Microchip Technology

PIC32MZ1024EFK144-I/JWX - 200MHz 32-bit MCU 1MB Flash | Microchip

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2.3 V to 3.6 V Vdss 144-ball TFBGA (JWX), 7x7 mm, 0.65 mm pitch Package 200 MHz (330 DMIPS) Speed 1024 KB (1 MB), dual-panel for live update Memory
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Price updated: 2026-10-04
Volume Pricing
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1 $4.85 $4.85
10 $4.45 $44.50
100 $4 $400.00
500 $3.55 $1,775.00
1,000 $3.1 $3,100.00
ℹ️ All prices are in USD

PIC32MZ1024EFK144-I/JWX Overview

The Microchip Technology PIC32MZ1024EFK144-I/JWX is a 32-bit MIPS32 M-Class microcontroller running at 200 MHz with 1 MB (1024 KB) of Flash and 256 KB of SRAM, packaged in a 144-ball Thin Fine-Pitch BGA (TFBGA) measuring 7x7 mm with 0.65 mm pitch. It is a member of the PIC32MZ EF family of Embedded Connectivity with Floating Point Unit devices, integrating an IEEE 754-compliant FPU and a DSP-enhanced core with four 64-bit accumulators and single-cycle MAC, saturating, and fractional math. According to the Microchip product page, the EF family targets connectivity applications in Industrial, Automotive, IoT, Graphics (HMI) and Motor Control market segments, supporting up to 2 MB Flash and 512 KB SRAM across the family.

A microcontroller (MCU) is an integrated circuit containing a CPU core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals (UART, I2C, SPI, ADC, timers, GPIO) on a single silicon die. Modern 32-bit MCUs such as the PIC32MZ family occupy the high-performance tier of the microcontroller taxonomy: microcontroller -> 32-bit MCU -> ARM/MIPS Cortex- and Warrior-class MCU -> high-performance connectivity MCU with FPU and DSP. They are differentiated from 8/16-bit MCUs by wider datapaths, higher clock rates, larger memory, and DSP/FPU capabilities, and from microprocessors (MPUs) by integrating memory and peripherals on-chip.

Key features of the PIC32MZ1024EFK144-I/JWX include: 200 MHz core delivering up to 330 DMIPS, dual-panel Flash supporting live update, hardware crypto engine, two CAN modules, high-speed USB, Ethernet, 12-bit ADC, SQI (Serial Quad Interface) for external memory, and a peripheral pin select (PPS) system that allows flexible remapping of digital peripherals to GPIO. The device operates from 2.3 V to 3.6 V and supports an industrial temperature grade of -40°C to +85°C (the I suffix).

From an architecture standpoint, the PIC32MZ EF core is a 32-bit Harvard architecture with separate Flash and SRAM buses, prefetch cache to mask Flash latency, and a tightly-coupled FPU. The 144-ball TFBGA package exposes up to 120 GPIO lines via the peripheral pin select, making the device well-suited to graphics HMI panels, multi-protocol gateway designs, and motor-control firmware where high CPU throughput and deterministic interrupt response matter.

Typical applications include industrial IoT gateways with Ethernet and CAN, graphical HMI panels with TFT LCD driving, automotive connectivity and body controllers (non-AEC-Q100 grade), brushless-DC and stepper motor control, and high-performance consumer connectivity products. Designers leverage the FPU for sensor-fusion DSP, the crypto engine for TLS/DTLS acceleration, and the dual-panel Flash for secure firmware-over-the-air (FOTA) update flows.

When planning layout for this part, place 0.1 µF decoupling capacitors adjacent to every VDDCORE/VDDIO pair and follow Microchip's BGA fanout recommendation in the datasheet PCB layout section, since 0.65 mm-pitch BGA escape routing is non-trivial. Designers should also budget for the chip's internal core voltage regulator stabilization network (4.7 µF + 0.1 µF) before issuing the board layout, and confirm the device variant's temperature grade and Flash size against your firmware image and environmental spec.

This page synthesizes distributor stock, pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design considerations not found in a single datasheet, helping engineers shorten the BOM, layout, and qualification cycle for a 200 MHz-class 32-bit MCU with FPU.

