PIC24EP64GP204T-I/MV - 16-bit 70 MIPS MCU, 64KB Flash | Microchip
N.º da peça: PIC24EP64GP204T-I/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.6225 | $2,62 |
| 10 | $2.35 | $23,50 |
| 100 | $2.05 | $205,00 |
| 500 | $1.82 | $910,00 |
| 1.000 | $1.65 | $1.650,00 |
PIC24EP64GP204T-I/MV Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of peripherals (ADC, timers, communication interfaces, I/O) into one device. Within the broader semiconductor taxonomy, MCUs belong to the microcontrollers and digital signal controllers category, sitting under the Integrated Circuits family. The PIC24EP family further specializes in high-performance 16-bit control with DSP-like instructions, advanced analog peripherals (12-bit ADC, op amps, CTMU), and the Peripheral Trigger Generator (PTG) for hardware-state-machine automation.
Key features include a 70 MIPS core at 70 MHz CPU clock, 64 KB self-programmable Flash, 8 KB SRAM, integrated op amps and CTMU for touch and sensor signal conditioning, a 12-bit ADC with up to 1.1 Msps, USB, UART, SPI, I2C, and CAN peripherals. The MV package measures 6x6 mm with an exposed pad that must be soldered to a ground pour for thermal dissipation and electrical performance.
The architecture uses a 16-bit modified-Harvard CPU with DSP instructions, dual-bus Flash and SRAM, and dedicated peripheral engines. The combination of high CPU throughput, integrated analog front-end blocks, and the PTG makes this MCU suitable for closed-loop control, sensor fusion, and motor-control pre-processing on a single device, eliminating external analog components.
Typical applications include industrial sensor signal conditioning, BLDC and PMSM motor control, LED lighting controllers, USB-enabled embedded devices, and human-machine interface (HMI) front-ends. The wide operating temperature range and on-chip op amps reduce external component count in analog-heavy designs.
When designing with this part, allocate a continuous ground copper pour under the exposed pad and stitch vias to inner ground planes. Ensure MCLR is tied to Vdd through the proper configuration circuit, and follow Microchip's MPLAB X IDE and XC16 compiler toolchain for code development.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical PCB design notes not found in the manufacturer datasheet alone, giving engineers a faster path from concept to prototype.
Alternativas drop-in para PIC24EP64GP204T-I/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24EP64GP204T-I/MV (mesmo formato e footprint) — diferindo em ADC, Package, CTMU, Program Memory (Flash), CPU Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24EP128GP204T-I/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24EP64GP204-I/MV
✅ Drop-In✓ Em estoque
$2.88 / unidade
Ver ficha técnica →PIC24EP64GP204-E/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24EP64GP204-H/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24EP512GP204T-I/MV
✅ Drop-In✓ Em estoque
$4.95 / unidade
Ver ficha técnica →PIC24EP64GP204T-I/MV Classificações máximas e características elétricas
| Manufacturer | Microchip Technology |
| Series | PIC® 24EP |
| Core | PIC24 16-bit |
| Core Size | 16-Bit |
| CPU Speed | 70 MIPS (max) |
| Program Memory (Flash) | 64 KB (22K x 24) |
| Data RAM | 8 KB |
| Operating Frequency | 70 MHz max |
| Encapsulamento | 48-UQFN (MV) 6x6 mm with exposed pad |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial, I grade) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| ADC | 12-bit, up to ~1.1 Msps |
| Integrated Op Amps | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| Communication Interfaces | UART, SPI, I2C, USB, CAN |
| Peripheral Trigger Generator (PTG) | Yes |
| Tape and Reel Suffix | T (e.g., /MV in T&R packaging) |
Configuração de pinos do PIC24EP64GP204T-I/MV
| Pino 1 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 2 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 3 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 4 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 5 | VREF+/ANn — ADC positive reference / analog input |
| Pino 6 | VREF-/ANn — ADC negative reference / analog input |
| Pino 7 | AVDD — Analog supply voltage |
| Pino 8 | AVSS — Analog ground |
| Pino 9 | OSC1/CLKI — Crystal oscillator input or external clock input |
| Pino 10 | OSC2/CLKO — Crystal oscillator output or clock output |
| Pino 11 | MCLR — Master clear reset (active low) |
| Pino 12 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 13 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 14 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 15 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 16 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 17 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 18 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 19 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 20 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 21 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 22 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 23 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 24 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 25 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 26 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 27 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 28 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 29 | D+/USB — USB D+ data line (when USB enabled) |
| Pino 30 | D-/USB — USB D- data line (when USB enabled) |
| Pino 31 | VBUS/USBDP — USB VBUS detect / USB pull-up control |
| Pino 32 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 33 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 34 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 35 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 36 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 37 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 38 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 39 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 40 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 41 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 42 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 43 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 44 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 45 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 46 | RPn/PWM/CMP — Remappable peripheral / PWM output / comparator input |
| Pino 47 | VDD — Digital supply voltage |
| Pino 48 | VSS — Digital ground |
Aplicações típicas
PIC24EP64GP204T-I/MV é adequado para 6 aplicaçãos: Industrial Sensor Signal Conditioning, BLDC and PMSM Motor Control, USB-Enabled Embedded Devices, LED Lighting and Color-Mixing Controllers, Human-Machine Interface (HMI) Front-Ends, Automotive Sensor Nodes (Non-Safety).
