PIC32MX254F128D-V/ML - 32-bit 72MHz 128KB Flash MCU | Microchip
Teilenummer: PIC32MX254F128D-V/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.45 | $5,45 |
| 10 | $4.92 | $49,20 |
| 100 | $4.18 | $418,00 |
| 500 | $3.65 | $1.825,00 |
| 1.000 | $3.2 | $3.200,00 |
PIC32MX254F128D-V/ML Übersicht
What is a PIC32MX microcontroller? The PIC32MX is Microchip's MIPS-based 32-bit MCU line that bridges 8/16-bit PIC and ARM Cortex-M ecosystems. The XLP (eXtreme Low Power) sub-family adds sub-uA sleep currents, multiple deep-sleep modes, and peripheral clock gating. PIC32MX parts integrate a MIPS32 M4K core, configurable peripherals through Peripheral Pin Select (PPS), USB 2.0 Full-Speed with on-chip transceiver, up to 16 channels of 10-bit ADC, and up to five 16-bit timers.
Key features of the PIC32MX254F128D-V/ML include 128 KB Flash, 32 KB RAM, 72 MHz CPU/USB clock from a 8 MHz system source, 34 usable I/O, two I2C modules, separate PLLs for CPU and USB, Capture Management of Cellular Therapy Unit (CTMU), Real-Time Clock Calendar (RTCC), and 5-bit 16-bit timers. Differential adapters ensure automotive-grade reliability. Three 16-bit timers/comparables are accessible via PPS remapping.
The device architecture employs a Harvard-style cache with separate 16 KB instruction and data paths, hardware multiply/divide, and 4-channel DMA with automatic data-size detection. This balances deterministic real-time response with high code density. The CTMU enables capacitive touch sensing, and a 10-bit 1 Msps ADC supports sensor and audio signal acquisition.
Typical applications include USB Human Interface Devices (HID), automotive body controllers and sensor clusters, low-cost graphics and audio front-ends, capacitive-touch user interfaces, and industrial sensor nodes. The wide 2.5–3.6 V supply range and AEC-Q100 qualification make it well suited for 12 V/24 V automotive bus systems. XLP modes permit multi-year battery life in portable or remote nodes.
When designing with this MCU, place the VCAP pin capacitor (low-ESR ceramic, >=6 V rating) within 1 cm of the pin. Use dedicated PGECx/PGEDx pairs for ICSP – these pins cannot be remapped. The USB bus requires a 48 MHz PLL lock and ESD protection per USB 2.0 specification.
This page consolidates distributor pricing, parametric comparison, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für PIC32MX254F128D-V/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX254F128D-V/ML (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, USB, ADC, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX254F128D-V/ML
✅ Drop-In✓ Auf Lager
$3.2 / Stück
Datenblatt ansehen →PIC32MX254F128DT-V/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX254F128D-I/ML
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC32MX254F128D-I/PT
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →PIC32MX250F128D-V/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX154F128D-V/ML
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →PIC32MX254F128D-V/ML Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K 32-bit RISC |
| CPU Frequency | 72 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 2.5 V to 3.6 V |
| I/O Pins | 34 |
| Gehäuse | 44-QFN (8x8 mm) |
| Montageart | Surface Mount |
| AEC-Q100 | Qualified (automotive grade -V) |
| Betriebstemperatur | -40C to +125C |
| USB | USB 2.0 Full-Speed with on-chip transceiver |
| Timers | Five 16-bit |
| Comparators | 3 |
| DMA Channels | 4 |
| CTMU | Yes (Capacitive Touch) |
| RTCC | Yes (Real-Time Clock Calendar) |
| Peripheral Pin Select | Yes (PPS) |
| RoHS-Status | Compliant |
PIC32MX254F128D-V/ML 44-qfn (8x8 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MX254F128D-V/ML (44-qfn (8x8 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MX254F128D-V/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MX254F128D-V/ML ist geeignet für 6 Anwendungs: USB Human Interface Devices (HID), Automotive Body Control Modules, Capacitive Touch User Interfaces, Industrial Sensor Nodes, Audio and Graphics Front-Ends, Portable and Battery-Operated Devices.
USB Human Interface Devices (HID)
The PIC32MX254F128D-V/ML integrates a USB 2.0 Full-Speed peripheral with on-chip transceiver, enabling direct connection to a USB host without external PHY components. Its 72 MHz CPU rate and 4-channel DMA support HID polling rates above 1 kHz with deterministic latency. The CTMU caps add capacitive-touch input, allowing combined touch-and-keyboard products. The 32 KB SRAM accommodates USB descriptor stacks plus HID report buffers. The AEC-Q100 automotive grade permits automotive cabin infotainment buttons and steering-wheel controls.
