PIC24F16KL401-E/MQ - 16KB Flash, 32MHz 16-bit MCU | Microchip
Teilenummer: PIC24F16KL401-E/MQ ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.16 | $2,16 |
| 10 | $1.94 | $19,40 |
| 100 | $1.73 | $173,00 |
| 500 | $1.55 | $775,00 |
| 1.000 | $1.38 | $1.380,00 |
PIC24F16KL401-E/MQ Übersicht
A microcontroller (MCU) is a single-chip computer containing a processor core, program and data memory, and programmable peripherals. The PIC24F family sits in the broader hierarchy of microcontrollers -> 16-bit microcontrollers -> flash microcontrollers -> embedded controllers -> semiconductors. The 16-bit PIC24F architecture uses a modified Harvard RISC core, providing deterministic instruction execution with rich peripheral integration in a tiny footprint ideal for low-power embedded systems.
Key features include a 12-channel 10-bit ADC for sensor and battery monitoring, one MSSP peripheral supporting both I2C and SPI communication, and a CCP/ECCP module for capture/compare/PWM control - features inherited from the PIC18 family to enable easy migration. The device also provides up to 17 I/O pins, multiple timers, and nanoWatt XLP technology that achieves sub-microamp sleep currents for battery-powered applications.
The PIC24F16KL401-E/MQ uses a 3.3 V typical operating voltage with wide 1.8 V to 3.6 V range, JTAG/ICSP programming/debug interfaces, and integrated low-power modes including Sleep, Idle, and Deep Sleep. The 5x5 mm VQFN-20 footprint includes an exposed thermal pad that improves thermal dissipation for industrial temperature (-40C to +125C) operation and reduces PCB footprint compared to SOIC-20 alternatives.
Typical applications include IoT sensor nodes, battery-powered remote controls, low-power wireless sensor endpoints, consumer electronics with LCD/keypad interfaces, and cost-sensitive industrial control. Peripherals include 12-bit ADC channels, MSSP, CCP/ECCP, comparators, and timers, providing a complete embedded solution with minimal external components.
When designing with this part, ensure the 32 MHz operation is paired with adequate decoupling (100 nF + 10 uF bulk) near the VDD pins. Program the MSSP early to match your target bus speed. Choose PIC24F08KL401-E/MQ if 8 KB Flash suffices; choose PIC24F32KL401 if 32 KB Flash is needed - all share the same VQFN-20 (MQ) package footprint.
This page synthesizes distributor pricing, same-package drop-in alternatives (within the PIC24F family), and practical design notes not found in the manufacturer datasheet alone - giving engineers a one-stop engineering reference for the PIC24F16KL401-E/MQ.
Drop-in-Alternativen für PIC24F16KL401-E/MQ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24F16KL401-E/MQ (gleiche Bauform und Footprint) – abweichend in ADC, Package, Program Memory (Flash), Core Architecture, I/O Pins.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24F08KL401-E/MQ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24F16KL401-I/MQ
✅ Drop-In✓ Auf Lager
$1.91 / Stück
Datenblatt ansehen →PIC24F16KL301-E/MQ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24F16KA101-I/MQ
✅ Drop-In✓ Auf Lager
$1.65 / Stück
Datenblatt ansehen →PIC24F04KL101-E/MQ
✅ Drop-In✓ Auf Lager
$1.05 / Stück
Datenblatt ansehen →PIC24F08KL201-E/MQ
✅ Drop-In✓ Auf Lager
$1.21 / Stück
Datenblatt ansehen →PIC24F16KL401-E/MQ Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24F (16-bit modified Harvard RISC) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 16 KB (5.5K x 24 instructions) |
| Data Memory (SRAM) | 1 KB |
| EEPROM | 512 bytes |
| Operating Voltage | 1.8 V to 3.6 V |
| ADC | 12-channel, 10-bit |
| I/O Pins | Up to 17 |
| I2C/SPI (MSSP) | 1 module |
| CCP/ECCP Module | 1 module |
| Timers | Multiple 16-bit/32-bit timer modules |
| Low-Power Mode | nanoWatt XLP (sub-uA sleep) |
| Betriebstemperatur | -40C to +125C (E suffix = Enhanced) |
| Gehäuse | 20-pin VQFN (MQ) 5x5 mm with exposed pad |
| Programming/Debug | ICSP / JTAG |
| RoHS-Status | Compliant |
PIC24F16KL401-E/MQ Pin-Konfiguration
| Pin 1 | RA0 — I/O / reference input |
| Pin 2 | RA1 — I/O / analog input |
| Pin 3 | RA2 — I/O / analog input |
| Pin 4 | MCLR — Master clear / reset input |
| Pin 5 | RA3 — I/O / analog input |
| Pin 6 | RA4 — I/O / analog input |
| Pin 7 | RA5 — I/O / analog input |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RA6 — I/O / analog input |
| Pin 10 | RA7 — I/O / analog input |
| Pin 11 | RB0 — I/O / analog input |
| Pin 12 | RB1 — I/O / analog input |
| Pin 13 | RB2 — I/O / analog input |
| Pin 14 | RB3 — I/O / analog input |
| Pin 15 | RB4 — I/O / analog input |
| Pin 16 | RB5 — I/O / analog input |
| Pin 17 | RB6 — I/O / ICSPCLK / PGC |
| Pin 18 | RB7 — I/O / ICSPDAT / PGD |
| Pin 19 | VDD — Positive supply |
| Pin 20 | RB8 — I/O / analog input |
Typische Anwendungen
PIC24F16KL401-E/MQ ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Remote Control / Wireless Key Fob, Industrial Sensor Interface, Consumer Electronics / Home Appliance UI, Cost-Sensitive 8-bit Migration Designs, Low-Power Wireless Endpoint.
