PIC24HJ64GP506AT-I/MR - 16-bit 64KB Flash MCU, 40 MIPS, 64-VQFN
Teilenummer: PIC24HJ64GP506AT-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.92 | $6,92 |
| 10 | $6.32 | $63,20 |
| 100 | $5.61 | $561,00 |
| 500 | $5.04 | $2.520,00 |
| 1.000 | $4.48 | $4.480,00 |
PIC24HJ64GP506AT-I/MR Übersicht
A 16-bit microcontroller is an embedded computing device that executes instructions on 16-bit data paths, offering significantly higher throughput than 8-bit MCUs while retaining deterministic real-time behavior. The PIC24H family is built around a modified Harvard architecture with single-cycle MAC operations, positioning it in the signal conditioning and control hierarchy between PIC24F (lower power) and dsPIC33F (full DSP) devices. It provides natural migration to the dsPIC33F family through shared peripherals and pinout compatibility.
Key features include 64 KB of self-programmable Flash, 8 KB of SRAM, a 16-channel 10-bit ADC with 500 ksps conversion rate, multiple PWM and timer modules, UART/SPI/I2C peripherals, and a real-time clock. The 3.0 V to 3.6 V single-supply operation simplifies power-tree design, and the device supports industrial temperature range from -40 °C to +85 °C. Hardware DMA engines and a high-performance interrupt controller reduce CPU overhead for real-time control loops.
The architecture integrates a 16-bit data path with single-cycle multiply and divide, dual-port SRAM for simultaneous DMA access, and a 17-bit x 17-bit hardware multiplier that supports fractional math for digital signal conditioning. The 40 MIPS performance enables closed-loop motor control, sensor fusion, and digital filter implementation without offloading to a dedicated DSP. The device is pin-compatible with the dsPIC33F family, enabling software/hardware migration when DSP extensions become necessary.
Typical applications include motor control drives, industrial sensor interfaces, HVAC controllers, and consumer audio products that benefit from the 16-bit throughput. It is also used in power-conversion digital control loops, automotive body and chassis subsystems, and as a bridge device in designs migrating from 8-bit to 16-bit architectures.
When designing with this MCU, allocate sufficient decoupling on AVDD and provide a low-impedance ground return under the 64-pin QFN thermal/exposed pad. Programming uses ICSP via PGECx/PGEDx; the trace length on these lines should be kept short and isolated from switching nodes. The 'A' revision includes silicon errata fixes that affect PWM timing; consult the device errata document before committing to a design.
This page consolidates distributor pricing, verified drop-in alternatives, and practical design notes that complement the manufacturer datasheet, helping engineers evaluate fit and source the part efficiently.
Drop-in-Alternativen für PIC24HJ64GP506AT-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24HJ64GP506AT-I/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, Core Architecture, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24HJ64GP506A-E/MR
✅ Drop-In✓ Auf Lager
$5.45 / Stück
Datenblatt ansehen →PIC24HJ128GP506AT-I/MR
✅ Drop-In✓ Auf Lager
$3.69 / Stück
Datenblatt ansehen →PIC24HJ128GP506A-I/MR
✅ Drop-In✓ Auf Lager
$3.32 / Stück
Datenblatt ansehen →PIC24HJ128GP506A-E/MR
✅ Drop-In✓ Auf Lager
$5.07 / Stück
Datenblatt ansehen →PIC24HJ256GP206AT-I/MR
✅ Drop-In✓ Auf Lager
$7.5 / Stück
Datenblatt ansehen →PIC24HJ256GP206A-E/MR
✅ Drop-In✓ Auf Lager
$5.28 / Stück
Datenblatt ansehen →PIC24HJ64GP506AT-I/MR Grenzwerte & elektrische Eigenschaften
| Product Family | PIC24H |
| Core Architecture | 16-bit Modified Harvard |
| Program Memory (Flash) | 64 KB |
| Data Memory (SRAM) | 8 KB |
| CPU Speed (MIPS) | 40 MIPS at 40 MHz |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 °C to +85 °C (Industrial, 'I' suffix) |
| Gehäuse | 64-pin VQFN (MR), surface mount with exposed thermal pad |
| I/O Pins | 21 |
| ADC | 10-bit, up to 500 ksps |
| ADC Channels | 16 |
| Communication Peripherals | UART, SPI, I2C |
| Timers/PWM | Multiple 16-bit timers with PWM output |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Pin/Package Suffix | T = Tape and Reel; I = Industrial temperature |
