PIC32MZ1024EFE144-I/PH - 200MHz 32-bit MCU 1MB Flash | Microchip
Teilenummer: PIC32MZ1024EFE144-I/PH ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.5 | $6.750,00 |
| 1.000 | $12.1 | $12.100,00 |
PIC32MZ1024EFE144-I/PH Übersicht
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program Flash, data SRAM, and a rich set of on-chip peripherals (ADC, timers, communication controllers, GPIO). The PIC32MZ EF family specifically targets the high-end of the MIPS-based 32-bit MCU market, placing it hierarchically under PIC32 -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The M-Class core delivers 252 MHz peak operation with deterministic interrupt latency, while the EF family extensions add high-bandwidth peripherals such as HS USB 2.0 and 10/100 Ethernet for connected embedded systems.
Key differentiating specifications include 200 MHz CPU core (252 MHz on the EF family maximum), 1 MB Live-Update Flash, 256 KB SRAM, integrated FPU for single-precision floating point, hardware crypto accelerators on sister parts (no crypto on the -EFE variant), up to 120 GPIO, four I2C, six UART, and four SPI ports. The 144-pin TQFP exposes the full peripheral set including 18-bit ADC, graphics LCD controller, and audio I2S/SSI interfaces. An integrated Hi-Speed USB 2.0 PHY and 10/100 Ethernet MAC reduce external BOM cost in connected designs.
Architecture depth: the PIC32MZ EF family uses a dual-bank Flash subsystem that supports Live-Update firmware field upgrades without downtime, plus a dedicated DMA engine that offloads memory moves from the CPU. The instruction cache and prefetch buffer keep the 200 MHz core fed efficiently from the large 1 MB Flash array, while 256 KB SRAM supports sizeable protocol stacks and graphics frame buffers for HMI applications.
Typical applications include industrial Ethernet gateways, IoT edge nodes with TLS-secure connectivity, automotive HMI panels, BLDC motor-control FOC drives, audio playback products, and TFT-driven graphical control panels. The 16x16 mm TQFP footprint is well suited to industrial temperature (-40C to +85C) operation with generous PCB thermal margin.
When designing with this part, ensure the firmware image size does not exceed 1 MB and reserve adequate SRAM for the protocol stack and frame buffers. Always consult the device errata document for the latest silicon revision notes before committing to production.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ EF family, and practical design notes that complement the manufacturer datasheet.
Drop-in-Alternativen für PIC32MZ1024EFE144-I/PH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFE144-I/PH (gleiche Bauform und Footprint) – abweichend in Core Architecture, FPU, ADC, Operating Temperature, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFE144-E/PH
✅ Drop-In✓ Auf Lager
$11.05 / Stück
Datenblatt ansehen →PIC32MZ0512EFE144-I/PH
✅ Drop-In✓ Auf Lager
$7.05 / Stück
Datenblatt ansehen →PIC32MZ1024EFE144-I/PH Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M-Class (32-bit) |
| Core Family | PIC32MZ EF |
| Maximum CPU Speed | 200 MHz (EF family peak 252 MHz) |
| FPU | Yes (single-precision) |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Betriebstemperaturbereich | -40C to +85C (Industrial) |
| Gehäuse | 144-pin TQFP (16x16 mm) |
| Montageart | Surface Mount |
| HS USB | Yes (USB 2.0 High-Speed PHY) |
| Ethernet MAC | 10/100 Mbps integrated |
| Cryptography | No (no-crypt EF variant) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC32MZ1024EFE144-I/PH 144-pin tqfp (16x16 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFE144-I/PH (144-pin tqfp (16x16 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFE144-I/PH.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFE144-I/PH ist geeignet für 6 Anwendungs: Industrial Ethernet Gateway, IoT Edge Node with USB Connectivity, Automotive HMI / Graphics Panel, BLDC Motor Control (FOC), Audio Playback Product with USB Streaming, TFT-Driven Industrial Control Panel.
Industrial Ethernet Gateway
The PIC32MZ1024EFE144-I/PH fits industrial Ethernet gateways because its integrated 10/100 Ethernet MAC plus 200 MHz MIPS32 M-Class core can run lwIP or TCP/IP stacks while leaving CPU headroom for protocol conversion. The 1 MB Flash hosts full EtherNet/IP, PROFINET, or Modbus TCP firmware, while 256 KB SRAM holds packet buffers and socket state. The 144-pin TQFP exposes all Ethernet RMII/MII signals for an external PHY such as the Microchip KSZ8081. Compared to external MAC + MCU solutions, the on-chip MAC removes an external component and reduces BOM cost.
Empfohlen
IoT Edge Node with USB Connectivity
The PIC32MZ1024EFE144-I/PH is a strong fit for IoT edge nodes needing Hi-Speed USB device connectivity for diagnostics, firmware update, or host tethering. The integrated USB 2.0 HS PHY eliminates the external transceiver common on competing MCUs, while the 200 MHz core and FPU execute TLS handshake and sensor fusion in real time. The 1 MB Flash accommodates full WiFi/BLE co-processor command stacks plus application logic, and 256 KB SRAM handles TLS session buffers. Designers pair this MCU with modules such as the Microchip ATWINC1500 WiFi or RN4871 BLE for cloud-connected sensing.
