PIC32MZ1024EFK144-I/JWX - 200MHz 32-bit MCU 1MB Flash | Microchip
Teilenummer: PIC32MZ1024EFK144-I/JWX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.45 | $44,50 |
| 100 | $4 | $400,00 |
| 500 | $3.55 | $1.775,00 |
| 1.000 | $3.1 | $3.100,00 |
PIC32MZ1024EFK144-I/JWX Übersicht
A microcontroller (MCU) is an integrated circuit containing a CPU core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals (UART, I2C, SPI, ADC, timers, GPIO) on a single silicon die. Modern 32-bit MCUs such as the PIC32MZ family occupy the high-performance tier of the microcontroller taxonomy: microcontroller -> 32-bit MCU -> ARM/MIPS Cortex- and Warrior-class MCU -> high-performance connectivity MCU with FPU and DSP. They are differentiated from 8/16-bit MCUs by wider datapaths, higher clock rates, larger memory, and DSP/FPU capabilities, and from microprocessors (MPUs) by integrating memory and peripherals on-chip.
Key features of the PIC32MZ1024EFK144-I/JWX include: 200 MHz core delivering up to 330 DMIPS, dual-panel Flash supporting live update, hardware crypto engine, two CAN modules, high-speed USB, Ethernet, 12-bit ADC, SQI (Serial Quad Interface) for external memory, and a peripheral pin select (PPS) system that allows flexible remapping of digital peripherals to GPIO. The device operates from 2.3 V to 3.6 V and supports an industrial temperature grade of -40°C to +85°C (the I suffix).
From an architecture standpoint, the PIC32MZ EF core is a 32-bit Harvard architecture with separate Flash and SRAM buses, prefetch cache to mask Flash latency, and a tightly-coupled FPU. The 144-ball TFBGA package exposes up to 120 GPIO lines via the peripheral pin select, making the device well-suited to graphics HMI panels, multi-protocol gateway designs, and motor-control firmware where high CPU throughput and deterministic interrupt response matter.
Typical applications include industrial IoT gateways with Ethernet and CAN, graphical HMI panels with TFT LCD driving, automotive connectivity and body controllers (non-AEC-Q100 grade), brushless-DC and stepper motor control, and high-performance consumer connectivity products. Designers leverage the FPU for sensor-fusion DSP, the crypto engine for TLS/DTLS acceleration, and the dual-panel Flash for secure firmware-over-the-air (FOTA) update flows.
When planning layout for this part, place 0.1 µF decoupling capacitors adjacent to every VDDCORE/VDDIO pair and follow Microchip's BGA fanout recommendation in the datasheet PCB layout section, since 0.65 mm-pitch BGA escape routing is non-trivial. Designers should also budget for the chip's internal core voltage regulator stabilization network (4.7 µF + 0.1 µF) before issuing the board layout, and confirm the device variant's temperature grade and Flash size against your firmware image and environmental spec.
This page synthesizes distributor stock, pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design considerations not found in a single datasheet, helping engineers shorten the BOM, layout, and qualification cycle for a 200 MHz-class 32-bit MCU with FPU.
Drop-in-Alternativen für PIC32MZ1024EFK144-I/JWX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFK144-I/JWX (gleiche Bauform und Footprint) – abweichend in ADC, Core Architecture, Operating Temperature, Package, CAN.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFK144-E/JWX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1024EFK144T-I/JWX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1024EFG144T-E/JWX
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.85 / Stück
Datenblatt ansehen →PIC32MZ0512EFK144T-I/JWX
✅ Drop-In✓ Auf Lager
$9.3 / Stück
Datenblatt ansehen →PIC32MZ1024EFF144T-E/JWX
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.12 / Stück
Datenblatt ansehen →PIC32MZ1024EFK144-I/JWX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (Warrior) |
| Core Frequency | 200 MHz (330 DMIPS) |
| FPU | IEEE 754-compliant single/double precision |
| DSP Extensions | Yes (4x 64-bit accumulators, single-cycle MAC, saturating & fractional math) |
| Program Flash | 1024 KB (1 MB), dual-panel for live update |
| SRAM | 256 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Betriebstemperatur | -40 °C to +85 °C (I grade) |
| Gehäuse | 144-ball TFBGA (JWX), 7x7 mm, 0.65 mm pitch |
| GPIO Count | Up to 120 (via Peripheral Pin Select) |
| Communication Interfaces | USB (HS), Ethernet MAC, 2x CAN, SQI, UART, SPI, I2C, I2S |
| ADC | 12-bit, up to ~5 MSPS |
| Crypto Engine | Hardware (AES, hashing, RNG) |
| DMA | Yes (multi-channel) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
PIC32MZ1024EFK144-I/JWX 144-ball tfbga (jwx), 7x7 mm, 0.65 mm pitch Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFK144-I/JWX (144-ball tfbga (jwx), 7x7 mm, 0.65 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFK144-I/JWX.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFK144-I/JWX ist geeignet für 7 Anwendungs: Industrial IoT Gateway, Graphics HMI Panels, Brushless DC Motor Control (FOC), Automotive Connectivity Modules, Smart Home and Consumer Connectivity, Test and Measurement Instrumentation, Industrial Sensor Hub.
