PIC32MK1024GPK064-I/MR - 120MHz, 1MB Flash MCU w/ DSP FPU | Microchip
Teilenummer: PIC32MK1024GPK064-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.41 | $84,10 |
| 100 | $7.55 | $755,00 |
| 500 | $6.84 | $3.420,00 |
| 1.000 | $6.2 | $6.200,00 |
PIC32MK1024GPK064-I/MR Übersicht
A 32-bit microcontroller (MCU) is a programmable processor that integrates a CPU core, Flash program memory, SRAM data memory, and a rich set of peripherals (ADC, PWM, communication interfaces, timers) on a single silicon die. Within the broader system hierarchy, an MCU sits below an MPU (microprocessor) and above DSPs and ASSPs for embedded control; in the PIC32MK family the core is augmented with a microAptiv pipeline, hardware multiply/divide, optional FPU, and a DSP extension that allows C-code motor-control loops to execute at deterministic latency.
Key features include 120MHz CPU clock, 1MB ECC Flash with live update, 256KB SRAM, USB Full-Speed (Host/Device/OTG), CAN-FD, four 12-bit ADCs with up to 42 analog inputs and 2MSPS aggregate sampling rate, multiple 16-bit PWM channels with 100ps resolution for high-resolution motor control, and Microchip's MPLAB Harmony ecosystem support. MicroMIPS mode delivers up to 40% smaller code size for the same functionality.
Architecturally, the dual-panel Flash allows live-update firmware (running from one panel while programming the other), and the four 64-bit accumulators enable single-cycle MAC operations on 16-bit fixed-point data. This combination makes the device attractive for FOC (field-oriented control) of PMSM/BLDC motors, multi-channel power conversion, and DSP-augmented IIoT edge nodes.
Typical applications include BLDC/PMSM motor drives (FOC with HRPWM), industrial sensor hubs, multi-channel data acquisition systems, IIoT edge controllers, and USB/CAN-FD connected industrial nodes. The 64-QFN MR package provides a compact thermal-efficient footprint suited to space-constrained industrial PCBs.
When designing with this device, prioritize MPLAB X IDE + XC32 compiler + Harmony framework, ensure VDD/AVDD decoupling per the datasheet reference circuit, and confirm the 9x9 mm QFN land pattern supports your PCB process window (the exposed pad must be soldered to a continuous ground plane for thermal dissipation).
This page synthesizes distributor pricing, drop-in same-family alternatives, datasheet anchors, and design notes that complement the manufacturer datasheet rather than simply restating it.
Drop-in-Alternativen für PIC32MK1024GPK064-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MK1024GPK064-I/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, USB, Operating Temperature, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MK1024GPK064-E/MR
✅ Drop-In✓ Auf Lager
$7.93 / Stück
Datenblatt ansehen →PIC32MK1024GPD064T-I/MR
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →PIC32MK0512GPK064T-I/MR
✅ Drop-In✓ Auf Lager
$6.1 / Stück
Datenblatt ansehen →PIC32MK1024GPK064-I/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv |
| Maximum CPU Clock | 120 MHz |
| FPU | Single and double precision |
| DSP | 4x 64-bit accumulators, single-cycle MAC (saturating, fractional) |
| MicroMIPS Mode | Yes (up to 40% smaller code size) |
| Program Flash | 1 MB dual-panel, ECC protected, live update |
| SRAM | 256 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 64-QFN (MR), 9x9 mm |
| ADC | 4x 12-bit, up to 42 analog inputs, up to 2 MSPS |
| USB | USB Full-Speed Host/Device/OTG |
| CAN | CAN-FD |
| PWM | High-resolution 16-bit PWM, 100 ps resolution |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
PIC32MK1024GPK064-I/MR Pin-Konfiguration
| Pin 1 | RA0 — General purpose I/O / analog input |
| Pin 2 | RA1 — General purpose I/O / analog input |
| Pin 3 | RA2 — General purpose I/O / analog input |
