PIC32MX270F256D-V/ML - 256KB Flash, USB, 44-QFN MCU | Microchip
Teilenummer: PIC32MX270F256D-V/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.6 | $2.300,00 |
| 1.000 | $4.05 | $4.050,00 |
PIC32MX270F256D-V/ML Übersicht
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program memory (Flash), data memory (RAM), and configurable peripherals on a single die. Within the embedded hierarchy, the PIC32MX2XX sits in the mid-range MIPS32 segment between low-power PIC16/PIC24 parts and the high-performance PIC32MZ family, offering USB and graphics-oriented peripherals suited to consumer and industrial user-interface products.
Key differentiators include 256 KB Flash and 64 KB RAM (the largest memory variant in the 44-pin PIC32MX1XX/2XX family), full-speed USB 2.0 with OTG, hardware PMP for direct LCD/glue-less display interface, and a CTMU that enables mTouch capacitive touch buttons plus 1 ns resolution time measurement for capacitive, inductive, or pulse-based sensing. The 0.5 mA/MHz typical active current and multiple low-power sleep modes help battery-powered designs.
The CPU executes most instructions in one cycle through a 5-stage pipeline and a multiply/divide unit, supporting up to 83 DMIPS at 40 MHz. PPS remaps most digital peripherals to a wide choice of physical pins, simplifying PCB routing. The 10-bit ADC reaches up to 1.1 Msps with multiple trigger sources, and the PMP can drive 8-bit or 16-bit parallel interfaces to TFT or graphics controllers.
Typical applications include Bluetooth audio development kits (the PIC32MX270F256D is the PIM device for Microchip's Bluetooth Audio Dev Kit), USB HID and CDC peripherals, consumer audio docks, graphics-enabled HMI panels with mTouch, and industrial control boards needing USB OTG and a graphics port.
Designers should budget the 44-QFN (8x8 mm) thermal pad with sufficient ground copper and place the 4 MHz to 20 MHz primary oscillator crystal within 6 mm of OSCI/OSCO. Use the PPS configuration locks to prevent accidental remapping at runtime and place a ferrite + bulk capacitor pair on Vbus when implementing USB host.
This page synthesizes distributor pricing, pin-compatible alternatives from the same PIC32MX family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für PIC32MX270F256D-V/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX270F256D-V/ML (gleiche Bauform und Footprint) – abweichend in ADC, Package, Core Architecture, Maximum CPU Speed, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX270F256DT-V/ML
✅ Drop-In✓ Auf Lager
$3.78 / Stück
Datenblatt ansehen →PIC32MX270F256D-I/ML
✅ Drop-In✓ Auf Lager
$4.18 / Stück
Datenblatt ansehen →PIC32MX270F256D-50I/ML
✅ Drop-In✓ Auf Lager
$3.74 / Stück
Datenblatt ansehen →PIC32MX270F256B-V/ML
✅ Drop-In✓ Auf Lager
$2.78 / Stück
Datenblatt ansehen →PIC32MX170F256D-V/ML
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →PIC32MX270F256D-V/ML Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 40 MHz / 83 DMIPS |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| USB | USB 2.0 full-speed device/host/OTG |
| ADC | 10-bit, up to 1.1 Msps |
| Touch Hardware | CTMU (mTouch capacitive touch) |
| Time Measurement Resolution | 1 ns |
| Graphics Interface | Parallel Master Port (PMP) |
| Audio Interfaces | 2x I2S/SPI modules |
| Peripheral Pin Select (PPS) | Yes |
| Active Current (Typical) | 0.5 mA/MHz |
| Gehäuse | 44-pin QFN (8x8x0.9 mm) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC32MX270F256D-V/ML Pin-Konfiguration
| Pin 1 | RPB9/RX1/DT1/IC2 — Remappable I/O / UART1 RX / I2C2 |
| Pin 2 | RPC6 — Remappable I/O |