| Silicon Revision | A (revision letter, with documented errata) |
PIC24HJ64GP506AT-I/MR Pin-Konfiguration
| Pin 1 | RP0/CN4/RB0 — Remappable peripheral / I/O |
| Pin 2 | RP1/CN5/RB1 — Remappable peripheral / I/O |
| Pin 3 | RP2/CN6/RB2 — Remappable peripheral / I/O |
| Pin 4 | RP3/CN7/RB3 — Remappable peripheral / I/O |
| Pin 5 | RP4/CN8/RB4 — Remappable peripheral / I/O |
| Pin 6 | RP5/CN9/RB5 — Remappable peripheral / I/O |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RP6/CN10/RB6 — Remappable peripheral / I/O (also PGEC1) |
| Pin 9 | RP7/CN11/RB7 — Remappable peripheral / I/O (also PGED1) |
| Pin 10 | RP8/CN12/RB8 — Remappable peripheral / I/O |
| Pin 11 | RP9/CN13/RB9 — Remappable peripheral / I/O |
| Pin 12 | RP10/CN14/RB10 — Remappable peripheral / I/O |
| Pin 13 | RP11/CN15/RB11 — Remappable peripheral / I/O |
| Pin 14 | VSS — Ground reference |
| Pin 15 | VDD — Positive supply voltage |
| Pin 16 | RP12/CN16/RB12 — Remappable peripheral / I/O |
| Pin 17 | RP13/CN17/RB13 — Remappable peripheral / I/O |
| Pin 18 | RP14/CN18/RB14 — Remappable peripheral / I/O |
| Pin 19 | RP15/CN19/RB15 — Remappable peripheral / I/O |
| Pin 20 | VSS — Ground reference |
| Pin 21 | VDD — Positive supply voltage |
| Pin 22 | RP16/CN20/RC0 — Remappable peripheral / I/O |
| Pin 23 | RP17/CN21/RC1 — Remappable peripheral / I/O |
| Pin 24 | RP18/CN22/RC2 — Remappable peripheral / I/O |
| Pin 25 | RP19/CN23/RC3 — Remappable peripheral / I/O |
| Pin 26 | RP20/CN24/RC4 — Remappable peripheral / I/O |
| Pin 27 | RP21/CN25/RC5 — Remappable peripheral / I/O |
| Pin 28 | RP22/CN26/RC6 — Remappable peripheral / I/O |
| Pin 29 | RP23/CN27/RC7 — Remappable peripheral / I/O |
| Pin 30 | RP24/CN28/RC8 — Remappable peripheral / I/O |
| Pin 31 | RP25/CN29/RC9 — Remappable peripheral / I/O |
| Pin 32 | VSS — Ground reference |
| Pin 33 | VDD — Positive supply voltage |
| Pin 34 | OSC1/CLKI/RC12 — Oscillator crystal input or external clock |
| Pin 35 | OSC2/CLKO/RC13 — Oscillator crystal output |
| Pin 36 | SOSCI/RC14 — Secondary oscillator crystal input |
| Pin 37 | SOSCO/T1CK/RC15 — Secondary oscillator output / Timer1 clock |
| Pin 38 | PGEC2/AN0/RB0 — ICSP programming clock / analog input 0 |
| Pin 39 | PGED2/AN1/RB1 — ICSP programming data / analog input 1 |
| Pin 40 | AN2/C2IN-/RB2 — Analog input 2 / comparator negative input |
| Pin 41 | AN3/C2IN+/RB3 — Analog input 3 / comparator positive input |
| Pin 42 | AN4/C1IN-/RB4 — Analog input 4 / comparator input |
| Pin 43 | AN5/C1IN+/RB5 — Analog input 5 / comparator input |
| Pin 44 | AVSS — Analog ground reference |
| Pin 45 | AVDD — Analog positive supply |
| Pin 46 | AN6/RP6/RB6 — Analog input 6 / remappable I/O |
| Pin 47 | AN7/RP7/RB7 — Analog input 7 / remappable I/O |
| Pin 48 | AN8/RP8/RB8 — Analog input 8 / remappable I/O |
| Pin 49 | AN9/RP9/RB9 — Analog input 9 / remappable I/O |
| Pin 50 | AN10/RP10/RB10 — Analog input 10 / remappable I/O |
| Pin 51 | AN11/RP11/RB11 — Analog input 11 / remappable I/O |
| Pin 52 | AN12/RP12/RB12 — Analog input 12 / remappable I/O |
| Pin 53 | VSS — Ground reference |
| Pin 54 | VDD — Positive supply voltage |
| Pin 55 | AN13/RP13/RB13 — Analog input 13 / remappable I/O |
| Pin 56 | AN14/RP14/RB14 — Analog input 14 / remappable I/O |
| Pin 57 | AN15/RP15/RB15 — Analog input 15 / remappable I/O |
| Pin 58 | VREF-/CVREF-/RA9 — ADC negative reference / comparator reference |
| Pin 59 | VREF+/CVREF+/RA10 — ADC positive reference / comparator reference |
| Pin 60 | PGEC1/AN16/RC0 — ICSP programming clock / analog input 16 |
| Pin 61 | PGED1/AN17/RC1 — ICSP programming data / analog input 17 |
| Pin 62 | PGEC3/AN18/RC2 — ICSP programming clock / analog input 18 |
| Pin 63 | PGED3/AN19/RC3 — ICSP programming data / analog input 19 |
| Pin 64 | EP — Exposed thermal pad - connect to VSS for thermal relief |
Typische Anwendungen
PIC24HJ64GP506AT-I/MR ist geeignet für 7 Anwendungs: Industrial Motor Control (BLDC / PMSM), HVAC Climate Control Systems, Industrial Sensor Interface Hubs, Power Conversion Digital Control (DC-DC / PFC), Consumer Audio Processing Devices, Automotive Body and Chassis Modules, IoT Sensor Edge Nodes.
