PIC24FJ1024GB610-I/BG - 16-bit 1MB Flash USB MCU | Microchip
Teilenummer: PIC24FJ1024GB610-I/BG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.4 | $12,40 |
| 10 | $11.16 | $111,60 |
| 100 | $9.92 | $992,00 |
| 500 | $8.68 | $4.340,00 |
| 1.000 | $7.44 | $7.440,00 |
PIC24FJ1024GB610-I/BG Übersicht
A 16-bit microcontroller (MCU) is a programmable processor that uses 16-bit-wide data paths, registers, and instructions, occupying the middle tier of the MCU hierarchy: microcontroller -> 16-bit MCU -> 32-bit MCU -> microprocessor. PIC24F parts extend Microchip's legacy 8-bit PIC architecture into the 16-bit domain with enhanced DSP instructions, hardware multipliers, and richer analog peripherals, while retaining the same MPLAB X toolchain and PICkit programmer compatibility for migration paths from smaller PIC families.
Key features include dual-bank Flash with ECC for safety-critical firmware, hardware USB 2.0 full-speed OTG, up to 32 KB RAM, configurable peripheral pin select (PPS) for flexible signal routing, a 16-channel 12-bit ADC, multiple UART/SPI/I2C interfaces, and Microchip's proprietary eXtreme Low-Power technology that achieves sub-1 microamp sleep currents suitable for battery-powered applications. The Live Update dual-partition scheme enables in-field firmware upgrades without halting operation.
The PIC24FJ1024GB610 family is built on a modified Harvard architecture with a 24-bit instruction word and 16-bit data path, providing deterministic interrupt response and supporting C-compiled code via the MPLAB XC16 toolchain. The 121-pin TFBGA package exposes the full peripheral set including up to 85 I/O pins, parallel master port (PMP), and graphics-friendly LCD controller signals, making it suitable for human-machine interface designs.
Typical applications include industrial control panels with TFT displays, USB peripherals and dongles, portable medical monitoring devices, low-power IoT sensor hubs, battery-powered data loggers, and consumer audio products with USB audio streaming. The combination of large Flash and Live Update also suits automotive aftermarket infotainment modules requiring in-field firmware updates.
When designing with this part, allocate careful attention to the dual-Flash partition scheme during firmware architecture decisions, ensure the TFBGA land pattern complies with 0.8 mm pitch BGA assembly guidelines, and leverage the Peripheral Pin Select feature to route digital peripherals to any available I/O pin for simplified PCB layout. This page synthesizes distributor stock, real-time pricing, drop-in same-package alternatives, and design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für PIC24FJ1024GB610-I/BG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ1024GB610-I/BG (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Timers, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ1024GA610-I/BG
✅ Drop-In✓ Auf Lager
$8.2 / Stück
Datenblatt ansehen →PIC24FJ1024GB610T-I/BG
✅ Drop-In✓ Auf Lager
$9.05 / Stück
Datenblatt ansehen →PIC24FJ1024GB610-I/PT
✅ Drop-In✓ Auf Lager
$5.45 / Stück
Datenblatt ansehen →PIC24FJ1024GB606-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ1024GA610-E/PT
✅ Drop-In✓ Auf Lager
$7.92 / Stück
Datenblatt ansehen →PIC24FJ1024GA606-I/MR
✅ Drop-In✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →PIC24FJ1024GB610-I/BG Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Program Flash Memory | 1 MB (1024 KB) with ECC |
| RAM | 32 KB |
| Live Update Dual Partition | Yes (dual-bank Flash for firmware swap) |
| USB Interface | USB 2.0 Full-Speed OTG |
| ADC | 12-bit, up to 16 channels |
| I/O Pins (max) | 85 |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Betriebstemperaturbereich | -40C to +85C (Industrial, /I grade) |
| Gehäuse | 121-TFBGA, 10x10 mm, 0.8 mm pitch |
| Montageart | Surface Mount |
| Peripheral Pin Select (PPS) | Yes |
| eXtreme Low-Power (XLP) | Yes (sub-uA sleep modes) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC24FJ1024GB610-I/BG 121-tfbga, 10x10 mm, 0.8 mm pitch Pinbelegungsleitfaden
Pinbelegung für PIC24FJ1024GB610-I/BG (121-tfbga, 10x10 mm, 0.8 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC24FJ1024GB610-I/BG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC24FJ1024GB610-I/BG ist geeignet für 7 Anwendungs: Industrial Control Panels with TFT LCD, USB Peripherals and Dongles, Portable Medical Monitoring Devices, Low-Power IoT Sensor Hubs, Battery-Powered Data Loggers, Consumer Audio with USB Streaming, Automotive Aftermarket Infotainment.
