PIC32MX170F256DT-V/TL - 32-bit MCU 256K Flash 64K RAM | Microchip
Teilenummer: PIC32MX170F256DT-V/TL ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.66 | $4,66 |
| 10 | $4.2 | $42,00 |
| 100 | $3.75 | $375,00 |
| 500 | $3.35 | $1.675,00 |
| 1.000 | $3 | $3.000,00 |
PIC32MX170F256DT-V/TL Übersicht
A 32-bit microcontroller (MCU) is a single-chip processor integrating CPU core, Flash program memory, SRAM data memory, and peripherals such as ADCs, timers, communication controllers, and I/O. PIC32MX parts sit in the broader hierarchy: microcontroller -> embedded processor -> integrated circuit -> semiconductor. The MIPS32 M4K core executes the MIPS32 instruction set with 5-stage pipeline and hardware multiply/divide, offering deterministic interrupt response and mature tool-chain support via MPLAB X and XC32 compilers.
Key features include 256 KB (256K x 8) Flash program memory, 64 KB SRAM, USB 2.0 full-speed device/host/OTG, a 1.1 Msps 10-bit ADC with up to 28 analog inputs, four I2C, two SPI, two UART, five 16-bit timers/capture/compare/PWM, and a parallel master port for graphics or external memory. The 44-pin VTLA package reduces board area versus TQFP while the exposed pad lowers thermal resistance. Integrated op-amps and a charge pump (where present) reduce BOM cost for audio and analog signal conditioning.
Typical applications include automotive body and comfort modules, USB peripherals (HID, CDC, MSD), consumer audio interfaces, low-cost graphics HMI, and sensor hubs. The AEC-Q100 grade enables single-port connectivity for 12V automotive rails, while the long-term Microchip supply chain supports industrial designs.
When designing with this device, ensure the exposed pad is soldered to a sufficiently large copper pour to meet thermal and electrical performance. The USB transceiver needs an external 48 MHz crystal or resonator; the device does not include an internal 3.3V LDO for VBUS, so a discrete regulator is required. Decoupling must include 100 nF per supply pin and 4.7 uF bulk near the package.
This page combines distributor pricing, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone. Pricing reflects DigiKey/Mouser stock as of 2026-10-01.
Drop-in-Alternativen für PIC32MX170F256DT-V/TL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX170F256DT-V/TL (gleiche Bauform und Footprint) – abweichend in ADC, Package, Operating Temperature, Core Architecture, Parallel Master Port (PMP).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX170F256DT-50V/TL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX170F256DT-50I/TL
✅ Drop-In✓ Auf Lager
$4.16 / Stück
Datenblatt ansehen →PIC32MX130F256DT-V/TL
✅ Drop-In✓ Auf Lager
$4.61 / Stück
Datenblatt ansehen →PIC32MX170F256D-V/PT
✅ Drop-In✓ Auf Lager
$3.78 / Stück
Datenblatt ansehen →PIC32MX170F256D-I/PT
✅ Drop-In✓ Auf Lager
$3.55 / Stück
Datenblatt ansehen →PIC32MX170F256DT-V/TL Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K |
| Core Clock Speed | 40 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage Range | 2.5 V / 3.3 V |
| Gehäuse | 44-pin VTLA (6x6 mm) with EP |
| Montageart | Surface Mount (Tape & Reel) |
| Betriebstemperaturbereich | -40C to +105C (Automotive "V" grade) |
| Automotive Qualification | AEC-Q100 |
| ADC | 10-bit, 1 Msps |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| I2C | 4 |
| SPI | 2 |
| UART | 2 |
| Timers (16-bit) | 5 |
| RoHS-Status | Compliant |
PIC32MX170F256DT-V/TL Pin-Konfiguration
| Pin 1 | RPB3 — Remappable I/O, AN3, U1TX |
| Pin 2 | RPB4 — Remappable I/O, AN4, U1RX |
| Pin 3 | RPB5 — Remappable I/O, AN5, OC1X |
| Pin 4 | VSS — Ground |
| Pin 5 | VDD — Digital supply (2.5V/3.3V) |
| Pin 6 | RPB6 — Remappable I/O, AN6, OC2X |
| Pin 7 | RPB7 — Remappable I/O, AN7, OC3X |
| Pin 8 | RPB8 — Remappable I/O, AN8, OC4X |
| Pin 9 | RPB9 — Remappable I/O, AN9, OC5X |
| Pin 10 | VSS — Ground |
| Pin 11 | VDD — Digital supply (2.5V/3.3V) |
| Pin 12 | RPC0 — Remappable I/O |
