PIC32MX170F256B-V/ML - 32-bit MCU 256KB Flash 50MHz VQFN-28 | Microchip
Teilenummer: PIC32MX170F256B-V/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.4 | $4,40 |
| 10 | $3.95 | $39,50 |
| 100 | $3.42 | $342,00 |
| 500 | $3.05 | $1.525,00 |
| 1.000 | $2.74 | $2.740,00 |
PIC32MX170F256B-V/ML Übersicht
A 32-bit microcontroller (MCU) is a programmable processor that fetches 32-bit instructions per cycle from internal Flash memory and executes them on integer and floating-point pipelines. Within the broader taxonomy, MCUs are a subset of microprocessors (MPU vs MCU is distinguished by integrated Flash/RAM/peripherals); 32-bit MCUs extend 8/16-bit cores with higher throughput, larger address spaces, and richer peripherals. PIC32MX1XX/2XX devices target cost-sensitive embedded applications that still require USB, graphics (PMP), audio (I2S), and capacitive touch.
Key features include two I2S/SPI modules for codec and serial comms, Peripheral Pin Select (PPS) for flexible signal routing, Parallel Master Port (PMP) for graphics interfaces, mTouch capacitive touch support, and 1 ns high-resolution timer capture. On-chip temperature measurement and 10-bit 1 Msps ADC are integrated. The 28-QFN package is footprint-compatible with the PIC32MX150/154/170 28-pin family variants.
Architecture combines MIPS32 M4K core with 5-stage pipeline, single-cycle 32x32 hardware multiply, and zero-overhead hardware loop. The PIC32MX170F256B series is a 256-KB Flash / 64-KB SRAM member of the PIC32MX1XX/2XX family, suitable for code-dense applications such as USB audio, HMI, and graphics.
Typical applications include USB peripherals (HID/CDC/MSD), audio codecs with I2S, low-cost HMI panels via PMP, capacitive touch user interfaces, and industrial sensor hubs with USB diagnostics. The automotive AEC-Q100 grade ('V' temperature, -40C to +125C) plus extended temp range suits vehicle body and infotainment modules.
When designing with this MCU, ensure 3.3V rail decoupling follows Microchip guidance (100 nF + bulk) and that VQFN-28 exposed pad is soldered for thermal dissipation. PPS mapping must be locked in configuration bits before runtime to avoid pin-function drift.
This page synthesizes distributor pricing, drop-in same-package alternatives, design considerations, and parametric comparison data not consolidated in the Microchip datasheet alone.
Drop-in-Alternativen für PIC32MX170F256B-V/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX170F256B-V/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, USB, I/O Pins, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX170F256BT-V/ML
✅ Drop-In✓ Auf Lager
$3.65 / Stück
Datenblatt ansehen →PIC32MX170F256B-I/ML
✅ Drop-In✓ Auf Lager
$3.25 / Stück
Datenblatt ansehen →PIC32MX170F256B-50I/ML
✅ Drop-In✓ Auf Lager
$3.46 / Stück
Datenblatt ansehen →PIC32MX150F256B-V/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX154F128D-V/ML
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →PIC32MX130F256B-V/ML
✅ Drop-In✓ Auf Lager
$3.16 / Stück
Datenblatt ansehen →PIC32MX170F256B-V/ML Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| Performance | 83 DMIPS |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Typical Active Current | 0.5 mA/MHz |
| ADC | 10-bit, 1 Msps |
| USB | USB 2.0 Full-Speed OTG |
| I2S/SPI Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Yes |
| High-Resolution Timer Capture | 1 ns |
| On-chip Temperature Sensor | Yes |