Industrial IoT Gateway
The PIC32MZ1024EFK144-I/JWX fits industrial IoT gateways because its 200 MHz MIPS32 core with IEEE 754 FPU and DSP extensions can sustain TLS/DTLS handshakes accelerated by the hardware crypto engine, while the integrated Ethernet MAC and dual CAN ports support fieldbus protocols (Modbus TCP, CANopen) without an external PHY or transceiver. The 1 MB Flash / 256 KB SRAM hosts a full TCP/IP stack (e.g., MPLAB Harmony Net) plus application firmware for sensor aggregation, and the -40 °C to +85 °C industrial temperature grade meets most factory-floor requirements. Its pin count (120 GPIO via PPS) handles multi-protocol bridging on a single board.
Empfohlen
Graphics HMI Panels
The PIC32MZ1024EFK144-I/JWX drives graphical HMI panels thanks to its 330 DMIPS throughput and dedicated TFT LCD controller peripherals (graphics controller with hardware acceleration). The 200 MHz core sustains real-time UI rendering, and the peripheral pin select (PPS) system lets the designer route the parallel RGB interface to any convenient ball on the 144-TFBGA package. With 256 KB of SRAM available as a framebuffer or partial framebuffer, modest 320x240 to 480x272 panels run smoothly. The hardware FPU accelerates image transforms and anti-aliased font rendering for high-end HMI designs.
Empfohlen
Brushless DC Motor Control (FOC)
Field-oriented control (FOC) of brushless-DC motors requires deterministic PWM generation and fast sine/cosine math, both of which the PIC32MZ1024EFK144-I/JWX delivers through its 200 MHz MIPS core with FPU and DSP extensions. The four 64-bit accumulators and single-cycle MAC enable real-time Park/Clarke transforms inside the current control loop, while the configurable PWM peripheral provides complementary center-aligned outputs with hardware dead-time insertion for 3-phase inverter drives. The 12-bit ADC at up to ~5 MSPS samples phase currents at the PWM rate. Up to 120 GPIO via PPS give the designer flexibility to map encoder, Hall, and fault signals across the TFBGA balls.
Empfohlen
Automotive Connectivity Modules
The PIC32MZ1024EFK144-I/JWX serves automotive connectivity modules (non-AEC-Q100 grade) such as CAN-to-Ethernet bridges, body controllers, and OBD-II gateways. The integrated dual CAN modules and Ethernet MAC let the firmware be modeled as a multi-protocol bridge on a single chip, while the hardware crypto engine accelerates secure boot and message authentication. The industrial temperature grade (-40 °C to +85 °C) covers under-dash and cabin modules; for under-hood or AEC-Q100 requirements, designers should switch to the AEC-Q100-qualified PIC32MZ EF variants. The 144-TFBGA footprint supports compact PCB layouts.
Empfohlen
Smart Home and Consumer Connectivity
The PIC32MZ1024EFK144-I/JWX powers smart home hubs, mesh-network gateways, and Wi-Fi/Ethernet/BLE bridge devices by combining the 200 MHz MIPS32 core with the hardware crypto engine for TLS sessions, integrated Ethernet MAC for wired backhaul, and ample GPIO for peripheral expansion (sensor I2C buses, SPI displays, PWM LED drivers). The 1 MB dual-panel Flash supports firmware-over-the-air (FOTA) updates with rollback safety, a critical feature for connected consumer products. Low-power Run/Idle/Backup modes through the PIC32 sleep controller let the device sip power when idle, extending battery life in wireless sensor bridges.
Empfohlen
Test and Measurement Instrumentation
The PIC32MZ1024EFK144-I/JWX is well suited to test-and-measurement front-ends where the 12-bit ADC at multi-MSPS sampling rate, combined with the DMA-driven acquisition engine, captures waveforms without CPU intervention. The 200 MHz MIPS core with FPU runs signal-processing algorithms (FFT, FIR filters) on streamed data, while the SQI (Serial Quad Interface) peripheral streams results to an external QSPI Flash for log storage. The peripheral pin select (PPS) lets the designer route high-speed trigger signals to dedicated timers, achieving deterministic timing in automated test equipment.
