PIC32MX270F256B-V/ML - 32-bit MCU 256KB Flash 40MHz | Microchip
Teilenummer: PIC32MX270F256B-V/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.84 | $4,84 |
| 10 | $4.36 | $43,60 |
| 100 | $3.7 | $370,00 |
| 500 | $3.18 | $1.590,00 |
| 1.000 | $2.78 | $2.780,00 |
PIC32MX270F256B-V/ML Übersicht
What is a PIC32MX microcontroller? The PIC32MX family is Microchip's 32-bit extension of the legacy PIC16/PIC24 architecture, built on the MIPS M4K core. MCUs are mixed-signal embedded processors that integrate CPU, non-volatile program memory, volatile data SRAM, and peripherals (ADC, timers, communication interfaces) into one device. PIC32MX parts sit in the hierarchy MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 family -> PIC32MX1XX/2XX sub-family and target cost-sensitive real-time control and USB-connected embedded applications.
Key features of the PIC32MX270F256B include a 1.2 mA/MHz typical dynamic current consumption, two I2S/SPI modules for audio codec interfacing, Peripheral Pin Select for flexible pin mapping, a Parallel Master Port for graphics, mTouch capacitive touch sensing support, a Charge Time Measurement Unit (CTMU) for 1 ns-resolution time measurement, a 10-bit 1 Msps ADC with up to 28 channels, and a USB 2.0 Full-Speed peripheral. The 28-QFN package is appropriate for space-constrained designs with moderate thermal dissipation requirements.
Architecturally, the PIC32MX270F256B uses a Harvard-style bus with separate Flash and SRAM paths, a 5-stage pipeline, single-cycle multiply, and zero-overhead hardware loops. PPS allows remapping of most digital peripherals to a wide range of I/O pins, which simplifies PCB layout. The PMP can interface to external parallel memory or graphics controllers, while the two I2S modules enable audio CODEC interfacing.
Typical applications include industrial sensing with USB diagnostics, automotive body and HMI controllers (AEC-Q100 qualified), USB peripherals such as HID/CDC devices, mTouch capacitive touch panels, graphics interfaces via PMP, and audio processing nodes using I2S. The combination of USB, PMP, and mTouch makes the part particularly attractive as a low-cost 32-bit platform for connected sensing and human-machine interfaces.
When designing with this device, allocate the 64 KB SRAM carefully - 32 KB is often reserved for DMA-coherent buffers in USB stacks. The 28-QFN package has a thermal pad that must be soldered to a sufficient copper pour to keep junction temperature below 115C at maximum CPU load. PPS remapping should be finalized in firmware early because some pin functions are not mappable.
This page synthesizes distributor pricing, automotive-grade cross references within the PIC32MX1XX/2XX family, and practical design notes not found in the bare manufacturer datasheet.
Drop-in-Alternativen für PIC32MX270F256B-V/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX270F256B-V/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, USB, Core Architecture, AEC-Q100.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX270F256B-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX270F256BT-V/ML
✅ Drop-In✓ Auf Lager
$4.38 / Stück
Datenblatt ansehen →PIC32MX270F128B-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX230F256D-I/ML
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →PIC32MX170F256B-V/ML
✅ Drop-In✓ Auf Lager
$2.74 / Stück
Datenblatt ansehen →PIC32MX250F256B-V/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX270F256B-V/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Flash | 256 KB |
| Data SRAM | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 21 (varies by package) |
| ADC | 10-bit, up to 1 Msps, 13 channels (28-QFN) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| SPI / I2S Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| Timers | 5 (16-bit) + 2 (32-bit) |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (1 ns time measurement) | Yes |
| mTouch Capacitive Touch | Yes |
| On-chip Temperature Sensor | Yes |
| Typical Active Current | 0.5 mA/MHz (typical) |
| Betriebstemperatur | -40C to +105C (V grade) |
| Gehäuse | 28-pin QFN (6x6 mm) (ML) |
| Montageart | Surface Mount |
| MSL-Level | 1 |
| RoHS-Status | Compliant |
| AEC-Q100 | Qualified (automotive grade, -V suffix) |
| Lead Free | Yes |
PIC32MX270F256B-V/ML Pin-Konfiguration
| Pin 1 | RPB0/AN0 — Remappable I/O / Analog input 0 |
