and color-temperature control. The PTG synchronizes multi-channel PWM with the ADC sample window, allowing closed-loop current regulation on each LED string without CPU overhead. The 70 MIPS core runs color-space conversion (CIE1931, gamut mapping) and brightness curves in real time. USB or CAN connectivity lets the lighting fixture participate in DALI, DMX, or proprietary building-automation networks. The integrated op amps condition analog temperature-sensor feedback for thermal derating, and the 48-UQFN 6x6 mm package fits into compact downlight form factors.
Empfohlen
Human-Machine Interface (HMI) Front-Ends
The PIC24EP64GP204T-I/MV suits HMI front-end controllers because the 70 MIPS core drives LCD or TFT control signals and runs touch-sensing firmware via the CTMU. The 8 KB RAM supports multi-page display framebuffers, while 64 KB Flash hosts the HMI logic and graphic asset decoding. USB and CAN enable host-side communication in industrial panels, and UART/SPI/I2C connect to display driver ICs. The integrated op amps condition analog joystick or rotary-encoder signals without external analog stages. The 48-UQFN (MV) package simplifies SMT assembly on HMI PCBs, and the exposed pad provides a stable ground reference for the analog sensing inputs in electrically noisy industrial environments.
Empfohlen
Automotive Sensor Nodes (Non-Safety)
The PIC24EP64GP204T-I/MV fits non-safety automotive sensor nodes because its -40C to +85C industrial range covers cabin and chassis areas, and CAN connectivity enables integration with vehicle networks. The 12-bit ADC and integrated op amps condition sensor signals (temperature, pressure, position) directly, while the 70 MIPS core runs calibration and diagnostics in real time. The 64 KB Flash accommodates OBD-II and UDS protocol stacks for diagnostic support. The 48-UQFN 6x6 mm package enables small sensor-module form factors. For safety-critical ECUs requiring AEC-Q100, the PIC24EP family offers Q-grade variants; the standard I/MV part is not AEC-Q100 qualified and should be evaluated case-by-case.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24EP64GP204T-I/MV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24EP128GP204T-I/MV | PIC24EP64GP204-I/MV | PIC24EP64GP204-E/MV | PIC24EP64GP204-H/MV | PIC24EP512GP204T-I/MV |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (MV) 6x6 mm | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash (KB) | 64 | 128 | 64 | 64 | 64 | 512 |
| RAM (KB) | 8 | 8 | 8 | 8 | 8 | 48 |
| CPU Speed (MIPS) | 70 | 70 | 70 | 70 | 70 | 70 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +150C (High) | -40C to +85C (Industrial) |
| Packaging Format | Tape & Reel | Tape & Reel | Tray | Tray (and T&R variants) | Tray (and T&R variants) | Tape & Reel |
| Integrated Op Amps | Yes | Yes | Yes | Yes | Yes | Yes |
| PTG (Peripheral Trigger Generator) | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Higher Flash headroom within the same package (vs. PIC24EP64GP204-I/MV)
- Extended temperature for harsher environments (vs. PIC24EP64GP204-E/MV)
- Highest Flash density in the same footprint (vs. PIC24EP512GP204T-I/MV)
Designhinweise
Solder the UQFN exposed pad directly to a continuous ground copper pour with at least 5 thermal vias (0.3 mm drill, 0.5 mm pitch) stitching to inner ground planes. The exposed pad is the primary thermal and electrical ground path for the analog peripherals; insufficient connection will degrade ADC accuracy and op amp performance. Estimated: at full 70 MIPS CPU load the device dissipates ~150 mW internally, and with the MV package thermal resistance, the exposed pad is essential for keeping junction temperature below the +85C ambient limit.
Place 100 nF decoupling capacitors as close as possible to each VDD pin and a 10 uF bulk capacitor on AVDD within 5 mm of the pin. Separate analog AVDD and digital VDD traces, joined only at a single point near the MCU, to prevent digital switching noise from coupling into the analog reference. Estimated: at 70 MIPS and active ADC sampling, expect ~30 mA peak current draw on VDD; budget the LDO or switching regulator accordingly. Add a ferrite bead on USB VBUS if USB is enabled.
Route analog input traces (ANx, VREF+, VREF-) away from PWM and switching signals, and keep ADC traces short with a ground shield underneath. Use guarded analog ground that ties only to the MCU's analog ground pin (AVSS), not directly to the digital ground plane, to avoid ground bounce coupling into ADC readings. According to the Microchip PIC24EP family reference manual, keep trace impedance matched and ADC sample rates below the datasheet-specified maximum to preserve ENOB.
Do not leave MCLR floating; tie it to VDD through a 10 kohm pull-up and a 100 nF cap for proper reset operation during programming. Configure the oscillator configuration bits in your firmware to match the actual crystal or clock source, otherwise the MCU may fail to start. Do not exceed the maximum I/O source/sink current (typically 4-8 mA per pin) or the MCU may latch up. Always program the JTAG/ICD pins to their alternate peripheral functions if not using debugging.
Use Microchip's recommended PCB land pattern for the 48-UQFN (MV) 6x6 mm package, ensuring the exposed pad has a 1:1 ratio of solder mask opening to copper for reliable assembly. Place the decoupling capacitors on the same side as the MCU and route power traces with sufficient width (>=0.2 mm per ampere of current). According to Microchip application notes, layer stack-up with a dedicated ground plane below the MCU significantly improves EMI/EMC performance.
Compliance-Informationen
RoHS and REACH compliance confirmed via Microchip product page and distributor listings. Lead-free packaging. The standard I/MV part is NOT AEC-Q100 qualified; for AEC-Q100 automotive applications, evaluate the Q-graded variants separately.
