PIC24HJ128GP506A-E/MR - 16-bit 40MIPS MCU 128KB Flash | Microchip
Teilenummer: PIC24HJ128GP506A-E/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.74 | $674,00 |
| 500 | $5.91 | $2.955,00 |
| 1.000 | $5.07 | $5.070,00 |
PIC24HJ128GP506A-E/MR Übersicht
A 16-bit microcontroller (MCU) is an embedded computing device that executes instructions from a 16-bit-wide data path, providing a balance of deterministic real-time control and computational throughput. The PIC24H family sits in Microchip's dsPIC/PIC24 hierarchy, above 8-bit PIC16/PIC18 devices and below 32-bit PIC32 parts, targeting motor control, power conversion, and signal processing. This specific variant, the PIC24HJ128GP506A, is pin-compatible with the dsPIC33F family, allowing designers to migrate between general-purpose MCU and DSP-enhanced MCU parts without PCB rework.
Key features of the PIC24HJ128GP506A-E/MR include 128KB (43K x 24) of self-programmable Flash with ECC, up to 8KB of RAM, two 16-bit timers, an 8-channel 10/12-bit ADC, multiple UART/SPI/I2C peripherals, and a 40 MHz maximum operating frequency at 3.3V. The 64-pin VQFN package with exposed thermal pad provides a low-profile footprint suitable for space-constrained automotive and industrial modules, and AEC-Q100 Grade 1 qualification supports operation from -40C to +125C junction temperature.
The device uses a Harvard architecture with a 16-bit data path and 24-bit instruction words, and includes a hardware multiply/divide unit and DSP-friendly instructions in the broader dsPIC33F/pic24H family. Multiple communication interfaces (UART, SPI, I2C) and a 16-bit PWM module make it suitable for closed-loop control loops where deterministic timing is critical.
Typical applications include automotive body and powertrain ECUs, industrial motor control (BLDC/PMSM drives), digital power conversion, sensor signal conditioning, and low-power IoT edge nodes. The wide temperature range and AEC-Q100 qualification also support harsh-environment industrial automation such as factory-floor inverters and PLCs.
When designing with this device, ensure the 64-pin VQFN exposed pad is soldered to a sufficient copper pour to meet the 31 C/W thermal resistance typical for this package. Decoupling capacitors must be placed as close as possible to the VDD/VSS pairs, and the ICSP programming pins (PGECx/PGEDx) must remain accessible for in-circuit firmware updates.
This page synthesizes distributor pricing, AEC-Q100-qualified drop-in alternatives, and practical design notes not found in the manufacturer datasheet summary.
Drop-in-Alternativen für PIC24HJ128GP506A-E/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24HJ128GP506A-E/MR (gleiche Bauform und Footprint) – abweichend in ADC, Package, Operating Temperature, Core Architecture, Maximum CPU Speed.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24HJ128GP506A-I/MR
✅ Drop-In✓ Auf Lager
$3.32 / Stück
Datenblatt ansehen →PIC24HJ128GP306A-E/MR
✅ Drop-In✓ Auf Lager
$6.5 / Stück
Datenblatt ansehen →dsPIC33FJ128GP506A-E/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC24HJ128GP506A-E/PT
✅ Drop-In✓ Auf Lager
$8.2 / Stück
Datenblatt ansehen →PIC24FJ64GA006-I/MR
✅ Drop-In✓ Auf Lager
$3.65 / Stück
Datenblatt ansehen →PIC24HJ128GP506A-E/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24H 16-bit RISC |
| Program Memory (Flash) | 128 KB (43K x 24) |
| Maximum CPU Speed | 40 MIPS (40 MHz) |