| Pin 2 | RPB1/AN1 — Remappable I/O / Analog input 1 |
| Pin 3 | RPB2/AN2 — Remappable I/O / Analog input 2 |
| Pin 4 | RPB3/AN3 — Remappable I/O / Analog input 3 |
| Pin 5 | VSS — Ground reference |
| Pin 6 | RPA0 — Remappable I/O |
| Pin 7 | RPA1 — Remappable I/O |
| Pin 8 | VDD — Positive supply (2.3V-3.6V) |
| Pin 9 | RPB4/AN4 — Remappable I/O / Analog input 4 |
| Pin 10 | RPB5/AN5 — Remappable I/O / Analog input 5 |
| Pin 11 | VSS — Ground reference |
| Pin 12 | RPA2 — Remappable I/O |
| Pin 13 | RPA3 — Remappable I/O |
| Pin 14 | RPB6/AN6 — Remappable I/O / Analog input 6 |
| Pin 15 | RPB7/AN7 — Remappable I/O / Analog input 7 |
| Pin 16 | VSS — Ground reference |
| Pin 17 | VDD — Positive supply (2.3V-3.6V) |
| Pin 18 | OSC1 — Oscillator input / external clock |
| Pin 19 | OSC2 — Oscillator output |
| Pin 20 | D+ — USB D+ data line |
| Pin 21 | D- — USB D- data line |
| Pin 22 | VBUS — USB VBUS sense |
| Pin 23 | MCLR — Master clear / reset (active low) |
| Pin 24 | RPB8 — Remappable I/O |
| Pin 25 | RPB9 — Remappable I/O |
| Pin 26 | RPA4 — Remappable I/O |
| Pin 27 | RPA5 — Remappable I/O |
| Pin 28 | EP — Exposed thermal pad (connect to VSS) |
Typische Anwendungen
PIC32MX270F256B-V/ML ist geeignet für 7 Anwendungs: USB HID / CDC Peripherals, Automotive HMI / Body Controllers, mTouch Capacitive Touch Panels, Audio Codec Interface via I2S, Industrial Sensor Hubs with USB Diagnostics, Graphics Interfaces via PMP, Connected IoT Edge Nodes.
USB HID / CDC Peripherals
The PIC32MX270F256B-V/ML fits USB HID, CDC, and vendor-class peripherals thanks to its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver, 256 KB Flash for composite-device stacks (USB + HID + CDC), and 64 KB SRAM for endpoint buffers. Peripheral Pin Select allows flexible routing of the USB D+/D- pair and the VBUS sense pin to free up I/O. Unlike external-USB parts, no companion PHY or external 5V-tolerance components are needed for Full-Speed at 12 Mbps, cutting BOM cost and PCB area in space-constrained HID devices such as industrial input tools, configurators, and instrumentation bridges.
Empfohlen
Automotive HMI / Body Controllers
The PIC32MX270F256B-V/ML suits AEC-Q100 automotive HMI and body electronics because its -V suffix guarantees -40C to +105C operation and the integrated USB, mTouch capacitive touch, and CTMU blocks remove the need for separate touch controllers or timers. The 10-bit 1 Msps ADC samples up to 13 channels of sensor data for switch and rotary inputs in cluster modules, while the Parallel Master Port drives small TFTs for secondary display mirrors or HVAC panels. Compared to 5V automotive MCUs, the 3.3V core reduces power dissipation in always-on body networks.
Empfohlen
mTouch Capacitive Touch Panels
The PIC32MX270F256B-V/ML's CTMU and mTouch library support up to 13-channel capacitive touch scanning at 1 ns resolution, replacing dedicated touch ICs in appliance control panels, white-goods keypads, and entry-level industrial front panels. The 256 KB Flash stores Microchip's mTouch library plus application logic, while the 10-bit ADC captures the CTMU charge-time measurements. The hardware CTMU offloads timing-critical charge measurement from the CPU, leaving MIPS headroom for backlight PWM, LED driving, and communication tasks in the same firmware loop.
Empfohlen
Audio Codec Interface via I2S
The PIC32MX270F256B-V/ML's two I2S modules interface directly to audio DACs and ADCs in compact audio products such as Bluetooth speakers, USB audio streaming dongles, and intercom systems. The DMA-capable I2S controller and 64 KB SRAM allow buffer-based playback without CPU stalls, while PPS routes the I2S bit-clock and word-select lines to convenient package pins. Compared to small 8-bit MCUs running bit-banged audio, the M4K core's 83 DMIPS handles MP3 decoding, USB streaming, and audio mixing simultaneously.
Empfohlen
Industrial Sensor Hubs with USB Diagnostics
The PIC32MX270F256B-V/ML acts as an industrial sensor hub where 13 ADC channels aggregate thermocouple, pressure, and flow sensor inputs, while USB 2.0 FS exposes the aggregated data to a host for diagnostics. The on-chip temperature sensor and CTMU provide self-monitoring and high-resolution timing for pulse-counting flow meters. The -V 105C rating supports factory-floor enclosure mounting, and 256 KB Flash hosts the USB stack, MODBUS, and sensor-calibration firmware in a single image.
