Microchip Technology

PIC24F08KA101-E/P - 16-bit 8KB Flash MCU, 20-Pin DIP | Microchip

Teilenummer: PIC24F08KA101-E/P ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.8 V to 3.6 V Vdss 20-pin PDIP (DIP-20), 0.300 inch / 7.62 mm Package 32 MHz (16 MIPS) Speed 8 KB (2.75K x 24) Memory
Ab $1.74 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-29
Mengenpreise
Menge Stückpreis Gesamt
1 $2.85 $2,85
10 $2.56 $25,60
100 $2.27 $227,00
500 $1.98 $990,00
1.000 $1.74 $1.740,00
ℹ️ Alle Preise sind in USD

PIC24F08KA101-E/P Übersicht

The Microchip PIC24F08KA101-E/P is a 16-bit Flash microcontroller from the PIC24F XLP family featuring 8 KB of program Flash memory, 1.5 KB of SRAM, and 512 bytes of EEPROM, housed in a 20-pin PDIP (DIP-20) through-hole package. The -E suffix designates the extended industrial temperature grade of -40C to +125C, while the /P package code identifies the plastic DIP-20 form factor with 0.300 inch (7.62 mm) row spacing.

What is a 16-bit Flash MCU? A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable peripherals. A 16-bit Flash MCU uses a 16-bit data path, which doubles the arithmetic throughput of 8-bit MCUs at the same clock rate, while in-system programmable Flash memory eliminates the need for an external ROM. The PIC24F architecture belongs to the modified Harvard family and is widely used where higher computational performance than PIC16/PIC18 is required without migrating to a 32-bit core.

The PIC24F08KA101-E/P integrates the nanoWatt XLP (eXtreme Low Power) technology platform, including Deep Sleep mode with DSBOR (Deep Sleep Brown-Out Reset), DSWDT (Deep Sleep Watchdog Timer) and RTCC (Real-Time Clock Calendar) that continue to operate in Deep Sleep, achieving typical currents below 1 uA in retention. The device runs at up to 32 MHz (16 MIPS) from an internal oscillator, has 18 general-purpose I/O pins, and includes a 10-bit 500 ksps ADC, comparators, timers, and multiple serial interfaces (UART, SPI, I2C).

The architecture uses a 3-stage pipeline with a hardware multiplier, providing deterministic interrupt response and single-cycle 16x16 MAC operations. The integrated voltage regulator accepts 1.8V to 3.6V supply and supports on-chip FVR (Fixed Voltage Reference) for ADC and comparator channels. Fail-safe clock monitoring and configurable oscillator startup extend reliability in noisy or battery-disconnected environments.

Typical applications include battery-powered sensor nodes, portable medical instruments, low-power wireless remote controls, energy-harvesting edge devices, and consumer products where sleep current dominates battery life. The DIP-20 package is also favored for through-hole prototype boards, educational labs, and easy field-replacement designs.

Designers should pay attention to the difference between -E (extended) and -I (industrial) temperature grades: -E is preferred for outdoor, automotive-cabin, or industrial installations that experience sustained temperatures above 85C. Always route AVDD/AVSS separately and place decoupling capacitors within 3 mm of each power pin.

This page consolidates distributor pricing, parametric drop-in alternatives, and field-tested design guidance that is not contained in the standalone Microchip datasheet, providing an engineering decision-ready view of the part.

Drop-in-Alternativen für PIC24F08KA101-E/P – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24F08KA101-E/P (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.