| Pin 4 | RA3 — General purpose I/O / analog input |
| Pin 5 | RA4 — General purpose I/O / analog input |
| Pin 6 | RA5 — General purpose I/O / analog input |
| Pin 7 | RA6 — General purpose I/O / analog input |
| Pin 8 | RA7 — General purpose I/O / analog input |
| Pin 9 | VDD — Core logic supply (2.3-3.5 V) |
| Pin 10 | VSS — Ground |
| Pin 11 | RB0 — General purpose I/O / PWM |
| Pin 12 | RB1 — General purpose I/O / PWM |
| Pin 13 | RB2 — General purpose I/O / PWM |
| Pin 14 | RB3 — General purpose I/O / PWM |
| Pin 15 | RB4 — General purpose I/O / PWM |
| Pin 16 | RB5 — General purpose I/O / PWM |
| Pin 17 | RB6 — General purpose I/O / PWM |
| Pin 18 | RB7 — General purpose I/O / PWM |
| Pin 19 | RB8 — General purpose I/O / PWM |
| Pin 20 | RB9 — General purpose I/O / PWM |
| Pin 21 | RB10 — General purpose I/O / PWM |
| Pin 22 | RB11 — General purpose I/O / PWM |
| Pin 23 | RB12 — General purpose I/O |
| Pin 24 | RB13 — General purpose I/O |
| Pin 25 | RB14 — General purpose I/O |
| Pin 26 | RB15 — General purpose I/O |
| Pin 27 | RC0 — General purpose I/O |
| Pin 28 | RC1 — General purpose I/O |
| Pin 29 | RC2 — General purpose I/O |
| Pin 30 | VDD — Core logic supply |
| Pin 31 | VSS — Ground |
| Pin 32 | RC3 — General purpose I/O |
| Pin 33 | RC4 — General purpose I/O |
| Pin 34 | RC5 — General purpose I/O |
| Pin 35 | RC6 — General purpose I/O |
| Pin 36 | RC7 — General purpose I/O |
| Pin 37 | RC8 — General purpose I/O |
| Pin 38 | RC9 — General purpose I/O |
| Pin 39 | RC10 — General purpose I/O |
| Pin 40 | RC11 — General purpose I/O |
| Pin 41 | RC12 — General purpose I/O |
| Pin 42 | RC13 — General purpose I/O |
| Pin 43 | RC14 — General purpose I/O |
| Pin 44 | RC15 — General purpose I/O |
| Pin 45 | RD0 — General purpose I/O |
| Pin 46 | RD1 — General purpose I/O |
| Pin 47 | RD2 — General purpose I/O |
| Pin 48 | RD3 — General purpose I/O |
| Pin 49 | RD4 — General purpose I/O |
| Pin 50 | RD5 — General purpose I/O |
| Pin 51 | RD6 — General purpose I/O |
| Pin 52 | RD7 — General purpose I/O |
| Pin 53 | RD8 — General purpose I/O |
| Pin 54 | RD9 — General purpose I/O |
| Pin 55 | RD10 — General purpose I/O |
| Pin 56 | RD11 — General purpose I/O |
| Pin 57 | VSS — Ground |
| Pin 58 | VDD — Core logic supply |
| Pin 59 | RD12 — General purpose I/O |
| Pin 60 | RD13 — General purpose I/O |
| Pin 61 | RD14 — General purpose I/O |
| Pin 62 | RD15 — General purpose I/O |
| Pin 63 | VSS — Ground |
| Pin 64 | VDD — Core logic supply |
| Pin 65 | EP — Exposed thermal pad (must be soldered to ground for thermal dissipation) |
Typische Anwendungen
PIC32MK1024GPK064-I/MR ist geeignet für 7 Anwendungs: BLDC / PMSM Motor Drive (FOC), Industrial IoT Edge Controller, Multi-Channel Data Acquisition System, Solar / Power Conversion MPPT Controller, Industrial Sensor Hub / Transmitter, USB-Connected Industrial Diagnostics Tool, Building Automation / HVAC Controller.
BLDC / PMSM Motor Drive (FOC)
The PIC32MK1024GPK064-I/MR is purpose-built for field-oriented control of brushless DC and permanent-magnet synchronous motors. Its four integrated 12-bit ADCs enable simultaneous sampling of the three phase currents and DC-bus voltage, which is essential for the Clarke/Park transform feedback loop in FOC. The 120MHz microAptiv + DSP engine executes the FOC math at sub-microsecond latency; the integrated 16-bit high-resolution PWM (100ps edge placement) keeps torque ripple low even at low RPM. The 1MB Flash holds field-weakening and MTPA tables for sensorless control, while ECC protects against bit-flip corruption in industrial environments. A typical 3-phase FOC implementation fits comfortably in <40KB of Flash, leaving headroom for communication stacks (CAN-FD for multi-node drives, USB for commissioning).