Empfohlen
Graphics Interfaces via PMP
The PIC32MX270F256B-V/ML's Parallel Master Port drives small parallel-TFT controllers for graphics-enabled embedded products such as thermostat displays, elevator indicators, and appliance UIs. The PMP provides 8-bit or 16-bit data, addressable mode for external parallel memory, and dedicated control signals for chip-select, read, and write strobes. The combination of PMP, two I2S, USB, and 256 KB Flash in a 28-QFN package reduces overall BOM by consolidating graphics, audio, and connectivity on a single MCU rather than pairing a graphics controller with a smaller MCU.
Empfohlen
Connected IoT Edge Nodes
The PIC32MX270F256B-V/ML serves as an edge node in IoT sensor and actuator networks where USB 2.0 FS provides local commissioning and diagnostics, I2C/SPI/UART connect sensors and radios, and the 50 MHz MIPS M4K runs edge-processing algorithms. The 64 KB SRAM supports buffer pooling for sensor-data queues, while the CTMU enables precise time-of-flight measurements for distance and flow IoT sensors. With PPS flexibility and 105C rating, the part is suitable for outdoor enclosures, smart-meter peripherals, and HVAC nodes that periodically stream data over USB or RS-485 to a host.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX270F256B-V/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX270F256B-I/ML | PIC32MX270F256BT-V/ML | PIC32MX270F128B-I/ML | PIC32MX230F256D-I/ML | PIC32MX170F256B-V/ML | PIC32MX250F256B-V/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) (ML) | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same | 28-QFN (6x6) (ML) - same |
| Flash | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS (-20%) |
| USB 2.0 FS | Yes (Device/Host/OTG) | Yes | Yes | Yes | No | Yes | Yes |
| Parallel Master Port | Yes | Yes | Yes | Yes | No | No | Yes |
| I2S Modules | 2 | 2 | 2 | 2 | 1 | 2 | 2 |
| CTMU (1 ns timing) | Yes | Yes | Yes | Yes | Yes | No | Yes |
| Temperature Grade | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) | -40C to +105C (V) | -40C to +105C (V) |
| AEC-Q100 | Yes (-V suffix) | No (-I suffix) | Yes (-V suffix) | No (-I suffix) | No (-I suffix) | Yes (-V suffix) | Yes (-V suffix) |
Wichtigste Unterscheidungsmerkmale
- Highest operating temperature grade within the 28-QFN PIC32MX270 family (vs. PIC32MX270F256B-I/ML)
- Includes Parallel Master Port for graphics interfaces (vs. PIC32MX170F256B-V/ML)
- Full USB 2.0 OTG peripheral with on-chip transceiver (vs. PIC32MX230F256D-I/ML)
- Same silicon as reel-packaged PIC32MX270F256BT-V/ML with pin-to-pin compatibility (vs. PIC32MX270F256BT-V/ML)
Designhinweise
The 28-QFN package exposes a thermal pad (pin 28) that must be soldered to a copper pour on the PCB. According to the family datasheet, the thermal pad carries both ground and heat; use a thermal via array (typically 4-9 vias) connecting to an inner ground plane. Without the pad soldered, junction temperature can exceed 115C at 50 MHz full load with 3.6V supply. A 1 square inch copper pour on the top layer is a minimum starting point.
Route the USB D+ and D- lines as a 90-ohm differential pair with length matching within 150 mil. Place the VBUS sense resistor and ESD protection diode within 5 mm of the connector. The crystal or oscillator traces must be short and guarded by a ground ring to minimize EMI. Decouple VDD with one 100 nF ceramic per pair of supply pins placed within 3 mm of each pin.
PPS inputs and outputs are mapped separately: an RPn pin can map to one peripheral input OR one peripheral output, not both simultaneously on the same RPn. Analog functions (ADC, comparators) are fixed and cannot be remapped. USB D+/D- are not remappable. According to the family datasheet, forgetting to lock the PPS configuration can allow runaway writes from runaway pointers - always set the IOLOCK bit after configuration.
Power the PIC32MX270 from a clean 3.3V LDO; the USB Full-Speed analog blocks are sensitive to supply noise. Use a ferrite bead or pi-filter on the USB analog supply pin (AVDD) if USB signal integrity is marginal. Place a 10 uF bulk capacitor and 100 nF decoupling on every VDD pin. The device draws approximately 25 mA at 50 MHz full load, so a 100 mA LDO provides ample margin.
Allocate USB endpoint buffers and any USB descriptor strings in non-cached Flash regions; 256 KB Flash is sufficient for a full USB stack plus application logic, but composite-device stacks can approach 200 KB. Reserve a DMA-coherent section of the 64 KB SRAM for endpoint buffers - typically 8 KB - to prevent descriptor corruption under USB interrupt load.
Compliance-Informationen
AEC-Q100 qualified due to the -V suffix. RoHS and REACH compliance per Microchip product page; lead-free and halogen-free per package materials declaration.