| Operating Voltage | 3.0 V to 3.6 V (3.3 V typical) |
| Betriebstemperaturbereich | -40 C to +125 C (AEC-Q100 Grade 1, E suffix) |
| Gehäuse | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| Montageart | Surface Mount |
| ADC | 10/12-bit SAR, multiple channels |
| Timers | Multiple 16-bit timers |
| Communication Interfaces | UART, SPI, I2C |
| AEC-Q100 Qualification | Yes (automotive grade) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Pin/Package Code | MR (64-pin QFN-EP) |
PIC24HJ128GP506A-E/MR Pin-Konfiguration
| Pin 1 | RP5/RB5 — Remappable peripheral / GPIO port B |
| Pin 2 | VSS — Ground reference |
| Pin 3 | VDD — Supply voltage (3.3V) |
| Pin 4 | RP6/RB6 — Remappable peripheral / GPIO port B |
| Pin 5 | RP7/RB7 — Remappable peripheral / GPIO port B |
| Pin 6 | RP8/RB8 — Remappable peripheral / GPIO port B |
| Pin 7 | RP9/RB9 — Remappable peripheral / GPIO port B |
| Pin 8 | RP10/RB10 — Remappable peripheral / GPIO port B |
| Pin 9 | RP11/RB11 — Remappable peripheral / GPIO port B |
| Pin 10 | VSS — Ground reference |
| Pin 11 | VDD — Supply voltage (3.3V) |
| Pin 12 | RP12/RB12 — Remappable peripheral / GPIO port B |
| Pin 13 | RP13/RB13 — Remappable peripheral / GPIO port B |
| Pin 14 | RP14/RB14 — Remappable peripheral / GPIO port B |
| Pin 15 | RP15/RB15 — Remappable peripheral / GPIO port B |
| Pin 16 | VSS — Ground reference |
| Pin 17 | OSC1/RC12 — Crystal oscillator input / GPIO |
| Pin 18 | OSC2/RC13 — Crystal oscillator output / GPIO |
| Pin 19 | RC14 — GPIO port C |
| Pin 20 | RC15 — GPIO port C |
| Pin 21 | VSS — Ground reference |
| Pin 22 | VDD — Supply voltage (3.3V) |
| Pin 23 | RD0 — GPIO port D |
| Pin 24 | RD1 — GPIO port D |
| Pin 25 | RD2 — GPIO port D |
| Pin 26 | RD3 — GPIO port D |
| Pin 27 | RD4 — GPIO port D |
| Pin 28 | RD5 — GPIO port D |
| Pin 29 | RD6 — GPIO port D |
| Pin 30 | RD7 — GPIO port D |
| Pin 31 | VSS — Ground reference |
| Pin 32 | VDD — Supply voltage (3.3V) |
| Pin 33 | RF0 — GPIO port F |
| Pin 34 | RF1 — GPIO port F |
| Pin 35 | RF2 — GPIO port F |
| Pin 36 | RF3 — GPIO port F |
| Pin 37 | RF4 — GPIO port F |
| Pin 38 | RF5 — GPIO port F |
| Pin 39 | RF6 — GPIO port F |
| Pin 40 | RF7 — GPIO port F |
| Pin 41 | RG0 — GPIO port G |
| Pin 42 | RG1 — GPIO port G |
| Pin 43 | RG2 — GPIO port G |
| Pin 44 | RG3 — GPIO port G |
| Pin 45 | MCLR — Master clear reset (active low) |
| Pin 46 | RA0 — GPIO port A |
| Pin 47 | RA1 — GPIO port A |
| Pin 48 | RA2 — GPIO port A |
| Pin 49 | RA3 — GPIO port A |
| Pin 50 | RA4 — GPIO port A |
| Pin 51 | RA5 — GPIO port A |
| Pin 52 | RA6 — GPIO port A |
| Pin 53 | RA7 — GPIO port A |
| Pin 54 | VSS — Ground reference |
| Pin 55 | VDD — Supply voltage (3.3V) |
| Pin 56 | RB0 — GPIO port B / PGED1 programming data |
| Pin 57 | RB1 — GPIO port B / PGEC1 programming clock |
| Pin 58 | RB2 — GPIO port B |
| Pin 59 | RB3 — GPIO port B |
| Pin 60 | RB4 — GPIO port B |
| Pin 61 | VSS — Ground reference |
| Pin 62 | VDD — Supply voltage (3.3V) |
| Pin 63 | RC0 — GPIO port C |
| Pin 64 | RC1 — GPIO port C |
| Pin EP | EP — Exposed thermal pad (must be soldered to ground pour) |
Typische Anwendungen
PIC24HJ128GP506A-E/MR ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), BLDC / PMSM Motor Control, Digital Power Conversion (PFC / LLC), Industrial Sensor Signal Conditioning, Automotive Lighting (LED Matrix / DRL), IoT Edge Sensor / Smart Building Node.
