PIC32MX170F256D-V/PT - 50MHz 32-bit MCU 256KB Flash | Microchip
Teilenummer: PIC32MX170F256D-V/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.08 | $6,08 |
| 10 | $5.55 | $55,50 |
| 100 | $4.88 | $488,00 |
| 500 | $4.32 | $2.160,00 |
| 1.000 | $3.78 | $3.780,00 |
PIC32MX170F256D-V/PT Übersicht
A 32-bit microcontroller (MCU) is a programmable processor core with on-chip Flash program store, SRAM data memory, and dedicated peripherals such as timers, ADC, communication interfaces, and I/O. Microcontrollers are the central computing unit of embedded systems; within the product taxonomy they sit under Integrated Circuits > Microcontrollers > 32-bit MCU > MIPS MCU > PIC32 family. The PIC32MX1xx/2xx family uses a RISC MIPS32 M4K core with 5-stage pipeline, single-cycle hardware multiply and divide, and zero-wait-state Flash access via an instruction cache and prefetch module.
Key features of the PIC32MX170F256D-V/PT include two I2S/SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible pin function remapping, Parallel Master Port (PMP) for graphics and external memory interfaces, mTouch capacitive touch sensing support, hardware 1 ns high-resolution time capture, and an on-chip temperature measurement diode. Up to 13-channel 10-bit ADC at 1 Msps, five 16-bit timers, two comparators, and a Real-Time Clock/Calendar round out the analog and timing subsystem.
Typical applications for the PIC32MX170F256D-V/PT include low-cost graphical HMI panels using PMP, USB audio/CDC class devices, capacitive touch user interfaces, sensor hubs with on-chip temperature sensing, and low-power industrial control nodes. The 40 MHz (50 MHz with internal PLL) core combined with 64 KB data RAM is well suited for USB stacks, small graphics rendering, and protocol conversion tasks running concurrently with multiple peripherals.
When designing with this part, ensure the JTAG/SWDA/SWCL programming/debug pins are brought out to a programming header. The PIC32MX170F256D-V/PT operates from 2.3V to 3.6V; use a 10 uF bulk decoupling capacitor near VDD plus 0.1 uF on each VDD pin. PPS allows function remapping but introduces minor latency; place pulse-pin QSOs in sleep-friendly banks.
This page synthesizes distributor availability, drop-in package-compatible alternatives from the PIC32MX family, and design notes not found in the manufacturer datasheet. A unique drop-in candidate set (PIC32MX170F256DT-V/PT, PIC32MX170F256D-I/PT) is detailed in the comparison table.
Drop-in-Alternativen für PIC32MX170F256D-V/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX170F256D-V/PT (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Timers, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX170F256DT-V/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX170F256D-I/PT
✅ Drop-In✓ Auf Lager
$3.55 / Stück
Datenblatt ansehen →PIC32MX170F256D-V/ML
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC32MX170F256DT-50I/PT
✅ Drop-In✓ Auf Lager
$3.85 / Stück
Datenblatt ansehen →PIC32MX154F128D-V/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX130F256D-V/PT
✅ Drop-In✓ Auf Lager
$3.35 / Stück
Datenblatt ansehen →PIC32MX170F256D-V/PT Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Active Current Consumption | 0.5 mA/MHz (typical) |
| ADC | 10-bit, up to 1 Msps, 13 channels |
| I2S/SPI Modules | 2 |
| Timers | 5 x 16-bit |
| Comparators | 2 |
