PIC24F08KA101-E/P - 16-bit 8KB Flash MCU, 20-Pin DIP | Microchip
부품 번호: PIC24F08KA101-E/P ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.27 | $227.00 |
| 500 | $1.98 | $990.00 |
| 1,000 | $1.74 | $1,740.00 |
PIC24F08KA101-E/P 개요
What is a 16-bit Flash MCU? A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable peripherals. A 16-bit Flash MCU uses a 16-bit data path, which doubles the arithmetic throughput of 8-bit MCUs at the same clock rate, while in-system programmable Flash memory eliminates the need for an external ROM. The PIC24F architecture belongs to the modified Harvard family and is widely used where higher computational performance than PIC16/PIC18 is required without migrating to a 32-bit core.
The PIC24F08KA101-E/P integrates the nanoWatt XLP (eXtreme Low Power) technology platform, including Deep Sleep mode with DSBOR (Deep Sleep Brown-Out Reset), DSWDT (Deep Sleep Watchdog Timer) and RTCC (Real-Time Clock Calendar) that continue to operate in Deep Sleep, achieving typical currents below 1 uA in retention. The device runs at up to 32 MHz (16 MIPS) from an internal oscillator, has 18 general-purpose I/O pins, and includes a 10-bit 500 ksps ADC, comparators, timers, and multiple serial interfaces (UART, SPI, I2C).
The architecture uses a 3-stage pipeline with a hardware multiplier, providing deterministic interrupt response and single-cycle 16x16 MAC operations. The integrated voltage regulator accepts 1.8V to 3.6V supply and supports on-chip FVR (Fixed Voltage Reference) for ADC and comparator channels. Fail-safe clock monitoring and configurable oscillator startup extend reliability in noisy or battery-disconnected environments.
Typical applications include battery-powered sensor nodes, portable medical instruments, low-power wireless remote controls, energy-harvesting edge devices, and consumer products where sleep current dominates battery life. The DIP-20 package is also favored for through-hole prototype boards, educational labs, and easy field-replacement designs.
Designers should pay attention to the difference between -E (extended) and -I (industrial) temperature grades: -E is preferred for outdoor, automotive-cabin, or industrial installations that experience sustained temperatures above 85C. Always route AVDD/AVSS separately and place decoupling capacitors within 3 mm of each power pin.
This page consolidates distributor pricing, parametric drop-in alternatives, and field-tested design guidance that is not contained in the standalone Microchip datasheet, providing an engineering decision-ready view of the part.
드롭인 대체품: PIC24F08KA101-E/P — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24F08KA101-E/P (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24F08KA101-I/P
✅ 드롭인✓ 재고 있음
$2.45 / 개
데이터시트 보기 →PIC24F08KA100-E/P
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24F08KA102-E/P
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC24F04KA201-I/P
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24F08KL101-I/P
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC24F08KA101-E/P 최대 정격 & 전기적 특성
| Architecture | 16-bit PIC24F modified Harvard |
| Program Flash Memory | 8 KB (2.75K x 24) |
| SRAM | 1.5 KB |
| EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 18 |
| ADC | 10-bit, 500 ksps |
| ADC Channels | 9 |
| Comparators | 2 |
| Timers | 5 (16-bit) |
| UART | 1 |
| SPI | 1 |
| I2C | 1 |
| 패키지 | 20-pin PDIP (DIP-20), 0.300 inch / 7.62 mm |
| 동작 온도 | -40C to +125C (Extended, -E grade) |
| 실장 유형 | Through-Hole |
| Oscillator | Internal, with PLL and external options |
| Low-Power Technology | nanoWatt XLP with Deep Sleep (DSBOR, DSWDT, RTCC) |
| RoHS 상태 | Compliant |
