PIC24FJ256GA702-I/SO - 16-bit MCU, 256KB Flash, 28-SOIC | Microchip
Teilenummer: PIC24FJ256GA702-I/SO ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.05 | $4,05 |
| 10 | $3.74 | $37,40 |
| 100 | $3.05 | $305,00 |
| 500 | $2.65 | $1.325,00 |
| 1.000 | $2.3 | $2.300,00 |
PIC24FJ256GA702-I/SO Übersicht
What is a 16-bit microcontroller? A microcontroller (MCU) is a single-chip computer containing a CPU, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of peripherals on one die. 16-bit MCUs occupy the middle ground between 8-bit parts (lowest cost, simplest peripherals) and 32-bit MCUs (highest performance, richest ecosystems); they typically deliver 1 to 2 MIPS per MHz, 16-bit-wide datapaths, and DSP-friendly instructions at clock rates of 16–70 MHz. Hypernyms: microcontroller -> MCU -> embedded processor -> semiconductor. Synonyms used across the industry: MCU, microcontroller, micro-controller, embedded controller.
Key features of the PIC24FJ256GA702 family include 256 KB ECC Flash for safer code storage, 16 KB RAM, DMA for offloading data movement, 12-bit 200 ksps ADC, 3 op amps/comparators with programmable biasing, CTMU for capacitive touch, USB/Full-Speed in related variants, and multiple low-power sleep modes via the XLP architecture that drop quiescent current below 1 µA in deep sleep. The PIC24F core also supports a peripheral pin-select (PPS) remapping block on many members, simplifying PCB routing.
Technically, the PIC24FJ256GA702 uses Microchip's nanoWatt XLP technology with multiple power-managed Run/Idle/Sleep modes, brown-out reset, watchdog timer, real-time clock calendar, and a flexible 16-bit timer/capture/compare/PWM engine. ECC on Flash improves reliability in harsh environments, while DMA accelerates high-bandwidth peripheral transactions such as ADC double-buffering or UART/SPI looped transfers.
Typical applications include low-power IoT sensor nodes, capacitive-touch HMI panels, portable medical monitoring accessories, USB peripherals (related variants), industrial sensor transmitters, and battery-powered metering. For each of these, the combination of large ECC Flash, ample RAM, and XLP quiescent current is the key selection factor. When designing with this part, budget 22 I/O lines (per JLCPCB listing) and confirm peripheral pin-select mappings against the chosen 28-pin SOIC variant to avoid pin-conflict surprises.
Drop-in-Alternativen für PIC24FJ256GA702-I/SO – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ256GA702-I/SO (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Operating Temperature, DMA Channels.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ256GA702-I/SS
✅ Drop-In✓ Auf Lager
$2.3 / Stück
Datenblatt ansehen →PIC24FJ256GA702-I/ML
✅ Drop-In✓ Auf Lager
$2.61 / Stück
Datenblatt ansehen →PIC24FJ256GA702-E/SO
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC24FJ256GA705-I/SO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ128GA702-I/SO
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC24FJ256GA702-I/SO Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24F (16-bit modified Harvard, DSP instructions) |
| CPU Speed | 32 MHz max (16 MIPS) |
| Program Flash | 256 KB (85.5K x 24 words) with ECC |
| RAM | 16 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| ADC | 12-bit, 200 ksps, up to 14 analog inputs |
| Comparators | 3 |
| CTMU (Charge Time Measurement Unit) | Yes - for capacitive touch |
| DMA | Yes |
| I/O Pins (28-SOIC) | 22 |
| Betriebstemperatur | -40C to +85C (Industrial, /I suffix) |
| Gehäuse | 28-SOIC (300 mil) |
| Montageart | Surface Mount |
| MSL-Level | 2 (per JLCPCB listing) |
| RoHS-Status | Compliant |
PIC24FJ256GA702-I/SO Pin-Konfiguration
| Pin 1 | SDA1/RP9/RB9 — I2C1 SDA / Remappable Peripheral Pin 9 / Port B9 |
| Pin 2 | RP8/RB8 — Remappable Peripheral Pin 8 / Port B8 |
| Pin 3 | RP7/RB7 — Remappable Peripheral Pin 7 / Port B7 |
| Pin 4 | RP6/RB6 — Remappable Peripheral Pin 6 / Port B6 |
| Pin 5 | RP5/RB5 — Remappable Peripheral Pin 5 / Port B5 |
| Pin 6 | RP4/RB4 — Remappable Peripheral Pin 4 / Port B4 |