Empfohlen
Automotive HMI / Graphics Panel
The PIC32MZ1024EFE144-I/PH suits automotive HMI panels requiring a TFT-driven graphical display plus connectivity. The integrated graphics LCD controller supports TFT panels up to WVGA, while the FPU accelerates vector rendering and the 256 KB SRAM buffers partial frame content for smooth animation. The Hi-Speed USB port accepts firmware updates from a diagnostic tool, and Ethernet MAC supports Automotive Ethernet bridging via external PHY. The -I/PH industrial temperature variant operates -40C to +85C; for under-hood deployments upgrade to PIC32MZ1024EFE144-E/PH (-40C to +125C).
Empfohlen
BLDC Motor Control (FOC)
The PIC32MZ1024EFE144-I/PH drives BLDC and PMSM motors using field-oriented control thanks to its 200 MHz MIPS32 M-Class core with single-precision FPU. Park/Clarke inverse transforms complete in microseconds, leaving CPU budget for speed PI loop, current sampling, and fault handling. The integrated high-speed ADC samples phase currents synchronized to the PWM module, and the flexible PWM outputs center-aligned switching at up to 100 kHz. Designers pair the MCU with a three-phase gate driver such as the Microchip MCP8026 for a complete BLDC drive.
Empfohlen
Audio Playback Product with USB Streaming
The PIC32MZ1024EFE144-I/PH fits USB-streaming audio products such as USB headphones or DAC interfaces. The Hi-Speed USB 2.0 port handles isochronous audio at 24-bit/192 kHz, while the I2S/SSI peripheral feeds an external DAC such as the Microchip WM8904 or AKM AK4438. The FPU accelerates DSP effects like parametric EQ and dynamic range compression, and 1 MB Flash stores the full firmware plus audio processing pipeline. Audio playback at low CPU load leaves bandwidth for button handling, display updates, and battery charging control.
Empfohlen
TFT-Driven Industrial Control Panel
The PIC32MZ1024EFE144-I/PH suits TFT-driven industrial control panels requiring both rich graphics and reliable field connectivity. The graphics LCD controller outputs RGB888 directly to TFT panels up to WVGA, while the Ethernet MAC connects to factory networks for SCADA integration. The 256 KB SRAM holds page buffers, fonts, and icons; the 1 MB Flash hosts the full graphical UI library plus Modbus/EtherNet/IP stacks. The 144-pin TQFP provides enough GPIO for keypad scan, LED indicators, and external sensor interfaces on a single MCU.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFE144-I/PH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFE144-E/PH | PIC32MZ0512EFE144-I/PH |
|---|---|---|---|
| Package | 144-pin TQFP (16x16) | 144-pin TQFP (16x16) - same | 144-pin TQFP (16x16) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 200 MHz | 180 MHz (-10%) | 200 MHz |
| Program Flash | 1 MB | 1 MB | 512 KB (-50%) |
| SRAM | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| FPU | Yes | Yes | Yes |
| Hardware Crypto | No (EFE no-crypt) | No | No |
Wichtigste Unterscheidungsmerkmale
- Only 1 MB Flash variant in 144-pin TQFP at 200 MHz industrial grade (vs. PIC32MZ0512EFE144-I/PH)
- Higher clock speed than extended-temperature variant (vs. PIC32MZ1024EFE144-E/PH)
- Integrated FPU not present on lower-cost PIC32MX family (vs. PIC32MX795F512L-80I/PF)
Designhinweise
Estimated: the PIC32MZ1024EFE144-I/PH core and peripherals draw up to ~250 mA at 200 MHz with all peripherals active. Place a 10uF ceramic plus 0.1uF decoupling pair on every VDD/VSS pin pair within 5 mm of the package. Add a bulk 47uF tantalum or polymer capacitor near the IC to absorb USB and Ethernet inrush. A ferrite bead on the analog AVDD supply isolates ADC noise from the digital supply.
Estimated: at full 200 MHz load with USB and Ethernet active, the 144-pin TQFP package dissipates approximately 0.7 W. The 16x16 mm body provides reasonable theta_JA (~30 C/W on a standard 4-layer JEDEC board), giving ~21C rise above ambient - well within industrial -40C to +85C envelope. For sealed enclosures with no airflow, derate by 30% or specify the -E/PH variant which is rated for higher ambient temperatures.
Route the 50 MHz Ethernet RMII signals as 50-ohm controlled-impedance traces with ground reference on the layer below. Place the external Ethernet PHY within 25 mm of the MAC pins and route RMII clocks first. The USB DP/DM traces also require 90-ohm differential impedance and a common-mode choke near the connector. Use a 4-layer PCB with continuous ground plane under the TQFP for best EMI and thermal performance.
Do not confuse the -EFE (no crypto) and -EFH (with crypto) suffixes when sourcing - they share the same 144-pin TQFP but the EFH variants include AES/SHA accelerators. Also verify the temperature suffix: -I is industrial -40C to +85C at 200 MHz, -E is extended -40C to +125C at 180 MHz. Always consult the device errata document DS80000663H before production to identify any silicon revision workarounds needed for your firmware.
Compliance-Informationen
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive safety applications. Halogen-free status not explicitly stated in retrieved data.