Industrial Sensor Signal Conditioning
The PIC24EP64GP204T-I/MV is well-suited for industrial sensor signal conditioning because its integrated op amps and 12-bit ADC form a complete analog front end on-chip. With 70 MIPS of CPU throughput, the MCU can run calibration and digital filtering in real time without external DSP components. The CTMU provides precise charge-time measurements for capacitive, RTD, and humidity sensors, while the CTMU and 8 KB RAM enable moving-average and FIR filter stacks up to several hundred taps. The 48-UQFN package fits into compact sensor modules, and the exposed pad enables reliable operation across the -40C to +85C industrial range, where factory-floor thermal stress would otherwise force derating. The PTG further reduces CPU overhead by sequencing ADC and CTMU triggers autonomously.
Recomendado
BLDC and PMSM Motor Control
The PIC24EP64GP204T-I/MV fits BLDC and PMSM motor control because the 70 MIPS core handles sinusoidal commutation and field-oriented control (FOC) algorithms in real time. The PTG sequences ADC sampling on phase currents synchronously with PWM edges, eliminating CPU latency in critical control loops. The 12-bit ADC with up to 1.1 Msps captures back-EMF and current waveforms at high PWM frequencies, while the integrated op amps condition analog feedback directly at the MCU pins. With USB and CAN on-chip, the same MCU drives the motor and exposes the drive telemetry to a host controller or industrial bus. The 48-UQFN (MV) 6x6 mm package enables compact motor-drive PCB layouts alongside the gate-driver stages.
Recomendado
USB-Enabled Embedded Devices
The PIC24EP64GP204T-I/MV fits USB-enabled embedded devices because the PIC24EP family integrates a USB 2.0 full-speed peripheral with on-chip transceiver, eliminating external PHY components. The 70 MIPS CPU handles USB stacks (HID, CDC, vendor classes) alongside application code, and 8 KB of RAM is sufficient for typical composite-USB device firmware. The 64 KB Flash accommodates both bootloader and application images with in-application programming support. The 48-UQFN package enables small-form-factor USB dongles and HMI panels, while the -40C to +85C range covers consumer and industrial deployment scenarios. PTG offloads repetitive USB endpoint servicing from the CPU, improving sustained throughput.
Recomendado
LED Lighting and Color-Mixing Controllers
The PIC24EP64GP204T-I/MV is appropriate for LED lighting and color-mixing controllers because the 12-bit ADC and PWM outputs enable fine-grained current and color-temperature control. The PTG synchronizes multi-channel PWM with the ADC sample window, allowing closed-loop current regulation on each LED string without CPU overhead. The 70 MIPS core runs color-space conversion (CIE1931, gamut mapping) and brightness curves in real time. USB or CAN connectivity lets the lighting fixture participate in DALI, DMX, or proprietary building-automation networks. The integrated op amps condition analog temperature-sensor feedback for thermal derating, and the 48-UQFN 6x6 mm package fits into compact downlight form factors.
Recomendado
Human-Machine Interface (HMI) Front-Ends
The PIC24EP64GP204T-I/MV suits HMI front-end controllers because the 70 MIPS core drives LCD or TFT control signals and runs touch-sensing firmware via the CTMU. The 8 KB RAM supports multi-page display framebuffers, while 64 KB Flash hosts the HMI logic and graphic asset decoding. USB and CAN enable host-side communication in industrial panels, and UART/SPI/I2C connect to display driver ICs. The integrated op amps condition analog joystick or rotary-encoder signals without external analog stages. The 48-UQFN (MV) package simplifies SMT assembly on HMI PCBs, and the exposed pad provides a stable ground reference for the analog sensing inputs in electrically noisy industrial environments.
