PIC32MM0016GPL036-E/M2 - 16KB Flash 32-bit MCU | Microchip
Teilenummer: PIC32MM0016GPL036-E/M2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.94 | $0,94 |
| 10 | $0.85 | $8,50 |
| 100 | $0.76 | $76,00 |
| 500 | $0.68 | $340,00 |
| 1.000 | $0.61 | $610,00 |
PIC32MM0016GPL036-E/M2 Übersicht
A PIC microcontroller is a programmable embedded controller based on the Harvard-architecture MIPS32 microAptiv core. Within the broader taxonomy, PIC32MM belongs to the 32-bit MCU family -> microcontroller -> embedded processor -> semiconductor IC. PIC32MM GPL variants specifically target eXtreme Low Power (XLP) applications, offering sleep currents down to 500 nA and small 4x4 mm packages, making them well-suited to space-constrained and battery-powered designs.
Key features include 16 KB Flash program memory, 4 KB SRAM, microMIPS instruction support for code density, multiple low-power sleep modes, a peripheral set that typically includes 12-bit ADC, comparators, timers, and configurable logic cells. The 36-pin SQFN (6x6 mm) package with an exposed thermal pad supports compact PCB layouts while providing a low-thermal-resistance path to the board copper for thermal dissipation during full 25 MHz operation.
The microAptiv core implements both MIPS32 and microMIPS instruction sets, achieving high code density without sacrificing throughput. Integrated peripherals include USB, I2C, SPI, UART, and motor-control PWMs depending on the device sub-series. The 12-bit 1.1 Msps ADC with up to 13 channels supports mixed-signal front-ends for sensor conditioning, while configurable logic cells allow glue-logic integration that previously required a CPLD.
Typical applications include low-power IoT sensor nodes, wearable fitness bands, battery-powered remote controls, motor-control BLDC drivers, and small home appliances. The 16 KB Flash / 4 KB RAM envelope fits compact state machines and simple communication stacks (BLE, LoRa, sub-GHz proprietary).
When designing with this device, ensure the exposed pad is soldered to a sufficiently large copper pour (at least 25 mm²) to meet datasheet thermal resistance specifications and to carry the device's ground return. Configure unused pins as digital outputs low to minimize sleep-mode current leakage per Microchip's XLP design guidelines.
This page synthesizes distributor pricing, pin-compatible Microchip alternatives, and practical low-power design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für PIC32MM0016GPL036-E/M2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MM0016GPL036-E/M2 (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, Core Architecture, MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MM0016GPL036-I/M2
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.65 / Stück
Datenblatt ansehen →PIC32MM0016GPL036-I/M2
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.65 / Stück
Datenblatt ansehen →PIC32MM0016GPL036-E/M2 Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv |
| Core Series | PIC32MM GPL |
| Maximum CPU Frequency | 25 MHz |
| CoreMark Score | 79 |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Supply Voltage Typ. | 3.3 V |
| Betriebstemperatur | -40°C to +125°C (Extended, -E suffix) |
| Gehäuse | 36-pin SQFN (6x6 mm) with Exposed Pad |
| Montageart | Surface Mount |
| Instruction Set | MIPS32 / microMIPS |
| Sleep Current (XLP) | 500 nA typical |
| MSL-Level | MSL1 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC32MM0016GPL036-E/M2 Pin-Konfiguration
| Pin 1 | RPB0/AN0/C1IND — GPIO/PMA/AN0 |
| Pin 2 | RPB1/AN1/C1INC — GPIO/PMA/AN1 |
| Pin 3 | RPB2/AN2/C2IND — GPIO/AN2 |
| Pin 4 | RPB3/AN3/C2INC — GPIO/AN3 |
| Pin 5 | VDD — Positive supply voltage (2.0-3.6V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RPB4/AN4 — GPIO/AN4 |
| Pin 8 | RPB5/AN5 — GPIO/AN5 |
| Pin 9 | RPB6/AN6 — GPIO/AN6 |
| Pin 10 | RPB7/AN7 — GPIO/AN7 |
| Pin 11 | RPC0 — GPIO |
| Pin 12 | RPC1 — GPIO |
| Pin 13 | RPC2 — GPIO |
| Pin 14 | RPC3 — GPIO |
| Pin 15 | RPC4 — GPIO |
| Pin 16 | RPC5 — GPIO |
| Pin 17 | RPC6 — GPIO |
| Pin 18 | RPC7 — GPIO |
| Pin 19 | RPC8 — GPIO |
| Pin 20 | RPC9 — GPIO |
| Pin 21 | VSS — Ground reference |
| Pin 22 | VDD — Positive supply voltage (2.0-3.6V) |
| Pin 23 | MCLR — Master Clear reset input (active low) |
| Pin 24 | PGED1 — Programming/debug data line |
| Pin 25 | PGEC1 — Programming/debug clock line |
| Pin 26 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pin 27 | OSC2/CLKO — Crystal oscillator output or clock output |
| Pin 28 | RPD0 — GPIO |
| Pin 29 | RPD1 — GPIO |
| Pin 30 | RPD2 — GPIO |
| Pin 31 | RPD3 — GPIO |
| Pin 32 | RPD4 — GPIO |
| Pin 33 | RPD5 — GPIO |
| Pin 34 | RPD6 — GPIO |
| Pin 35 | RPD7 — GPIO |
| Pin 36 | RPD8 — GPIO |
Typische Anwendungen
PIC32MM0016GPL036-E/M2 ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Wearable Fitness Band, Remote Control (IR/RF), Small Home Appliance (BLDC Motor Control), Industrial Sensor Transmitter, Smart LED Lighting Controller.