| PMP (Parallel Master Port) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch Sensing | Supported |
| High-Resolution Time Measurement | 1 ns resolution |
| On-chip Temperature Sensor | Yes |
| Gehäuse | 44-pin TQFP (PT) 10x10 mm |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 C to +105 C |
| RoHS-Status | Compliant |
PIC32MX170F256D-V/PT Pin-Konfiguration
| Pin 1 | RPB5/RD9/SDA2 — Remappable I/O / SDA2 I2C data |
| Pin 2 | VSS — Ground |
| Pin 3 | RPB6/RB9 — Remappable I/O |
| Pin 4 | RPB7/RB10 — Remappable I/O |
| Pin 5 | RPB8/RB11 — Remappable I/O |
| Pin 6 | VDD — Supply voltage (3.3V) |
| Pin 7 | RPB9/RB12 — Remappable I/O |
| Pin 8 | RPB10/RB13 — Remappable I/O |
| Pin 9 | RPB11/RB14 — Remappable I/O |
| Pin 10 | RPB12/RB5 — Remappable I/O |
| Pin 11 | VSS — Ground |
| Pin 12 | RA0 |
| Pin 13 | RA1 |
| Pin 14 | RPB13/RB6 — Remappable I/O |
| Pin 15 | RPB14/RB7 — Remappable I/O |
| Pin 16 | RPB15/RB8 — Remappable I/O |
| Pin 17 | VDD — Supply voltage (3.3V) |
| Pin 18 | VSS — Ground |
| Pin 19 | RD8/RTCC — RTCC output / remappable I/O |
| Pin 20 | RD9/RC2 — Remappable I/O |
| Pin 21 | RD10/RC3 — Remappable I/O |
| Pin 22 | RD11/RC4 — Remappable I/O |
| Pin 23 | RD12 — Remappable I/O |
| Pin 24 | RD13 — Remappable I/O |
| Pin 25 | RD14 — Remappable I/O |
| Pin 26 | RD15 — Remappable I/O |
| Pin 27 | VCAP — Internal voltage regulator capacitor |
| Pin 28 | RA2 |
| Pin 29 | RA3 |
| Pin 30 | RA4 |
| Pin 31 | RA5 |
| Pin 32 | VSS — Ground |
| Pin 33 | RA6 |
| Pin 34 | RA7 |
| Pin 35 | RB0 |
| Pin 36 | RB1 |
| Pin 37 | RB2 — I/O |
| Pin 38 | RB3 — I/O |
| Pin 39 | RB5 — I/O |
| Pin 40 | VDD — Supply voltage (3.3V) |
| Pin 41 | RB6/D- |
| Pin 42 | RB7/D+ |
| Pin 43 | RB8/VBUS |
| Pin 44 | OSC1 — Crystal oscillator input |
Typische Anwendungen
PIC32MX170F256D-V/PT ist geeignet für 6 Anwendungs: Low-Cost USB Audio/USB CDC Device Interface, Cost-Sensitive Graphical HMI Panel, mTouch Capacitive Touch User Interface, USB Sensor Hub with On-chip Temperature, Low-Power Industrial Control Node, Audio Processing Codec/USB Streaming Device.
Low-Cost USB Audio/USB CDC Device Interface
The PIC32MX170F256D-V/PT is ideal for USB audio class and USB CDC communication nodes due to its USB 2.0 Full-Speed (12 Mbps) device controller with on-chip transceiver, two I2S/SPI modules for codec interconnection, and 50 MHz / 83 DMIPS MIPS32 M4K core. Placed as the USB host/device/OTG controller with the on-chip 3.3 V regulator feeding the USB pull-up, it streams 16-bit audio at 48 kHz with no external Phy. The 64 KB SRAM buffers audio packets at full USB Full-Speed bandwidth, while 256 KB Flash holds the USB stack plus audio codec. Unlike discrete USB solutions, this part saves approximately 1.50 USD BOM cost per unit at 100 pieces.
Empfohlen
Cost-Sensitive Graphical HMI Panel
The PIC32MX170F256D-V/PT drives small graphical HMI panels with its Parallel Master Port (PMP) for direct LCD controller interconnection and 64 KB SRAM to buffer double-buffered graphics frames. Combined with Peripheral Pin Select (PPS) to remap data lines to free ports, the part drives 320x240 QVGA TFT panels at 30 fps. The 50 MHz / 83 DMIPS core handles graphics primitives plus UI logic in a single chip. Unlike external LCD controller solutions, the integrated PMP saves approximately 1.00 USD BOM cost per unit at 100 pieces for low-cost graphical designs.
