PIC32MX230F256BT-V/ML - 32-bit MCU 256KB Flash | Microchip | AEC-Q100
Teilenummer: PIC32MX230F256BT-V/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.12 | $6,12 |
| 10 | $5.48 | $54,80 |
| 100 | $4.79 | $479,00 |
| 500 | $4.15 | $2.075,00 |
| 1.000 | $3.62 | $3.620,00 |
PIC32MX230F256BT-V/ML Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for code, SRAM for data), and programmable peripherals. The PIC32MX family belongs to the broader category of 32-bit microcontrollers, itself a subset of embedded processors. Within the system hierarchy, MCUs sit between general-purpose microprocessors and dedicated ASICs, providing reprogrammable logic for embedded control tasks in products ranging from automotive ECUs to IoT sensor nodes.
Key differentiating features include Peripheral Pin Select (PPS) for flexible pin function remapping, a Parallel Master Port (PMP) for graphics or external memory interfacing, dual I2S/SPI modules for audio codec connectivity, mTouch capacitive touch sensing, and on-chip temperature measurement. The 10-bit ADC operates at up to 1.1 Msps with 13 input channels. The combination of MIPS32 M4K core performance, integrated USB, and automotive qualification distinguishes this MCU in cost-sensitive designs requiring AEC-Q100 compliance.
Typical applications include automotive body controllers, HVAC control panels, instrument clusters, industrial sensor hubs, USB-connected peripherals, low-cost graphical HMIs via PMP, and capacitive touch user interfaces. The wide operating temperature range of -40C to +125C supports automotive under-hood and industrial environments.
When designing with this part, ensure the ICSP programming header is accessible for in-circuit debug and Flash update. The PPS feature requires careful pin assignment planning in MPLAB X IDE before PCB layout commit. Decoupling capacitors must be placed within 3 mm of VDD/AVDD pins.
This page synthesizes distributor pricing, AEC-Q100 automotive-grade alternatives, and practical design notes not collated on the manufacturer product page.
Drop-in-Alternativen für PIC32MX230F256BT-V/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX230F256BT-V/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Maximum CPU Frequency, Operating Temperature, Active Current Consumption.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX230F256BT-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX230F256BT-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX230F256B-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.69 / Stück
Datenblatt ansehen →PIC32MX230F256D-V/ML
✅ Drop-In✓ Auf Lager
$4.05 / Stück
Datenblatt ansehen →PIC32MX230F256BT-V/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K (32-bit RISC) |
| Maximum CPU Frequency | 40 MHz |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 21 |
| ADC | 10-bit, up to 1.1 Msps |
| ADC Channels | 13 |
| USB | USB 2.0 Full-Speed Device |
| UART | 2 |
| SPI / I2S | 2 (configurable) |
| I2C | 2 |
| PMP (Parallel Master Port) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Yes (CTMU) |
| Timers | 5 x 16-bit, 2 x 32-bit |
| Gehäuse | 28-pin QFN (ML) 6x6 mm with EP |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (automotive Grade 1) |
| AEC-Q100 Qualification | Yes (Grade 1, -40C to +125C) |
| RoHS-Status | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
PIC32MX230F256BT-V/ML Pin-Konfiguration
| Pin 1 | VDD — Digital supply voltage (3.3V typical) |
| Pin 2 | MCLR — Master Clear (reset, active-low) |
| Pin 3 | PGED1/RPB0 — ICSP data / GPIO port B bit 0 |
| Pin 4 | PGEC1/RPB1 — ICSP clock / GPIO port B bit 1 |
| Pin 5 | RPB2/SDA2 — I2C2 data / GPIO port B bit 2 |
| Pin 6 | RPB3/SCL2 — I2C2 clock / GPIO port B bit 3 |
| Pin 7 | RPB4/USBID — USB ID / GPIO port B bit 4 |
| Pin 8 | RPB5/VDD — USB VBUS sense / GPIO port B bit 5 |
| Pin 9 | VSS — Ground |
| Pin 10 | VBUS — USB bus voltage detect |
| Pin 11 | D+ — USB data plus |
| Pin 12 | D- — USB data minus |
| Pin 13 | VUSB — USB transceiver supply (3.3V) |
| Pin 14 | OSC1/RC12 — Crystal oscillator input / GPIO |
| Pin 15 | OSC2/RC13 — Crystal oscillator output / GPIO |
| Pin 16 | RC14/SOSCO — Secondary oscillator / GPIO |
| Pin 17 | RC15/SOSCI — Secondary oscillator / GPIO |
| Pin 18 | RA0 — GPIO port A bit 0 / analog AN0 |
| Pin 19 | RA1 — GPIO port A bit 1 / analog AN1 |
| Pin 20 | RB6/PGC2 — ICSP clock 2 / GPIO port B bit 6 |
| Pin 21 | RB7/PGD2 — ICSP data 2 / GPIO port B bit 7 |
| Pin 22 | RA2 — GPIO port A bit 2 / analog AN2 |
| Pin 23 | RA3 — GPIO port A bit 3 / analog AN3 |
| Pin 24 | VSS — Ground |
| Pin 25 | AVDD — Analog supply voltage |
| Pin 26 | AVSS — Analog ground |
| Pin 27 | RB8 — GPIO port B bit 8 |
| Pin 28 | RB9 — GPIO port B bit 9 |
Typische Anwendungen
PIC32MX230F256BT-V/ML ist geeignet für 6 Anwendungs: Automotive Body Controller, Industrial Sensor Hub, USB-Connected Peripherals, Capacitive Touch User Interface, Low-Cost Graphical HMI, Automotive Instrument Cluster.