Empfohlen
Automotive Body Control Modules
AEC-Q100 Grade 1 qualification and the -40C to +125C operating range make this MCU suitable for body controllers managing lights, locks, and HVAC actuators. The CTMU touch peripheral supports capacitive switch panels, while the RTCC tracks scheduling and wake-up events. Five 16-bit timers and Peripheral Pin Select enable flexible PWM generation for motor control loops. The 2.5–3.6 V supply accepts direct connection to 12 V automotive rails through simple LDO regulation.
Empfohlen
Capacitive Touch User Interfaces
The CTMU (Charge Time Measurement Unit) on this MCU delivers accurate capacitive-touch sensing using low-cost PCB pads without dedicated touch ICs. Combined with 34 I/O lines and PPS routing, designers can implement up to 16-channel touch sliders and matrices. AEC-Q100 qualification supports automotive center-stack touchscreens and HVAC controls. The XLP sleep modes enable wake-on-touch at sub-100 uA, extending battery life in portable touch remotes.
Empfohlen
Industrial Sensor Nodes
The wide 2.5–3.6 V supply and AEC-Q100 qualification allow deployment in industrial sensor networks across factory floors and process-control cabinets. Three analog comparators, 16-bit timers, and PWM outputs drive motor-control loops and analog front-ends. The USB peripheral simplifies factory calibration and firmware update procedures. PPS remapping allows the same PCB to support multiple sensor configurations by changing pin assignments in firmware.
Empfohlen
Audio and Graphics Front-Ends
The PIC32MX254F128D-V/ML's 32 KB RAM and DMA engine support graphics TFT display driving and basic audio DAC interfaces for entry-level HMI products. The 72 MHz core is sufficient for low-resolution color TFTs (<320x240) and 16 ksps audio playback. The USB Full-Speed peripheral enables seamless content updates. AEC-Q100 qualification lets the same firmware serve both industrial HMI and automotive cluster secondary displays.
Empfohlen
Portable and Battery-Operated Devices
XLP low-power modes and the 32 KB SRAM of this MCU support multi-year battery life in portable medical or instrumentation products. Sleep currents in deep-sleep mode drop below 1 uA while preserving RTCC operation for timed wake-up. The USB peripheral enables convenient battery charging via USB hosts. PPS flexibility allows the same hardware to host different sensor daughterboards in product variants.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX254F128D-V/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX254F128DT-V/ML | PIC32MX254F128D-I/ML | PIC32MX254F128D-I/PT | PIC32MX250F128D-V/ML | PIC32MX154F128D-V/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-TQFP - different | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 50 MHz (-30%) |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C | -40C to +125C |
| I/O Pins | 34 | 34 | 34 | 34 | 34 | 34 |
| USB Peripheral | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Unit Price (qty 1, USD) | $5.45 | ~$5.45 (T&R volume pricing) | ~$4.50 (industrial grade) | ~$4.60 (TQFP package) | ~$4.20 (lower cost tier) | ~$4.80 (older generation) |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 Grade 1 automotive qualification with -V suffix (vs. PIC32MX254F128D-I/ML)
- 72 MHz CPU vs older MX1 generation (vs. PIC32MX154F128D-V/ML)
- Full PIC32MX25x peripheral set including CTMU and RTCC (vs. PIC32MX250F128D-V/ML)
Designhinweise
The PIC32MX254F128D-V/ML requires a low-ESR (1 ohm or less) ceramic VCAP bypass capacitor rated at 6 V or higher to stabilize the internal core voltage regulator. Place this capacitor within 1 cm of the VCAP pin with a wide trace to ground. The MCU operates from 2.5 V to 3.6 V; design the upstream LDO for at least 200 mA of transient headroom to accommodate USB enumeration peaks.
Use only matched PGECx/PGEDx pairs for ICSP programming; these pairs cannot be reassigned via Peripheral Pin Select (PPS). Provide test-point access to at least one PGEC/PGED pair on the production PCB for in-circuit programming. Place the 8 MHz crystal close to the OSC1/OSC2 pins with a grounded guard ring to reduce EMI. Keep high-speed USB traces at 90 ohms differential impedance.
The 44-QFN 8x8 mm package dissipates heat through the central exposed pad; this pad MUST be soldered to a PCB thermal land with multiple thermal vias to the inner ground plane. Without proper thermal connection, the junction temperature may exceed the 125C automotive limit at full CPU load. Follow JEDEC JESD51 standards for QFN thermal land pattern design and verify with thermal imaging during qualification.
Do not connect VCAP directly to VDD – the internal regulator requires the external capacitor for phase margin. When migrating firmware from PIC32MX1XX to MX2XX, verify that PPS register names match; older MX1XX PPS conventions may differ. The USB bus requires the 48 MHz PLL to lock before USB enumeration; failing to wait for PLL lock produces enumeration failures on cold start.
Compliance-Informationen
AEC-Q100 Grade 1 qualified via the -V automotive suffix. RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free packaging confirmed for automotive-grade QFN.