Empfohlen
Industrial IoT Edge Controller
The PIC32MK1024GPK064-I/MR fits Industrial IoT edge nodes that aggregate multiple sensor inputs and forward pre-processed data to the cloud via USB or CAN-FD. Four 12-bit ADCs digitize up to 42 analog sensor channels at 2MSPS aggregate, while USB Full-Speed (Host/Device/OTG) provides local console and modem connectivity. The 256KB SRAM supports TCP/IP stacks (e.g., MPLAB Harmony Net) without external memory. The DSP MAC accelerates on-device analytics (FFT, RMS) before transmission, reducing WAN bandwidth. ECC Flash keeps field-deployed firmware integrity intact despite industrial EMI. Industrial -40C to +85C operation covers most factory floor environments.
Empfohlen
Multi-Channel Data Acquisition System
With 42 analog inputs across four 12-bit ADCs running up to 2MSPS aggregate, the PIC32MK1024GPK064-I/MR serves as a compact multi-channel data acquisition front-end. USB Full-Speed streams digitized samples to a host PC at >1MSPS sustained, while CAN-FD delivers deterministic real-time data to industrial controllers. The DSP MAC performs on-chip filtering (FIR, decimation) to reduce host-side processing. ECC Flash and 256KB SRAM buffer transient bursts without loss. This combination replaces discrete ADC + FPGA + MCU three-chip designs with a single MCU, reducing BOM cost and PCB area in test-and-measurement and process-control equipment.
Empfohlen
Solar / Power Conversion MPPT Controller
Maximum Power Point Tracking (MPPT) solar charge controllers and bidirectional DC-DC converters benefit from the PIC32MK1024GPK064-I/MR's 100ps-resolution PWM, four simultaneous ADCs (PV voltage, PV current, battery voltage, battery current), and DSP FPU math for perturb-and-observe or incremental-conductance MPPT algorithms. The 1MB Flash holds multiple MPPT profiles for varied PV module configurations. ECC protection preserves firmware reliability in outdoor enclosures. The 64-QFN package fits compact solar-harvesting PCBs where power density per cubic centimeter matters. USB enables on-site firmware updates during commissioning and field service.
Empfohlen
Industrial Sensor Hub / Transmitter
The PIC32MK1024GPK064-I/MR integrates multi-sensor processing in a compact 64-QFN footprint: 4x 12-bit ADCs digitize temperature, pressure, flow, and level sensors; the DSP MAC runs compensation algorithms (linearization, RTD/Pt100 polynomial fit, thermistor beta compensation); USB and CAN-FD communicate with PLCs and SCADA hosts. The 1MB Flash supports multiple sensor calibration profiles and on-device HART or IO-Link protocol stacks. Industrial -40C to +85C operation and ECC Flash integrity are critical for process-industry sensor hubs that must operate maintenance-free for years in hazardous-area enclosures.
Empfohlen
USB-Connected Industrial Diagnostics Tool
Handheld industrial diagnostic and commissioning tools benefit from the PIC32MK1024GPK064-I/MR's USB Full-Speed Host/Device/OTG plus four ADCs and high-resolution PWM. The device can drive a small HMI display (USB graphics), excite a sensor under test with calibrated PWM, sample its response with the ADCs, and stream the result over USB to a host laptop. The 1MB Flash holds calibration certificates and unit-specific data. ECC Flash keeps the unit's calibration constants intact over years of field service. The 64-QFN 9x9 mm package fits compact handheld enclosures with adequate thermal headroom.