Battery-Powered IoT Sensor Node
The PIC24F16KL401-E/MQ's nanoWatt XLP sub-microamp sleep current makes it ideal for battery-powered IoT sensor nodes that spend most of their life in sleep and only wake briefly to transmit data. The 32 MHz/16 MIPS core provides enough processing headroom for sensor fusion and protocol stack execution. The 12-channel 10-bit ADC enables multi-sensor monitoring (temperature, humidity, light, battery voltage) with a single MCU. Per the Microchip datasheet, sleep current as low as 50 nA (RTCC + WDT) extends coin-cell operation to years. Pair with RN2500XT-FCC or SX1278 for sub-GHz wireless; the wide 1.8-3.6 V range suits single-cell Li-ion, 2x AA, or coin-cell topologies directly.
Empfohlen
Remote Control / Wireless Key Fob
The PIC24F16KL401-E/MQ's deep-sleep nanoWatt XLP currents (typically <1 uA with full RAM retention) make it ideal for remote control and key fob applications powered by CR2032 coin cells. The 16 KB program space holds rolling-code encoders and button-debounce logic, while the MSSP peripheral drives low-cost sub-GHz radio modules (NRF22L01, SX1278) over SPI. The CCP/ECCP module generates PWM for IR LED modulation in universal remote designs. The VQFN-20 (MQ) 5x5 mm footprint fits inside the smallest fob enclosures, and -40C to +125C operation handles outdoor automotive key fob conditions. Per Microchip documentation, average current under 5 uA is achievable for years of battery life.
Empfohlen
Industrial Sensor Interface
The PIC24F16KL401-E/MQ's 12-channel 10-bit ADC and 1.8-3.6 V operation make it well suited for industrial 4-20 mA sensor interfaces and 0-10 V analog front ends. The 32 MHz core runs calibration, linearization, and HART-like protocol stacks in real time without timing overruns. The MSSP peripheral drives SPI/I2C-connected ADCs and DACs for higher-precision signal chains. The Extended -40C to +125C temperature grade handles factory floor environments, and the VQFN-20 exposed pad provides thermal headroom for continuously-powered industrial panels. Per the Microchip datasheet, the 10-bit ADC achieves 500 ksps, sufficient for vibration and process variable monitoring.
Empfohlen
Consumer Electronics / Home Appliance UI
The PIC24F16KL401-E/MQ drives consumer appliance user interfaces including LCD/keypad control boards, capacitive touch buttons, and small graphic OLED displays. The MSSP peripheral supports SPI-driven OLEDs and I2C-connected capacitive touch sensors, while the CCP/ECCP module generates backlight PWM and buzzer tones. The 16 KB Flash accommodates full UI state machines plus simple connectivity stacks. The wide 1.8-3.6 V range allows direct 3.3 V or 5 V (with LDO) operation, and the 20-pin VQFN is small enough for compact appliance control boards. Per Microchip documentation, the ICSP/JTAG interface simplifies in-circuit firmware updates during production.
Empfohlen
Cost-Sensitive 8-bit Migration Designs
The PIC24F16KL401-E/MQ is designed as a drop-in upgrade path for legacy PIC18F designs that need more performance, more memory, or both, without migrating to a new toolchain. Per the Microchip datasheet, the PIC24F inherits PIC18 peripherals (MSSP, CCP/ECCP) for direct code reuse. 16 KB Flash/1 KB SRAM is ample for migrated codebases, and the same MPLAB X IDE and XC16 compiler apply. The 1.8-3.6 V wide voltage range matches PIC18FxxK/LQ25 typical applications, and the VQFN-20 (MQ) footprint fits legacy PCBs. This makes the KL401 a low-cost migration target for cost-sensitive designs outgrowing 8-bit PIC18 resources.