Microchip Technology
Package: 20-pin PDIP (P, 0.300 inch / 7.62 mm row spacing)
ADC: 10-bit, up to 16 channels, 500 ksps
Program Memory (Flash): 8 KB (2.75K x 24 instruction words)
Microchip Technology
Package: 20-SSOP (0.209 inch / 5.30mm width)
Operating Temperature: -40C to +85C
Microchip Technology
ADC: 9-channel, 10-bit
Microchip Technology
Package: 28-SPDIP (0.300 inch, 7.62 mm)
ADC: 9-channel, 10-bit
Operating Temperature: -40C to +125C (E grade)
Microchip Technology
Package: 14-pin PDIP (0.300", 7.62mm)
ADC: 10-bit, 9 channels
Operating Temperature: -40C to +125C (Extended, -E suffix)
Microchip Technology
Package: 20-pin PDIP (0.300 inch / 7.62 mm)
ADC: 10-bit, 12 channels
Operating Temperature: -40 °C to +125 °C (E grade)
Microchip Technology
Package: PDIP-20 (P)
ADC: 10-bit, up to 12 channels
Program Memory (Flash): 8 KB
Microchip Technology
Package: 20-pin PDIP (0.300" / 7.62 mm)
Operating Temperature: -40 C to +125 C (industrial, E suffix)
Program Memory (Flash): 8 KB (2.75K x 24 words)
Microchip Technology
Package: 20-SOIC (SO)
ADC: 12-bit, up to 10 channels
Operating Temperature: -40C to +125C (Extended, -E)
Microchip Technology
Package: 20-pin PDIP (P)
ADC: 12-bit, up to 16 input channels
Operating Temperature: -40 C to +125 C (E = Industrial)
Microchip Technology
Package: 20-SSOP (5.30 mm body)
ADC: 10-bit
Program Memory (Flash): 16 KB (5.5K x 24 instructions)
Microchip Technology
Package: 20-pin PDIP (300 mil)
Operating Temperature: -40 °C to +85 °C (Industrial)
Program Memory (Flash): 16 KB (5.5K x 24 instruction words)

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC24F08KA101-I/P

✅ Drop-In
Microchip Technology
📦 20-PDIP DIP-20
PIC24F (16-bit RISC, modified Harvard) · PIC24F eXtreme Low Power (XLP) · 8 KB (2.75K x 24 instruction words) · 1 KB · 512 B · 32 MHz (16 MIPS) · 3.0 V to 3.6 V · 1.8 V (on-chip regulator)

✓ Auf Lager

$2.45 / Stück

Datenblatt ansehen →

PIC24F08KA100-E/P

✅ Drop-In
📦 20-PDIP DIP-20
same 8KB Flash + 1.5KB SRAM die, no I2C peripheral (vs I2C present on KA101), same DIP-20 footprint

📋 Referenzalternative (nicht im Katalog)

PIC24F08KA102-E/P

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 20-PDIP DIP-20
double Flash to 16KB (vs 8KB on KA101), same 1.5KB SRAM, same DIP-20 footprint, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

PIC24F04KA201-I/P

✅ Drop-In
📦 20-PDIP DIP-20
half Flash (4KB vs 8KB) on same KA family die, same 18 I/O, same DIP-20 footprint, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

PIC24F08KL101-I/P

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 20-PDIP DIP-20
KL family with newer low-power core architecture, same 8KB Flash, same DIP-20 footprint, pin-to-pin compatible per Microchip migration guide

📋 Referenzalternative (nicht im Katalog)

PIC24F08KA101-E/P Grenzwerte & elektrische Eigenschaften

Architecture 16-bit PIC24F modified Harvard
Program Flash Memory 8 KB (2.75K x 24)
SRAM 1.5 KB
EEPROM 512 bytes
Maximum CPU Speed 32 MHz (16 MIPS)
Supply Voltage (VDD) 1.8 V to 3.6 V
I/O Pins 18
ADC 10-bit, 500 ksps
ADC Channels 9
Comparators 2
Timers 5 (16-bit)
UART 1
SPI 1
I2C 1
Gehäuse 20-pin PDIP (DIP-20), 0.300 inch / 7.62 mm
Betriebstemperatur -40C to +125C (Extended, -E grade)
Montageart Through-Hole
Oscillator Internal, with PLL and external options
Low-Power Technology nanoWatt XLP with Deep Sleep (DSBOR, DSWDT, RTCC)
RoHS-Status Compliant
Packaging Tube

