PIC32MX130F256B-I/ML - 40MHz 32-bit MCU, 256KB Flash, 28-QFN | Microchip
Teilenummer: PIC32MX130F256B-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.72 | $57,20 |
| 100 | $5.18 | $518,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.12 | $4.120,00 |
PIC32MX130F256B-I/ML Übersicht
A 32-bit microcontroller (MCU) is a single-chip computer core, memory, and peripherals that executes instructions on 32-bit data paths in a single cycle. The PIC32MX family belongs to the wider PIC32 product line, which is itself a branch of Microchip's 8/16/32-bit PIC microcontroller portfolio. Within the broader taxonomy, PIC32MX1XX/2XX sits between the entry-level PIC32MM (lower pin counts, lower power) and higher-performance PIC32MK/MZ (DSP, FPU, larger memory). The M4K core is a Harvard-architecture MIPS32 core with single-cycle multiply and hardware divide.
Key features include 256KB Flash (256K x 8), 16KB SRAM, 40MHz/50MHz MIPS performance (50 MIPS), USB 2.0 full-speed OTG with on-chip transceiver, 10-bit 1 Msps ADC with up to 13 channels, and 5 16-bit timers/counters. The device also offers PMP/PSP for graphics and parallel interfaces, I2S for digital audio, JTAG and 2-wire programming/debug interfaces, and a CTMU for capacitive touch.
The architecture integrates a 5-stage pipeline, MPU for memory protection, and zero-wait-state Flash access at 40MHz. The device can be programmed in C with MPLAB X IDE and the XC32 compiler. Power management includes Idle, Sleep, and Deep Sleep modes, plus an integrated LDO that allows single 3.3V rail operation even at higher core voltages.
Typical applications include USB peripherals and human-interface devices, industrial control panels with TFT displays, low-cost audio accessories using I2S, sensor hubs, and consumer electronics requiring modest Flash and USB connectivity. The compact 6x6 mm QFN package makes it suited for space-constrained designs.
When designing, observe decoupling guidelines: place 0.1 uF ceramic capacitors near each VDD pin, keep trace lengths under 5mm, and use the exposed pad as the primary ground return. For USB applications, ensure the 3.3V USB transceiver supply is stable during enumeration to comply with USB-IF specifications.
This page synthesizes current distributor pricing, drop-in pin-compatible alternatives, and application-specific design notes not found in the manufacturer datasheet alone, giving engineers a complete sourcing and design-decision reference.
Drop-in-Alternativen für PIC32MX130F256B-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX130F256B-I/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, Timers, Operating Temperature, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX230F256B-I/ML
✅ Drop-In✓ Auf Lager
$2.69 / Stück
Datenblatt ansehen →PIC32MX170F256B-I/ML
✅ Drop-In✓ Auf Lager
$3.25 / Stück
Datenblatt ansehen →PIC32MX130F256B-50I/ML
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC32MX150F256B-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX130F128B-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX130F064B-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX210F256B-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX130F256B-I/ML Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K, 32-bit RISC |
| Maximum CPU Speed | 40 MHz (50 MIPS) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 21 |
| ADC | 10-bit, up to 13 channels, 1 Msps |
| USB | USB 2.0 Full-Speed OTG with on-chip transceiver |
| Timers | 5 x 16-bit timers/counters |
| UART | 2 |
| SPI | 2 |
| I2C | 2 |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 28-QFN (6x6 mm) with Exposed Pad |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC32MX130F256B-I/ML Pin-Konfiguration
| Pin 1 | RB9 — I/O port B bit 9 / SDA2 / PMA1 |
| Pin 2 | RB10 — I/O port B bit 10 / SCL2 / PMA0 |
| Pin 3 | RB11 — I/O port B bit 11 / PMA13 |
| Pin 4 | RB12 — I/O port B bit 12 / PMA11 |
| Pin 5 | RB13 — I/O port B bit 13 / PMA10 / SDA1 |
| Pin 6 | RB14 — I/O port B bit 14 / SCL1 / PMA9 |
| Pin 7 | RB15 — I/O port B bit 15 / PMA8 |
| Pin 8 | VDD — Digital supply voltage |