| Pin 3 | RPC7 — Remappable I/O |
| Pin 4 | RPC8 — Remappable I/O |
| Pin 5 | RPC9 — Remappable I/O |
| Pin 6 | VSS — Ground reference |
| Pin 7 | VDD — Core supply voltage 2.3V to 3.6V |
| Pin 8 | RPC10 — Remappable I/O |
| Pin 9 | RPC11 — Remappable I/O |
| Pin 10 | RPC12 — Remappable I/O |
| Pin 11 | RPC13 — Remappable I/O |
| Pin 12 | RPC14 — Remappable I/O |
| Pin 13 | RPC15 — Remappable I/O |
| Pin 14 | VSS — Ground reference |
| Pin 15 | VDD — Core supply voltage 2.3V to 3.6V |
| Pin 16 | RPD0 — Remappable I/O |
| Pin 17 | RPD1 — Remappable I/O |
| Pin 18 | RPD2 — Remappable I/O |
| Pin 19 | RPD3 — Remappable I/O |
| Pin 20 | RPD4 — Remappable I/O |
| Pin 21 | RPD5 — Remappable I/O |
| Pin 22 | VSS — Ground reference |
| Pin 23 | VDD — Core supply voltage 2.3V to 3.6V |
| Pin 24 | RPD6 — Remappable I/O |
| Pin 25 | RPD7 — Remappable I/O |
| Pin 26 | RPD8 — Remappable I/O |
| Pin 27 | RPD9 — Remappable I/O |
| Pin 28 | RPD10 — Remappable I/O |
| Pin 29 | RPD11 — Remappable I/O |
| Pin 30 | RPD12 — Remappable I/O |
| Pin 31 | OSCI — External clock/oscillator input |
| Pin 32 | OSCO — External clock/oscillator output |
| Pin 33 | VSS — Ground reference |
| Pin 34 | VBUS — USB bus power sense input |
| Pin 35 | D+ — USB D+ differential data line |
| Pin 36 | D- — USB D- differential data line |
| Pin 37 | VUSB — Internal USB transceiver supply (3.3V regulated output) |
| Pin 38 | PGED3/AN20/RPA0 — Programming/debug data / ADC analog input / GPIO |
| Pin 39 | PGEC3/AN21/RPA1 — Programming/debug clock / ADC analog input / GPIO |
| Pin 40 | MCLR — Master clear reset input (active low) |
| Pin 41 | RPE0/PMPD0 — Remappable I/O / PMP data line 0 |
| Pin 42 | RPE1/PMPD1 — Remappable I/O / PMP data line 1 |
| Pin 43 | RPE2/PMPD2 — Remappable I/O / PMP data line 2 |
| Pin 44 | Exposed thermal pad (must be soldered to ground) |
Typische Anwendungen
PIC32MX270F256D-V/ML ist geeignet für 6 Anwendungs: Bluetooth Audio Docking Module, USB HID / CDC Peripherals, Graphics-Enabled HMI with PMP, mTouch Capacitive Touch Interfaces, Industrial 32-bit Control Boards, Consumer Audio and Infotainment.
Bluetooth Audio Docking Module
The PIC32MX270F256D-V/ML is the Plug-In Module (PIM) device for Microchip's Bluetooth Audio Development Kit, demonstrating its core fitness for Bluetooth audio docks. Its dual I2S/SPI modules provide two independent audio data paths for stereo streaming, while 256 KB Flash holds protocol stacks plus audio processing and 64 KB RAM buffers decoded PCM frames. The USB 2.0 full-speed OTG controller supports direct audio playback from USB thumb drives alongside the wireless input.
Empfohlen
USB HID / CDC Peripherals
The PIC32MX270F256D-V/ML's integrated USB 2.0 full-speed device/host/OTG controller eliminates the need for an external PHY in HID, CDC-ACM, and mass-storage peripherals. With 256 KB Flash, full USB stacks and class drivers fit comfortably alongside application code; 64 KB RAM provides double-buffered endpoints for reliable bulk transfers. The Peripheral Pin Select (PPS) feature remaps USB-attached peripherals to a wide choice of physical pins, simplifying PCB routing.
Empfohlen
Graphics-Enabled HMI with PMP
The hardware Parallel Master Port (PMP) on PIC32MX270F256D-V/ML drives 8-bit or 16-bit parallel TFT or graphics controllers directly, offloading the CPU from display refresh. Combined with the CTMU's 1 ns-resolution time measurement and mTouch capacitive touch libraries, the part builds complete touch-screen human-machine interfaces in a single chip. The 64 KB RAM supports frame buffers for small TFT panels without external memory.
