PIC32MM0016GPL036-E/M2 - 16KB Flash 32-bit MCU | Microchip
N.º da peça: PIC32MM0016GPL036-E/M2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0.94 | $0,94 |
| 10 | $0.85 | $8,50 |
| 100 | $0.76 | $76,00 |
| 500 | $0.68 | $340,00 |
| 1.000 | $0.61 | $610,00 |
PIC32MM0016GPL036-E/M2 Visão geral
A PIC microcontroller is a programmable embedded controller based on the Harvard-architecture MIPS32 microAptiv core. Within the broader taxonomy, PIC32MM belongs to the 32-bit MCU family -> microcontroller -> embedded processor -> semiconductor IC. PIC32MM GPL variants specifically target eXtreme Low Power (XLP) applications, offering sleep currents down to 500 nA and small 4x4 mm packages, making them well-suited to space-constrained and battery-powered designs.
Key features include 16 KB Flash program memory, 4 KB SRAM, microMIPS instruction support for code density, multiple low-power sleep modes, a peripheral set that typically includes 12-bit ADC, comparators, timers, and configurable logic cells. The 36-pin SQFN (6x6 mm) package with an exposed thermal pad supports compact PCB layouts while providing a low-thermal-resistance path to the board copper for thermal dissipation during full 25 MHz operation.
The microAptiv core implements both MIPS32 and microMIPS instruction sets, achieving high code density without sacrificing throughput. Integrated peripherals include USB, I2C, SPI, UART, and motor-control PWMs depending on the device sub-series. The 12-bit 1.1 Msps ADC with up to 13 channels supports mixed-signal front-ends for sensor conditioning, while configurable logic cells allow glue-logic integration that previously required a CPLD.
Typical applications include low-power IoT sensor nodes, wearable fitness bands, battery-powered remote controls, motor-control BLDC drivers, and small home appliances. The 16 KB Flash / 4 KB RAM envelope fits compact state machines and simple communication stacks (BLE, LoRa, sub-GHz proprietary).
When designing with this device, ensure the exposed pad is soldered to a sufficiently large copper pour (at least 25 mm²) to meet datasheet thermal resistance specifications and to carry the device's ground return. Configure unused pins as digital outputs low to minimize sleep-mode current leakage per Microchip's XLP design guidelines.
This page synthesizes distributor pricing, pin-compatible Microchip alternatives, and practical low-power design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC32MM0016GPL036-E/M2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MM0016GPL036-E/M2 (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, Core Architecture, MSL Level.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MM0016GPL036-I/M2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.65 / unidade
Ver ficha técnica →PIC32MM0016GPL036-I/M2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.65 / unidade
Ver ficha técnica →PIC32MM0016GPL036-E/M2 Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Core Series | PIC32MM GPL |
| Maximum CPU Frequency | 25 MHz |
| CoreMark Score | 79 |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Supply Voltage Typ. | 3.3 V |
| Temperatura de operação | -40°C to +125°C (Extended, -E suffix) |
| Encapsulamento | 36-pin SQFN (6x6 mm) with Exposed Pad |
| Tipo de montagem | Surface Mount |
| Instruction Set | MIPS32 / microMIPS |
| Sleep Current (XLP) | 500 nA typical |
| Nível MSL | MSL1 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do PIC32MM0016GPL036-E/M2
| Pino 1 | RPB0/AN0/C1IND — GPIO/PMA/AN0 |
| Pino 2 | RPB1/AN1/C1INC — GPIO/PMA/AN1 |
| Pino 3 | RPB2/AN2/C2IND — GPIO/AN2 |
| Pino 4 | RPB3/AN3/C2INC — GPIO/AN3 |
| Pino 5 | VDD — Positive supply voltage (2.0-3.6V) |
| Pino 6 | VSS — Ground reference |
| Pino 7 | RPB4/AN4 — GPIO/AN4 |
| Pino 8 | RPB5/AN5 — GPIO/AN5 |
| Pino 9 | RPB6/AN6 — GPIO/AN6 |
| Pino 10 | RPB7/AN7 — GPIO/AN7 |
| Pino 11 | RPC0 — GPIO |
| Pino 12 | RPC1 — GPIO |
| Pino 13 | RPC2 — GPIO |
| Pino 14 | RPC3 — GPIO |
| Pino 15 | RPC4 — GPIO |
| Pino 16 | RPC5 — GPIO |
| Pino 17 | RPC6 — GPIO |
| Pino 18 | RPC7 — GPIO |
| Pino 19 | RPC8 — GPIO |
| Pino 20 | RPC9 — GPIO |
| Pino 21 | VSS — Ground reference |
| Pino 22 | VDD — Positive supply voltage (2.0-3.6V) |
| Pino 23 | MCLR — Master Clear reset input (active low) |
| Pino 24 | PGED1 — Programming/debug data line |
| Pino 25 | PGEC1 — Programming/debug clock line |
| Pino 26 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pino 27 | OSC2/CLKO — Crystal oscillator output or clock output |
| Pino 28 | RPD0 — GPIO |
| Pino 29 | RPD1 — GPIO |
| Pino 30 | RPD2 — GPIO |
| Pino 31 | RPD3 — GPIO |
| Pino 32 | RPD4 — GPIO |
| Pino 33 | RPD5 — GPIO |
| Pino 34 | RPD6 — GPIO |
| Pino 35 | RPD7 — GPIO |
| Pino 36 | RPD8 — GPIO |
Aplicações típicas
PIC32MM0016GPL036-E/M2 é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Node, Wearable Fitness Band, Remote Control (IR/RF), Small Home Appliance (BLDC Motor Control), Industrial Sensor Transmitter, Smart LED Lighting Controller.
