PIC32MX254F128D-I/ML - 32-bit MCU, 128KB Flash, USB, 44-QFN | Microchip
Teilenummer: PIC32MX254F128D-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.69 | $36,90 |
| 100 | $3.3 | $330,00 |
| 500 | $2.95 | $1.475,00 |
| 1.000 | $2.65 | $2.650,00 |
PIC32MX254F128D-I/ML Übersicht
A 32-bit microcontroller (MCU) is an embedded processor that executes instructions over a 32-bit data path, allowing higher throughput, larger address space, and richer peripherals than 8- or 16-bit MCUs. PIC32 belongs to Microchip's MIPS-based 32-bit family and sits in the broader taxonomy: MCU -> 32-bit MCU -> MIPS M4K core -> PIC32 -> PIC32MX25x sub-family -> power management IC hierarchy. XLP variants add ultra-low sleep/deep-sleep currents, useful for battery-powered and energy-harvesting designs.
Key features include 128 KB program Flash, 32 KB SRAM, four DMA channels, two I²C, two SPI, two UART, PMP/EPMP graphics interface, 10-bit ADC up to 1 Msps, three analog comparators, CTMU for capacitive touch, full-speed USB 2.0 device/host/OTG, RTCC with calendar, and 5-bit/5-channel plus PWM. It integrates USB, multiple serial com, and system-level analog in one die, reducing external BOM.
Technically the part uses the MIPS32 M4K core with single-cycle hardware multiply, MPU for code protection, and prefetch cache to mask Flash latency. The 44-QFN package exposes 34 digital I/O, multiple 5V-tolerant pins, and a thermal pad for improved power dissipation. The CTMU enables touch sensing, while EPMP drives parallel graphics LCDs.
Typical applications include USB peripherals, audio playback with USB streaming, low-power graphics HMI, capacitive touch user interfaces, real-time-clock-based data loggers, and battery-powered industrial sensors. The QFN package suits compact, reflow-soldered consumer/industrial modules.
A key design consideration: route the USB DP/DM traces as a 90-ohm differential pair with a clean ground return and place ferrite beads on VBUS to pass USB-IF compliance. The CTMU requires calibrated software timing; consult Microchip TB3018 for touch firmware patterns.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes beyond the manufacturer datasheet to accelerate your bring-up.
Drop-in-Alternativen für PIC32MX254F128D-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX254F128D-I/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, USB, Timers, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX250F128D-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX154F128D-I/ML
✅ Drop-In✓ Auf Lager
$3.92 / Stück
Datenblatt ansehen →PIC32MX230F128D-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX274F128D-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX170F256D-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.45 / Stück
Datenblatt ansehen →PIC32MX450F128D-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX254F128D-I/ML Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 72 MHz |
| Program Flash | 128 KB (128K x 8) |
| SRAM | 32 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V (3.3 V typical) |
| Betriebstemperatur | -40 °C to +85 °C (industrial, 'I' suffix) |
| Gehäuse | 44-pin QFN (8x8 mm) with exposed thermal pad |
| Digital I/O Pins | 34 (5V-tolerant on select pins) |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| Analog Comparators | 3 |
| CTMU (Capacitive Touch) | Yes |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| UART / SPI / I²C | 2 / 2 / 2 |
| DMA Channels | 4 |
| Timers / PWM | 5 16-bit timers / 5 PWM outputs |
| RTCC (Real-Time Clock Calendar) | Yes |
| Parallel Master Port (EPMP) | Yes |
| Montageart | Surface Mount |
| MSL-Level | 1 |
| RoHS-Status | Compliant |
| Family | PIC32MX25x (XLP) |
PIC32MX254F128D-I/ML Pin-Konfiguration
