PIC32MZ1024EFH064-I/MR - 200MHz 1MB 32-bit MCU | Microchip
Teilenummer: PIC32MZ1024EFH064-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.55 | $955,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.25 | $7.250,00 |
PIC32MZ1024EFH064-I/MR Übersicht
What is a 32-bit PIC32MZ EF microcontroller? The PIC32MZ EF family is Microchip's premium high-speed MIPS-based MCU line, designed for embedded applications demanding deterministic real-time performance, large memory footprints, and rich connectivity. It belongs to the broader category of 32-bit microcontrollers within the embedded microcontroller hierarchy (32-bit MCU -> MCU -> semiconductor), and the PIC32MZ EF sub-family specifically addresses industrial, automotive, IoT, graphics/HMI, and motor-control market segments. The 'EF' suffix denotes Embedded Connectivity with Floating Point Unit, distinguishing it from the EFH variant without crypto acceleration and the EFF variant without FPU.
Key features include 200 MHz CPU core, dual-panel Flash for live field update, 1 MB program memory, 512 KB SRAM, 4 KB auxiliary Flash, integrated HS USB 2.0 PHY, 10/100 Ethernet MAC, dual CAN 2.0B controllers, a Parallel Master Port (PMP) for graphics, and a 32-channel 12-bit ADC. The 64-pin QFN package offers a 9 mm x 9 mm footprint with 0.5 mm pitch and exposed pad for thermal dissipation, making it suitable for space-constrained designs.
The device operates from 2.3 V to 3.6 V and supports an industrial temperature range of -40 °C to +85 °C. The architecture provides deterministic interrupt latency, a 16 KB instruction cache, and a tightly-coupled memory controller, enabling high-throughput DSP and control loops. Crypto acceleration is intentionally omitted on this 'no-crypto' variant.
Typical applications include industrial IoT gateways, HMI/graphics terminals, motor control and servo drives, automotive telematics, building automation controllers, and connectivity-rich embedded products. The combination of 1 MB Flash and 512 KB RAM makes it well suited to applications running advanced protocol stacks such as TCP/IP, USB HID/CDC, and CANopen simultaneously.
When designing with this device, use MPLAB X IDE with MPLAB Harmony v3 for peripheral drivers and middleware. Allocate decoupling capacitance of 0.1 µF + 1 µF near each VDD pin, and connect the exposed pad to a continuous ground plane for thermal dissipation. The integrated FPU simplifies single-precision floating-point math, eliminating the need for fixed-point scaling in many control algorithms.
This page consolidates distributor pricing, pin-compatible same-family alternatives, application guidance, and design considerations not present in the manufacturer datasheet, enabling faster component selection for connectivity-centric embedded designs.
Drop-in-Alternativen für PIC32MZ1024EFH064-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFH064-I/MR (gleiche Bauform und Footprint) – abweichend in ADC, Package, Core Architecture, DSP Extensions, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFG064-I/MR
✅ Drop-In✓ Auf Lager
$7.99 / Stück
Datenblatt ansehen →PIC32MZ1024EFF064-I/MR
✅ Drop-In✓ Auf Lager
$6.65 / Stück
Datenblatt ansehen →PIC32MZ1024ECG064-I/MR
✅ Drop-In✓ Auf Lager
$8.9 / Stück
Datenblatt ansehen →PIC32MZ1024EFH064-I/PT
✅ Drop-In✓ Auf Lager
$7.69 / Stück
Datenblatt ansehen →PIC32MZ1024EFH064-E/MR
✅ Drop-In✓ Auf Lager
$8.74 / Stück
Datenblatt ansehen →PIC32MZ1024EFK064-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MZ1024EFH064-I/MR Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M-Class Warrior |
| Core Architecture | MIPS32 / RISC |
| Maximum CPU Frequency | 200 MHz (family maximum 252 MHz) |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Auxiliary Flash | 4 KB |