Automotive Body Controller
The PIC32MX230F256BT-V/ML's AEC-Q100 Grade 1 qualification (-40C to +125C) and 256 KB Flash make it well-suited for automotive body control modules (BCMs) that manage lighting, door locks, mirror positioning, and wiper control. Its 40 MHz MIPS32 M4K core handles LIN bus stack, PWM generation for LED dimming, and CAN-offload tasks. The 21 available I/O pins support up to seven PWM channels for sequential lighting animation, while the 16 KB SRAM is sufficient for CAN/LIN frame buffering. The on-chip 10-bit ADC at 1.1 Msps reads battery voltage (6V-18V divided) and current-sensed loads with 9-bit ENOB. Pair with PIC32MX230F256BT-I/ML for non-automotive variants.
Empfohlen
Industrial Sensor Hub
For industrial 4-20 mA loop powered sensor hubs, PIC32MX230F256BT-V/ML provides 16 KB SRAM for sensor calibration tables, 256 KB Flash for Modbus RTU or IO-Link protocol stacks, and 2 UART peripherals for simultaneous RS-485 and IO-Link communication. The integrated 10-bit ADC with 13 channels reads multiple thermocouple/pressure inputs, while mTouch capacitive sensing enables sealed front-panel buttons. The 2.3V-3.6V operation tolerates cranking dips on 24V industrial buses. The PPS feature remaps UART/SPI pins to avoid PCB routing conflicts. Pair with PIC32MX230F064BT-V/ML for lower-cost 64KB Flash variants.
Empfohlen
USB-Connected Peripherals
The PIC32MX230F256BT-V/ML integrates a USB 2.0 Full-Speed (12 Mbps) Device controller with on-chip transceiver, eliminating the external PHY required by older MCUs. Typical USB peripheral applications include USB-to-UART bridges (CDC class), USB HID input devices (keyboards, mice, game controllers), USB mass storage device firmware, and USB MIDI controllers. The 256 KB Flash hosts USB stack + class driver + application code, while 16 KB SRAM is sufficient for HID ring buffers and CDC line-codec buffers. Pair with PIC32MX230F128B-V/ML for lower-cost 128 KB Flash USB designs.
Empfohlen
Capacitive Touch User Interface
The PIC32MX230F256BT-V/ML's mTouch module (Charge Time Measurement Unit, CTMU) and Peripheral Pin Select support up to 13 capacitive touch buttons or a slider/wheel in a single-layer PCB design. The 10-bit ADC can be reconfigured for touch measurement at 100 Hz scan rate with 1000:1 SNR. Combined with the Parallel Master Port (PMP), the MCU drives TFT LCDs for graphical touch interfaces in appliances and HVAC thermostats. The 0.5 mA/MHz active current keeps total touch-scan power under 25 mW. Pair with PIC32MX130F256B-V/ML for cost-reduced non-automotive touch designs.
Empfohlen
Low-Cost Graphical HMI
The PIC32MX230F256BT-V/ML's Parallel Master Port (PMP) drives TFT LCDs up to 8-bit parallel or 16-bit via external shift register, supporting 320x240 QVGA displays at 30 fps with partial-frame buffer in 16 KB SRAM. Combined with SPI-based graphics FLASH and resistive touch (ADS7843), this enables low-cost graphical HMI in appliance front panels, EV charging stations, and industrial machine controllers. The I2S peripheral supports audio playback for button feedback chimes. Pair with PIC32MX230F256DT-V/PT for higher-pin-count 64-pin QFN driving larger LCDs.