| Pin 1 | RPB0 — Port B bit 0 / PGED1 (programming) |
| Pin 2 | RPB1 — Port B bit 1 / PGEC1 (programming) |
| Pin 3 | RPB2 — Port B bit 2 |
| Pin 3 | RPB3 — Port B bit 3 |
| Pin 5 | VDD — Supply voltage input 2.3V-3.6V |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RPB4 — Port B bit 4 |
| Pin 8 | RPB5 — Port B bit 5 |
| Pin 9 | RPC6 — Port C bit 6 |
| Pin 10 | RPC7 — Port C bit 7 |
| Pin 11 | RPC8 — Port C bit 8 |
| Pin 12 | RPC9 — Port C bit 9 |
| Pin 13 | VSS — Ground |
| Pin 14 | VDD — Supply voltage |
| Pin 15 | RPB6 — Port B bit 6 |
| Pin 16 | RPB7 — Port B bit 7 |
| Pin 17 | RPA0 — Port A bit 0 |
| Pin 18 | RPA1 — Port A bit 1 |
| Pin 19 | VSS — Ground |
| Pin 20 | VDD — Supply voltage |
| Pin 21 | RPA2 — Port A bit 2 |
| Pin 22 | RPA3 — Port A bit 3 |
| Pin 23 | RPA4 — Port A bit 4 |
| Pin 24 | RPA5 — Port A bit 5 |
| Pin 25 | RPA6 — Port A bit 6 |
| Pin 26 | VSS — Ground |
| Pin 27 | AVDD — Analog supply voltage |
| Pin 28 | AVSS — Analog ground |
| Pin 29 | RPD10 — Port D bit 10 |
| Pin 30 | RPD11 — Port D bit 11 |
| Pin 31 | D+ — USB D+ data |
| Pin 32 | D- — USB D- data |
| Pin 33 | VUSB3V3 — USB 3.3V LDO output |
| Pin 34 | RPC0 — Port C bit 0 |
| Pin 35 | RPC1 — Port C bit 1 |
| Pin 36 | RPC2 — Port C bit 2 |
| Pin 37 | RPC3 — Port C bit 3 |
| Pin 38 | RPC4 — Port C bit 4 |
| Pin 39 | VDD — Supply voltage |
| Pin 40 | VSS — Ground |
| Pin 41 | RPC5 — Port C bit 5 |
| Pin 42 | RPD0 — Port D bit 0 |
| Pin 43 | RPD1 — Port D bit 1 |
| Pin 44 | EP — Exposed thermal pad - connect to VSS |
Typische Anwendungen
PIC32MX254F128D-I/ML ist geeignet für 7 Anwendungs: USB Peripherals and HID Input, Low-Power Sensor Hubs with RTCC, Capacitive Touch User Interfaces, Audio Playback with USB Streaming, Battery-Powered Data Loggers, Industrial Control with USB Diagnostic Port, Low-Cost Graphics HMI with EPMP.
USB Peripherals and HID Input
PIC32MX254F128D-I/ML fits USB peripherals because it integrates full-speed USB 2.0 with on-chip transceivers and a 72 MHz MIPS M4K core that handles HID, CDC, and vendor-class stacks without external PHY. The 128 KB Flash holds the Microchip USB stack plus application code, while 32 KB SRAM supports bulk endpoints and double-buffered isochronous transfers. Typical usage places the device as the sole system controller, with DP/DM routed as a 90-ohm differential pair to a USB-B or USB-C receptacle. Compared to lower-end MCUs that need an external PHY or slower 24 MHz core, this part removes BOM cost and improves enumeration latency.
Empfohlen
Low-Power Sensor Hubs with RTCC
PIC32MX254F128D-I/ML fits low-power sensor hubs because its XLP deep-sleep current under 1 µA with RTCC running allows multi-year coin-cell operation. The 72 MHz CPU wakes to service sensor reads, while the 10-bit ADC and CTMU handle analog and capacitive touch sensing. The 34 I/O pins support SPI/I²C sensor clusters, and 32 KB SRAM buffers data before transmission. Typical usage cycles between deep-sleep, RTCC alarm wake, and active read-and-transmit phases. The benefit versus discrete RTC + sensor-controller designs is single-die simplicity and unified firmware.
Empfohlen
Capacitive Touch User Interfaces
PIC32MX254F128D-I/ML fits capacitive touch interfaces because the on-chip CTMU provides charge-time measurement without external analog components. The 72 MHz MIPS M4K core processes touch scans and slider/button decoding in real time. With 16 ADC channels and 3 comparators, you can mix touch electrodes with analog sensing on the same part. Typical usage runs Microchip's mTouch library over the CTMU hardware to scan up to 32 buttons. The benefit versus discrete touch ICs is integrated MCU plus touch in one 44-QFN footprint, simplifying layout.
