PIC24FJ256GA702T-I/SO - 256KB Flash 16-bit MCU, 32MHz, 28-SOIC
Teilenummer: PIC24FJ256GA702T-I/SO ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.86 | $4,86 |
| 10 | $4.45 | $44,50 |
| 100 | $3.96 | $396,00 |
| 500 | $3.62 | $1.810,00 |
| 1.000 | $3.21 | $3.210,00 |
PIC24FJ256GA702T-I/SO Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and peripherals such as ADC, timers, communication interfaces, and GPIO. The PIC24F sits in the hierarchy of 16-bit MCU -> microcontroller -> embedded processor -> semiconductor, and is positioned between 8-bit PIC16/PIC18 devices and 32-bit PIC32 parts. Its Modified Harvard architecture, deterministic instruction execution, and 16-bit data path make it ideal for real-time control loops where predictable timing is required.
Key features include 256 KB (85.5K x 24) self-programmable Flash with error-correcting code (ECC), 16 KB SRAM, up to 21 channels of 12-bit ADC with 200 ksps throughput, three analog comparators, a Charge Time Measurement Unit (CTMU) for touch sensing and precise time measurement, multiple UART/SPI/I2C interfaces, and 5-channel DMA. The 'T' suffix indicates Tape and Reel packaging, and 'I' denotes the industrial -40 °C to +85 °C temperature grade. Operating voltage spans 2.0 V to 3.6 V, and the device supports multiple low-power sleep modes with nanoWatt technology for battery-powered applications.
The PIC24FJ256GA702 family is implemented in a low-power CMOS process with on-chip voltage regulation and a sophisticated clock tree that allows peripheral operation while the CPU sleeps. Hardware DMA offloads data movement between peripherals and memory, freeing the core for application code, and ECC Flash improves reliability in harsh environments by correcting single-bit errors in program memory.
Typical applications include human-machine interface (HMI) panels with capacitive touch, IoT sensor nodes, low-power medical wearables, industrial control and sensor conditioning, USB device interfaces, and consumer appliances. The combination of generous Flash, DMA, and the CTMU makes it especially attractive for touch-based UI designs where BOM consolidation is critical.
When designing with this part, allocate at least one UART for debug and consider migrating to a TQFP package if you need more than 21 available I/O lines; the 28-pin SOIC variant has approximately 18 usable I/O depending on peripheral allocation. Use the MPLAB XC16 compiler and the MPLAB Code Configurator (MCC) plugin to generate peripheral initialization code automatically.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, design notes, and FAQ content not found in the standalone datasheet, giving engineers a single reference for sourcing, replacement, and application guidance.
Drop-in-Alternativen für PIC24FJ256GA702T-I/SO – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ256GA702T-I/SO (gleiche Bauform und Footprint) – abweichend in ADC, Operating Temperature, Package, MSL Level, I/O Pins.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ256GA702-I/SO
✅ Drop-In✓ Auf Lager
$2.3 / Stück
Datenblatt ansehen →PIC24FJ16GA002T-I/SO
✅ Drop-In✓ Auf Lager
$2.45 / Stück
Datenblatt ansehen →PIC24FJ32KA302-I/SO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24FJ128GB202T-I/SO
✅ Drop-In✓ Auf Lager
$4.42 / Stück
Datenblatt ansehen →PIC24FJ256GA702T-I/SO Grenzwerte & elektrische Eigenschaften
| Architecture | PIC24F 16-bit RISC (Modified Harvard) |
| CPU Core | 16-bit, 32 MHz / 16 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24 words) with ECC |
| SRAM | 16 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 200 ksps, up to 14 analog inputs |
| Analog Comparators | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| DMA Channels | 5 channels |
| Communication Interfaces | UART, SPI, I2C (multiple instances) |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) |
| Gehäuse | 28-pin SOIC (SO) |
| Montageart | Surface Mount |
| MSL-Level | 1 |
| RoHS-Status | Compliant |
| Low-Power Modes | nanoWatt technology, Sleep/Idle/Deep Sleep |
PIC24FJ256GA702T-I/SO Pin-Konfiguration
| Pin 1 | MCLR — Master Clear (reset) input, drive low to reset |
| Pin 2 | RA0 — Port A bit 0 / analog input AN0 / CTMU |
| Pin 3 | RA1 — Port A bit 1 / analog input AN1 / CTMU |
| Pin 4 | RB0 — Port B bit 0 / analog input AN2 / CTMU |
| Pin 5 | RB1 — Port B bit 1 / analog input AN3 / CTMU |
| Pin 6 | RB2 — Port B bit 2 / analog input AN4 / CTMU |
| Pin 7 | RB3 — Port B bit 3 / analog input AN5 / CTMU |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RA2 — Port A bit 2 / analog input AN6 / CTMU |