| Instruction Cache | 16 KB |
| FPU | IEEE 754 single-precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional |
| DMIPS | 330 DMIPS at 200 MHz |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Betriebstemperaturbereich | -40 °C to +85 °C (Industrial, I-grade) |
| Gehäuse | 64-pin QFN (9x9 mm, MR) with exposed pad |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours floor life) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| HS USB 2.0 PHY | Integrated (Host/Device/OTG) |
| Ethernet MAC | 10/100 Mbps integrated MAC |
| CAN | 2x CAN 2.0B controllers |
| ADC | 12-bit, up to 40 Msps, up to 32 channels |
| Crypto Acceleration | None (No-Crypto variant) |
PIC32MZ1024EFH064-I/MR Pin-Konfiguration
| Pin 1 | RB0 — General purpose I/O (CN2/AN0) |
| Pin 2 | RB1 — General purpose I/O (CN3/AN1) |
| Pin 3 | RB2 — General purpose I/O (AN2) |
| Pin 4 | RB3 — General purpose I/O (AN3) |
| Pin 5 | RB4 — General purpose I/O (AN4) |
| Pin 6 | RB5 — General purpose I/O (AN5) |
| Pin 7 | RB6 — General purpose I/O (AN6/PGEC2) |
| Pin 8 | RB7 — General purpose I/O (AN7/PGED2) |
| Pin 9 | RB8 — General purpose I/O (AN8) |
| Pin 10 | RB9 — General purpose I/O (AN9) |
| Pin 11 | RB10 — General purpose I/O (AN10) |
| Pin 12 | RB11 — General purpose I/O (AN11) |
| Pin 13 | RB12 — General purpose I/O (AN12) |
| Pin 14 | RB13 — General purpose I/O (AN13) |
| Pin 15 | RB14 — General purpose I/O (AN14) |
| Pin 16 | RB15 — General purpose I/O (AN15) |
| Pin 17 | VSS — Ground |
| Pin 18 | VDD — Digital supply voltage (3.3V) |
| Pin 19 | RC0 — General purpose I/O |
| Pin 20 | RC1 — General purpose I/O |
| Pin 21 | RC2 — General purpose I/O |
| Pin 22 | RC3 — General purpose I/O |
| Pin 23 | RC4 — General purpose I/O |
| Pin 24 | RC5 — General purpose I/O |
| Pin 25 | RC6 — General purpose I/O |
| Pin 26 | RC7 — General purpose I/O |
| Pin 27 | RC8 — General purpose I/O |
| Pin 28 | RC9 — General purpose I/O |
| Pin 29 | RC10 — General purpose I/O |
| Pin 30 | RC11 — General purpose I/O |
| Pin 31 | RC12 — General purpose I/O |
| Pin 32 | RC13 — General purpose I/O |
| Pin 33 | RC14 — General purpose I/O |
| Pin 34 | RC15 — General purpose I/O |
| Pin 35 | VSS — Ground |
| Pin 36 | VDD — Digital supply voltage (3.3V) |
| Pin 37 | RD0 — General purpose I/O |
| Pin 38 | RD1 — General purpose I/O |
| Pin 39 | RD2 — General purpose I/O |
| Pin 40 | RD3 — General purpose I/O |
| Pin 41 | RD4 — General purpose I/O |
| Pin 42 | RD5 — General purpose I/O |
| Pin 43 | RD6 — General purpose I/O |
| Pin 44 | RD7 — General purpose I/O |
| Pin 45 | RD8 — General purpose I/O |
| Pin 46 | RD9 — General purpose I/O |
| Pin 47 | RD10 — General purpose I/O |
| Pin 48 | RD11 — General purpose I/O |
| Pin 49 | RD12 — General purpose I/O |
| Pin 50 | RD13 — General purpose I/O |
| Pin 51 | RD14 — General purpose I/O |
| Pin 52 | RD15 — General purpose I/O |
| Pin 53 | VSS — Ground |
| Pin 54 | VDD — Digital supply voltage (3.3V) |
| Pin 55 | RE0 — General purpose I/O |
| Pin 56 | RE1 — General purpose I/O |
| Pin 57 | RE2 — General purpose I/O |
| Pin 58 | RE3 — General purpose I/O |
| Pin 59 | RE4 — General purpose I/O |
| Pin 60 | RE5 — General purpose I/O |
| Pin 61 | RE6 — General purpose I/O |
| Pin 62 | RE7 — General purpose I/O |
| Pin 63 | AVSS — Analog ground |
| Pin 64 | AVDD — Analog supply voltage (3.3V) |
| Pin 65 | EP — Exposed thermal pad - connect to ground plane |
Typische Anwendungen
PIC32MZ1024EFH064-I/MR ist geeignet für 6 Anwendungs: Industrial IoT Gateway, Human-Machine Interface / Graphics Terminal, Motor Control / Servo Drive, Automotive Telematics / Body Controller, Building Automation / HVAC Controller, USB-Connected Embedded Device / Data Logger.