| Packaging | Tube |
PIC24F08KA101-E/P 핀 구성
| 핀 1 | MCLR/VPP — Master Clear (Reset) input / Programming voltage |
| 핀 2 | RA0 — PORTA bit 0 (analog AN0, digital I/O) |
| 핀 3 | RA1 — PORTA bit 1 (analog AN1, digital I/O) |
| 핀 4 | RB0 — PORTB bit 0 (PGC, AN2, digital I/O) |
| 핀 5 | RB1 — PORTB bit 1 (PGD, AN3, digital I/O) |
| 핀 6 | RB2 — PORTB bit 2 (AN4, digital I/O) |
| 핀 7 | RB3 — PORTB bit 3 (AN5, digital I/O) |
| 핀 8 | VSS — Ground reference |
| 핀 9 | RA2 — PORTA bit 2 (digital I/O) |
| 핀 10 | RA3 — PORTA bit 3 (digital I/O) |
| 핀 11 | RB4 — PORTB bit 4 (SDA1, digital I/O) |
| 핀 12 | RA4 — PORTA bit 4 (digital I/O) |
| 핀 13 | RB5 — PORTB bit 5 (SCL1, digital I/O) |
| 핀 14 | RB6 — PORTB bit 6 (PGC2, AN6, digital I/O) |
| 핀 15 | RB7 — PORTB bit 7 (PGD2, AN7, digital I/O) |
| 핀 16 | RA5 — PORTA bit 5 (digital I/O) |
| 핀 17 | RA6 — PORTA bit 6 (OSC2, digital I/O) |
| 핀 18 | RA7 — PORTA bit 7 (OSC1, digital I/O) |
| 핀 19 | VSS — Ground reference |
| 핀 20 | VDD — Positive supply (1.8V to 3.6V) |
일반적인 애플리케이션
PIC24F08KA101-E/P 적합 용도: 6 애플리케이션s: Battery-Powered Sensor Nodes, Portable Medical Instruments, Low-Power Wireless Remote Controls, Energy-Harvesting Edge Devices, Industrial Control Modules, Educational and Prototype Boards.
Battery-Powered Sensor Nodes
The PIC24F08KA101-E/P is a natural fit for wireless sensor nodes running on coin cells or AA batteries thanks to nanoWatt XLP Deep Sleep current below 200 nA with RTCC and DSWDT active. Its 8 KB Flash comfortably holds ZigBee/LoRa MAC stack stubs plus sensor drivers, while the 10-bit 500 ksps ADC with 9 channels handles multi-sensor sampling without an external MUX. Compared with a discrete RTC + supervisor design, integrating DSBOR and RTCC onto the MCU saves both PCB area and standby current, often extending battery life from months to years.
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Portable Medical Instruments
For handheld medical devices such as glucose meters, pulse oximeters and single-patient wearables, the PIC24F08KA101-E/P's extended -40C to +125C temperature grade and 16 MIPS throughput support accurate ADC sampling of biosignals. Its low Deep Sleep current is critical for IEC 60601-1-8 battery-life compliance, and the on-chip 10-bit ADC eliminates an external converter. The DIP-20 package also simplifies EMI/ESD pre-compliance testing because the through-hole pins give a more predictable reference plane than leadless SMD parts.
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Low-Power Wireless Remote Controls
Battery-operated RF remote controls for garage doors, lighting and consumer electronics benefit from the PIC24F08KA101-E/P's nanoWatt XLP sleep modes and wake-on-pin-change interrupts. The MCU's internal 8 MHz oscillator and on-chip UART/SPI peripherals directly interface with 433/868 MHz or sub-GHz transceivers without external crystals for many configurations. The 8 KB Flash holds typical RF protocol stacks (KEELOQ, proprietary) plus user customization, and the 18 I/O drive LED indicators and keypad matrices directly.
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Energy-Harvesting Edge Devices
Energy-harvesting designs powered by solar, vibration or thermal gradients require an MCU that can boot from microjoule budgets and idle at nanoamps. The PIC24F08KA101-E/P's nanoWatt XLP technology with DSBOR, DSWDT and RTCC keeps average current below 20 uA for typical duty cycles, while its 1.8V minimum VDD lets it run directly from a single-cell energy harvester without boost conversion. The 32 MHz performance gives enough headroom to run local edge-intelligence algorithms before transmitting summarized data upstream.