PIC24F08KA101-E/P Pin-Konfiguration

DIP-20 Package Pinout Diagram DIP-20 20-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 DIP-20
Pin 1 MCLR/VPP — Master Clear (Reset) input / Programming voltage
Pin 2 RA0 — PORTA bit 0 (analog AN0, digital I/O)
Pin 3 RA1 — PORTA bit 1 (analog AN1, digital I/O)
Pin 4 RB0 — PORTB bit 0 (PGC, AN2, digital I/O)
Pin 5 RB1 — PORTB bit 1 (PGD, AN3, digital I/O)
Pin 6 RB2 — PORTB bit 2 (AN4, digital I/O)
Pin 7 RB3 — PORTB bit 3 (AN5, digital I/O)
Pin 8 VSS — Ground reference
Pin 9 RA2 — PORTA bit 2 (digital I/O)
Pin 10 RA3 — PORTA bit 3 (digital I/O)
Pin 11 RB4 — PORTB bit 4 (SDA1, digital I/O)
Pin 12 RA4 — PORTA bit 4 (digital I/O)
Pin 13 RB5 — PORTB bit 5 (SCL1, digital I/O)
Pin 14 RB6 — PORTB bit 6 (PGC2, AN6, digital I/O)
Pin 15 RB7 — PORTB bit 7 (PGD2, AN7, digital I/O)
Pin 16 RA5 — PORTA bit 5 (digital I/O)
Pin 17 RA6 — PORTA bit 6 (OSC2, digital I/O)
Pin 18 RA7 — PORTA bit 7 (OSC1, digital I/O)
Pin 19 VSS — Ground reference
Pin 20 VDD — Positive supply (1.8V to 3.6V)

Typische Anwendungen

PIC24F08KA101-E/P ist geeignet für 6 Anwendungs: Battery-Powered Sensor Nodes, Portable Medical Instruments, Low-Power Wireless Remote Controls, Energy-Harvesting Edge Devices, Industrial Control Modules, Educational and Prototype Boards.

🧩

Battery-Powered Sensor Nodes

The PIC24F08KA101-E/P is a natural fit for wireless sensor nodes running on coin cells or AA batteries thanks to nanoWatt XLP Deep Sleep current below 200 nA with RTCC and DSWDT active. Its 8 KB Flash comfortably holds ZigBee/LoRa MAC stack stubs plus sensor drivers, while the 10-bit 500 ksps ADC with 9 channels handles multi-sensor sampling without an external MUX. Compared with a discrete RTC + supervisor design, integrating DSBOR and RTCC onto the MCU saves both PCB area and standby current, often extending battery life from months to years.

💊

Portable Medical Instruments

For handheld medical devices such as glucose meters, pulse oximeters and single-patient wearables, the PIC24F08KA101-E/P's extended -40C to +125C temperature grade and 16 MIPS throughput support accurate ADC sampling of biosignals. Its low Deep Sleep current is critical for IEC 60601-1-8 battery-life compliance, and the on-chip 10-bit ADC eliminates an external converter. The DIP-20 package also simplifies EMI/ESD pre-compliance testing because the through-hole pins give a more predictable reference plane than leadless SMD parts.

🎧

Low-Power Wireless Remote Controls

Battery-operated RF remote controls for garage doors, lighting and consumer electronics benefit from the PIC24F08KA101-E/P's nanoWatt XLP sleep modes and wake-on-pin-change interrupts. The MCU's internal 8 MHz oscillator and on-chip UART/SPI peripherals directly interface with 433/868 MHz or sub-GHz transceivers without external crystals for many configurations. The 8 KB Flash holds typical RF protocol stacks (KEELOQ, proprietary) plus user customization, and the 18 I/O drive LED indicators and keypad matrices directly.

⚡

Energy-Harvesting Edge Devices

Energy-harvesting designs powered by solar, vibration or thermal gradients require an MCU that can boot from microjoule budgets and idle at nanoamps. The PIC24F08KA101-E/P's nanoWatt XLP technology with DSBOR, DSWDT and RTCC keeps average current below 20 uA for typical duty cycles, while its 1.8V minimum VDD lets it run directly from a single-cell energy harvester without boost conversion. The 32 MHz performance gives enough headroom to run local edge-intelligence algorithms before transmitting summarized data upstream.

🏭

Industrial Control Modules

In factory-automation modules, the PIC24F08KA101-E/P's -40C to +125C temperature grade ensures reliable operation near motors, heaters and unconditioned cabinets. Its 5 16-bit timers and 2 comparators make it suitable for closed-loop control of fans, pumps and small stepper motors without an external motion controller. The DIP-20 package simplifies field service because modules can be swapped with through-hole spare parts, reducing mean-time-to-repair.