| Pin 7 | RP3/RB3 — Remappable Peripheral Pin 3 / Port B3 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RP2/RB2 — Remappable Peripheral Pin 2 / Port B2 |
| Pin 10 | RP1/RB1 — Remappable Peripheral Pin 1 / Port B1 |
| Pin 11 | RP0/RB0 — Remappable Peripheral Pin 0 / Port B0 |
| Pin 12 | RA0 — Port A0 / analog input |
| Pin 13 | RA1 — Port A1 / analog input |
| Pin 14 | RA2 — Port A2 / analog input |
| Pin 15 | RA3 — Port A3 / analog input |
| Pin 16 | RA4 — Port A4 / analog input |
| Pin 17 | AVDD — Analog supply voltage |
| Pin 18 | AVSS — Analog ground |
| Pin 19 | RA5 — Port A5 / analog input |
| Pin 20 | RA6 — Port A6 / analog input |
| Pin 21 | RC0 — Port C0 |
| Pin 22 | RC1 — Port C1 |
| Pin 23 | RC2 — Port C2 |
| Pin 24 | RC3 — Port C3 |
| Pin 25 | RC4 — Port C4 |
| Pin 26 | RC5 — Port C5 |
| Pin 27 | VDD — Digital supply voltage |
| Pin 28 | VSS — Ground reference |
Typische Anwendungen
PIC24FJ256GA702-I/SO ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Capacitive Touch HMI Panel, Portable Medical Monitoring Accessory, Industrial 4-20 mA Sensor Transmitter, USB HID Peripherals and HID Game Controllers, Smart Home Bridge and Appliance Controller.
Battery-Powered IoT Sensor Node
The PIC24FJ256GA702-I/SO's nanoWatt XLP sleep currents below 1 uA combined with 256 KB ECC Flash make it ideal for coin-cell or 2xAAA-powered wireless sensor nodes. The 16 KB RAM supports modest buffering for sensor data between radio transmissions, while the 32 MHz core wakes briefly to execute sensor reads and BLE/Wi-Fi companion-driver code. The 12-bit 200 ksps ADC handles thermocouple, voltage-divider, or strain-gauge signals directly, and CTMU enables low-cost capacitive water/leak sensors. Compared with Cortex-M0+ alternatives at this price tier, the GA702 offers twice the Flash and similar XLP sleep performance, reducing total BOM cost by eliminating an external memory chip.
Empfohlen
Capacitive Touch HMI Panel
The on-chip CTMU (Charge Time Measurement Unit) turns the PIC24FJ256GA702-I/SO into a multi-touch capacitive button or slider controller without external analog ICs. Up to 14 analog inputs can be scanned at the 12-bit ADC's 200 ksps rate, supporting slide, wheel, and matrix-touch layouts. The 16 MIPS performance is sufficient for gesture-recognition firmware while the XLP sleep modes drop system current below 5 uA between user touches. Designers typically pair this MCU with a segmented LCD or simple OLED indicator, with the GA702 driving the display directly via SPI or I2C. Its ECC Flash is critical for HMI products in the field where bit-flips could corrupt gesture state machines.
Empfohlen
Portable Medical Monitoring Accessory
Portable medical accessories such as pulse oximeters, spirometers, and wearable ECG patches benefit from the PIC24FJ256GA702-I/SO's combination of 256 KB Flash (for FDA-grade firmware with logging), 12-bit ADC (for analog biosensor signal conditioning), and XLP low-power modes. The 16 KB RAM holds short rolling buffers of physiological waveforms before Bluetooth upload, while the DMA engine offloads continuous ADC-to-RAM transfers without CPU intervention. Industrial-grade -40C to +85C operation covers skin-contact and pocket-storage temperature extremes. Unlike Cortex-M0+ parts in this range, the GA702's DSP instructions accelerate FIR/IIR filtering of sensor data on-chip, reducing or eliminating external DSP ICs.
Empfohlen
Industrial 4-20 mA Sensor Transmitter
Industrial 4-20 mA loop-powered transmitters use the PIC24FJ256GA702-I/SO's wide 2.0-3.6 V operating range to run directly off a regulated 3.3 V derived from the loop supply. The 12-bit ADC at 200 ksps digitizes bridge, RTD, or thermocouple inputs with adequate resolution for process-control applications, and the 3 on-chip comparators handle sensor-failure detection and HART demodulation. The 256 KB ECC Flash is well suited to 12-18 month sensor-calibration log retention and complex linearization tables. Compared with older PIC18 alternatives, the 16-bit datapath doubles arithmetic throughput for polynomial compensation math, and the -40C to +85C industrial grade ensures year-round outdoor cabinet operation.
