PIC32MX150F256HT-V/MR - 32-bit MCU, 256KB Flash, 64-QFN | Microchip
Teilenummer: PIC32MX150F256HT-V/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.18 | $61,80 |
| 100 | $5.49 | $549,00 |
| 500 | $4.92 | $2.460,00 |
| 1.000 | $4.45 | $4.450,00 |
PIC32MX150F256HT-V/MR Übersicht
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip designed for cost-sensitive embedded designs that need more horsepower and peripherals than 8-bit PIC16/PIC18 devices while staying inside Microchip's MPLAB X ecosystem. Positioned in the taxonomy as: 32-bit microcontroller -> MIPS32 M4K core -> PIC32MX family -> general-purpose MCU -> embedded controller, the PIC32MX150F256H variant is the memory-rich 256 KB Flash option used for applications with larger firmware footprints, USB device/host stacks, or graphical user interfaces.
Key features of this V/MR variant include the PPS mapping engine, a Parallel Master Port (PMP) with dual buffers for graphics or external memory, a 10-bit 1 Msps ADC, USB 2.0 full-speed device/host/OTG, two I2C modules, and five 16-bit timers. The 64-QFN package (9x9 mm with exposed pad) saves board space and provides a low thermal resistance path via the e-pad. CTMU (Charge Time Measurement Unit) is included for capacitive touch and precise time-of-flight measurements.
The architecture combines a Harvard-style 5-stage pipeline M4K core, single-cycle 32x32 hardware multiply, and a tightly-coupled prefetch module that boosts Flash throughput at 50 MHz. The wide peripheral set combined with PPS means designers can route UART, SPI, I2S, and PWM to almost any digital I/O, simplifying PCB routing.
Typical applications for the PIC32MX150F256HT-V/MR include industrial control HMIs, USB peripherals and human-interface devices, low-cost audio playback with I2S DACs, sensor hubs, motor control, and battery-powered consumer devices where the -40C to +105C grade is required. Designers should always solder the exposed pad to a continuous ground pour for thermal dissipation and signal integrity, and follow Microchip's datasheet bypass-capacitor guidance (100 nF + 10 uF close to VDDCORE pins).
Drop-in-Alternativen für PIC32MX150F256HT-V/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX150F256HT-V/MR (gleiche Bauform und Footprint) – abweichend in ADC, Package, Parallel Master Port (PMP), Core Architecture, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX150F256H-I/MR
✅ Drop-In✓ Auf Lager
$3.75 / Stück
Datenblatt ansehen →PIC32MX150F256HT-50I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX150F256H-50I/MR
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →PIC32MX130F128H-V/MR
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →PIC32MX250F256B-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX150F256HT-V/MR Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K (32-bit) |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Flash | 256 KB |
| SRAM | 32 KB |
| Pin-Anzahl | 64 |
| Gehäuse | QFN-64 (9x9 mm) with exposed pad |
| Operating Voltage | 2.3 V to 3.6 V |
| Betriebstemperatur | -40 C to +105 C (V grade) |
| ADC | 10-bit, 1 Msps |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| SPI Modules | 4 |
| I2C Modules | 2 |
| I2S Modules | 2 |
| Timers (16-bit) | 5 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, dual buffers |
| CTMU (Charge Time Measurement Unit) | Yes |
| Montageart | Surface Mount |
| RoHS | Compliant |
| Lead-Free | Yes |
PIC32MX150F256HT-V/MR Pin-Konfiguration
| Pin 1 | RB9 — General-purpose I/O / PPS-mappable |
| Pin 2 | RB10 — General-purpose I/O / PPS-mappable |
| Pin 3 | RB11 — General-purpose I/O / PPS-mappable |
| Pin 4 | RB12 — General-purpose I/O / PPS-mappable |
| Pin 5 | RB13 — General-purpose I/O / PPS-mappable |
| Pin 6 | RB14 — General-purpose I/O / PPS-mappable |
| Pin 7 | RB15 — General-purpose I/O / PPS-mappable |