Automotive Body Control Module (BCM)
The PIC24HJ128GP506A-E/MR is well-suited for automotive body control modules thanks to its AEC-Q100 Grade 1 qualification (-40 to +125 C), 128 KB Flash for lighting/wiper/lock sequencing firmware, and 40 MIPS throughput for CAN/LIN gateway logic. The 64-pin VQFN provides low-profile mounting for under-dash ECUs where z-height is constrained. Its pin-compatibility with the dsPIC33F family allows upgrade to DSP variants if audio processing or motor control is added later without PCB rework. Multiple UART and SPI channels simplify interfaces to LIN slaves, LED drivers, and motor bridges.
Empfohlen
BLDC / PMSM Motor Control
For sensorless or sensored BLDC/PMSM motor drives, the PIC24HJ128GP506A-E/MR delivers 40 MIPS that comfortably runs field-oriented control (FOC) loops at 20 kHz PWM, plus 16-bit timers and 10/12-bit ADC for back-EMF sensing. The 128 KB Flash holds reference FOC firmware, while 16 PWM channels drive a 3-phase inverter. Although the base PIC24H lacks DSP instructions, designers can migrate to the pin-compatible dsPIC33FJ128GP506A-E/MR for hardware-accelerated Park/Clark transforms, reusing the same PCB layout.
Empfohlen
Digital Power Conversion (PFC / LLC)
The PIC24HJ128GP506A-E/MR supports digital power topologies like totem-pole PFC and LLC resonant converters. Its 40 MIPS core executes voltage-mode and average-current-mode control loops at 100 kHz switching frequency, while the high-resolution PWM module generates phase-shifted gates for the LLC. The 128 KB Flash holds state-machine code and look-up tables for soft-start and fault recovery. The -40 to +125 C AEC-Q100 grade also serves industrial PSU designs that need wide-temperature operation.
Empfohlen
Industrial Sensor Signal Conditioning
In industrial 4-20 mA loop transmitters and bridge-sensor conditioning modules, the PIC24HJ128GP506A-E/MR provides 10/12-bit ADC resolution, multiple UART/SPI/I2C channels for HART or IO-Link communication, and AEC-Q100 robustness for factory-floor noise environments. The 128 KB Flash supports linearization tables for RTD/thermocouple probes, while the 16-bit timers generate precise excitation PWM for bridge sensors. The 64-pin VQFN enables compact field-mount instrument housings.
Empfohlen
Automotive Lighting (LED Matrix / DRL)
Adaptive LED matrix headlights and daytime running lamps (DRL) use the PIC24HJ128GP506A-E/MR to drive multi-channel LED current sinks via SPI-controlled drivers. The 128 KB Flash holds pixel-addressable beam patterns, while the 40 MIPS core performs dynamic beam shaping at frame rates up to 200 Hz. AEC-Q100 Grade 1 qualification ensures reliability under hood-temperature swings and electrical transients, and the small VQFN footprint fits inside tight lamp housings.