| Pin 9 | OSC1/RC13 — Crystal oscillator input |
| Pin 10 | OSC2/RC14 — Crystal oscillator output |
| Pin 11 | RC15 — I/O port C bit 15 |
| Pin 12 | VSS — Digital ground |
| Pin 13 | RC0 — I/O port C bit 0 |
| Pin 14 | RC1 — I/O port C bit 1 |
| Pin 15 | RC2 — I/O port C bit 2 |
| Pin 16 | RC3 — I/O port C bit 3 |
| Pin 17 | RC4 — I/O port C bit 4 / SDA1 |
| Pin 18 | RC5 — I/O port C bit 5 / SCL1 |
| Pin 19 | AVDD — Analog supply voltage |
| Pin 20 | AVSS — Analog ground |
| Pin 21 | RA0 — I/O port A bit 0 / AN0 |
| Pin 22 | RA1 — I/O port A bit 1 / AN1 |
| Pin 23 | RB0 — I/O port B bit 0 / AN2 |
| Pin 24 | RB1 — I/O port B bit 1 / AN3 |
| Pin 25 | VBUS — USB VBUS detect |
| Pin 26 | D- — USB D- data line |
| Pin 27 | D+ — USB D+ data line |
| Pin 28 | RB2 — I/O port B bit 2 / AN4 |
Typische Anwendungen
PIC32MX130F256B-I/ML ist geeignet für 7 Anwendungs: USB Human Interface Devices (HID), Industrial Sensor Hubs, Consumer Audio Accessories with I2S, TFT Display Controller with PMP, Low-Cost IoT Edge Nodes, Capacitive Touch User Interfaces, Educational and Hobby Development Platforms.
USB Human Interface Devices (HID)
The PIC32MX130F256B-I/ML is well suited for USB HID peripherals such as keyboards, mice, custom input devices, and consumer electronics. Its integrated USB 2.0 Full-Speed OTG transceiver eliminates external PHY ICs, and 256 KB Flash comfortably accommodates the Microchip Harmony USB HID stack. The 40 MHz/50 MIPS core processes HID reports with minimal latency, while the 16 KB SRAM handles report buffers without DMA pressure. Place a 1.5k pull-up on D+ for self-powered modes or use the internal pull-up to save BOM. The 28-QFN footprint fits inside mini-keyboard assemblies and ultra-thin OEM designs.
Empfohlen
Industrial Sensor Hubs
The PIC32MX130F256B-I/ML serves as a low-power industrial sensor hub aggregating I2C/SPI sensor data over USB to a host PC or PLC. Its 10-bit ADC with 13 channels handles analog sensors up to 1 Msps, and 2x I2C/SPI/UART interfaces support common industrial sensors. The -40C to +85C industrial temperature range suits factory floor deployment. With 256 KB Flash running a lightweight protocol bridge, the device can sample 4-8 channels at 100 Hz continuously. The QFN package plus exposed pad provides robust thermal performance in enclosed industrial environments.
Empfohlen
Consumer Audio Accessories with I2S
The PIC32MX130F256B-I/ML drives low-cost consumer audio accessories via its I2S digital audio interface, including USB audio class 1.0 dongles, headphone adapters, and small Bluetooth audio sinks. The 256 KB Flash supports the USB Audio class driver and I2S DMA configuration, while 40 MHz sustains 48 kHz stereo audio with low CPU load. Connect a USB host port to the on-chip transceiver, an external DAC or codec to the I2S pins, and the firmware handles enumeration and audio streaming. This avoids the BOM cost of dedicated USB audio processors for sub-$20 products.
Empfohlen
TFT Display Controller with PMP
The PIC32MX130F256B-I/ML can drive small TFT displays via its Parallel Master Port (PMP), making it suitable for control panels, IoT gateways, and small HMI products. PMP supports 8/16-bit parallel data and addresses up to 512K x 16-bit external memory or peripheral. At 40 MHz, it sustains 8-bit PMP transfers at up to 10 MHz, enough for 320x240 QVGA updates. Combined with 256 KB Flash for graphics libraries and CTMU for capacitive touch, the PIC32MX130F256B-I/ML enables cost-effective display products.
Empfohlen
Low-Cost IoT Edge Nodes
The PIC32MX130F256B-I/ML works as a low-cost IoT edge node processor for cloud-bound telemetry, sensor pre-processing, and command execution. Its USB OTG enables wired network tethering; serial peripherals connect to Wi-Fi/BLE modules. With 256 KB Flash and 16 KB SRAM, the device runs the Microchip MLA TCP/IP stack, MQTT client, and TLS libraries. Idle and Sleep modes drop current to microampere levels, allowing battery-powered or energy-harvested designs. Industrial temperature operation supports outdoor deployment.