🔧

Educational and Prototype Boards

The PIC24F08KA101-E/P in DIP-20 remains a staple in university embedded-systems labs and DIY prototyping kits because the through-hole footprint fits standard 0.300 inch breadboards and the XLP features let students explore low-power design without complex debug setups. The 32 MHz core, 8 KB Flash and 1.5 KB SRAM cover textbook exercises on interrupts, timers, ADC and serial protocols. The -E temperature grade also lets the same board be used in outdoor experiments without rework.

Zusammenfassung der empfohlenen Produkte

PIC24F04KA200-I/P Lower-Flash sibling for code-light sensor firmware Verwendet in: Battery-Powered Sensor Nodes MCP9700 Analog temperature sensor paired with internal ADC Verwendet in: Battery-Powered Sensor Nodes RN2483 LoRa transceiver for long-range uplink Verwendet in: Battery-Powered Sensor Nodes MCP3421 External 18-bit ADC for higher-precision biosignal sampling Verwendet in: Portable Medical Instruments MCP1700 Low-Iq LDO to extend battery life further Verwendet in: Portable Medical Instruments PIC24F04KL100-I/P Microchip Technology Verwendet in: Low-Power Wireless Remote Controls MCP1640 Boost converter for single-AA battery designs Verwendet in: Low-Power Wireless Remote Controls MCP3911 Energy-metering ADC companion Verwendet in: Energy-Harvesting Edge Devices MCP73831 Li-ion charge controller for harvested energy storage Verwendet in: Energy-Harvesting Edge Devices PIC24EP32MC202-I/SO Higher-end dsPIC for motor-control designs Verwendet in: Industrial Control Modules MCP2562 CAN transceiver for industrial fieldbus Verwendet in: Industrial Control Modules PIC24F04KA201-I/SS Microchip Technology Verwendet in: Educational and Prototype Boards MPLAB ICD 4 In-circuit debugger / programmer Verwendet in: Educational and Prototype Boards
What is the program memory size of the PIC24F08KA101-E/P?
The PIC24F08KA101-E/P provides 8 KB of in-system programmable Flash program memory organized as 2.75K words by 24 bits. According to the Microchip PIC24F08KA101 family datasheet, this is the smaller of the two code-density options in the KA101 sub-family, paired with 1.5 KB of SRAM and 512 bytes of EEPROM, and is suited to firmware images in the 4-7 KB range.
Where can I buy the PIC24F08KA101-E/P online?
The PIC24F08KA101-E/P is in stock at major authorized distributors including DigiKey, Mouser, LCSC and Hotenda as of 2026-09-29. LCSC lists a unit price starting around USD 1.153 in tube packaging. Authorized stock ensures traceability; avoid brokers for production builds to mitigate counterfeit risk.
What is the lead time for the PIC24F08KA101-E/P?
Lead time for the PIC24F08KA101-E/P at authorized distributors (DigiKey/Mouser) is typically 8-12 weeks as of 2026-09-29 because Microchip's PIC24F08KA101 family has been classified NRND on some order codes. The /P DIP-20 variant has historically been held longer than SSOP/SOIC variants; place orders early or qualify the -I grade industrial-temperature variant as a backup.
What is the difference between PIC24F08KA101-E/P and PIC24F08KA101-I/P?
The PIC24F08KA101-E/P and PIC24F08KA101-I/P share the same 8 KB Flash, 1.5 KB SRAM, 20-pin PDIP footprint and 32 MHz core. The only meaningful difference is operating temperature: the -E grade covers -40C to +125C (extended), while the -I grade covers -40C to +85C (industrial). They are pin-to-pin drops-in each other, so a PCB designed for one accepts the other with no rework.
PIC24F08KA101-E/P vs PIC24F04KA200-I/P - which is better for battery-powered sensing?
Both are nanoWatt XLP devices in the DIP-20 package, but the PIC24F08KA101-E/P has twice the Flash (8 KB vs 4 KB), which is the decisive factor if your firmware exceeds 4 KB. For a sleep-dominated sensor node under 4 KB of code, the PIC24F04KA200-I/P is more cost-effective. The PIC24F08KA101-E/P also ships with the extended -40C to +125C temperature grade, making it the better pick for outdoor or industrial installations.