Empfohlen
mTouch Capacitive Touch Interfaces
The Charge Time Measurement Unit (CTMU) on PIC32MX270F256D-V/ML delivers Microchip's mTouch capacitive touch button, slider, and proximity-sensing capability with 1 ns time-measurement resolution. This allows robust touch sensing through overlay glass and plastic, including water-tolerant operation, without an external touch controller IC. The 0.5 mA/MHz active current keeps idle consumption low for battery-powered appliances.
Empfohlen
Industrial 32-bit Control Boards
The PIC32MX270F256D-V/ML's MIPS32 M4K core delivers 83 DMIPS at 40 MHz, ample headroom for industrial control loops, Modbus or CAN bridging via SPI/I2S, and USB diagnostics on a single board. The -40C to +105C V-temp grade suits cabinet-mounted equipment and factory-floor enclosures. PPS allows mixed-pin assignments so the same 44-QFN layout serves multiple SKUs.
Empfohlen
Consumer Audio and Infotainment
Dual I2S modules, 256 KB Flash for audio codecs, and 64 KB RAM for audio buffers make PIC32MX270F256D-V/ML a strong fit for consumer docking stations, soundbars, and infotainment accessories. The USB OTG controller supports both host playback from USB media and device-mode firmware upgrade via the same port. PPS reassigns audio data lines to clean routing channels on mixed-signal PCBs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX270F256D-V/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX270F256DT-V/ML | PIC32MX270F256D-I/ML | PIC32MX270F256D-50I/ML | PIC32MX270F256B-V/ML | PIC32MX170F256D-V/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Speed | 40 MHz / 83 DMIPS | 40 MHz / 83 DMIPS | 40 MHz / 83 DMIPS | 50 MHz / 105 DMIPS | 40 MHz / 83 DMIPS | 40 MHz / 83 DMIPS |
| USB | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | None (B variant) | USB 2.0 FS device/host/OTG |
| PMP / Graphics | Yes (full PMP) | Yes (full PMP) | Yes (full PMP) | Yes (full PMP) | Reduced on B variant | Reduced on 170 sub-family |
| Operating Temperature | -40C to +105C (V) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (50I) | -40C to +105C (V) | -40C to +105C (V) |
Wichtigste Unterscheidungsmerkmale
- Highest memory variant in the 44-pin PIC32MX1XX/2XX family (vs. PIC32MX150F128D-V/PT)
- Full-speed USB OTG integrated on-chip (vs. PIC32MX270F256B-V/ML)
- Extended -40C to +105C V-temp grade (vs. PIC32MX270F256D-I/ML)
Designhinweise
The 44-QFN (8x8 mm) exposed thermal pad (pin 44, EP) MUST be soldered to a ground copper pour of at least 25 mm^2 on the top layer to meet the datasheet's thermal performance. Without proper EP soldering, junction-to-ambient thermal resistance rises dramatically, especially at 40 MHz with USB active. Provide at least 4 thermal vias in the EP land to a mid-layer ground plane to spread heat.
Place the 4 MHz to 20 MHz primary oscillator crystal within 6 mm of OSCI (pin 31) and OSCO (pin 32), surrounded by a ground guard ring. Keep clock traces short and at equal length to minimize duty-cycle distortion. USB D+/D- lines (pins 35, 36) must be routed as a 90 ohm differential pair with no stubs, and VBUS (pin 34) requires a 1 uF decoupling capacitor within 3 mm.
Configure Peripheral Pin Select (PPS) lock registers before runtime to prevent accidental remapping that could silently move peripheral signals to wrong physical pins. Use the MPLAB Harmony Configuration tool or direct register init in startup code. Verify the configured input/output mapping against the PCB layout on every prototype build before firmware lock-down.
Compliance-Informationen
RoHS compliant per Microchip product page; AEC-Q100 not applicable (general-purpose MCU, not automotive-qualified). Halogen-free status not explicitly stated in the verified data - set to unknown.