Drop-in alternatives for PIC32MZ1024EFK144-I/JWX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MZ1024EFK144-I/JWX (same form factor and footprint) — differing in ADC, Core Architecture, Operating Temperature, Package, CAN.

Microchip Technology
ADC: 12-bit up to 48 MSPS
Core Architecture: MIPS32 microAptiv M-Class
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
ADC: 12-bit, up to 48 MSPS
Core Architecture: MIPS32 M-Class (PIC32)
Operating Temperature: -40C to +125C (E grade)
Microchip Technology
ADC: 12-bit, up to 5 Msps
Core Architecture: MIPS32 M-Class (PIC32MZ)
Operating Temperature: -40C to +125C (automotive grade)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MZ1024EFK144-E/JWX

✅ Drop-In
📦 144-TFBGA (JWX)
Identical die and 144-TFBGA package; -E extended temp grade (-40C to +125C) vs -I industrial (-40C to +85C); pin-to-pin compatible footprint

📋 Reference alternative (not in catalog)

PIC32MZ1024EFK144T-I/JWX

✅ Drop-In
📦 144-TFBGA (JWX)
Same die/package as PIC32MZ1024EFK144-I/JWX; tape-and-reel packing suffix for high-volume assembly; electrically identical

📋 Reference alternative (not in catalog)

PIC32MZ1024EFG144T-E/JWX

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 144-TFBGA (JWX)
MIPS32 M-Class (PIC32MZ) · 200 MHz max (180 MHz on -E speed grade per distributor listings) · 1 MB (1024 KB) · 512 KB · 3.3 V (2.0 V to 3.6 V I/O range) · 144-TFBGA, 7 mm x 7 mm · 120 (approx.) · 12-bit, up to 5 Msps

✓ In Stock

$5.85 / Unit

View Datasheet →

PIC32MZ0512EFK144T-I/JWX

✅ Drop-In
Microchip Technology
📦 144-TFBGA (JWX)
MIPS32 microAptiv M-Class · 200 MHz (max) · 512 KB (512K x 8) · 128 KB · Yes (single/double precision IEEE 754) · 144-TFBGA (JWX) 7x7 mm, 0.5 mm pitch · -40C to +85C (Industrial) · 2.2 V to 3.6 V

✓ In Stock

$9.3 / Unit

View Datasheet →

PIC32MZ1024EFF144T-E/JWX

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 144-TFBGA (JWX)
MIPS32 M-Class (PIC32) · 180 MHz (200 MHz on -I variant) · 1 MB (1M x 8) · 256 KB · Yes (single/double precision) · Yes (DSP-enhanced ASE) · 8 · 120

✓ In Stock

$9.12 / Unit

View Datasheet →

PIC32MZ1024EFK144-I/JWX Maximum Ratings & Electrical Characteristics

Core Architecture MIPS32 M-Class (Warrior)
Core Frequency 200 MHz (330 DMIPS)
FPU IEEE 754-compliant single/double precision
DSP Extensions Yes (4x 64-bit accumulators, single-cycle MAC, saturating & fractional math)
Program Flash 1024 KB (1 MB), dual-panel for live update
SRAM 256 KB
Supply Voltage (VDD) 2.3 V to 3.6 V
Operating Temperature -40 °C to +85 °C (I grade)
Package 144-ball TFBGA (JWX), 7x7 mm, 0.65 mm pitch
GPIO Count Up to 120 (via Peripheral Pin Select)
Communication Interfaces USB (HS), Ethernet MAC, 2x CAN, SQI, UART, SPI, I2C, I2S
ADC 12-bit, up to ~5 MSPS
Crypto Engine Hardware (AES, hashing, RNG)
DMA Yes (multi-channel)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

PIC32MZ1024EFK144-I/JWX 144-ball tfbga (jwx), 7x7 mm, 0.65 mm pitch Pin Configuration Guide

Pin configuration for PIC32MZ1024EFK144-I/JWX (144-ball tfbga (jwx), 7x7 mm, 0.65 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

144-ball tfbga (jwx), 7x7 mm, 0.65 mm pitch package pinout diagram for PIC32MZ1024EFK144-I/JWX

No detailed pinout data available for PIC32MZ1024EFK144-I/JWX.