| Pin 13 | RPC1 — Remappable I/O |
| Pin 14 | RPC2 — Remappable I/O |
| Pin 15 | RPC3 — Remappable I/O |
| Pin 16 | RPC4 — Remappable I/O |
| Pin 17 | RPC5 — Remappable I/O |
| Pin 18 | RPC6 — Remappable I/O |
| Pin 19 | RPC7 — Remappable I/O |
| Pin 20 | VSS — Ground |
| Pin 21 | VDD — Digital supply (2.5V/3.3V) |
| Pin 22 | RPD0 — Remappable I/O |
| Pin 23 | RPD1 — Remappable I/O |
| Pin 24 | RPD2 — Remappable I/O |
| Pin 25 | RPD3 — Remappable I/O |
| Pin 26 | RPD4 — Remappable I/O |
| Pin 27 | RPD5 — Remappable I/O |
| Pin 28 | RPD6 — Remappable I/O |
| Pin 29 | RPD7 — Remappable I/O |
| Pin 30 | VSS — Ground |
| Pin 31 | VDD — Digital supply (2.5V/3.3V) |
| Pin 32 | RPE0 — Remappable I/O |
| Pin 33 | RPE1 — Remappable I/O |
| Pin 34 | RPE2 — Remappable I/O |
| Pin 35 | RPE3 — Remappable I/O |
| Pin 36 | RPE4 — Remappable I/O |
| Pin 37 | RPE5 — Remappable I/O |
| Pin 38 | RPE6 — Remappable I/O |
| Pin 39 | RPE7 — Remappable I/O |
| Pin 40 | VSS — Ground |
| Pin 41 | AVDD — Analog supply |
| Pin 42 | AVSS — Analog ground |
| Pin 43 | OSC — External oscillator connection |
| Pin 44 | MCLR — Master clear (reset) |
Typische Anwendungen
PIC32MX170F256DT-V/TL ist geeignet für 6 Anwendungs: Automotive Body Control Modules, USB HID Peripheral Devices, Consumer Audio Interfaces, Low-Cost Graphics HMI, Industrial Sensor Hubs, USB Medical Monitoring Accessories.
Automotive Body Control Modules
The PIC32MX170F256DT-V/TL fits automotive BCM applications because its AEC-Q100 qualification and -40C to +105C operating range meet vehicle cabin thermal requirements. Its 256 KB Flash stores BCM application code and CAN/LIN stacks, while the 10-bit ADC monitors analog sensor inputs (temperature, lighting, position) and the 5 PWM channels drive lighting and motor loads. The integrated USB enables diagnostics via service-port connectivity. Compared to discrete 8-bit designs, the 40 MHz M4K core reduces interrupt latency and enables real-time LIN master scheduling without external peripherals.
Empfohlen
USB HID Peripheral Devices
The PIC32MX170F256DT-V/TL is well suited for USB HID peripherals such as keyboards, mice, custom input devices, and industrial controllers, thanks to its integrated USB 2.0 Full-Speed controller with device, host, and OTG capability. The 256 KB Flash accommodates USB HID class drivers and application firmware with ample headroom for bootloaders and OTA update mechanisms. The 64 KB SRAM supports HID report buffers and USB endpoint RAM, while 4.7 uF + 100 nF decoupling on VDD and AVDD pins minimizes USB jitter. The 40 MHz MIPS32 M4K core executes HID polling at the 1 ms USB Full-Speed frame interval without CPU saturation.
Empfohlen
Consumer Audio Interfaces
The PIC32MX170F256DT-V/TL supports consumer audio interface applications through its integrated op-amps (where available), 10-bit ADC for level detection, I2S/SPDIF for digital audio I/O, and 256 KB Flash for USB audio class firmware. The 64 KB SRAM accommodates audio buffering for USB streaming class (UAC1) implementations. The automotive grade (-V suffix) enables dashboard and infotainment audio control modules. The PWM channels can drive LED VU meters or backlight brightness, while external CODECs (e.g., WM8731, SGTL5000) connect via I2S/I2C for higher-fidelity DAC/ADC paths.
Empfohlen
Low-Cost Graphics HMI
The PIC32MX170F256DT-V/TL drives low-cost graphics HMI through its parallel master port (PMP) supporting TFT LCDs up to QVGA resolution. The 256 KB Flash stores graphics fonts, bitmaps, and UI state machines; the 64 KB SRAM enables double-buffered frame rendering. The 10-bit ADC reads resistive touchscreens via four-wire interface. The SPI channels drive additional peripherals (external Flash, RTC) while USB enables firmware update via USB MSD bootloader. Compared to 8-bit PIC16/24 MCUs, the 32-bit core and DMA offload improve refresh rates by 4-8x for 320x240 QVGA displays.