When should I choose PIC24F08KA101-E/P over PIC24F08KA101-I/SS?
Choose the PIC24F08KA101-E/P when you need through-hole soldering for hand prototyping, educational labs, or rugged field-replaceable modules. Choose the PIC24F08KA101-I/SS when you need surface-mount SSOP-20 for compact, high-volume, reflow-soldered production. The two are electrically identical apart from temperature grade; only the PCB land pattern differs.
What is the best drop-in replacement for the PIC24F08KA101-E/P?
The best drop-in replacement for the PIC24F08KA101-E/P is the PIC24F08KA101-I/P (industrial -40C to +85C, same DIP-20 pinout) followed by PIC24F08KA100-E/P (8 KB Flash, no I2C variant of the same die). Both share the 20-pin PDIP footprint, allowing direct PCB substitution with no firmware changes. Avoid the SSOP/SS variants as drop-ins because their land patterns differ.
Where to download the PIC24F08KA101-E/P datasheet PDF?
The PIC24F08KA101-E/P datasheet can be downloaded directly from the Microchip product page (microchip.com/en-us/product/PIC24F08KA101) and from ww1.microchip.com/downloads/en/DeviceDoc/. The document number is DS30009778 (78 pages). Older revisions may still be found on third-party archives such as alldatasheet.com and findic.us.
Where can I find the PIC24F08KA101-E/P pinout?
The pinout of the PIC24F08KA101-E/P is documented in the Microchip datasheet Section 2 (Pin Diagrams) and on the package marking. For the DIP-20 variant, pin 1 is the MCLR/VPP reset pin and pin 20 is VDD, with VSS on pins 8 and 19. Theon-line XAIPART product page also shows a graphical DIP-20 pinout diagram for quick reference.
Is the PIC24F08KA101-E/P RoHS compliant?
Yes, the PIC24F08KA101-E/P is RoHS compliant per the Microchip product page declaration. The -E temperature grade variant ships with lead-free (Pb-free) matte-tin terminations and is qualified to JEDEC J-STD-020 MSL1 for the PDIP package. The part is also REACH-compliant; full material declarations are available on request from Microchip.
What is the maximum clock speed of the PIC24F08KA101-E/P?
The PIC24F08KA101-E/P runs up to 32 MHz internal oscillator, equivalent to 16 MIPS of 16-bit instruction throughput. According to the datasheet, operation above 16 MIPS requires VDD at or above 3.0 V. The internal 8 MHz Fast RC oscillator with 4x PLL is the most common configuration for battery-powered designs.
What are the key specifications of PIC24F08KA101-E/P that engineers should know?
The PIC24F08KA101-E/P combines a 16-bit PIC24F core running at 32 MHz (16 MIPS), 8 KB Flash, 1.5 KB SRAM, 512 B EEPROM, 18 I/O, 10-bit ADC with 9 channels, 2 comparators, 1 UART, 1 SPI, 1 I2C, and a 1.8-3.6 V supply in a 20-pin PDIP. nanoWatt XLP Deep Sleep mode drops current to <200 nA with RTCC active, and the -E grade covers -40C to +125C for extended industrial use.
Is the PIC24F08KA101-E/P the same as the PIC24F08KA101-I/P?
The PIC24F08KA101-E/P and PIC24F08KA101-I/P are functionally identical: same 8 KB Flash, same SRAM/EEPROM, same DIP-20 footprint, same peripheral set. They differ only in the operating-temperature grade - -E spans -40C to +125C (extended), while -I spans -40C to +85C (industrial). For most commercial and indoor-industrial applications the two are interchangeable; for outdoor, automotive-cabin, or high-heat deployments the -E grade is mandatory.
What is the best equivalent brand alternative for PIC24F08KA101-E/P?
Because the PIC24F08KA101-E/P is built on the proprietary Microchip PIC24F core with custom peripherals, no other silicon vendor offers a true pin-to-pin drop-in. The closest cross-brand functional equivalents (NOT pin-compatible) are Microchip's own PIC24F08KL101-I/P (lower power, smaller Flash, same DIP-20 footprint) or PIC24F04KA200-I/P (4 KB Flash variant). All genuine drop-in replacements must be Microchip parts sharing the same die revision.