Empfohlen
Industrial Sensor Hub
The PIC32MZ1024EFK144-I/JWX aggregates multiple industrial sensors (temperature, pressure, flow, vibration) via I2C, SPI and UART buses thanks to its high peripheral count and PPS flexibility. The 200 MHz core runs sensor-fusion algorithms (Kalman filters, exponential averaging) in real time, while the hardware FPU accelerates floating-point math. The dual CAN ports forward processed sensor data to a fieldbus master, and the Ethernet MAC pushes telemetry to a SCADA dashboard. With -40 °C to +85 °C operation, the device handles factory environments, and the 1 MB Flash / 256 KB SRAM easily hosts the firmware plus a TCP/IP stack.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFK144-I/JWX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFK144-E/JWX | PIC32MZ1024EFK144T-I/JWX | PIC32MZ1024EFG144T-E/JWX | PIC32MZ0512EFK144T-I/JWX | PIC32MZ1024EFF144T-E/JWX |
|---|---|---|---|---|---|---|
| Package | 144-TFBGA (JWX) 7x7 mm | 144-TFBGA (JWX) 7x7 mm | 144-TFBGA (JWX) 7x7 mm | 144-TFBGA (JWX) 7x7 mm | 144-TFBGA (JWX) 7x7 mm | 144-TFBGA (JWX) 7x7 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 1024 KB (1 MB) | 512 KB (-50%) | 1024 KB (1 MB) |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| Temperature Grade | Industrial (-40C to +85C) | Extended (-40C to +125C) | Industrial (-40C to +85C) | Extended (-40C to +125C) | Industrial (-40C to +85C) | Extended (-40C to +125C) |
| FPU | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) |
| Hardware Crypto Engine | Yes | Yes | Yes | Yes | Yes | Yes |
| Packaging Format | Tray | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- 1 MB dual-panel Flash for firmware-over-the-air updates (vs. PIC32MZ0512EFK144T-I/JWX)
- Industrial temperature grade in compact 144-TFBGA footprint (vs. PIC32MZ1024EFK144T-I/JWX)
- Hardware crypto engine and 256 KB SRAM for TLS acceleration (vs. PIC32MX795F512L-80I/BG (predecessor PIC32MX MCU))
Designhinweise
Estimated: The 144-TFBGA package at 0.65 mm pitch requires a 4-layer PCB with microvia fanout for signal break-out. Per Microchip application note AN2686, route traces on the top layer directly out of BGA balls where possible, and use dog-bone fanout with vias-in-pad only if the PCB fab supports it. Decoupling: place a 0.1 µF X7R capacitor adjacent to every VDDCORE/VDDIO pair, plus bulk 4.7 µF + 0.1 µF on the internal 1.2 V regulator stabilization pins. Ground return vias must be co-located with each decoupling capacitor via to reduce parasitic inductance.
The PIC32MZ1024EFK144-I/JWX has an internal 1.2 V core voltage regulator driven from the 3.3 V VDD rail. Place the datasheet-recommended 4.7 µF + 0.1 µF network on the VCAP pin (the regulator output), and ensure the 3.3 V rail can supply up to ~150 mA peak for the core + peripherals. Add a bulk 10 µF + 0.1 µF on the 3.3 V input, and use a ferrite bead to isolate analog AVDD from noisy digital VDD if your design uses the ADC. Sleep-mode current drops to under 30 mA per the family datasheet, but standby current is higher than the PIC32MX family - factor this into battery designs.
Use Microchip's MPLAB Harmony Configurator (MHC) pin manager to assign peripheral functions to physical balls before locking the PCB layout - the Peripheral Pin Select (PPS) system allows remapping but the resulting signal integrity depends on the layout. Place the 50 MHz external crystal (if used) within 5 mm of the OSC1/OSC2 balls with a grounded guard ring, and route USB DP/DN as a 90-ohm differential pair with length matching within 150 mil (3.8 mm). For Ethernet, route RMII signals length-matched to the PHY within 50 mil.
Three pitfalls to avoid: (1) Confusing the PIC32MZ1024EFK144-I/JWX (TFBGA 'K' ballout) with the PIC32MZ1024EFG144-I/JWX (LQFP 'G' package) - they are NOT pin-compatible even though both are 'EF'. (2) Do not exceed 3.6 V on any VDDIO ball - the absolute maximum is 4.0 V but reliability degrades above 3.6 V. (3) When migrating from PIC32MX to PIC32MZ, note that the I/O port naming and peripheral library differ; do not assume drop-in software compatibility without recompiling against the PIC32MZ Harmony framework.
Compliance-Informationen
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100-qualified PIC32MZ EF variants for automotive. Halogen-free status not stated in the provided data.