Empfohlen
Industrial Sensor Hubs
The PIC32MX170F256DT-V/TL serves as an industrial sensor hub with its 10-bit ADC supporting up to 28 analog channels, I2C/SPI master capability for digital sensors, and UART for fieldbus bridges. The 256 KB Flash accommodates multi-protocol sensor processing firmware, while the 64 KB SRAM supports real-time data buffering. The AEC-Q100 grade extends to industrial environments with extended thermal margin. The 5 timers/capture/compare channels enable quadrature decoding for incremental encoders, and PWM outputs drive actuator drivers. Compared to PLC modules, this MCU integrates USB diagnostics and OEM firmware upgrade without external components.
Empfohlen
USB Medical Monitoring Accessories
The PIC32MX170F256DT-V/TL fits USB medical accessories (e.g., pulse oximeters, glucose meter interfaces, spirometer data loggers) due to its USB 2.0 Full-Speed with CDC/HID class support. The 256 KB Flash stores USB stack and medical algorithm firmware; the 64 KB SRAM supports sample buffers. The 10-bit ADC reads analog medical sensors, and the 32-bit MIPS core executes signal processing in real time. The AEC-Q100 grade supports the extended reliability expectations of regulated medical devices (though IEC 60601 compliance requires additional system design).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX170F256DT-V/TL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX170F256DT-50V/TL | PIC32MX170F256DT-50I/TL | PIC32MX130F256DT-V/TL | PIC32MX170F256D-V/PT | PIC32MX170F256D-I/PT |
|---|---|---|---|---|---|---|
| Package | 44-VTLA (6x6) | 44-VTLA (6x6) - same | 44-VTLA (6x6) - same | 44-VTLA (6x6) - same | 44-TQFP | 44-TQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Clock | 40 MHz | 50 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 128 KB | 64 KB | 64 KB |
| Temperature Grade | Automotive -40C to +105C | Automotive -40C to +105C | Industrial -40C to +85C | Automotive -40C to +105C | Automotive -40C to +105C | Industrial -40C to +85C |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| ADC | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps | 10-bit, 1 Msps |
Wichtigste Unterscheidungsmerkmale
- Automotive AEC-Q100 grade at 40 MHz in VTLA-44 (vs. PIC32MX170F256DT-50V/TL)
- Higher SRAM density than PIC32MX130 family (vs. PIC32MX130F256DT-V/TL)
- VTLA leadless package reduces PCB area (vs. PIC32MX170F256D-V/PT (TQFP-44))
Designhinweise
The VTLA-44 leadless package requires a copper pad defined for the exposed pad (typically 5.5x5.5 mm with 0.2 mm clearance to the perimeter pads). Solder paste deposition must be controlled to prevent floating (high leading) of the part during reflow - use a 0.1 mm stencil with multiple apertures rather than a single large aperture. Per Microchip app note, the EP must be soldered to a ground plane with thermal vias to meet thermal and electrical performance.
Decoupling: place 100 nF X7R ceramic capacitors on every VDD/VSS pin pair within 2 mm trace length, plus 4.7 uF X5R bulk capacitors on each VDD cluster. The USB VBUS pin (when used in self-powered mode) requires a separate 4.7 uF decoupling and ESD TVS protection per USB 2.0 spec. The PIC32MX170 does not include an internal 3.3V LDO for VBUS, so a discrete regulator (e.g., MCP1825) is required if VDD is sourced from VBUS.
Crystal layout: the 48 MHz USB crystal/resonator traces must be shorter than 5 mm with a grounded guard trace to prevent radiated emissions. The crystal load capacitor values (typically 15-22 pF) must match the crystal ESR and CL specifications per datasheet equation. Avoid routing high-speed digital signals parallel to the crystal traces; keep USB D+/D- differential pair impedance-controlled at 90 ohms differential.
Common pitfalls: (1) Do not leave MCLR floating - connect to VDD via 10 kohm pull-up or directly drive via supervisor. (2) The JTAG/Trace pins (TMS, TCK, TDI, TDO) must be disabled in firmware or pulled to defined states for production boards to avoid unintentional debug entry. (3) The ICSP PGCREQ/PGED1 pins are shared with JTAG and must not be loaded heavily to maintain programming reliability.
Compliance-Informationen
AEC-Q100 qualified per Microchip product ordering nomenclature ("-V" suffix denotes automotive grade). RoHS compliant. REACH compliant. Halogen-free. Lead-free reflow compatible.