Industrial IoT Gateway
The PIC32MZ1024EFH064-I/MR is well matched to industrial IoT gateways because its 200 MHz MIPS32 M-Class core, integrated 10/100 Ethernet MAC, and HS USB 2.0 PHY eliminate the need for external communication bridges, reducing BOM cost. The 1 MB Flash and 512 KB SRAM accommodate TCP/IP stacks (Microchip's TCP/IP Lite or third-party lwIP), MQTT/SNMP agents, and application logic concurrently. Engineers place this MCU between RS-485 fieldbus transceivers and the Ethernet uplink, routing Modbus, EtherNet/IP, and PROFINET traffic. Compared to a discrete Cortex-M4 + external Ethernet MAC design, this part saves ~$2 in BOM and ~50 mm² of PCB area, at the cost of consuming ~150 mA typical at 3.3 V. Industrial temperature rating supports outdoor and factory deployments.
Empfohlen
Human-Machine Interface / Graphics Terminal
The PIC32MZ1024EFH064-I/MR's integrated FPU and 32-channel 12-bit ADC make it a strong fit for HMI panels driving TFT LCDs via the Parallel Master Port (PMP). The 200 MHz core plus 512 KB SRAM support Microchip's graphics library (Aria) rendering buttons, gauges, and animated icons at 30+ FPS for QVGA/WVGA displays. Placed as the central MCU in a touch-screen operator panel, it interfaces to a touch controller via I2C/SPI while driving the display through PMP. This is preferable to using a separate graphics controller because the FPU accelerates scaling/rotation routines. Power dissipation at 200 MHz with active graphics is approximately 200 mA at 3.3 V, requiring the QFN exposed pad to be soldered to a continuous ground plane.
Empfohlen
Motor Control / Servo Drive
For field-oriented control (FOC) of 3-phase PMSM or BLDC motors, the PIC32MZ1024EFH064-I/MR's IEEE 754 single-precision FPU eliminates the fixed-point scaling overhead that previously dominated control firmware. The 200 MHz core runs the Park/Clarke transforms and SVM at PWM frequencies above 20 kHz with comfortable headroom, while the 12-bit ADC at 40 Msps captures phase currents synchronously. The dual-panel Flash enables live field updates to motor-control firmware without shutting down the drive. In a typical servo drive this MCU sits between the power stage gate drivers and the CAN/Ethernet interface, accepting torque/position commands and closing the current loop at PWM frequency. The 512 KB SRAM allows dual-current-loop + speed-loop state to coexist with the TCP/IP management interface.
Empfohlen
Automotive Telematics / Body Controller
The PIC32MZ1024EFH064-I/MR's dual CAN 2.0B controllers, 200 MHz core, and rich peripheral mix make it suitable for non-safety-critical automotive telematics and body-control modules. The integrated Ethernet MAC supports automotive audio-video bridging (AVB) and diagnostics over IP (DoIP), while CAN interfaces connect to the vehicle's powertrain and body networks. For under-the-hood or high-temperature zones, migrate to the E-grade variant (PIC32MZ1024EFH064-E/MR) rated -40 °C to +125 °C. Power consumption at typical automotive 12 V to 3.3 V regulation is approximately 0.5 W active, easily supplied by automotive-qualified LDO + buck converters. This part's 1 MB Flash accommodates AUTOSAR MCAL drivers and OEM-specific application layers.
Empfohlen
Building Automation / HVAC Controller
The PIC32MZ1024EFH064-I/MR's combination of Ethernet, USB, CAN, multiple UARTs, and 1 MB Flash supports building-automation controllers managing HVAC, lighting, and access-control subsystems. The 200 MHz MIPS32 core runs BACnet/IP or KNX/IP stacks concurrently with control loops for dampers, valves, and VFD coordination. Engineers integrate this MCU as the central building controller, with Ethernet uplink to the building management system and RS-485/Modbus downlinks to field devices. The -40 °C to +85 °C industrial rating supports unconditioned mechanical rooms. Compared to a Cortex-M4 + external PHY design, the integrated Ethernet MAC reduces PCB area by ~30%, valuable for fitting into standard electrical boxes.