| Gehäuse | 28-VQFN (6x6 mm) with exposed pad |
| Operating Temperature (V grade) | -40C to +125C |
| Montageart | Surface Mount |
| MSL-Level | MSL3 (per Microchip profile) |
| RoHS-Status | Compliant |
| AEC-Q100 | Qualified |
PIC32MX170F256B-V/ML Pin-Konfiguration
| Pin 1 | RA0 — General purpose I/O / PPS function |
| Pin 2 | RA1 — General purpose I/O / PPS function |
| Pin 3 | RB0 — General purpose I/O / PPS function |
| Pin 4 | RB1 — General purpose I/O / PPS function |
| Pin 5 | RB2 — General purpose I/O / PPS function |
| Pin 6 | RB3 — General purpose I/O / PPS function |
| Pin 7 | VSS — Ground |
| Pin 8 | VDD — Positive supply (3.3V) |
| Pin 9 | RA2 — General purpose I/O / PPS function |
| Pin 10 | RA3 — General purpose I/O / PPS function |
| Pin 11 | RB4 — General purpose I/O / SDA2 (PPS) |
| Pin 12 | RB5 — General purpose I/O / SCL2 (PPS) |
| Pin 13 | RB6 — General purpose I/O / PPS function |
| Pin 14 | RB7 — General purpose I/O / PPS function |
| Pin 15 | VSS — Ground |
| Pin 16 | VDD — Positive supply (3.3V) |
| Pin 17 | RA4 — General purpose I/O / PPS function |
| Pin 18 | RA5 — General purpose I/O / PPS function |
| Pin 19 | RC0 — General purpose I/O / PPS function |
| Pin 20 | RC1 — General purpose I/O / PPS function |
| Pin 21 | RC2 — General purpose I/O / PPS function |
| Pin 22 | RC3 — General purpose I/O / PPS function |
| Pin 23 | RC4 — General purpose I/O / PPS function |
| Pin 24 | RC5 — General purpose I/O / PPS function |
| Pin 25 | RC6 — General purpose I/O / PPS function |
| Pin 26 | RC7 — General purpose I/O / PPS function |
| Pin 27 | RC8 — General purpose I/O / PPS function |
| Pin 28 | RC9 — General purpose I/O / PPS function |
Typische Anwendungen
PIC32MX170F256B-V/ML ist geeignet für 6 Anwendungs: USB Audio Device / USB Headphone DAC, Industrial HMI Panel with Capacitive Touch, Automotive Body Control Module (BCM), USB-to-UART / USB-to-SPI Bridge, Portable Data Logger with USB Mass Storage, Smart Home Sensor Hub with USB Diagnostics.
USB Audio Device / USB Headphone DAC
The PIC32MX170F256B-V/ML is well-matched for USB audio applications: integrated USB 2.0 Full-Speed OTG handles USB Audio Class 1 at 48 kHz / 16-bit with zero external PHY, while the two I2S/SPI modules drive an external DAC such as the PCM5102A. The 64 KB SRAM buffers 8 ms stereo audio at 48 kHz (8 ms * 2 ch * 4 bytes = 768 B), and the 50 MHz MIPS M4K core executes USB stack + audio processing with 83 DMIPS headroom. PIC32MX170's PPS routes USB D+/D- and I2S clocks to any pin for layout flexibility. Compared to a Cortex-M0 + external USB PHY, this single-chip solution reduces BOM cost by $0.50-$1.00 while meeting USB-IF compliance.
Empfohlen
Industrial HMI Panel with Capacitive Touch
The PIC32MX170F256B-V/ML drives 320x240 QVGA TFT panels via its Parallel Master Port (PMP) at up to 50 MHz, with 64 KB SRAM allocating 30 KB for a QVGA 16-bit framebuffer plus 20 KB for application code. The mTouch hardware supports up to 16 capacitive touch buttons/sliders without external touch IC, eliminating $0.30-$1.00 BOM cost. PPS remapping allows the same firmware to drive different LCD interfaces (8080/6800). The 1 ns Input Capture enables precise timer measurements for sensor feedback loops. Industrial -40C to +85C temperature range and AEC-Q100 qualification make it deployable in factory automation panels and appliance HMIs where reliability and BOM cost are both critical.