| Pin 10 | RA3 — Port A bit 3 / analog input AN7 / CTMU |
| Pin 11 | RB4 — Port B bit 4 / analog input AN8 / CTMU |
| Pin 12 | RB5 — Port B bit 5 / analog input AN9 / CTMU |
| Pin 13 | RB6 — Port B bit 6 / analog input AN10 / CTMU |
| Pin 14 | RB7 — Port B bit 7 / analog input AN11 / CTMU |
| Pin 15 | RA4 — Port A bit 4 / analog input AN12 / CTMU |
| Pin 16 | RA5 — Port A bit 5 / analog input AN13 / CTMU |
| Pin 17 | RA6 — Port A bit 6 / oscillator / clock |
| Pin 18 | RA7 — Port A bit 7 / oscillator / clock |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage (2.0 V to 3.6 V) |
| Pin 21 | RB8 — Port B bit 8 / analog input AN14 / CTMU |
| Pin 22 | RB9 — Port B bit 9 / analog input AN15 / CTMU |
| Pin 23 | RB10 — Port B bit 10 / CTMU |
| Pin 24 | RB11 — Port B bit 11 / CTMU |
| Pin 25 | RC0 — Port C bit 0 |
| Pin 26 | RC1 — Port C bit 1 |
| Pin 27 | RC2 — Port C bit 2 |
| Pin 28 | RC3 — Port C bit 3 |
Typische Anwendungen
PIC24FJ256GA702T-I/SO ist geeignet für 6 Anwendungs: Capacitive Touch HMI Panel, IoT Sensor Node, Industrial Sensor Conditioning, Low-Power Medical Wearable, USB Device Accessory, Consumer Appliance Control.
Capacitive Touch HMI Panel
The PIC24FJ256GA702T-I/SO is well-suited to capacitive touch human-machine interface panels because its integrated CTMU provides constant-current time-based capacitance measurement with sub-pF resolution, while the 12-bit ADC handles up to 14 touch electrodes directly. With 256 KB Flash, designers can fit Microchip's mTouch touch firmware library, gesture recognition code, and a full GUI state machine without external memory. The 16 KB SRAM supports touch scanning buffers and event queues for multi-touch sliders. Operating from 2.0 V to 3.6 V lets the design run directly from a single Li-ion cell, simplifying BOM for handheld appliances and industrial keypads.
Empfohlen
IoT Sensor Node
For battery-powered IoT sensor nodes, the PIC24FJ256GA702T-I/SO delivers the right combination of low-power nanoWatt sleep modes (down to sub-uA standby current) and on-chip 12-bit ADC for direct sensor conditioning. The 256 KB Flash holds full wireless stacks such as LoRaWAN or BLE peripheral roles plus application code, while 16 KB SRAM buffers measurement data between wake cycles. Five-channel DMA offloads peripheral-to-memory transfers without waking the CPU, enabling years of battery life on 2x AA cells. The 32 MHz core executes sensor fusion at 16 MIPS with deterministic interrupt latency.
Empfohlen
Industrial Sensor Conditioning
The PIC24FJ256GA702T-I/SO is ideal for industrial 4-20 mA loop-powered sensor transmitters because of its 12-bit ADC at 200 ksps with 14 inputs, three analog comparators for fast threshold detection, and 256 KB Flash for calibration and linearization tables. Hardware ECC on Flash prevents bit corruption in electrically noisy factory environments, while the -40 °C to +85 °C industrial temperature grade supports outdoor and process-plant deployments. DMA enables continuous ADC sampling without CPU load, and the rich UART/SPI/I2C set lets the device communicate with downstream PLCs or wireless modules.
Empfohlen
Low-Power Medical Wearable
Wearable medical and fitness devices benefit from the PIC24FJ256GA702T-I/SO's eXtreme Low Power architecture, which supports nanoWatt sleep modes with sub-microamp standby currents while retaining RAM and rapid wake-up. The 12-bit ADC captures biometric signals such as heart rate, SpO2, and temperature at 200 ksps, and the CTMU enables precision time-domain measurements for body impedance analysis. 256 KB Flash stores BLE stacks and sensor-fusion algorithms, while 16 KB SRAM holds ECG sample buffers. The 28-SOIC package is well-suited to compact wearable PCBs and supports operation from a single coin cell.
Empfohlen
USB Device Accessory
USB accessories such as HID input devices, USB-to-UART bridges, and CDC virtual COM ports can leverage the PIC24FJ256GA702T-I/SO's 256 KB Flash for the USB stack and application code, although designers needing full-speed USB OTG should consider the PIC24FJ256GB2 family instead. The 16-bit core at 16 MIPS handles USB protocol with deterministic timing, and 16 KB SRAM supports USB endpoint buffers. Multiple UART/SPI/I2C peripherals let the part bridge to downstream sensors or wireless modules while presenting as a USB device on the host side. The industrial temperature grade ensures operation across consumer and embedded environments.