Battery-Powered IoT Sensor Node
The PIC32MM0016GPL036-E/M2 fits battery-powered IoT sensor nodes because its XLP sleep currents down to 500 nA enable multi-year coin-cell operation, while the 25 MHz microAptiv core wakes quickly to process sensor samples. The 16 KB Flash accommodates small BLE or LoRaWAN protocol stacks with microMIPS compression, and 4 KB SRAM is sufficient for buffering sensor payloads before transmission. Typical deployment achieves 5+ year battery life with 1% duty cycle.
Recomendado
Wearable Fitness Band
For wearable fitness bands, the PIC32MM0016GPL036-E/M2's 6x6 mm SQFN package fits space-constrained PCB layouts while delivering 32-bit performance for step counting and heart-rate processing algorithms. The microAptiv core executes motion-processing firmware at 25 MHz with low active power, and 16 KB Flash holds compact pedometer and HRM algorithms. Sleep modes below 1 uA extend battery life between charges, critical for 24/7 wear scenarios.
Recomendado
Remote Control (IR/RF)
Remote controls benefit from the PIC32MM0016GPL036-E/M2's deep-sleep current of 500 nA, allowing alkaline batteries to last the entire shelf-life plus years of standby. The 25 MHz core handles IR protocol encoding or RF sub-GHz packet generation, and 16 KB Flash supports multiple protocol variants (NEC, RC5, proprietary). The 36-pin SQFN exposes ample GPIO for key matrix scanning and LED indicators without external glue logic.
Recomendado
Small Home Appliance (BLDC Motor Control)
The PIC32MM0016GPL036-E/M2 drives small BLDC motors in appliances like desk fans, personal blenders, or pump controllers. The 25 MHz core runs sensorless BEMF detection algorithms, while the on-chip PWM and 12-bit ADC generate motor drive waveforms with closed-loop control. 16 KB Flash fits standard state-machine control code, and the extended -40 to +125C temperature grade tolerates appliance thermal environments.
Recomendado
Industrial Sensor Transmitter
For industrial 4-20 mA loop-powered transmitters, the PIC32MM0016GPL036-E/M2's extended -40 to +125C temperature grade and 16 KB Flash accommodate linearization, HART or IO-Link protocol stacks, and self-calibration routines. The microAptiv core handles floating-point math via software libraries, while XLP sleep modes reduce loop current draw below 3.5 mA. The 12-bit ADC integrates 13 channels for multi-sensor measurement and diagnostics.
Recomendado
Smart LED Lighting Controller
The PIC32MM0016GPL036-E/M2 controls smart LED fixtures by generating PWM dimming signals and running communication protocols like ZigBee, BLE, or DMX. Its 25 MHz core processes dimming curves and color-mixing math in real time, while 4 KB SRAM buffers frame data. Low sleep currents enable standby power below 0.5 W to meet energy-saving regulations like Energy Star, and 16 KB Flash holds complete lighting firmware.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MM0016GPL036-E/M2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MM0016GPL036-I/M2 | PIC32MM0032GPL028-I/M6 |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-pin SQFN (6x6) | 36-pin SQFN (6x6) | 28-pin UQFN |
| Flash Memory | 16 KB | 16 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 4 KB |
| Maximum Clock | 25 MHz | 25 MHz | 25 MHz |
| CoreMark Score | 79 | 79 | 79 |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Principais diferenciais
- Extended -40C to +125C industrial temperature range (vs PIC32MM0016GPL036-I/M2)
- 36-pin count for maximum GPIO peripheral access (vs PIC32MM0032GPL028-I/M6)
Notas de projeto
The 36-pin SQFN package has an exposed thermal pad that must be soldered to a ground-pour copper area of at least 25 mm² on the PCB. At 25 MHz active operation the device dissipates approximately 20-30 mW depending on peripheral activity. Without proper thermal pad soldering, junction temperature can rise above datasheet limits during sustained full-load operation, especially at +125C ambient.
For lowest sleep current (down to 500 nA per Microchip XLP datasheet figures), disable all unused peripherals via PMD registers before entering sleep, and configure all unused GPIO as digital outputs driven low. Use the on-chip LDO regulator mode (rather than external) when possible, and ensure the VDDCORE pin has a 10 uF ceramic decoupling capacitor placed within 5 mm of the pin.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically one per supply pin pair). Add a bulk 4.7-10 uF tantalum or ceramic capacitor at the regulator output. Keep the crystal traces (OSC1/OSC2) short and symmetric, surrounded by a ground guard ring to minimize EMI susceptibility. Route the PGED/PGEC traces symmetrically and keep them away from switching signals.
Informações de conformidade
RoHS and REACH compliant per Microchip product documentation. -E suffix denotes extended temperature grade, not AEC-Q100 automotive qualification.