Refer to the datasheet for full pin configuration.

Typical Applications

PIC32MZ1024EFK144-I/JWX is suitable for 7 applications: Industrial IoT Gateway, Graphics HMI Panels, Brushless DC Motor Control (FOC), Automotive Connectivity Modules, Smart Home and Consumer Connectivity, Test and Measurement Instrumentation, Industrial Sensor Hub.

🏭

Industrial IoT Gateway

The PIC32MZ1024EFK144-I/JWX fits industrial IoT gateways because its 200 MHz MIPS32 core with IEEE 754 FPU and DSP extensions can sustain TLS/DTLS handshakes accelerated by the hardware crypto engine, while the integrated Ethernet MAC and dual CAN ports support fieldbus protocols (Modbus TCP, CANopen) without an external PHY or transceiver. The 1 MB Flash / 256 KB SRAM hosts a full TCP/IP stack (e.g., MPLAB Harmony Net) plus application firmware for sensor aggregation, and the -40 °C to +85 °C industrial temperature grade meets most factory-floor requirements. Its pin count (120 GPIO via PPS) handles multi-protocol bridging on a single board.

📺

Graphics HMI Panels

The PIC32MZ1024EFK144-I/JWX drives graphical HMI panels thanks to its 330 DMIPS throughput and dedicated TFT LCD controller peripherals (graphics controller with hardware acceleration). The 200 MHz core sustains real-time UI rendering, and the peripheral pin select (PPS) system lets the designer route the parallel RGB interface to any convenient ball on the 144-TFBGA package. With 256 KB of SRAM available as a framebuffer or partial framebuffer, modest 320x240 to 480x272 panels run smoothly. The hardware FPU accelerates image transforms and anti-aliased font rendering for high-end HMI designs.

🏭

Brushless DC Motor Control (FOC)

Field-oriented control (FOC) of brushless-DC motors requires deterministic PWM generation and fast sine/cosine math, both of which the PIC32MZ1024EFK144-I/JWX delivers through its 200 MHz MIPS core with FPU and DSP extensions. The four 64-bit accumulators and single-cycle MAC enable real-time Park/Clarke transforms inside the current control loop, while the configurable PWM peripheral provides complementary center-aligned outputs with hardware dead-time insertion for 3-phase inverter drives. The 12-bit ADC at up to ~5 MSPS samples phase currents at the PWM rate. Up to 120 GPIO via PPS give the designer flexibility to map encoder, Hall, and fault signals across the TFBGA balls.

🚗

Automotive Connectivity Modules

The PIC32MZ1024EFK144-I/JWX serves automotive connectivity modules (non-AEC-Q100 grade) such as CAN-to-Ethernet bridges, body controllers, and OBD-II gateways. The integrated dual CAN modules and Ethernet MAC let the firmware be modeled as a multi-protocol bridge on a single chip, while the hardware crypto engine accelerates secure boot and message authentication. The industrial temperature grade (-40 °C to +85 °C) covers under-dash and cabin modules; for under-hood or AEC-Q100 requirements, designers should switch to the AEC-Q100-qualified PIC32MZ EF variants. The 144-TFBGA footprint supports compact PCB layouts.

🧩

Smart Home and Consumer Connectivity

The PIC32MZ1024EFK144-I/JWX powers smart home hubs, mesh-network gateways, and Wi-Fi/Ethernet/BLE bridge devices by combining the 200 MHz MIPS32 core with the hardware crypto engine for TLS sessions, integrated Ethernet MAC for wired backhaul, and ample GPIO for peripheral expansion (sensor I2C buses, SPI displays, PWM LED drivers). The 1 MB dual-panel Flash supports firmware-over-the-air (FOTA) updates with rollback safety, a critical feature for connected consumer products. Low-power Run/Idle/Backup modes through the PIC32 sleep controller let the device sip power when idle, extending battery life in wireless sensor bridges.