| Pin 8 | VSS — Digital ground |
| Pin 9 | VDD — Digital supply (2.3-3.6 V) |
| Pin 10 | RA0 — Analog/digital I/O |
| Pin 11 | RA1 — Analog/digital I/O |
| Pin 12 | RA2 — Analog/digital I/O |
| Pin 13 | RA3 — Analog/digital I/O |
| Pin 14 | RA4 — Analog/digital I/O |
| Pin 15 | RA5 — Analog/digital I/O |
| Pin 16 | RA6 — Analog/digital I/O |
| Pin 17 | RA7 — Analog/digital I/O |
| Pin 18 | AVDD — Analog supply (2.3-3.6 V) |
| Pin 19 | AVSS — Analog ground |
| Pin 20 | RC0 — General-purpose I/O / PPS-mappable |
| Pin 21 | RC1 — General-purpose I/O / PPS-mappable |
| Pin 22 | RC2 — General-purpose I/O / PPS-mappable |
| Pin 23 | RC3 — General-purpose I/O / PPS-mappable |
| Pin 24 | RC4 — General-purpose I/O / PPS-mappable |
| Pin 25 | RC5 — General-purpose I/O / PPS-mappable |
| Pin 26 | RC6 — General-purpose I/O / PPS-mappable |
| Pin 27 | RC7 — General-purpose I/O / PPS-mappable |
| Pin 28 | RC8 — General-purpose I/O / PPS-mappable |
| Pin 29 | RC9 — General-purpose I/O / PPS-mappable |
| Pin 30 | VDD — Digital supply (2.3-3.6 V) |
| Pin 31 | VSS — Digital ground |
| Pin 32 | RD0 — General-purpose I/O / PMP |
| Pin 33 | RD1 — General-purpose I/O / PMP |
| Pin 34 | RD2 — General-purpose I/O / PMP |
| Pin 35 | RD3 — General-purpose I/O / PMP |
| Pin 36 | RD4 — General-purpose I/O / PMP |
| Pin 37 | RD5 — General-purpose I/O / PMP |
| Pin 38 | RD6 — General-purpose I/O / PMP |
| Pin 39 | RD7 — General-purpose I/O / PMP |
| Pin 40 | RE0 — General-purpose I/O / PMP |
| Pin 41 | RE1 — General-purpose I/O / PMP |
| Pin 42 | RE2 — General-purpose I/O / PMP |
| Pin 43 | RE3 — General-purpose I/O / PMP |
| Pin 44 | RE4 — General-purpose I/O / PMP |
| Pin 45 | RE5 — General-purpose I/O / PMP |
| Pin 46 | RE6 — General-purpose I/O / PMP |
| Pin 47 | RE7 — General-purpose I/O / PMP |
| Pin 48 | RF0 — General-purpose I/O |
| Pin 49 | RF1 — General-purpose I/O |
| Pin 50 | RF2 — General-purpose I/O / USB |
| Pin 51 | RF3 — General-purpose I/O / USB D- |
| Pin 52 | RF4 — General-purpose I/O / USB D+ |
| Pin 53 | RF5 — General-purpose I/O |
| Pin 54 | RF6 — General-purpose I/O |
| Pin 55 | RF7 — General-purpose I/O |
| Pin 56 | RG0 — General-purpose I/O |
| Pin 57 | RG1 — General-purpose I/O |
| Pin 58 | RG2 — General-purpose I/O |
| Pin 59 | RG3 — General-purpose I/O |
| Pin 60 | VDD — Digital supply (2.3-3.6 V) |
| Pin 61 | VSS — Digital ground |
| Pin 62 | OSC1 — Crystal oscillator input |
| Pin 63 | OSC2 — Crystal oscillator output |
| Pin 64 | MCLR — Master clear (reset), active-low |
Typische Anwendungen
PIC32MX150F256HT-V/MR ist geeignet für 6 Anwendungs: Industrial HMI with USB and Graphics, USB Audio Device (I2S DAC + USB Input), Sensor Hub and Data Logger, Capacitive Touch Interface, Low-Cost BLDC Motor Controller, Battery-Powered Portable Device.
Industrial HMI with USB and Graphics
The PIC32MX150F256HT-V/MR is well suited for industrial human-machine interface (HMI) panels combining USB configuration and small graphical displays. Its 256 KB Flash comfortably stores USB stacks and lightweight graphical drivers, while the Parallel Master Port (PMP) interfaces directly to TFT LCD controllers. The -40 C to +105 C V grade tolerates factory-floor enclosures, and PPS remapping simplifies PCB layout when routing to a TFT, USB connector, and keypad matrix simultaneously.
Empfohlen
USB Audio Device (I2S DAC + USB Input)
USB audio peripherals such as USB-to-I2S DACs and USB headphones benefit from the PIC32MX150F256HT-V/MR's integrated USB 2.0 Full-Speed transceiver plus two I2S modules. The 32 KB RAM is sufficient for small audio buffering, while 256 KB Flash holds the USB Audio class firmware. PPS allows the I2S bit-clock and word-select lines to be routed to convenient pins, and the MIPS M4K core at 50 MHz keeps up with 48 kHz/16-bit stereo with low overhead.