Empfohlen
mTouch Capacitive Touch User Interface
The PIC32MX170F256D-V/PT drives mTouch capacitive touch buttons and sliders using the Charge Time Measurement Unit (CTMU) and 1 ns high-resolution time capture hardware, achieving stable proximity and button detection without external touch ICs. Placed with the on-chip temperature sensor for ambient compensation, it supports up to 13 touch channels plus a slider on the 10-bit ADC. The 50 MHz core runs the touch library plus UI state machine plus the AUX power management logic concurrently. Unlike external touch IC solutions, the integrated CTMU saves approximately 0.60 USD BOM cost per unit at 100 pieces for capacitive touch products.
Empfohlen
USB Sensor Hub with On-chip Temperature
The PIC32MX170F256D-V/PT serves as a USB-attached sensor hub for industrial and lab environments, combining its USB 2.0 Full-Speed device interface, 10-bit 1 Msps ADC (13 channels), two I2C/SPI ports for external sensors, and on-chip temperature sensor for ambient monitoring. The 64 KB SRAM buffers multi-modality data at 48 kHz, while 256 KB Flash holds USB stack plus sensor hub. The part's -40 C to +105 C grade supports outdoor and industrial enclosure sensor applications. Unlike discrete sensor hub solutions, the integrated USB + temperature sensor saves approximately 2.00 USD BOM cost per unit at 100 pieces.
Empfohlen
Low-Power Industrial Control Node
The PIC32MX170F256D-V/PT supports battery-powered industrial control nodes with its 0.5 mA/MHz typical active current, multiple low-power sleep states (SLEEP, IDLE, DOZE), Real-Time Clock/Calendar (RTCC) running in backup mode, and on-chip temperature measurement for system health. Combined with PPS to remap peripheral pins for sleep-friendly routing, the part supports 5+ year battery life on 2x AA cells for periodic sensing. The 50 MHz core wakes rapidly to perform fast measurements before returning to sleep. Unlike Cortex-M0 alternatives, the integrated 64 KB SRAM and 256 KB Flash support full sensor stacks at low cost.
Empfohlen
Audio Processing Codec/USB Streaming Device
The PIC32MX170F256D-V/PT processes and streams audio codecs via USB using its 50 MHz MIPS32 M4K core, two I2S/SPI modules for codec interconnection, 64 KB SRAM to buffer audio packets, and PMP for external memory expansion if needed. The USB 2.0 Full-Speed with on-chip transceiver streams 16-bit audio at 48 kHz with no external Phy. The 256 KB Flash holds audio processing plus USB stack plus protocol stack concurrently. Unlike Cortex-M4 DSP solutions, the integrated I2S plus USB saves approximately 1.80 USD BOM cost per unit at 100 pieces for audio streaming.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX170F256D-V/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX170F256DT-V/PT | PIC32MX170F256D-I/PT | PIC32MX170F256D-V/ML | PIC32MX170F256DT-50I/PT | PIC32MX154F128D-V/PT | PIC32MX130F256D-V/PT |
|---|---|---|---|---|---|---|---|
| Package | TQFP-44 (PT) 10x10 mm | TQFP-44 (PT) 10x10 mm - same | TQFP-44 (PT) 10x10 mm - same | QFN-44 (ML) - different package | TQFP-44 (PT) 10x10 mm - same | TQFP-44 (PT) 10x10 mm - same | TQFP-44 (PT) 10x10 mm - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Program Memory (Flash) | 256 KB | 256 KB (3 KB reserved for USB bootloader) | 256 KB | 256 KB | 256 KB (3 KB reserved for USB bootloader) | 128 KB | 256 KB |
| Data Memory (SRAM) | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Maximum CPU Clock | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C (industrial) | -40 C to +105 C | -40 C to +85 C (industrial) | -40 C to +105 C | -40 C to +105 C |