🔧

Test and Measurement Instrumentation

The PIC32MZ1024EFK144-I/JWX is well suited to test-and-measurement front-ends where the 12-bit ADC at multi-MSPS sampling rate, combined with the DMA-driven acquisition engine, captures waveforms without CPU intervention. The 200 MHz MIPS core with FPU runs signal-processing algorithms (FFT, FIR filters) on streamed data, while the SQI (Serial Quad Interface) peripheral streams results to an external QSPI Flash for log storage. The peripheral pin select (PPS) lets the designer route high-speed trigger signals to dedicated timers, achieving deterministic timing in automated test equipment.

🏭

Industrial Sensor Hub

The PIC32MZ1024EFK144-I/JWX aggregates multiple industrial sensors (temperature, pressure, flow, vibration) via I2C, SPI and UART buses thanks to its high peripheral count and PPS flexibility. The 200 MHz core runs sensor-fusion algorithms (Kalman filters, exponential averaging) in real time, while the hardware FPU accelerates floating-point math. The dual CAN ports forward processed sensor data to a fieldbus master, and the Ethernet MAC pushes telemetry to a SCADA dashboard. With -40 °C to +85 °C operation, the device handles factory environments, and the 1 MB Flash / 256 KB SRAM easily hosts the firmware plus a TCP/IP stack.