Empfohlen
Sensor Hub and Data Logger
The PIC32MX150F256HT-V/MR's 10-bit 1 Msps ADC, CTMU, and multiple UART/I2C/SPI interfaces make it a practical sensor hub aggregating analog and digital sensor data. 256 KB Flash allows on-device calibration tables and logging protocols (Modbus, CAN-friendly layer), and the wide temperature V grade supports outdoor sensor installations. PPS remapping helps when routing many UARTs to a single connector for stacked daughterboards.
Empfohlen
Capacitive Touch Interface
The integrated CTMU combined with the PPS-mappable I/O and 50 MHz MIPS M4K core supports robust capacitive-touch button sliders and wheels on the PIC32MX150F256HT-V/MR. Designers can implement self-capacitance or mutual-capacitance scanning firmware in 256 KB Flash without external touch controllers. The V temperature grade suits appliance, white-good, and outdoor control panels that demand reliable touch under varying humidity and temperature.
Empfohlen
Low-Cost BLDC Motor Controller
PWM, QEI, and ADC resources of the PIC32MX150F256HT-V/MR can drive small brushless DC (BLDC) and stepper motors in appliance and robotics applications. The MIPS M4K core runs vector-control or six-step commutation algorithms with enough headroom for 256 KB of state machines and protective firmware. V-grade temperature tolerance suits motor compartments where ambient can reach +90 C.
Empfohlen
Battery-Powered Portable Device
Battery-powered designs leverage the PIC32MX150F256HT-V/MR's low-power sleep modes, USB charging input, and flexible I/O mapping via PPS. The 32 KB SRAM allows modest data buffering while USB device mode handles charging and data transfer to a host PC. The V temperature grade supports outdoor consumer electronics like rugged GPS handhelds and industrial scanners where reliable operation from -40 C to +105 C is required.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX150F256HT-V/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX150F256H-I/MR | PIC32MX150F256HT-50I/MR | PIC32MX150F256H-50I/MR | PIC32MX130F128H-V/MR | PIC32MX250F256B-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB | 32 KB |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Temperature | -40 C to +105 C (V) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +85 C (I) | -40 C to +105 C (V) | -40 C to +85 C (I) |
| USB | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) |
| PPS | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Wider -40 C to +105 C operating temperature range (vs. PIC32MX150F256H-I/MR)
- Same QFN-64 footprint as lower-memory variants (vs. PIC32MX130F128H-V/MR)
- Mature MIPS32 M4K core with broad Microchip toolchain (vs. PIC32MX250F256B-I/MR)
Designhinweise
The QFN-64 (9x9 mm) exposed pad is the primary heat-dissipation path. Solder the e-pad to a continuous ground copper pour of at least 1 square inch with thermal vias (typically 4-9 vias in a 3x3 grid) to keep junction temperature within the -40 C to +105 C operating envelope. Without proper e-pad soldering, expect a theta_JA increase of 30-50% and derated performance in enclosed housings.
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically 4 VDD pins on this package). Add a bulk 10 uF ceramic on the AVDD/AVSS analog pair to reduce ADC sampling noise. USB designs also require a 10 uF bulk on VBUS for hot-plug events. The PIC32MX150F256HT-V/MR requires a stable 2.3-3.6 V supply; ripple above 50 mVpp can corrupt Flash programming.
Route USB D+/D- (RF3/RF4) as a 90 ohm differential pair with matched length within 2 mm. Keep clock traces short and away from analog inputs to reduce ADC crosstalk. When using PPS, configure PPS groups before enabling peripherals and lock pins when possible to avoid accidental remapping. The PMP data lines (RDx/REx) should be length-matched if used for TFT or external memory interfaces.
Do not confuse the 'T' suffix in PIC32MX150F256HT-V/MR with TQFP package - the trailing T indicates Tape & Reel packaging, while the /MR suffix confirms the 64-QFN package. Always verify the package code from the orderable part number. Designers switching from PIC32MX150F256H-I/MR to the V/MR variant must re-verify thermal design margins since the V grade upper limit is +105 C vs +85 C.
Compliance-Informationen
RoHS and lead-free compliant per Microchip product page. AEC-Q100 not applicable - this is an industrial-grade part, not automotive qualified. For automotive applications use PIC32MX family AEC-Q100 variants if available.