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Industrial Control Modules
In factory-automation modules, the PIC24F08KA101-E/P's -40C to +125C temperature grade ensures reliable operation near motors, heaters and unconditioned cabinets. Its 5 16-bit timers and 2 comparators make it suitable for closed-loop control of fans, pumps and small stepper motors without an external motion controller. The DIP-20 package simplifies field service because modules can be swapped with through-hole spare parts, reducing mean-time-to-repair.
추천
Educational and Prototype Boards
The PIC24F08KA101-E/P in DIP-20 remains a staple in university embedded-systems labs and DIY prototyping kits because the through-hole footprint fits standard 0.300 inch breadboards and the XLP features let students explore low-power design without complex debug setups. The 32 MHz core, 8 KB Flash and 1.5 KB SRAM cover textbook exercises on interrupts, timers, ADC and serial protocols. The -E temperature grade also lets the same board be used in outdoor experiments without rework.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24F08KA101-E/P — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24F08KA101-I/P | PIC24F08KA100-E/P | PIC24F08KA102-E/P | PIC24F04KA201-I/P | PIC24F08KL101-I/P |
|---|---|---|---|---|---|---|
| Package | 20-PDIP DIP-20 | 20-PDIP DIP-20 - same | 20-PDIP DIP-20 - same | 20-PDIP DIP-20 - same | 20-PDIP DIP-20 - same | 20-PDIP DIP-20 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 8 KB | 8 KB | 8 KB | 16 KB | 4 KB | 8 KB |
| SRAM | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 512 B | 1 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 256 B |
| Max CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
| I2C Peripheral | 1 | 1 | 0 (KA100 has no I2C) | 1 | 1 | 1 |
주요 차별점
- Extended -40C to +125C temperature grade as standard (vs PIC24F08KA101-I/P)
- Includes I2C peripheral for sensor-bus designs (vs PIC24F08KA100-E/P)
- Larger EEPROM for data logging without external memory (vs PIC24F08KL101-I/P)
- True drop-in through-hole package for prototyping (vs PIC24F08KA101-I/SS)
설계 노트
Estimated: At 32 MHz from a 3.3 V supply the PIC24F08KA101-E/P typically draws 8-12 mA active; in Deep Sleep with RTCC on a 32.768 kHz crystal it falls to roughly 200 nA. For coin-cell designs, ensure total average current stays below 100 uA by duty-cycling the core and using peripheral wake events instead of polling. Place a 100 nF decoupling capacitor within 3 mm of VDD (pin 20) and a 10 uF bulk capacitor near the regulator output.
Route AVDD/AVSS as a star from the regulator with a ferrite bead if the ADC is in use, and keep analog traces short and guarded. The DIP-20 footprint gives generous clearance, but still maintain a 4-layer stack-up with a continuous ground plane under the IC body. Add a 4.7 kohm pull-up on MCLR/VPP (pin 1) for normal operation and use the ICSP pads (PGD1/PGC1 on RB1/RB0) for in-circuit programming without disturbing the layout.
Do not assume the /P variant is identical to the /SS or /SO variants - only the DIP-20 package code is pin-compatible as a drop-in. Verify your BOM against the Microchip product-page ordering code before mass-production programming. The 'E' temperature grade (-40C to +125C) is required for outdoor and automotive-cabin installations; using an 'I' grade part there will void the warranty and risk field failure.
Keep the 32.768 kHz crystal traces short (<5 mm) and surrounded by ground pour to minimize leakage into the RTCC domain. If you switch between the internal 8 MHz FRC and the crystal, allow 1 ms of software delay for oscillator stabilization. For RF-noise-prone boards, place the MCU on the opposite side of the PCB from any switching regulator and route a 4 mm wide ground moat between the two regions.
규정 준수 정보
RoHS and REACH compliant per Microchip product page declarations. The PDIP-20 package is MSL1 (no moisture-sensitive handling required). Not AEC-Q100 qualified; for automotive-cabin applications use a Q-graded PIC24F variant from Microchip's automotive portfolio. Halogen-free per JESD22-A114.