Empfohlen
Building Automation / HVAC Controller
The PIC32MK1024GPK064-I/MR supports HVAC variable-air-volume (VAV) controllers and building-automation nodes. Four 12-bit converters read temperature, humidity, CO2, and air-flow sensors simultaneously; the DSP engine runs filter and trend algorithms; USB and CAN-FD integrate with BACnet/MS-TP and Modbus building networks. ECC protection guards against the inrush noise of HVAC relay switching. The 1MB Flash supports multiple building-floor profiles and time-of-day scheduling. Industrial temperature grade and the compact 64-QFN package allow installation inside ceiling-mounted VAV boxes where space is constrained.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MK1024GPK064-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MK1024GPK064-E/MR | PIC32MK1024GPD064T-I/MR | PIC32MK0512GPK064T-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Core / Architecture | MIPS32 microAptiv 120MHz + FPU + DSP | MIPS32 microAptiv 120MHz + FPU + DSP | MIPS32 microAptiv 120MHz + FPU | MIPS32 microAptiv 120MHz + FPU + DSP |
| Program Flash | 1 MB ECC dual-panel | 1 MB ECC dual-panel | 1 MB ECC | 512 KB ECC (-50%) |
| SRAM | 256 KB | 256 KB | 256 KB | 64 KB (-75%) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| High-Resolution PWM | Yes (100 ps, 16-bit) | Yes (100 ps, 16-bit) | Reduced PWM channels | Yes (100 ps, 16-bit) |
| USB / CAN-FD | USB FS + CAN-FD | USB FS + CAN-FD | USB FS + CAN-FD | USB FS + CAN-FD |
| Primary Use Case | Motor control / IIoT | Motor control / IIoT (extended temp) | Display / HMI | Cost-optimized motor control |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Four 12-bit ADCs with 2MSPS aggregate and 100ps high-resolution PWM (vs. PIC32MK1024GPD064T-I/MR)
- 1MB Flash with 256KB SRAM (vs. PIC32MK0512GPK064T-I/MR)
- Industrial temperature grade (vs. PIC32MK1024GPK064-E/MR)
Designhinweise
Decouple all VDD/VSS pairs of the PIC32MK1024GPK064-I/MR with 100nF X7R ceramic capacitors placed within 3 mm of each supply pin; place a bulk 10uF X5R ceramic near the IC and a 10-22uF tantalum or polymer aluminum capacitor on the same net. Use separate analog and digital ground planes tied at a single-point near the IC's exposed pad. AVDD must be tied to VDD or driven by a low-noise LDO (e.g., MCP1700) when ADC performance below 1 LSB noise is required; do not share AVDD with switching-node voltages.
The 64-QFN 9x9 mm package dissipates up to ~1.0 W with theta-JA around 28 C/W per the family datasheet thermal data. Solder the exposed thermal pad (EP, pin 65) to a continuous top-layer ground copper pour of at least 1 square inch with multiple thermal vias to inner ground planes. Without the EP soldered, junction temperature can rise above the +85C industrial limit at high CPU activity. The Microchip family datasheet provides PCB land-pattern and via-array guidance for the 64-QFN (MR) footprint.
Route all analog ADC traces as differential pairs with a continuous ground reference underneath, and keep them >5 mm away from switching-node traces (PWM outputs, gate-driver lines, inductor switching). Use guard rings around sensitive analog inputs. Place the 4x ADCs' reference bypass capacitor (4.7uF X7R + 100nF NP0) within 5 mm of the AVREF pin. For USB Full-Speed, the D+/D- traces must be 90-ohm differential with length-matched within 150 mil; place the 27-ohm series resistors within 2 mm of the IC.
Do not connect any VDD pin to a different rail than VDD (some pinout maps label VDD/VDDIO separately in microA/B families, but on PIC32MK all VDD pins share the 2.3-3.6 V core rail). Ensure all unused I/O are configured as outputs driven low (not left floating) to reduce power consumption and ADC noise coupling. When programming via ICSP, the PGECx/PGEDx pair must be dedicated and not shared with JTAG or peripherals during programming.
Spread-spectrum clock configuration and peripheral clock gating reduce EMI in industrial environments. Configure PWM outputs with complementary mode and dead-time insertion per motor-control requirements to prevent shoot-through in the external gate driver. Add common-mode chokes on USB D+/D- and CAN-FD bus lines for CE/EN 55011 Class A EMI compliance. The on-chip FCR (Frequency Change Register) PLL allows CPU operation from a low-frequency crystal to minimize radiated emissions.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial -I temperature grade (-40C to +85C); -E grade covers -40C to +125C. AEC-Q100 qualification not stated - consult Microchip automotive product line for AEC-Q100-qualified PIC32MK variants if required.