Recommended Products Summary

LAN8742A 10/100 Ethernet PHY for external MII/RMII connection Used in: Industrial IoT Gateway MCP25625 CAN FD transceiver matching the on-chip CAN module Used in: Industrial IoT Gateway, Automotive Connectivity Modules AT25SF321 External SPI Flash for firmware log or data buffering Used in: Industrial IoT Gateway PIC32MZ1024EFH144-I/PH Microchip Technology Used in: Graphics HMI Panels MTF017QN-A QVGA TFT LCD display driven by parallel RGB interface Used in: Graphics HMI Panels MCP8024 3-phase brushless DC gate driver with built-in LDO Used in: Brushless DC Motor Control (FOC) ACS712 Allegro MicroSystems Used in: Brushless DC Motor Control (FOC) TLE7259-3 LIN/CAN SBC (system basis chip) for in-vehicle networks Used in: Automotive Connectivity Modules ATWINC1500 Wi-Fi module for wireless connectivity expansion Used in: Smart Home and Consumer Connectivity ATECC608B Hardware authentication IC complementing the MCU's crypto engine Used in: Smart Home and Consumer Connectivity ADS8860 External 16-bit ADC for higher-precision measurement channels Used in: Test and Measurement Instrumentation W25Q64JV External QSPI Flash for measurement log buffering via SQI Used in: Test and Measurement Instrumentation MCP9808 High-accuracy I2C temperature sensor Used in: Industrial Sensor Hub MPXV7002DP NXP Semiconductors Used in: Industrial Sensor Hub
What is the operating voltage of PIC32MZ1024EFK144-I/JWX?
The PIC32MZ1024EFK144-I/JWX operates from 2.3 V to 3.6 V on the VDDIO/VDD rails, with an internal 1.2 V core voltage generated by the on-chip regulator. According to the Microchip PIC32MZ EF family datasheet, operating outside this range risks Flash read integrity and ADC accuracy. Always decouple the core regulator pins with the datasheet-recommended 4.7 µF + 0.1 µF network.
What is the Flash memory size and RAM of PIC32MZ1024EFK144-I/JWX?
The PIC32MZ1024EFK144-I/JWX integrates 1024 KB (1 MB) of dual-panel Flash supporting live firmware update and 256 KB of SRAM. According to the Microchip product page and family datasheet, the dual-panel architecture lets you run from one panel while writing the other, enabling firmware-over-the-air (FOTA) without downtime. Note: the family max is 2 MB Flash / 512 KB SRAM on larger variants.
Where can I buy PIC32MZ1024EFK144-I/JWX online?
The PIC32MZ1024EFK144-I/JWX is in stock at Microchip-authorized distributors including DigiKey, Mouser, LCSC and Octopart-listed resellers. As of October 2026, LCSC lists the part at approximately $4.85 per unit, with quantity discounts kicking in at 100 pieces. Lead time for direct Microchip orders typically runs 8-12 weeks for tray quantities.
What is the price of PIC32MZ1024EFK144-I/JWX at quantity 100?
As of October 2026, the PIC32MZ1024EFK144-I/JWX prices at approximately $4.00 per unit at 100-piece quantity, dropping further to $3.10 at 1,000 pieces (DigiKey/Mouser reference pricing). LCSC's single-piece price is around $4.85. For OEM volume (>5k), request a direct quote from Microchip or authorized distributors to unlock the best price tier.
What is the lead time for PIC32MZ1024EFK144-I/JWX?
As of October 2026, the PIC32MZ1024EFK144-I/JWX lead time at major distributors (DigiKey, Mouser) is typically 8-12 weeks when not in distributor stock, with smaller quantities often available from LCSC and Avnet. The PIC32MZ EF family is in active production at Microchip, so confirmed orders are firm. Always confirm current stock via Octopart before committing to a design schedule.
Is PIC32MZ1024EFK144-I/JWX in stock?
Yes, as of October 2026 the PIC32MZ1024EFK144-I/JWX is in stock at LCSC and intermittently stocked at DigiKey and Mouser in tray quantity. The PIC32MZ EF family is in active production, so Microchip direct orders are also available. For urgent prototyping, LCSC provides the fastest single-piece fulfillment; for production, request a factory-direct quote from Microchip.
PIC32MZ1024EFK144-I/JWX vs PIC32MZ1024EFG144-I/JWX — what is the difference?
The PIC32MZ1024EFK144-I/JWX is part of the EF 'K' sub-family (144-pin TFBGA), while the PIC32MZ1024EFG144-I/JWX is the 'G' sub-family (144-pin LQFP). Both share the same MIPS32 M-Class core, 200 MHz speed, 1 MB Flash and 256 KB SRAM, but they differ in package: TFBGA 7x7 mm vs LQFP 16x16 mm. They are NOT pin-to-pin compatible because the BGA ball map differs from the QFP pin map; pick the package that matches your PCB layout.
What is the difference between PIC32MZ1024EFK144-I/JWX and PIC32MZ1024EFK144-E/JWX?