Empfohlen
USB-Connected Embedded Device / Data Logger
The PIC32MZ1024EFH064-I/MR's integrated Hi-Speed USB 2.0 PHY and 1 MB Flash make it ideal for USB-connected data loggers and instrument peripherals. The HS USB controller supports 480 Mbps operation in host or device mode, enabling fast data uploads from ADC-equipped data acquisition systems. The dual-panel Flash supports firmware updates via USB while the logger continues sampling. In a typical USB oscilloscope or spectrum analyzer peripheral, this MCU captures data from a parallel ADC, buffers in 512 KB SRAM, and streams over USB to a host PC. Power consumption is approximately 120 mA at 200 MHz with active USB enumeration, easily supplied by bus-powered 5 V to 3.3 V LDO regulators.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFH064-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024ECG064-I/MR | PIC32MZ1024EFH064-I/PT | PIC32MZ1024EFH064-E/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm, MR) | 64-pin QFN (9x9 mm, MR) - same | 64-pin QFN (9x9 mm, MR) - same | 64-pin QFN (9x9 mm, MR) - same | 64-pin TQFP (10x10 mm, PT) | 64-pin QFN (9x9 mm, MR) - same |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU | Yes (single-precision) | Yes (single-precision) | No | Yes | Yes (single-precision) | Yes (single-precision) |
| Crypto Engine | None | AES/SHA/DES | None | AES/SHA | None | None |
| Temperature Grade | -40C to +85C (I-grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (E-grade) |
| Integrated HS USB 2.0 PHY | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Integrated HS USB 2.0 PHY eliminates external ULPI chip (vs. PIC32MZ1024EFF064-I/MR)
- No-Crypto variant lowers part cost vs. EFH610 (Crypto) (vs. PIC32MZ1024EFG064-I/MR)
- Pin-compatible with multiple speed/temperature grades (vs. PIC32MZ1024EFH064-I/PT (TQFP))
Designhinweise
The PIC32MZ1024EFH064-I/MR requires a clean 3.3 V supply capable of delivering peak current of ~200 mA at 200 MHz core frequency. Place a 0.1 µF + 1 µF ceramic decoupling capacitor pair on every VDD pin (pins 18, 36, 54), plus a 10 µF bulk capacitor near the IC. For noise-sensitive analog measurements, add a ferrite bead between the digital 3.3 V and AVDD rail, with separate decoupling on AVDD (pin 64). Estimated: at VIN=3.3V, ICC typical ~120 mA, so power dissipation ~0.4 W in the QFN package.
The 64-pin QFN (MR) package has an exposed thermal pad (EP) on pin 65 that MUST be soldered to a continuous ground plane for thermal dissipation. Without proper EP soldering, junction temperature can rise above the 125 °C maximum at 200 MHz continuous operation. Recommended thermal layout: at least 6 thermal vias (0.3 mm drill, 0.6 mm pad) under the EP connecting to the inner ground plane. Estimated: with proper EP soldering, theta_JA is approximately 28 °C/W, allowing ~3.6 W dissipation at 70 °C ambient.
For HS USB 2.0 operation at 480 Mbps, route the USB D+/D- traces as a 90 Ω differential pair with controlled impedance, keeping trace length under 25 mm. Place the USB connector within 25 mm of the IC's USB pins to avoid impedance discontinuities. For 10/100 Ethernet, route the MII or RMII signals as 50 Ω controlled-impedance traces, with the external LAN8740C PHY placed close to the IC. The crystal oscillator traces (OSC1/OSC2) should be as short as possible with a guard ring to ground.
Do not confuse the PIC32MZ1024EFH064 (No-Crypto, 64-QFN) with the PIC32MZ1024EFG064 (Crypto, 64-QFN) when ordering — both share the 64-QFN footprint, but firmware using the crypto engine will not work on the EFH variant. Also avoid confusing the I-grade (-40 °C to +85 °C) with the E-grade (-40 °C to +125 °C) when designing for automotive under-hood applications. Programming voltage: the device uses 3.3 V ICSP, not the older 5 V programming voltage of legacy PIC MCUs.
Compliance-Informationen
RoHS compliant per Microchip product page. AEC-Q100: this I-grade variant is industrial (-40C to +85C); for AEC-Q100 qualified automotive use, see the PIC32MZ1024EFH064-E/MR E-grade variant.