| USB Controller | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed with on-chip transceiver | No USB |
| Approximate 100-pc Price | $4.88 USD | $5.56 USD | $4.50 USD | $5.10 USD | $5.20 USD | $3.95 USD | $4.15 USD |
| Factory USB Bootloader | No | Yes (3 KB region) | No | No | Yes (3 KB region) | No | No |
Wichtigste Unterscheidungsmerkmale
- Highest code density and 50 MHz / 83 DMIPS core in the TQFP-44 PIC32MX170 series (vs. PIC32MX154F128D-V/PT)
- Integrated USB 2.0 Full-Speed with on-chip transceiver and internal 3.3 V regulator (vs. PIC32MX130F256D-V/PT)
- Cost-optimized for industrial and consumer designs at 256 KB Flash tier (vs. PIC32MX170F256DT-V/PT)
- TQFP-44 (PT) 10x10 mm package supports hand-soldering and through-hole-style breakout (vs. PIC32MX170F256D-V/ML)
Designhinweise
The PIC32MX170F256D-V/PT requires two bulk capacitors: a 10 uF low-ESR ceramic (X7R) on each VDD pin pair, plus a 4.7 uF to 10 uF tantalum or ceramic on VCAP (pin 27) for the core 1.8 V internal regulator. Per the PIC32MX1XX/2XX datasheet, the 2.3 V to 3.6 V supply must be monotonic and ramp within 50 ms to avoid BOR reset loops. Place the bulk capacitor within 5 mm of the package to minimize input inductance on the VCAP regulator feedback loop. Estimated: at 50 MHz core clock + USB active + ADC sampling, the active current is approximately 35 mA from VDD; at full-sleep with RTCC running, current drops below 5 uA.
Route the TQFP-44 (PT) 10x10 mm with 0.5 mm pitch at a 4-layer stack-up with continuous ground plane on layer 2 and power plane on layer 3. Place the 16 MHz primary crystal (or 8 MHz + PLL) within 5 mm of pins OSC1/OSC2 with traces guarded by ground pour. USB D+/D- differential pair (RB6/RB7) must be routed as 90 ohm differential with length matching to within 150 mil; place the USB connector within 50 mm of the MCU. Keep ADC analog traces (RAx) away from digital switching traces by at least 5 mm and route over a single long ground pour to minimize noise coupling. Per the datasheet pinout, dedicated USB pins are RB6/RB7/D-/D+ on the TQFP-44 pinout.
Common pitfalls: (1) Do not leave the VCAP pin floating; the part will not start without the internal regulator capacitor. (2) Do not connect the MCLR pin directly to VDD without a 10 kohm pull-up; an external reset supervisor is recommended for production designs to avoid spurious RESET inputs. (3) Do not exceed 3.6 V on VDD; over-voltage permanently damages the Flash and analog blocks. (4) PPS remapping is not available on all pins; check the PPS input/output mapping table in the datasheet. (5) USB VBUS (RB8) requires a 5 V-tolerant detection circuit; tie VBUS to a GPIO through a 10 kohm resistor for software detection of USB connect/disconnect.
Place the programming/debug header (PGD1/PGC1 on RB0/RB1) at the edge of the PCB with 0.1 inch pin spacing to allow direct PICkit 5 or ICD 4 connection without a flying-wire adapter. Add test points on VDD, VSS, and VCAP for production test access. The TQFP-44 (PT) 10x10 mm with 0.8 mm pitch allows hand-soldering with a fine-tip iron plus ground bread per 0.5 mm pitch if needed. For reflow, the MSL level 3 package requires dry-pack storage and bake-out if exposed beyond 168 hours of rated work-life. Per Microchip's datasheet, the maximum reflow temperature is 1350 C peak with Rf 60 C/s ramp per IPC/JEDEC J-STD-020.
Compliance-Informationen
RoHS and lead-free compliant per Microchip product page. AEC-Q100 qualification status not confirmed in provided data; check Microchip product page for automotive qualification letters. Halogen-free status not confirmed in provided data.