The two parts share the same die, package (144-TFBGA), 1 MB Flash and 256 KB SRAM, but the -I suffix denotes an industrial temperature grade (-40 °C to +85 °C) while the -E suffix denotes an extended temperature grade (-40 °C to +125 °C). The -E variant is rated for harsher environments but is not AEC-Q100 qualified; for true automotive-grade selection, look at the PIC32MZ EF AEC-Q100 catalog. Functionally and pin-compatible for non-automotive uses.
When should I choose PIC32MZ1024EFK144-I/JWX over a PIC32MX MCU?
Choose the PIC32MZ1024EFK144-I/JWX over a PIC32MX (e.g., PIC32MX795F512L) when you need higher CPU performance (>200 MHz vs 80 MHz), more memory (1 MB Flash vs 512 KB), a hardware FPU and DSP extensions, and connectivity peripherals like Ethernet, CAN, and high-speed USB. The PIC32MX remains competitive for cost-sensitive, lower-throughput designs; the PIC32MZ EF is the right choice for IoT gateways, HMI panels, and motor control.
Is PIC32MZ1024EFK144-I/JWX suitable for industrial IoT gateway designs?
Yes, the PIC32MZ1024EFK144-I/JWX is well suited for industrial IoT gateways. Its 200 MHz MIPS32 core with FPU handles TLS/DTLS handshake acceleration via the hardware crypto engine, the integrated Ethernet MAC and dual CAN ports support fieldbus and industrial Ethernet protocols, and the industrial -40 °C to +85 °C temperature grade meets most factory-floor requirements. The 1 MB Flash / 256 KB SRAM footprint comfortably hosts an embedded TCP/IP stack plus application logic.
What is the best drop-in replacement for PIC32MZ1024EFK144-I/JWX?
The best drop-in replacement for the PIC32MZ1024EFK144-I/JWX in the same 144-TFBGA (JWX) footprint is the PIC32MZ1024EFG144T-E/JWX, which shares the same die, memory, and peripherals in the same package but swaps to the 'G' sub-family ballout. Within the same 'K' sub-family and TFBGA package, the PIC32MZ1024EFH144-I/PH (LQFP-144) is NOT pin-compatible because the package differs. Verify against your specific schematic before substituting.
Can PIC32MZ1024EFG144-I/JWX replace PIC32MZ1024EFK144-I/JWX?
No — the PIC32MZ1024EFG144-I/JWX uses a 144-ball TFBGA ballout that differs from the PIC32MZ1024EFK144-I/JWX because the 'K' and 'G' sub-families have different peripheral-to-ball mappings even in the same physical TFBGA. They share memory and core but require PCB rework. For a true drop-in alternative on the same footprint, choose a same-'K'-sub-family part like PIC32MZ1024EFK144-E/JWX (extended temp) instead.
Where to download PIC32MZ1024EFK144-I/JWX datasheet PDF?
The official PIC32MZ1024EFK144-I/JWX datasheet PDF is available on Microchip's website under the PIC32MZ EF family datasheet document. The family datasheet covers the entire PIC32MZ EF lineup including the 144-TFBGA variants; pinout and electrical characteristics are documented there. Microchip also publishes a separate PIC32M Family Reference Manual for peripheral details not in the device-specific datasheet.
Where to find PIC32MZ1024EFK144-I/JWX pinout?
The PIC32MZ1024EFK144-I/JWX pinout is documented in the PIC32MZ EF family datasheet, in the 'Pinout and Packaging' section for the 144-TFBGA (JWX) variant. The datasheet provides a complete 144-ball map with signal names, ball coordinates, and peripheral pin select (PPS) remapping tables. For schematic capture, use Microchip's MPLAB Harmony Configurator (MHC) pin manager, which exports the pinout directly into your CAD tool.
What are the key specifications of PIC32MZ1024EFK144-I/JWX that engineers should know?
Key specs: 200 MHz MIPS32 M-class core (330 DMIPS) with IEEE 754 FPU and DSP extensions; 1024 KB dual-panel Flash supporting live update; 256 KB SRAM; 144-ball TFBGA 7x7 mm package; 2.3-3.6 V supply; -40 °C to +85 °C industrial temp grade; up to 120 GPIO via peripheral pin select; integrated Ethernet MAC, dual CAN, HS USB, SQI, 12-bit ADC, and hardware crypto engine. According to the Microchip product page, the EF family targets industrial, IoT, automotive and motor-control designs.
What is the best Microchip alternative for PIC32MZ1024EFK144-I/JWX in the same package?
Within Microchip's portfolio, the closest same-package drop-in alternatives for the PIC32MZ1024EFK144-I/JWX are other 'EF' family members with the 144-TFBGA (JWX) ballout. Candidates include the PIC32MZ1024EFG144T-E/JWX (same TFBGA footprint, E temperature grade) and other EF-family TFBGA variants in the 1 MB Flash tier. Always verify the ball map against your PCB footprint before substitution, and prefer parts already on Microchip's active stock list.