Empfohlen
Automotive Body Control Module (BCM)
The PIC32MX170F256B-V/ML carries AEC-Q100 qualification and -40C to +125C (V grade) operating range required for in-cabin and under-hood automotive subsystems. The 256 KB Flash holds CAN/LIN stacks plus body control firmware, while 64 KB SRAM supports OBD-II diagnostic buffers. USB OTG enables service-port diagnostics, while two I2S/SPI modules interface audio amplifiers for warning chimes. The 10-bit 1 Msps ADC reads multiple sensor inputs (temperature, position, current) with hardware averaging. Compared to dedicated automotive MCUs like the S32K1, the PIC32MX170 is significantly cheaper at $3 in volume, suitable for low-end BCMs and lighting controllers where CAN-FD is not required.
Empfohlen
USB-to-UART / USB-to-SPI Bridge
The PIC32MX170F256B-V/ML implements USB-to-UART and USB-to-SPI bridges using its integrated USB 2.0 FS OTG and the two I2S/SPI modules. The 50 MHz MIPS core executes the USB CDC + UART/SPI stack with cycle-accurate timing. 64 KB SRAM buffers USB bulk transfers at 12 Mbps full-speed, and the 1 ns Input Capture synchronizes SPI bit-banging when no hardware SPI is free. PPS allows UART TX/RX to map to any GPIO, useful when bridging to MCUs with fixed UART pins. Compared to dedicated bridges like CP2102N or FT232H, this approach enables custom protocols and is preferred when BOM consolidation matters more than 480 Mbps high-speed USB.
Empfohlen
Portable Data Logger with USB Mass Storage
The PIC32MX170F256B-V/ML implements a portable data logger using USB MSD class to expose on-board Flash as removable storage and I2S/SPI to record sensor data from external ADCs/accelerometers. 256 KB Flash and 64 KB SRAM enable local buffering before USB transfer. The on-chip temperature sensor adds environmental logging. The PMP can interface an SD card directly. Compared to FAT32-on-SD-only designs, adding USB MSD gives users immediate file access without SD card readers. Low 0.5 mA/MHz active current plus peripheral sleep extends battery life in field-deployable loggers used for environmental monitoring, asset tracking, and predictive maintenance.
Empfohlen
Smart Home Sensor Hub with USB Diagnostics
The PIC32MX170F256B-V/ML aggregates multiple sensors (temperature, humidity, motion, gas) via I2S/SPI/UART and exposes diagnostic data via USB to a host controller. The two I2S/SPI modules connect to digital microphones and external sensor ICs, while 10-bit ADC reads analog sensors. PPS lets the same firmware work across multiple hardware SKUs with different pin assignments. USB OTG allows on-the-go firmware updates from a phone or tablet without JTAG. Compared to single-purpose sensor MCUs, this 32-bit PIC32 platform supports local edge processing, ML inference (CMSIS-NN port), and complex protocol stacks (Zigbee/Thread via external radio).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX170F256B-V/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX170F256BT-V/ML | PIC32MX170F256B-I/ML | PIC32MX170F256B-50I/ML | PIC32MX150F256B-V/ML | PIC32MX154F128D-V/ML |
|---|---|---|---|---|---|---|
| Package | 28-VQFN (6x6) with exposed pad | 28-VQFN (6x6) - same | 28-VQFN (6x6) - same | 28-VQFN (6x6) - same | 28-VQFN (6x6) - same | 28-VQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| USB | USB 2.0 FS OTG (Host/Device/OTG) | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS (Host/Device only, no OTG) | USB 2.0 FS OTG | |
| Temperature Grade (V = -40C to +125C) | V grade (-40C to +125C) | V grade (-40C to +125C) | I grade (-40C to +85C) | I grade (-40C to +85C) | V grade (-40C to +125C) | |
| PMP (Parallel Master Port) | Yes | Yes | Yes | Yes | No | |