Battery-Powered IoT Sensor Node
The PIC32MM0016GPL036-E/M2 fits battery-powered IoT sensor nodes because its XLP sleep currents down to 500 nA enable multi-year coin-cell operation, while the 25 MHz microAptiv core wakes quickly to process sensor samples. The 16 KB Flash accommodates small BLE or LoRaWAN protocol stacks with microMIPS compression, and 4 KB SRAM is sufficient for buffering sensor payloads before transmission. Typical deployment achieves 5+ year battery life with 1% duty cycle.
Empfohlen
Wearable Fitness Band
For wearable fitness bands, the PIC32MM0016GPL036-E/M2's 6x6 mm SQFN package fits space-constrained PCB layouts while delivering 32-bit performance for step counting and heart-rate processing algorithms. The microAptiv core executes motion-processing firmware at 25 MHz with low active power, and 16 KB Flash holds compact pedometer and HRM algorithms. Sleep modes below 1 uA extend battery life between charges, critical for 24/7 wear scenarios.
Empfohlen
Remote Control (IR/RF)
Remote controls benefit from the PIC32MM0016GPL036-E/M2's deep-sleep current of 500 nA, allowing alkaline batteries to last the entire shelf-life plus years of standby. The 25 MHz core handles IR protocol encoding or RF sub-GHz packet generation, and 16 KB Flash supports multiple protocol variants (NEC, RC5, proprietary). The 36-pin SQFN exposes ample GPIO for key matrix scanning and LED indicators without external glue logic.
Empfohlen
Small Home Appliance (BLDC Motor Control)
The PIC32MM0016GPL036-E/M2 drives small BLDC motors in appliances like desk fans, personal blenders, or pump controllers. The 25 MHz core runs sensorless BEMF detection algorithms, while the on-chip PWM and 12-bit ADC generate motor drive waveforms with closed-loop control. 16 KB Flash fits standard state-machine control code, and the extended -40 to +125C temperature grade tolerates appliance thermal environments.
Empfohlen
Industrial Sensor Transmitter
For industrial 4-20 mA loop-powered transmitters, the PIC32MM0016GPL036-E/M2's extended -40 to +125C temperature grade and 16 KB Flash accommodate linearization, HART or IO-Link protocol stacks, and self-calibration routines. The microAptiv core handles floating-point math via software libraries, while XLP sleep modes reduce loop current draw below 3.5 mA. The 12-bit ADC integrates 13 channels for multi-sensor measurement and diagnostics.
Empfohlen
Smart LED Lighting Controller
The PIC32MM0016GPL036-E/M2 controls smart LED fixtures by generating PWM dimming signals and running communication protocols like ZigBee, BLE, or DMX. Its 25 MHz core processes dimming curves and color-mixing math in real time, while 4 KB SRAM buffers frame data. Low sleep currents enable standby power below 0.5 W to meet energy-saving regulations like Energy Star, and 16 KB Flash holds complete lighting firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MM0016GPL036-E/M2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MM0016GPL036-I/M2 | PIC32MM0032GPL028-I/M6 |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-pin SQFN (6x6) | 36-pin SQFN (6x6) | 28-pin UQFN |
| Flash Memory | 16 KB | 16 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 4 KB |
| Maximum Clock | 25 MHz | 25 MHz | 25 MHz |
| CoreMark Score | 79 | 79 | 79 |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- Extended -40C to +125C industrial temperature range (vs. PIC32MM0016GPL036-I/M2)
- 36-pin count for maximum GPIO peripheral access (vs. PIC32MM0032GPL028-I/M6)
Designhinweise
The 36-pin SQFN package has an exposed thermal pad that must be soldered to a ground-pour copper area of at least 25 mm² on the PCB. At 25 MHz active operation the device dissipates approximately 20-30 mW depending on peripheral activity. Without proper thermal pad soldering, junction temperature can rise above datasheet limits during sustained full-load operation, especially at +125C ambient.
For lowest sleep current (down to 500 nA per Microchip XLP datasheet figures), disable all unused peripherals via PMD registers before entering sleep, and configure all unused GPIO as digital outputs driven low. Use the on-chip LDO regulator mode (rather than external) when possible, and ensure the VDDCORE pin has a 10 uF ceramic decoupling capacitor placed within 5 mm of the pin.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically one per supply pin pair). Add a bulk 4.7-10 uF tantalum or ceramic capacitor at the regulator output. Keep the crystal traces (OSC1/OSC2) short and symmetric, surrounded by a ground guard ring to minimize EMI susceptibility. Route the PGED/PGEC traces symmetrically and keep them away from switching signals.
Compliance-Informationen
RoHS and REACH compliant per Microchip product documentation. -E suffix denotes extended temperature grade, not AEC-Q100 automotive qualification.