Empfohlen
Capacitive Touch User Interfaces
The PIC32MX130F256B-I/ML includes a CTMU (Charge Time Measurement Unit) for implementing capacitive touch buttons, sliders, and proximity sensors. Combined with the 10-bit ADC, the CTMU enables up to 13 touch channels without external components. The 256 KB Flash supports Microchip's mTouch library for water-tolerant touch, gesture detection, and proximity sensing. At 40 MHz, the device samples touch channels at 100 Hz with low CPU overhead, ideal for appliance controls and HMI products.
Empfohlen
Educational and Hobby Development Platforms
The PIC32MX130F256B-I/ML is a popular choice for educational platforms and hobbyist projects because of its 32-bit MIPS performance, generous Flash and RAM, and full USB support. It is supported by MPLAB X IDE, the free XC32 compiler, and the MPLAB Harmony framework. Starter kits, Curiosity boards, and the chipKIT ecosystem provide ready-to-use development environments for university courses, maker communities, and rapid prototyping. The 28-QFN package fits into breadboard adapter boards and small dev kits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX130F256B-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX230F256B-I/ML | PIC32MX170F256B-I/ML | PIC32MX130F256B-50I/ML | PIC32MX130F128B-I/ML | PIC32MX130F064B-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Max CPU Speed | 40 MHz / 50 MIPS | 50 MHz / 83 MIPS | 40 MHz / 50 MIPS | 50 MHz / 50 MIPS | 40 MHz / 50 MIPS | 40 MHz / 50 MIPS |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Voltage | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx Unit Price (1 pc) | $6.20 | $7.10 | $6.40 | $6.45 | $5.50 | $4.95 |
Wichtigste Unterscheidungsmerkmale
- Higher Flash density at same price tier (vs. PIC32MX130F128B-I/ML)
- Lower cost than faster 50 MHz variant (vs. PIC32MX230F256B-I/ML)
- Faster 50 MHz speed grade option exists in same footprint (vs. PIC32MX130F256B-50I/ML)
Designhinweise
The PIC32MX130F256B-I/ML requires 0.1 uF ceramic decoupling capacitors within 5 mm of every VDD and AVDD pin. Place a bulk 10 uF tantalum or ceramic capacitor near the package to handle USB inrush current. For USB applications, AVDD must be tied to VDD through a ferrite bead or filter to reduce digital switching noise injected into the ADC reference. Power sequencing is not required; the internal LDO handles core voltage generation independently.
The 28-QFN package has an exposed thermal pad that MUST be soldered to a continuous ground plane for electrical grounding and thermal dissipation. Use an array of thermal vias (8-12 vias, 0.3 mm drill, 0.5 mm pitch) under the EP to sink heat into the PCB ground plane. In USB applications, route D+ and D+ as 90-ohm differential pairs with controlled impedance; keep trace lengths under 25 mm to avoid USB signal integrity issues.
USB D+/D- traces must be routed as a 90-ohm differential pair, matched within 2 mm. Place a common-mode choke or ferrite near the connector for EMI suppression. Keep USB signals away from switching power supplies and PWM signals. The 10-bit ADC reference pin (AVDD) should be decoupled with a 10 nF and 1 uF capacitor pair to reduce ADC sampling noise. Reference Microchip AN-26 for additional USB design considerations.
Do not enable code protection bits until firmware is fully validated - locked devices require a bulk erase to recover, which is costly in production. The PIC32MX130F256B-I/ML has only 16 KB SRAM, so avoid large USB ping-pong buffers; use the Harmony framework's small-buffer mode for memory efficiency. The 256 KB Flash is banked; ensure linker scripts place interrupt vectors in the correct region. Always enable the JTAG disabled fuse if JTAG is unused, freeing I/O pins RB7-RB10 for general I/O.
Compliance-Informationen
RoHS compliant per Microchip product page. Halogen Free: Compliant per GlobalSpec cross-reference page. Not AEC-Q100 qualified; for automotive applications consider AEC-Q100 qualified PIC32 variants. Estimated EOL Date 2027 noted on cross-reference page; consult Microchip for current product longevity commitments.