Empfohlen
Consumer Appliance Control
The PIC24FJ256GA702T-I/SO fits consumer appliance control boards (coffee machines, washing machines, dishwashers, air purifiers) where its 256 KB Flash accommodates motor control libraries, user-interface state machines, and safety firmware. Three analog comparators support over-current and zero-cross detection for triac and relay control, while the 12-bit ADC reads temperature, humidity, and flow sensors. Low-power sleep modes keep standby power below eco-design limits, and the 28-SOIC package keeps PCB cost low. ECC Flash improves long-term reliability in temperature-cycled appliance environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ256GA702T-I/SO – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ256GA702-I/SO | PIC24FJ128GA702T-I/ML | PIC24FJ16GA002T-I/SO | PIC24FJ32KA302-I/SO | PIC24FJ128GB202T-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin SOIC | 28-pin SOIC - same | 28-pin QFN (ML) - DIFFERENT | 28-pin SOIC - same | 28-pin SOIC - same | 28-pin SOIC - same |
| Flash Memory | 256 KB | 256 KB | 128 KB (-50%) | 16 KB (-94%) | 32 KB (-88%) | 128 KB (-50%) |
| SRAM | 16 KB | 16 KB | 8 KB (-50%) | 4 KB (-75%) | 2 KB (-88%) | 8 KB (-50%) |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| ADC | 12-bit, 200 ksps | 12-bit, 200 ksps | 12-bit, 200 ksps | 10-bit, 500 ksps | 10-bit, 200 ksps | 10-bit, 500 ksps |
| USB | No | No | No | No | No | USB 2.0 Full-Speed |
| CTMU | Yes | Yes | Yes | No | Yes | No |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
Wichtigste Unterscheidungsmerkmale
- Largest Flash in the PIC24FJ256GA702 28-pin SOIC family (vs. PIC24FJ128GA702T-I/ML)
- Industrial temperature grade for harsh environments (vs. PIC24FJ32KA302-I/SO)
- On-chip CTMU enables capacitive touch without external ICs (vs. PIC24FJ16GA002T-I/SO)
- 5-channel DMA offloads peripheral-to-memory transfers (vs. PIC24FJ128GB202T-I/SO)
Designhinweise
The PIC24FJ256GA702T-I/SO requires a single 2.0 V to 3.6 V supply on VDD (pin 20) with a decoupling 100 nF ceramic capacitor placed within 5 mm of the pin and a bulk 10 uF tantalum or ceramic capacitor on the same rail. The MCLR pin (pin 1) must be pulled up to VDD through a 10 kohm resistor for normal operation; a 100 nF capacitor from MCLR to ground improves noise immunity. Place all decoupling capacitors on the same PCB layer as the MCU with short, wide traces to minimize parasitic inductance. According to Microchip's PIC24F hardware design checklist, the AGND pin (when present in larger packages) should be tied to VSS at a single point to avoid ground loops in ADC sampling.
For capacitive touch designs using the CTMU, route the touch electrodes as short, narrow traces on a single PCB layer without crossing other signals, and use a ground pour guard ring around each electrode to suppress stray capacitance coupling. Add a series ferrite bead on the touch power rail to reduce conducted EMI from the MCU into the touch sensors. Keep the touch MCU firmware's ADC acquisition time and CTMU current-source timing values per Microchip application note AN1250 (mTouch Conducted Noise Immunity) to maintain sensitivity in noisy environments.
A common pitfall when migrating firmware from PIC24FJ128GA702 to PIC24FJ256GA702 is forgetting to update the linker script for the larger Flash and SRAM regions - the default linker file for the smaller part will silently truncate code or data. Always regenerate the linker script via MPLAB XC16 when changing device variants. Another pitfall is configuring peripherals before unlocking the PPS (Peripheral Pin Select) registers on remappable pins - peripheral outputs will simply not appear on the assigned GPIO until PPS unlock is performed in the correct sequence. Finally, do not exceed the 200 ksps ADC sampling rate, as this introduces acquisition-time errors visible as gain and offset drift in sensor readings.
Place the 32 MHz crystal or external oscillator close to the OSC1/OSC2 pins (RA6/RA7 in this 28-SOIC package) with the load capacitors within 3 mm of the pins. Keep the high-frequency clock traces short and surrounded by a ground pour to minimize EMI radiation. Route analog ADC inputs away from digital switching signals; if crossing is unavoidable, cross them at 90 degrees. Use a separate analog ground island under the ADC input traces if the design has high-current digital switching, and join analog and digital grounds at a single point near the MCU VSS pin. This layout discipline typically reduces ADC noise by 1-2 LSB and improves CTMU touch measurement stability.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified (use PIC24F AEC-Q100 automotive variants for automotive designs). Lead-free and halogen-free packaging.