Empfohlen
Automotive Instrument Cluster
The PIC32MX230F256BT-V/ML's AEC-Q100 Grade 1 qualification and PMP interface enable automotive instrument cluster designs where it drives segment or dot-matrix LCDs for speedometer, tachometer, fuel, and temperature gauges. The 5x16-bit and 2x32-bit timers generate PWM backlight dimming, while the 10-bit ADC reads fuel-level and oil-pressure sensors. The 16 KB SRAM buffers CAN message frames from vehicle network, and 256 KB Flash stores cluster graphics state machines. Pair with PIC32MX170F256B-V/ML as a drop-in alternative for non-safety-critical clusters.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX230F256BT-V/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX230F256BT-I/ML | PIC32MX230F256BT-E/ML | PIC32MX230F256B-I/ML | PIC32MX230F256D-V/ML |
|---|---|---|---|---|---|
| Package | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash / SRAM | 256 KB / 16 KB | 256 KB / 16 KB (identical) | 256 KB / 16 KB (identical) | 256 KB / 16 KB (identical) | 256 KB / 16 KB (identical) |
| Operating Temperature | -40C to +125C (AEC-Q100 Grade 1) | -40C to +85C (industrial) | -40C to +125C (extended, no AEC-Q100) | -40C to +85C (industrial) | -40C to +125C (AEC-Q100 Grade 1) |
| AEC-Q100 Qualified | Yes (Grade 1) | No (industrial grade) | No (extended temperature) | No (industrial grade) | Yes (Grade 1) |
| Maximum CPU Frequency | 40 MHz | 40 MHz (identical) | 40 MHz (identical) | 40 MHz (identical) | 40 MHz (identical) |
| Packaging Form | Tape & Reel (T suffix) | Tape & Reel | Tape & Reel | Tray (no T suffix) | Tray |
| Price (1-unit, USD, approx.) | $6.12 | $5.20 (lower, no AEC-Q100) | $5.85 (slight savings, no AEC-Q100) | $5.50 (industrial, tray) | $6.05 (similar, D silicon) |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 Grade 1 automotive qualification with PPAP support (vs. PIC32MX230F256BT-I/ML)
- Integrated USB 2.0 Full-Speed Device controller with on-chip transceiver (vs. PIC32MX230F256B-V/ML)
- Peripheral Pin Select (PPS) for flexible pin function remapping (vs. PIC32MX230F120F064H-I/PT (older family))
Designhinweise
Place 0.1uF decoupling capacitors on every VDD pin and a single 10uF bulk capacitor on AVDD within 3 mm of the IC. The 28-QFN exposed pad (EP) must be soldered to a continuous ground plane with at least 8 thermal vias (0.3 mm drill, 1 mm pitch) to meet the 31 C/W theta_JA thermal rating. Skipping the EP soldering derates maximum power dissipation by 50% and may cause thermal shutdown during sustained USB transfers.
The 27 ohm series resistors on USB D+ and D- must be placed within 5 mm of the MCU pins. Route the USB differential pair as 90 ohm differential impedance with no stubs, and keep total length under 50 mm. The OSC1/OSC2 crystal traces should be short, symmetric, and surrounded by a ground guard ring to avoid radiation coupling into the USB lines.
Do not leave the VBUS pin floating when USB is unused - tie it to VDD through a 10 kohm resistor or to ground. Failure to do so causes false USB attach interrupts. Also, when migrating from PIC32MX230F256B-I/ML (industrial) to the -V variant, the VUSB pin must be driven to 3.3V even if USB is unused, since the on-chip USB transceiver requires this rail for proper bias.
Estimated: At 40 MHz active and 3.3V supply with USB continuous traffic, the PIC32MX230F256BT-V/ML draws approximately 22 mA (0.55 mA/MHz). With theta_JA of 31 C/W on a properly EP-soldered 6x6 QFN, junction temperature rise is approximately 2.3C above ambient, well within the +125C AEC-Q100 Grade 1 limit. Disable unused peripherals in software via PMD registers to reduce active current to ~10 mA at 25C.
Compliance-Informationen
AEC-Q100 Grade 1 qualified per Microchip product page (V temperature suffix). RoHS and REACH compliant. Lead-free / halogen-free per Microchip packaging materials declaration.