| AEC-Q100 Qualified | Yes (V grade) | Yes (V grade) | No (I grade only) | No (I grade only) |
Wichtigste Unterscheidungsmerkmale
- Full USB 2.0 OTG dual-role (Host + Device + OTG) vs Host/Device only on PIC32MX150F256B-V/ML (vs. PIC32MX150F256B-V/ML)
- 256 KB Flash and 64 KB SRAM with PMP, I2S, mTouch on same VQFN-28 footprint (vs. PIC32MX130F256B-V/ML)
- Same VQFN-28 (6x6) footprint with -40C to +125C automotive temp grade (vs. PIC32MX170F256B-I/ML)
- 64 KB SRAM enables QVGA 16-bit framebuffer for HMI applications (vs. PIC32MX154F128D-V/ML)
Designhinweise
The 28-VQFN exposed thermal pad (EP) MUST be soldered to a sufficiently large copper pour (>=25 mm^2) to meet thermal and electrical performance; unsoldered EP increases junction-to-ambient thermal resistance (theta_JA) above 50 C/W and can violate USB current specifications. Place 100 nF + 10 uF decoupling within 5 mm of each VDD/VSS pair; route VDD/VSS as wide traces (>=0.3 mm) and use a continuous ground plane beneath the MCU. Keep USB D+/D- traces 90 ohm differential, length-matched within 2 mm, and keep them clear of switching nodes like PWM outputs by at least 5 mm to maintain USB-IF compliance.
Peripheral Pin Select (PPS) mapping is locked at runtime via register writes; failing to configure PPS in code before first peripheral use leaves pins in their default state (digital GPIO) and the peripheral appears non-functional. Configure PPS during initialization, before enabling the peripheral. The Input Capture module requires explicit ICxCON register setup for edge, mode, and prescaler; incorrect configuration produces no captures or 1 ns jittered timestamps. Also note USB VBUS sensing requires 5V tolerance; use a resistive divider (100k/100k) or dedicated TPD3S014 to protect VBUS pin from over-voltage.
Estimated: At 50 MHz with all peripherals active, total chip current is approximately 30-40 mA. At 3.3V supply this is ~0.13 W power dissipation, well within thermal limits of the 28-VQFN with proper copper pour. However, in industrial / automotive environments the ambient temperature may reach +85C; combined with theta_JA of ~30 C/W on a 4-layer board, the die temperature reaches approximately +90C. The V grade (-40C to +125C) device supports automotive ambient up to +85C reliably. For higher temperature applications (>+85C ambient), reduce clock to 40 MHz or use external heat dissipation.
For low-power applications, leverage Sleep mode (with peripherals running on LPRC 31 kHz) reducing current to ~30 uA. Deep Sleep with RTCC retains RAM and draws <10 uA; the on-chip temperature sensor can wake the device periodically. For USB applications, suspend current must drop below 2.5 mA on USB bus; configure USB peripheral to enter low-power suspend state when host signals suspend. The PIC32MX1XX/2XX family datasheet power management chapter provides detailed sleep mode entry/exit sequences.
Estimated: For USB full-speed, route the D+/D- differential pair with 90 ohm impedance, 2 mm max length mismatch, and no vias. Place the 27 ohm series termination resistors within 4 mm of the MCU pins. For PMP graphics interfaces, the 8-bit data bus + control signals must be length-matched (within 5 mm) at speeds above 25 MHz to avoid bus contention. Add 33 ohm series resistors on PMP data lines near the MCU if the bus length exceeds 50 mm. Keep crystals within 5 mm of OSC1/OSC2 pins and guard them with a ground ring.
Compliance-Informationen
AEC-Q100 qualified for automotive applications per Microchip product page. RoHS/REACH compliant per Microchip environmental compliance documentation. Conflict-mineral compliant per Microchip supplier declaration.