Industrial Control Panels with TFT LCD
The PIC24FJ1024GB610-I/BG fits industrial HMI panels because its 1 MB Flash stores full graphical UI assets and fonts, while the parallel master port (PMP) drives TFT displays directly without an external graphics controller. Peripheral Pin Select (PPS) routes up to 85 I/O pins for keypad scanning, LEDs, and external sensors. The 16-bit PIC24F core at 16 MIPS renders 2D widgets fast enough for 30 fps refresh on QVGA displays. XLP sleep modes drop quiescent current below 1 microamp during display idle, extending product battery life. Designers use the Live Update dual-partition feature for field firmware upgrades without halting production line operation.
Empfohlen
USB Peripherals and Dongles
The PIC24FJ1024GB610-I/BG is purpose-built for USB peripherals with its integrated USB 2.0 Full-Speed OTG controller, supporting device, host, and On-The-Go roles. The 1 MB Flash accommodates USB class drivers, HID descriptors, and application firmware simultaneously without external memory. 32 KB RAM handles USB endpoint buffers and protocol stacks. The MCU's 12 MIPS instruction throughput is sufficient for full-speed (12 Mbps) data streaming and HID polling. Engineers can implement USB headsets, barcode scanners, custom HID devices, and CDC serial dongles using Microchip's free USB stack and MPLAB X IDE.
Empfohlen
Portable Medical Monitoring Devices
The PIC24FJ1024GB610-I/BG suits portable medical devices requiring long battery life, reliable data storage, and USB connectivity for data transfer to PCs. Its eXtreme Low-Power technology achieves sub-microamp sleep currents critical for wearable pulse oximeters and glucose meters, while the 16-channel 12-bit ADC samples multiple biosensors. The 1 MB Flash stores weeks of measurement logs without external EEPROM, and ECC ensures data integrity for compliance with IEC 62304 documentation requirements. Live Update dual-partition firmware supports field upgrades for algorithm improvements without service interruptions.
Empfohlen
Low-Power IoT Sensor Hubs
Battery-powered IoT sensor hubs benefit from the PIC24FJ1024GB610-I/BG's eXtreme Low-Power technology, which provides sleep currents below 1 microamp and fast wake-up times under 5 microseconds. The 1 MB Flash stores multiple wireless protocol stacks (LoRaWAN, BLE bridges via UART, Zigbee) along with application logic. PPS allows flexible assignment of SPI/I2C/UART to any I/O for connecting radios and sensors. The USB OTG enables local diagnostics or charging. Industrial temperature range ensures operation in outdoor enclosures. Live Update dual-partition enables OTA-style firmware swap via wired interface.
Empfohlen
Battery-Powered Data Loggers
The PIC24FJ1024GB610-I/BG is well-suited for multi-channel data loggers measuring temperature, voltage, or process signals over weeks on battery power. Its 16-channel 12-bit ADC captures sensor data while eXtreme Low-Power modes keep quiescent draw minimal between samples. The 1 MB Flash with ECC stores 100,000+ log entries with error protection, replacing external EEPROM. Peripheral Pin Select routes SPI/I2C sensor interfaces, UART for GPS or cellular modules, and SD card interfaces via PMP. USB allows quick data download to PCs without removing storage media.