Recomendado
Automotive Sensor Nodes (Non-Safety)
The PIC24EP64GP204T-I/MV fits non-safety automotive sensor nodes because its -40C to +85C industrial range covers cabin and chassis areas, and CAN connectivity enables integration with vehicle networks. The 12-bit ADC and integrated op amps condition sensor signals (temperature, pressure, position) directly, while the 70 MIPS core runs calibration and diagnostics in real time. The 64 KB Flash accommodates OBD-II and UDS protocol stacks for diagnostic support. The 48-UQFN 6x6 mm package enables small sensor-module form factors. For safety-critical ECUs requiring AEC-Q100, the PIC24EP family offers Q-grade variants; the standard I/MV part is not AEC-Q100 qualified and should be evaluated case-by-case.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24EP64GP204T-I/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24EP128GP204T-I/MV | PIC24EP64GP204-I/MV | PIC24EP64GP204-E/MV | PIC24EP64GP204-H/MV | PIC24EP512GP204T-I/MV |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (MV) 6x6 mm | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same | 48-UQFN (MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash (KB) | 64 | 128 | 64 | 64 | 64 | 512 |
| RAM (KB) | 8 | 8 | 8 | 8 | 8 | 48 |
| CPU Speed (MIPS) | 70 | 70 | 70 | 70 | 70 | 70 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +150C (High) | -40C to +85C (Industrial) |
| Packaging Format | Tape & Reel | Tape & Reel | Tray | Tray (and T&R variants) | Tray (and T&R variants) | Tape & Reel |
| Integrated Op Amps | Yes | Yes | Yes | Yes | Yes | Yes |
| PTG (Peripheral Trigger Generator) | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Higher Flash headroom within the same package (vs PIC24EP64GP204-I/MV)
- Extended temperature for harsher environments (vs PIC24EP64GP204-E/MV)
- Highest Flash density in the same footprint (vs PIC24EP512GP204T-I/MV)
Notas de projeto
Solder the UQFN exposed pad directly to a continuous ground copper pour with at least 5 thermal vias (0.3 mm drill, 0.5 mm pitch) stitching to inner ground planes. The exposed pad is the primary thermal and electrical ground path for the analog peripherals; insufficient connection will degrade ADC accuracy and op amp performance. Estimated: at full 70 MIPS CPU load the device dissipates ~150 mW internally, and with the MV package thermal resistance, the exposed pad is essential for keeping junction temperature below the +85C ambient limit.
Place 100 nF decoupling capacitors as close as possible to each VDD pin and a 10 uF bulk capacitor on AVDD within 5 mm of the pin. Separate analog AVDD and digital VDD traces, joined only at a single point near the MCU, to prevent digital switching noise from coupling into the analog reference. Estimated: at 70 MIPS and active ADC sampling, expect ~30 mA peak current draw on VDD; budget the LDO or switching regulator accordingly. Add a ferrite bead on USB VBUS if USB is enabled.
Route analog input traces (ANx, VREF+, VREF-) away from PWM and switching signals, and keep ADC traces short with a ground shield underneath. Use guarded analog ground that ties only to the MCU's analog ground pin (AVSS), not directly to the digital ground plane, to avoid ground bounce coupling into ADC readings. According to the Microchip PIC24EP family reference manual, keep trace impedance matched and ADC sample rates below the datasheet-specified maximum to preserve ENOB.
Do not leave MCLR floating; tie it to VDD through a 10 kohm pull-up and a 100 nF cap for proper reset operation during programming. Configure the oscillator configuration bits in your firmware to match the actual crystal or clock source, otherwise the MCU may fail to start. Do not exceed the maximum I/O source/sink current (typically 4-8 mA per pin) or the MCU may latch up. Always program the JTAG/ICD pins to their alternate peripheral functions if not using debugging.
Use Microchip's recommended PCB land pattern for the 48-UQFN (MV) 6x6 mm package, ensuring the exposed pad has a 1:1 ratio of solder mask opening to copper for reliable assembly. Place the decoupling capacitors on the same side as the MCU and route power traces with sufficient width (>=0.2 mm per ampere of current). According to Microchip application notes, layer stack-up with a dedicated ground plane below the MCU significantly improves EMI/EMC performance.
Informações de conformidade
RoHS and REACH compliance confirmed via Microchip product page and distributor listings. Lead-free packaging. The standard I/MV part is NOT AEC-Q100 qualified; for AEC-Q100 automotive applications, evaluate the Q-graded variants separately.