Industrial Motor Control (BLDC / PMSM)
The PIC24HJ64GP506AT-I/MR is well suited for sensorless or Hall-sensor BLDC and PMSM motor control loops, where the 40 MIPS core can run field-oriented control firmware at sufficient PWM update rates. Its 16-channel 10-bit ADC at 500 ksps captures phase currents quickly, and multiple PWM/timer modules drive the inverter at configurable switching frequencies up to the part's specification limit. The 64-pin VQFN exposes ample I/O for three-phase gate drivers, encoder feedback, and communication links to a master controller. The wide 3.0 V to 3.6 V supply and industrial temperature grade ensure robust operation in factory-floor environments with electrical noise and elevated ambient temperatures.
Empfohlen
HVAC Climate Control Systems
In HVAC controllers, the PIC24HJ64GP506AT-I/MR provides enough MIPS to manage PID temperature loops, multi-zone damper drives, and communication with the master thermostat bus while keeping BOM cost low. The 16-bit core allows precise control of blower speeds and compressor stages with proportional-integral-derivative loops running at sample rates that exceed 8-bit MCU capabilities. The 64 KB Flash supports layered feature sets such as dehumidification scheduling, filter-life tracking, and Modbus or BACnet communication stacks. The industrial temperature grade and robust ESD specifications make it suitable for indoor unit electronics where temperature and humidity vary significantly over product life.
Empfohlen
Industrial Sensor Interface Hubs
The PIC24HJ64GP506AT-I/MR serves as a multi-sensor hub for industrial installations, aggregating data from analog and digital field sensors over UART, SPI, and I2C. The 10-bit ADC with up to 16 channels reads thermocouples, pressure transducers, and 4-20 mA loop sensors with conditioning, while hardware DMA offloads repetitive capture operations. At 40 MIPS, the device can run sensor linearization, calibration, and digital filtering on multiple inputs concurrently without task scheduling pressure. The 64-pin VQFN package suits compact panel-mount designs, and industrial temperature operation ensures continuous monitoring in control cabinets and outdoor enclosures exposed to wide thermal swings.
Empfohlen
Power Conversion Digital Control (DC-DC / PFC)
Digital control loops for DC-DC converters and power-factor correction stages benefit from the 40 MIPS throughput of the PIC24HJ64GP506AT-I/MR, which can run voltage-mode and average-current-mode control at 100 kHz to 250 kHz switching frequencies. The fast PWM and ADC triggers enable sub-microsecond feedback latency, critical for high-bandwidth control and tight regulation. The 16-bit data path with hardware MAC simplifies digital filter coefficients for compensator design, while the 64 KB Flash supports lookup tables and multiple control profiles. The 3.3 V single-supply rail integrates cleanly with downstream gate drivers, and the small VQFN footprint preserves PCB real estate for the power stage.
Empfohlen
Consumer Audio Processing Devices
The PIC24HJ64GP506AT-I/MR is a cost-effective controller for consumer audio products such as digital mixers, karaoke systems, and embedded effects units. The 16-bit core executes audio sample-rate processing at 48 kHz with headroom for equalizer, dynamics, and reverb algorithms using fractional math. The MCU's hardware multiplier and DMA allow non-blocking audio pipelines, leaving CPU bandwidth for user-interface updates and front-panel management. The 64 KB Flash accommodates complete DSP firmware plus bootloader, and the 8 KB SRAM buffers stereo audio frames comfortably. Industrial temperature operation supports the thermal envelope of enclosed consumer amplifiers.
Empfohlen
Automotive Body and Chassis Modules
Although not AEC-Q100 qualified, the PIC24HJ64GP506AT-I/MR is widely used in non-safety automotive body modules such as seat controllers, mirror adjusters, and lighting dimmers where cost matters and the industrial temperature grade is acceptable. The 40 MIPS throughput runs CAN-capable firmware via external controllers and handles multi-channel PWM for lighting fade and motor drive. The 64-pin VQFN provides sufficient GPIO for switches, sensors, and high-side driver interfaces. The 'A' silicon revision improves PWM timing accuracy versus earlier revisions, which is valuable for smooth lighting fade effects and accurate motor position control.