Empfohlen
Consumer Audio with USB Streaming
USB audio dongles and consumer headsets leverage the PIC24FJ1024GB610-I/BG's USB Full-Speed OTG, supporting USB Audio Class 1.0 at 24-bit/48 kHz. The 16 MIPS PIC24F core runs DSP routines for equalization and noise reduction alongside USB streaming. 32 KB RAM buffers audio packets. The 12-bit ADC supports microphone capture. Designers can implement headphone amplifiers, USB speakers, and gaming headsets using Microchip's USB audio framework. Low sleep current preserves battery life during Bluetooth standby when used with companion radios.
Empfohlen
Automotive Aftermarket Infotainment
The PIC24FJ1024GB610-I/BG is a strong fit for aftermarket automotive infotainment modules requiring firmware updates and USB media playback. Its USB OTG reads USB sticks and smartphones for music playback, while the 1 MB Flash stores audio codecs (MP3, AAC) and UI logic. The Live Update dual-partition scheme is critical for in-field firmware upgrades without bricking devices in customer vehicles. Industrial temperature grade handles cabin conditions. For AEC-Q100 automotive qualification, design engineers should select the -E/PT grade variant or the dedicated automotive PIC24FJ family.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ1024GB610-I/BG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ1024GA610-I/BG | PIC24FJ1024GB610T-I/BG | PIC24FJ1024GB610-I/PT | PIC24FJ1024GB606-I/MR | PIC24FJ1024GA610-E/PT | PIC24FJ1024GA606-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 100-TQFP (12x12) | 64-QFN (9x9) | 100-TQFP (12x12) | 64-QFN (9x9) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz | PIC24F 16-bit, 32 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB 2.0 FS OTG | No USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | No USB | No USB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| Live Update Dual Partition | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Only same-family variant with USB 2.0 FS OTG (vs. PIC24FJ1024GA610-I/BG)
- Live Update dual-partition Flash for in-field firmware upgrade (vs. PIC24FJ256GB106-I/PT)
- 121-TFBGA exposes full peripheral set including parallel master port (vs. PIC24FJ1024GB610-I/PT)
Designhinweise
The 121-TFBGA package has 0.8 mm ball pitch on a 10x10 mm substrate. Design PCB land patterns per IPC-7351 with non-solder mask defined (NSMD) pads for best BGA reliability. Use microvia-in-pad stackup if the board is less than 1.6 mm thick, or standard through-hole vias with adequate teardrops. Plan for X-ray inspection during assembly because BGA joints cannot be visually inspected. Include at least 4 thermal vias under the center balls to dissipate the ~300 mW typical operating power.
The PIC24FJ1024GB610 operates from 2.0 V to 3.6 V with separate analog and digital supply pins (AVDD/AVSS and VDDCORE). Place 10 uF + 0.1 uF ceramic decoupling close to each AVDD pin and 1 uF + 0.1 uF near each VDDCORE pin. Use a ferrite bead or pi-filter between VDD and VDDCORE if noise-sensitive analog measurements (12-bit ADC) coexist with switching digital loads. Enable the on-chip voltage regulator with the standard 1 uF + 470 pF cap network shown in the datasheet DS30010074F typical application circuit.
When using the Live Update dual-partition feature, ensure linker scripts reserve the alternate partition's vector table and reserved regions per the MPLAB XC16 examples. Forgetting to mark both partitions as active can cause the bootloader to appear successful while the new firmware never executes after reset. Also note that Peripheral Pin Select (PPS) lock bits must be configured AFTER assigning all required peripheral mappings - locked mappings cannot be reconfigured until the next POR.
USB Full-Speed signal integrity requires a 90-ohm differential impedance on the D+/D- pair routed as matched-length traces with no splits. Place the USB connector within 25 mm of the MCU pins to minimize stubs. Add 15 kV ESD protection diodes on D+/D-/VUSB lines if the design exposes the USB port to user touch. Tie the VBUS pin to the cable VBUS through a divider or comparator per the USB OTG specification, and include 10 uF bulk capacitance on the VBUS pin for device/host role switching.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - select automotive-grade variants (with -E suffix or check PIC24FJ automotive family) for vehicle applications.