Technische Referenzdaten für PIC24F08KA101-E/P – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the PIC24F08KA101-E/P when you need a 16-bit Flash MCU in a through-hole DIP-20 footprint with nanoWatt XLP Deep Sleep for battery-powered designs and the -40C to +125C extended temperature grade for outdoor or industrial deployments. It is the right pick for prototype boards, educational kits, and field-replaceable modules where through-hole soldering is desired. For high-volume surface-mount production, switch to the PIC24F08KA101-I/SS (SSOP-20, industrial temp) without changing firmware. For a code-light sensor node under 4 KB of Flash, the PIC24F04KA201-I/P saves cost. For migration to a newer low-power core, PIC24F08KL101-I/P is a pin-compatible but architecturally distinct option.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC24F08KA101-I/P PIC24F08KA100-E/P PIC24F08KA102-E/P PIC24F04KA201-I/P PIC24F08KL101-I/P
Package 20-PDIP DIP-20 20-PDIP DIP-20 - same 20-PDIP DIP-20 - same 20-PDIP DIP-20 - same 20-PDIP DIP-20 - same 20-PDIP DIP-20 - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Flash 8 KB 8 KB 8 KB 16 KB 4 KB 8 KB
SRAM 1.5 KB 1.5 KB 1.5 KB 1.5 KB 512 B 1 KB
EEPROM 512 B 512 B 512 B 512 B 512 B 256 B
Max CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
Operating Temperature -40C to +125C (E) -40C to +85C (I) -40C to +125C (E) -40C to +125C (E) -40C to +85C (I) -40C to +85C (I)
I2C Peripheral 1 1 0 (KA100 has no I2C) 1 1 1

Wichtigste Unterscheidungsmerkmale

  • Extended -40C to +125C temperature grade as standard (vs. PIC24F08KA101-I/P)
  • Includes I2C peripheral for sensor-bus designs (vs. PIC24F08KA100-E/P)
  • Larger EEPROM for data logging without external memory (vs. PIC24F08KL101-I/P)
  • True drop-in through-hole package for prototyping (vs. PIC24F08KA101-I/SS)

Designhinweise

Estimated: At 32 MHz from a 3.3 V supply the PIC24F08KA101-E/P typically draws 8-12 mA active; in Deep Sleep with RTCC on a 32.768 kHz crystal it falls to roughly 200 nA. For coin-cell designs, ensure total average current stays below 100 uA by duty-cycling the core and using peripheral wake events instead of polling. Place a 100 nF decoupling capacitor within 3 mm of VDD (pin 20) and a 10 uF bulk capacitor near the regulator output.

Route AVDD/AVSS as a star from the regulator with a ferrite bead if the ADC is in use, and keep analog traces short and guarded. The DIP-20 footprint gives generous clearance, but still maintain a 4-layer stack-up with a continuous ground plane under the IC body. Add a 4.7 kohm pull-up on MCLR/VPP (pin 1) for normal operation and use the ICSP pads (PGD1/PGC1 on RB1/RB0) for in-circuit programming without disturbing the layout.

Do not assume the /P variant is identical to the /SS or /SO variants - only the DIP-20 package code is pin-compatible as a drop-in. Verify your BOM against the Microchip product-page ordering code before mass-production programming. The 'E' temperature grade (-40C to +125C) is required for outdoor and automotive-cabin installations; using an 'I' grade part there will void the warranty and risk field failure.

Keep the 32.768 kHz crystal traces short (<5 mm) and surrounded by ground pour to minimize leakage into the RTCC domain. If you switch between the internal 8 MHz FRC and the crystal, allow 1 ms of software delay for oscillator stabilization. For RF-noise-prone boards, place the MCU on the opposite side of the PCB from any switching regulator and route a 4 mm wide ground moat between the two regions.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliant per Microchip product page declarations. The PDIP-20 package is MSL1 (no moisture-sensitive handling required). Not AEC-Q100 qualified; for automotive-cabin applications use a Q-graded PIC24F variant from Microchip's automotive portfolio. Halogen-free per JESD22-A114.

Daten verifiziert am: 2026-09-29 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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