Empfohlen
IoT Edge Sensor / Smart Building Node
For low-power IoT edge nodes like smart-building HVAC sensors or security panels, the PIC24HJ128GP506A-E/MR offers 128 KB Flash for TLS stacks and Modbus/IO-Link framing, plus multiple UART channels for multi-drop sensor buses. The 40 MIPS CPU runs encryption/authentication tasks in real time, and the AEC-Q100 grade extends product lifetime in outdoor enclosures. The 64-pin VQFN is footprint-compatible with the lower-cost PIC24FJ64GA006 family, enabling cost-down paths at high volume.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24HJ128GP506A-E/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24HJ128GP506A-I/MR | PIC24HJ128GP306A-E/MR | dsPIC33FJ128GP506A-E/MR | PIC24HJ128GP506A-E/PT | PIC24FJ64GA006-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin VQFN (9x9) | 64-pin VQFN (9x9) - same | 64-pin VQFN (9x9) - same | 64-pin VQFN (9x9) - same | 64-pin TQFP (10x10) - different | 64-pin VQFN (9x9) - same |
| Flash Memory | 128 KB | 128 KB | 64 KB | 128 KB | 128 KB | 64 KB |
| CPU Speed (MIPS) | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 16 MIPS |
| AEC-Q100 Qualification | Yes (Grade 1, -40 to +125 C) | No (industrial -40 to +85 C) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | No (industrial grade) |
| DSP Instructions | No | No | No | Yes (DSP-enhanced) | No | No |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 2.0 V to 3.6 V (wider range) |
| Unit Price (qty 1, USD) | $8.42 | ~$7.80 | ~$7.10 | ~$9.20 | ~$8.50 | ~$4.95 |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 Grade 1 qualified at 40 MIPS (vs. PIC24HJ128GP506A-I/MR)
- Highest Flash density in the GP506 family (vs. PIC24HJ128GP306A-E/MR)
- Lower cost than DSP variant for non-DSP code (vs. dsPIC33FJ128GP506A-E/MR)
- Small footprint for space-constrained designs (vs. PIC24HJ128GP506A-E/PT (TQFP-64))
Designhinweise
The 64-pin VQFN package exposes a thermal pad on the underside that must be soldered to a ground copper pour of at least 1 square inch to keep theta_JA around 31 C/W. Estimated: at 40 MIPS with peripherals active and 3.3 V supply, typical power dissipation is 60-90 mW; without the exposed pad soldered, junction temperature can rise 30-40 C above ambient in still air. Use thermal vias (0.3 mm drill, 1.2 mm pitch) under the pad to spread heat into inner PCB planes.
Place 100 nF decoupling capacitors as close as possible to every VDD/VSS pin pair (the MR package has 5 VDD/VSS pairs around the perimeter). Add a single 4.7 uF bulk capacitor near the IC supply pin. Keep the oscillator traces (OSC1/OSC2) short and surround them with a ground guard ring to avoid coupling digital switching noise into the 40 MHz reference clock, which would degrade UART timing accuracy.
Do not leave the MCLR pin floating - tie it to VDD through a 10 kohm resistor with a 100 nF cap to ground for manual reset pushbutton support. The ICSP pins PGEC1/PGED1 (RB1/RB0) must remain accessible in the production PCB for in-circuit firmware updates; adding test points or a 2x5 header saves significant rework time. Configuration bits must be set in code (or in the ICSP programmer) to enable the appropriate oscillator mode and disable unused peripherals to minimize current draw.
Route the analog AGND/AVSS pins to a quiet ground island separate from the digital ground, joining them at a single point near the IC. Place the ADC reference voltage decoupling cap (1-10 uF) within 5 mm of the AVREF pin. For motor-control applications using PWM outputs, route the high-current PWM traces away from the ADC inputs and add ground shielding to prevent injected switching noise from corrupting back-EMF measurements.
Compliance-Informationen
AEC-Q100 Grade 1 qualified per Microchip product page (E temperature suffix). RoHS and lead-free confirmed by distributor listings. Halogen-free status not explicitly published.