Engineering reference data for PIC32MZ1024EFK144-I/JWX — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MZ1024EFK144-I/JWX when you need a high-performance 32-bit MCU with FPU and DSP for industrial IoT gateways, motor-control FOC, or graphical HMI panels in a compact 144-TFBGA footprint. Pick the PIC32MZ1024EFK144-E/JWX for the same silicon in an extended temperature grade (-40C to +125C) for harsher environments. Choose the PIC32MZ0512EFK144T-I/JWX when you can accept 512 KB Flash for cost-sensitive applications. For tape-and-reel assembly in high-volume SMT lines, choose the -T suffix variants. For designs that need an LQFP package (easier rework), pick the PIC32MZ1024EFH144-I/PH or PIC32MZ1024EFF144-I/PH, but note that LQFP-to-TFBGA requires PCB rework. All 'K' sub-family TFBGA parts share the same die and peripherals, so software compatibility is preserved across the family.

Comparison with Alternatives

Parameter This Product PIC32MZ1024EFK144-E/JWX PIC32MZ1024EFK144T-I/JWX PIC32MZ1024EFG144T-E/JWX PIC32MZ0512EFK144T-I/JWX PIC32MZ1024EFF144T-E/JWX
Package 144-TFBGA (JWX) 7x7 mm 144-TFBGA (JWX) 7x7 mm 144-TFBGA (JWX) 7x7 mm 144-TFBGA (JWX) 7x7 mm 144-TFBGA (JWX) 7x7 mm 144-TFBGA (JWX) 7x7 mm
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core Frequency 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Flash Memory 1024 KB (1 MB) 1024 KB (1 MB) 1024 KB (1 MB) 1024 KB (1 MB) 512 KB (-50%) 1024 KB (1 MB)
SRAM 256 KB 256 KB 256 KB 256 KB 128 KB (-50%) 256 KB
Temperature Grade Industrial (-40C to +85C) Extended (-40C to +125C) Industrial (-40C to +85C) Extended (-40C to +125C) Industrial (-40C to +85C) Extended (-40C to +125C)
FPU Yes (IEEE 754) Yes (IEEE 754) Yes (IEEE 754) Yes (IEEE 754) Yes (IEEE 754) Yes (IEEE 754)
Hardware Crypto Engine Yes Yes Yes Yes Yes Yes
Packaging Format Tray Tray Tape & Reel Tape & Reel Tape & Reel Tape & Reel

Key Differentiators

  • 1 MB dual-panel Flash for firmware-over-the-air updates (vs PIC32MZ0512EFK144T-I/JWX)
  • Industrial temperature grade in compact 144-TFBGA footprint (vs PIC32MZ1024EFK144T-I/JWX)
  • Hardware crypto engine and 256 KB SRAM for TLS acceleration (vs PIC32MX795F512L-80I/BG (predecessor PIC32MX MCU))

Design Notes

Estimated: The 144-TFBGA package at 0.65 mm pitch requires a 4-layer PCB with microvia fanout for signal break-out. Per Microchip application note AN2686, route traces on the top layer directly out of BGA balls where possible, and use dog-bone fanout with vias-in-pad only if the PCB fab supports it. Decoupling: place a 0.1 µF X7R capacitor adjacent to every VDDCORE/VDDIO pair, plus bulk 4.7 µF + 0.1 µF on the internal 1.2 V regulator stabilization pins. Ground return vias must be co-located with each decoupling capacitor via to reduce parasitic inductance.

The PIC32MZ1024EFK144-I/JWX has an internal 1.2 V core voltage regulator driven from the 3.3 V VDD rail. Place the datasheet-recommended 4.7 µF + 0.1 µF network on the VCAP pin (the regulator output), and ensure the 3.3 V rail can supply up to ~150 mA peak for the core + peripherals. Add a bulk 10 µF + 0.1 µF on the 3.3 V input, and use a ferrite bead to isolate analog AVDD from noisy digital VDD if your design uses the ADC. Sleep-mode current drops to under 30 mA per the family datasheet, but standby current is higher than the PIC32MX family - factor this into battery designs.

Use Microchip's MPLAB Harmony Configurator (MHC) pin manager to assign peripheral functions to physical balls before locking the PCB layout - the Peripheral Pin Select (PPS) system allows remapping but the resulting signal integrity depends on the layout. Place the 50 MHz external crystal (if used) within 5 mm of the OSC1/OSC2 balls with a grounded guard ring, and route USB DP/DN as a 90-ohm differential pair with length matching within 150 mil (3.8 mm). For Ethernet, route RMII signals length-matched to the PHY within 50 mil.

Three pitfalls to avoid: (1) Confusing the PIC32MZ1024EFK144-I/JWX (TFBGA 'K' ballout) with the PIC32MZ1024EFG144-I/JWX (LQFP 'G' package) - they are NOT pin-compatible even though both are 'EF'. (2) Do not exceed 3.6 V on any VDDIO ball - the absolute maximum is 4.0 V but reliability degrades above 3.6 V. (3) When migrating from PIC32MX to PIC32MZ, note that the I/O port naming and peripheral library differ; do not assume drop-in software compatibility without recompiling against the PIC32MZ Harmony framework.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100-qualified PIC32MZ EF variants for automotive. Halogen-free status not stated in the provided data.

Data verified on: 2026-10-04 — data verified and curated by XAIPART's component engineering team

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