Empfohlen
USB HID Peripherals and HID Game Controllers
While the PIC24FJ256GA702-I/SO does not include on-chip USB, paired with an external USB-UART bridge (MCP2200 or CP2102) or with the pin-compatible PIC24FJ256GB family which adds USB 2.0 Full-Speed, it forms an excellent HID controller for keyboards, mice, and game controllers. The 32 MHz core provides sufficient bandwidth for HID class descriptor parsing and LED animation, while the DMA engine accelerates HID report generation without CPU overhead. The 256 KB Flash hosts extensive HID report maps and macro/lighting firmware, and ECC prevents field failures from bit-flips in long-running installations such as arcade cabinets.
Empfohlen
Smart Home Bridge and Appliance Controller
The PIC24FJ256GA702-I/SO is a strong choice for smart-home bridges, appliance controllers, and HVAC thermostats. Its XLP modes allow deep sleep between user interactions or scheduled events, while the 12-bit ADC reads thermistor or humidity sensors directly. UART, SPI, and I2C peripherals are abundant enough to bridge Wi-Fi (ESP-12F), BLE (RN4870), and Sub-GHz radios in parallel. The 256 KB Flash stores multi-protocol stacks (Matter, Zigbee, BLE), and 16 KB RAM is sufficient for OTA staging buffers. Industrial temperature rating enables attic, garage, and outdoor enclosures without additional thermal conditioning.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ256GA702-I/SO – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ256GA702-I/SS | PIC24FJ256GA702-I/ML | PIC24FJ256GA702-E/SO | PIC24FJ256GA705-I/SO | PIC24FJ128GA702-I/SO |
|---|---|---|---|---|---|---|
| Package | 28-SOIC (300 mil) | 28-SSOP | 28-QFN (ML) | 28-SOIC (300 mil) - same | 28-SOIC (300 mil) - same | 28-SOIC (300 mil) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24F (16-bit, 16 MIPS) | PIC24F (16-bit, 16 MIPS) | PIC24F (16-bit, 16 MIPS) | PIC24F (16-bit, 16 MIPS) | PIC24F (16-bit, 16 MIPS) | PIC24F (16-bit, 16 MIPS) |
| Max CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Flash | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB | 128 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB (approx.) | 16 KB |
| ADC | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| 1k-piece Price (approx.) | $2.30 | $2.30 (approx.) | $2.40 (approx.) | $2.60 (approx.) | $2.55 (approx.) | $2.05 (approx.) |
Wichtigste Unterscheidungsmerkmale
- ECC Flash for higher reliability vs. non-ECC PIC24F variants (vs. PIC24FJ256GA705-I/SO)
- Tube packaging for low-MOI prototype runs (vs. Tape & Reel variants)
- 16 KB RAM vs PIC24FJ128GA702's identical 16 KB but 128 KB Flash (vs. PIC24FJ128GA702-I/SO)
Designhinweise
Use the on-chip nanoWatt XLP Sleep and Idle modes aggressively to drop average current below 5 uA in battery-powered designs. According to Microchip application notes, the GA702 deep-sleep current is under 60 nA with RTC running, which is achieved by turning off all peripherals except the selected wake-up source. Estimated: at 1 wake per minute from sleep at 32 MHz, average current approximates (active_time * 8 mA + sleep_time * 0.06 uA) / 60 s. Decoupling: place 100 nF X7R ceramic within 5 mm of each VDD pin and a 4.7 uF bulk tantalum or ceramic on the same net to handle ADC sample bursts.
Route AVSS and AVSS (if used) as a star-ground back to the VDD bulk capacitor rather than daisy-chaining. For ADC accuracy better than 1 LSB at 12 bits, keep analog traces away from switching-node digital lines and add a ground pour under the analog section. Per Microchip's PIC24F hardware design checklist, leave the ICSP/ICD programming pins (PGEDx/PGECx) accessible on the PCB for in-circuit debug, even in production prototypes, to avoid rework later.
Do not apply 5 V to any I/O pin - the PIC24FJ256GA702 is a 3.3 V-only part and over-voltage will damage the silicon. For 5 V system compatibility, add a level translator. Estimated: an accidental 5 V on an I/O can source >10 mA through internal ESD diodes and trigger latch-up. The ECC Flash protects against single-bit corruption but does not protect against full VDD over-voltage events. Always include a low-cost 3.3 V LDO with thermal and over-current protection at the board entry point.
Compliance-Informationen
RoHS and lead-free status per JLCPCB part listing; conflict-minerals compliance per Microchip product page; AEC-Q100 not claimed for the -I grade; choose -E grade or AEC-Q100 qualified variant for automotive.