Empfohlen
Low-Power Wireless Endpoint
The PIC24F16KL401-E/MQ's nanoWatt XLP technology with sub-uA deep-sleep, IoT integration, and 32 MHz/16 MIPS core make it ideal for BLE-Zigbee-LoRa endpoint applications where the MCU sleeps most of the time and briefly wakes to transmit. Per Microchip documentation, sleep current as low as 20 nA (with RTCC, WDT, and RAM kept) enables years of operation on a coin cell. The MSSP peripheral connects to any sub-GHz radio (NRF24L01, SX1276, RN2503) over SPI. The 16 KB Flash fits simple star-network endpoint stacks; the 12-channel 10-bit ADC handles multi-sensor reading. The 5x5 mm VQFN-20 is small enough for wearable and stick-on sensor tags.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24F16KL401-E/MQ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24F08KL401-E/MQ | PIC24F16KL401-I/MQ | PIC24F16KL301-E/MQ | PIC24F16KA101-I/MQ | PIC24F04KL101-E/MQ | PIC24F08KL201-E/MQ |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-pin VQFN (MQ) 5x5 | 20-pin VQFN (MQ) 5x5 - same | 20-pin VQFN (MQ) 5x5 - same | 20-pin VQFN (MQ) 5x5 - same | 20-pin VQFN (MQ) 5x5 - same | 20-pin VQFN (MQ) 5x5 - same | 20-pin VQFN (MQ) 5x5 - same |
| Flash Memory | 16 KB | 8 KB | 16 KB | 16 KB | 16 KB | 4 KB | 8 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 512 B | 1 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 256 B | 512 B |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| ADC Channels | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit | 9 x 10-bit | 9 x 10-bit |
Wichtigste Unterscheidungsmerkmale
- Highest-density Flash in KL401 family (vs. PIC24F08KL401-E/MQ)
- Extended temperature grade option (vs. PIC24F16KL401-I/MQ)
- nanoWatt XLP vs older KA family sleep current (vs. PIC24F16KA101-I/MQ)
Designhinweise
The PIC24F16KL401-E/MQ's nanoWatt XLP technology achieves idle/standby current as low as 20 nA (RTCC + WDT, no RAM retention) and sleep currents of <1 uA with full 1 KB SRAM retention. For battery-powered designs targeting years of operation on coin cells (CR2032 ~220 mAh), use Sleep mode with RTCC for periodic wake-ups rather than Idle mode. Disable all unused peripherals via the PMD (Peripheral Module Disable) register - each disabled peripheral saves 1-5 uA.
Place a 100 nF decoupling capacitor and a 10 uF bulk capacitor as close as possible to the VDD (pin 19) and VSS (pin 8) pins. The exposed thermal pad (EP) on the VQFN-20 package MUST be soldered to a PCB pad and tied to VSS through a low-impedance plane for both thermal dissipation and ground reference. Per Microchip's PCB layout guidelines, route analog and digital signals on separate layers and keep ADC traces short.
Do not skip the MCLR pull-up resistor (typically 10 kohm to VDD) - leaving MCLR floating causes erratic reset behavior and unreliable programming. The MSSP peripheral can be configured as I2C or SPI but NOT both simultaneously; choose at firmware compile time. ADC readings in Sleep use the dedicated RC ADC oscillator for low-power conversion - the user must wait for the dedicated conversion-complete interrupt. Watch out for the ICSP programming pin overlap with RB6/RB7 (PGC/PGD) - do not use external pull-ups that could obstruct ICSP communication.
Keep the ICSP connector trace lengths short (<5 cm) to RB6 (PGC) and RB7 (PGD) for reliable in-circuit programming. Per Microchip's MPLAB X ICD 4 programmer documentation, add ESD protection diodes on RB6/RB7 if exposed to user-accessible connectors. Route the crystal/oscillator traces symmetrically with ground guard traces if using an external crystal; the internal 8 MHz oscillator eliminates the need for external crystals in most cost-sensitive designs.
Compliance-Informationen
RoHS compliant per Microchip product page. The E temperature grade (-40C to +125C) extends the operational range but does NOT carry AEC-Q100 automotive qualification - for AEC-Q100 qualified parts, consider PIC24FxxKAxxx Q1 variants or contact Microchip for automotive-grade SKUs.