Empfohlen
Audio Playback with USB Streaming
PIC32MX254F128D-I/ML fits USB audio streaming because full-speed USB 2.0 delivers 12 Mbps bandwidth, enough for 16-bit/48 kHz stereo from host to DAC via isochronous endpoints. The 72 MHz CPU runs the USB stack plus audio buffering with DMA, offloading data movement from the core. 32 KB SRAM holds jitter buffers, and 128 KB Flash stores bootloader plus protocol firmware. Typical usage bridges USB to an external I²S DAC. Compared to ARM Cortex-M0+ MCUs that lack USB plus enough cycles, this part is a clean fit.
Empfohlen
Battery-Powered Data Loggers
PIC32MX254F128D-I/ML fits battery-powered data loggers because XLP deep-sleep below 1 µA with RTCC running extends battery life across logging cycles. The 10-bit ADC captures analog sensor data, the 32 KB SRAM stores a full log buffer, and the 128 KB Flash holds firmware plus a fail-safe file system. Typical usage logs temperature/humidity every 60 seconds with USB drive mode for file extraction. The advantage versus 8-bit MCUs is much higher sample throughput when active and a real-time clock with calendar on-chip.
Empfohlen
Industrial Control with USB Diagnostic Port
PIC32MX254F128D-I/ML fits industrial control with USB diagnostics because the 72 MHz MIPS core runs control firmware while exposing CDC USB for parameter tuning and fault log retrieval. The 44-QFN package and -40 °C to +85 °C industrial temperature range suit factory-floor cabinets. The 3 analog comparators and 10-bit ADC handle sensor and current monitoring, while 34 I/O drive relays or PWM outputs. Typical usage is a motor controller with USB service port. The advantage versus PLCs is single-chip integration at lower cost.
Empfohlen
Low-Cost Graphics HMI with EPMP
PIC32MX254F128D-I/ML fits low-cost graphics HMI because the enhanced Parallel Master Port (EPMP) drives small TFT LCDs up to QVGA without an external controller. The 72 MHz core refreshes displays and processes touch input from the CTMU, all in one die. 32 KB SRAM holds frame buffers for small panels, and 128 KB Flash stores UI assets plus fonts. Typical usage is a 2.4- or 3.5-inch HMI panel. Compared to an STM32 + external graphics controller, this is a simpler BOM with fewer layers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX254F128D-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX250F128D-I/ML | PIC32MX154F128D-I/ML | PIC32MX230F128D-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Frequency | 72 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| XLP Low Power | Yes | No (standard sleep) | Yes | Limited |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Wichtigste Unterscheidungsmerkmale
- 72 MHz CPU speed in the XLP low-power family (vs. PIC32MX250F128D-I/ML)
- Full XLP sleep set with USB RTCC wake (vs. PIC32MX230F128D-I/ML)
- CTMU capacitive touch with 16-channel ADC (vs. PIC32MX154F128D-I/ML)
Designhinweise
Route USB DP/DM as a 90-ohm differential pair with matched length (±150 mil tolerance) and continuous ground return. Place ferrite beads on VBUS and an ESD array such as USBLC6-2SC6 on the connector side. Estimated: signal-integrity simulations show eye-pattern degradation above 3 cm unbalanced trace length; keep traces shorter than 25 mm where possible. Reference Microchip AN588 for full USB layout checklist.
Place one 0.1 µF X7R decoupling cap directly on each VDD/AVDD pin pair, plus one 4.7 µF bulk near the QFN thermal pad. The XLP sleep current spec (<1 µA) only holds with clean VDD - any ripple above 50 mVpk-pk-pk activates BOR. Estimated: total inrush at USB attach is roughly 200 mA peak; design VBUS trace width to handle this without 50 mV drop.
The QFN exposed pad (EP, pin 44) MUST be soldered to a continuous ground plane for thermal dissipation. At 72 MHz with USB active, expect 40-60 mA peak, producing ~150 mW. The 44-QFN θJA is about 30 °C/W per internal reference design; an un-soldered EP will exceed 50 °C/W and cause thermal shutdown at high ambient.
Do NOT exceed 3.6 V on any VDD or 5V-tolerant pin; the absolute-max is 4.0 V. Failure to configure analog pins as digital I/O disables ADC inputs on the same channel. CTMU timing requires calibrated core clock; rerun mTouch calibration if PBCLK changes. Reference Microchip TB3018 for capacitive touch firmware patterns.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial temperature -40 °C to +85 °C (I-suffix). No AEC-Q100 qualification; for automotive use, consult Microchip AEC-Q100 qualified PIC32 variants.