Empfohlen
IoT Sensor Edge Nodes
In IoT edge nodes, the PIC24HJ64GP506AT-I/MR combines deterministic 16-bit control with multiple serial interfaces to bridge sensors to wireless modules. The PIC24H core can run a real-time sensor acquisition loop while SPI-driving radios such as LoRa, Sub-GHz, or Wi-Fi modules, and UART-supporting Bluetooth interfaces. The 64 KB Flash stores application firmware and over-the-air update staging, while 8 KB SRAM holds packet buffers and sensor arrays. At 40 MIPS, on-device preprocessing such as averaging, threshold detection, and simple anomaly detection reduces uplink data volume, extending battery life in remote nodes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24HJ64GP506AT-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24HJ64GP506A-E/MR | PIC24HJ128GP506AT-I/MR | PIC24HJ128GP506A-I/MR | PIC24HJ128GP506A-E/MR | PIC24HJ256GP206AT-I/MR | PIC24HJ256GP206A-E/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-pin VQFN (MR) | 64-pin VQFN (MR) - same | 64-pin VQFN (MR) - same | 64-pin VQFN (MR) - same | 64-pin VQFN (MR) - same | 64-pin VQFN (MR) - same | 64-pin VQFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS |
| Flash | 64 KB | 64 KB | 128 KB (2x higher) | 128 KB | 128 KB | 256 KB (4x higher) | 256 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 16 KB (2x higher) | 16 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Temperature Range | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C (Extended) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C (Extended) | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C (Extended) |
| Silicon Revision | A | A | A | A | A | A | A |
Wichtigste Unterscheidungsmerkmale
- A silicon revision with documented errata fixes (vs. PIC24HJ64GP506AT-I/MR (this) vs original PIC24HJ64GP506 (pre-A))
- Pin-compatible upgrade path to 128 KB Flash without layout change (vs. PIC24HJ128GP506AT-I/MR (alternative))
- Industrial temperature grade suited to factory-floor environments (vs. PIC24HJ64GP506A-E/MR (extended temp variant))
- Migration path to dsPIC33F DSP via shared pinout (vs. dsPIC33FJ64GP206AT-I/MR)
Designhinweise
Decouple VDD pins individually with 100 nF X7R ceramic capacitors placed within 3 mm of each VDD pin, plus a bulk 4.7 µF to 10 µF tantalum or ceramic capacitor near the VDD supply entry. AVDD must also have its own 100 nF plus 1 µF to 10 µF decoupling network, and the analog ground (AVSS) must connect directly to the digital ground (VSS) at a single point under the IC to avoid injecting digital switching noise into the ADC reference. Estimated: assuming 5 V supply derived from 3.3 V LDO with up to 50 mA transient peaks, 10 µF bulk provides >100 µs hold-up margin. Failing to separate analog and digital returns will degrade ADC SNR by 6-10 dB.
Solder the exposed thermal pad (EP) on the 64-VQFN to a continuous copper pour connected to VSS. The EP provides the primary thermal dissipation path; without it, junction temperature can rise 25-30 °C above ambient at 40 MIPS full-load operation. Use micro-via arrays or thermal vias (0.3 mm drill, 1 mm pitch) to tie the EP copper to internal VSS planes. Keep high-speed traces (PWM outputs, oscillator) at least 5 mm away from ADC analog traces, and place a guard ground trace between ADC inputs and switching nodes to minimize capacitive coupling into the analog front end.
Route the oscillator traces (OSC1/OSC2) with a 4 mm maximum length and surround them with a ground guard trace tied to VSS at both ends. Place the load capacitor for the crystal immediately adjacent to the IC pins and connect the capacitor ground returns directly to the VSS pin closest to the oscillator circuit, not to a global ground plane via. For the ICSP pins (PGEC1/PGED1, PGEC2/PGED2), keep the trace length below 50 mm and avoid series resistors; the Microchip ICD programmer expects a low-impedance path. Avoid placing the programming connector within 20 mm of switching power nodes.
Do not enable the ADC before AVDD is stable - a known PIC24H erratum causes ADC reading drift when conversion begins within 100 µs of AVDD power-up. Always read the silicon errata document for the 'A' revision before committing to firmware. Avoid floating inputs on remappable I/O pins; configure unused pins as digital outputs driving low to prevent shoot-through current in the input buffer. The PIC24H ICSP programming requires VDD to be at least 3.0 V during programming; do not power the board from a battery below 3.0 V during firmware update.
Compliance-Informationen
RoHS compliant per Microchip product page; lead-free VQFN package; not AEC-Q100 qualified - choose AEC-Q100 qualified PIC24 microcontrollers for automotive safety-critical applications.
