PIC32MZ1064DAH169-I/6J - 32-bit MCU 1MB Flash 169-LFBGA | Microchip
Teilenummer: PIC32MZ1064DAH169-I/6J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.88 | $7,88 |
| 10 | $7.46 | $74,60 |
| 100 | $7.05 | $705,00 |
| 500 | $6.48 | $3.240,00 |
| 1.000 | $5.92 | $5.920,00 |
| 3.000 | $5.21 | $15.630,00 |
PIC32MZ1064DAH169-I/6J Übersicht
A 32-bit microcontroller (MCU) is an integrated circuit combining a 32-bit CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single die. It belongs to the hierarchy: microcontroller -> embedded processor -> semiconductor -> integrated circuit. The PIC32MZ DA family is positioned at the upper end of the 32-bit MCU market, offering MPU-class performance with the design simplicity of an MCU, removing the need for an external memory controller or complex power sequencing typical of microprocessor + external DDR designs.
Key differentiating features include an integrated graphics controller with hardware-accelerated rendering, a dedicated graphics processor for JPEG decoding and image composition, 640 KB of SRAM, and support for stacked DDR2 DRAM up to 128 MB. This combination eliminates external memory components required by competing solutions, reducing BOM cost and PCB area for HMI and IoT gateway applications. The 12-bit ADC samples at 18 MSPS, enabling audio processing and precision sensor interfaces without an external converter.
Typical applications include industrial HMI panels, automotive infotainment displays, medical patient monitors, IoT gateways with on-device graphics, and high-resolution touch-screen controllers. The 169-LFBGA package is footprint-compatible across the PIC32MZ1064DAH169 family, allowing design teams to scale between Flash densities without PCB rework.
A practical design consideration: this BGA package demands careful PCB layout with via-in-pad technology, controlled-impedance traces for the DDR2 interface, and matched-length routing for the parallel display bus. Engineers should validate thermal performance against the 1.7W typical dissipation at 200 MHz operation.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet, accelerating your selection and qualification process.
Drop-in-Alternativen für PIC32MZ1064DAH169-I/6J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1064DAH169-I/6J (gleiche Bauform und Footprint) – abweichend in Core Architecture, USB, Graphics Controller, ADC, CAN.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2064DAH169-I/6J
✅ Drop-In✓ Auf Lager
$12.6 / Stück
Datenblatt ansehen →PIC32MZ1064DAH169T-I/6J
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1064DAB169-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.4 / Stück
Datenblatt ansehen →PIC32MZ1064DAA169-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →PIC32MZ2064DAS169-I/6J
✅ Drop-In✓ Auf Lager
$11.94 / Stück
Datenblatt ansehen →PIC32MZ1064DAH169-I/6J Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv |
| Series | PIC32MZ DA (DAG/DAB176) |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| RAM (SRAM) | 640 KB |
| External Memory Support | Up to 128 MB DDR2 DRAM (externally addressable, stacked option) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (hardware-accelerated rendering) |
| Graphics Processor | Integrated (JPEG decode, image composition) |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| Versorgungsspannung | 1.8 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (industrial) |
| Gehäuse | 169-LFBGA (11x11 mm) |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
PIC32MZ1064DAH169-I/6J 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1064DAH169-I/6J (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1064DAH169-I/6J.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1064DAH169-I/6J ist geeignet für 6 Anwendungs: Industrial HMI Touch Panels, Automotive Infotainment Displays, Medical Patient Monitor Screens, IoT Gateways with Local Display, High-Resolution Touch Screen Kiosks, Smart Home Control Panels.
Industrial HMI Touch Panels
The PIC32MZ1064DAH169-I/6J is purpose-built for industrial HMI panels, where its integrated graphics controller and hardware JPEG decoder drive WVGA TFT displays without an external GPU. The 200 MHz MIPS32 microAptiv core sustains 60 fps refresh rates even with anti-aliased fonts and alpha-blended overlays, while the 640 KB SRAM holds full frame buffers for QVGA resolutions. The 12-bit 18 MSPS ADC samples resistive-touch and analog front-panel potentiometers simultaneously, eliminating an external ADC IC. CAN connectivity integrates directly into Modbus and CANopen industrial networks without a bridge IC. Compared to an MPU + external DDR solution, this single-chip design cuts BOM by $3-$5 and reduces PCB area by ~40%, critical for sealed IP65 panel enclosures.
Empfohlen
Automotive Infotainment Displays
For automotive infotainment, the PIC32MZ1064DAH169-I/6J drives secondary instrument-cluster and HVAC displays with hardware-accelerated graphics rendering. The DDR2 interface supports external memory mapped for navigation tile caches, while the integrated graphics processor handles PNG decoding and alpha blending in hardware. The AEC-Q100 qualified -Q1 sibling variant (extended -40C to +125C range) shares the same 169-LFBGA footprint, enabling automotive-tier qualification without PCB rework. HS USB supports smartphone projection protocols, and CAN integrates with the vehicle bus. At 200 MHz, the core sustains instrument-cluster graphics at 30 fps minimum while reserving CPU headroom for OBD-II telemetry aggregation and HVAC control loops.
Empfohlen
Medical Patient Monitor Screens
The PIC32MZ1064DAH169-I/6J's 12-bit 18 MSPS sampling rate directly digitizes multi-lead ECG, SpO2, and temperature analog front-ends without an external ADC, simplifying medical-isolated designs. The graphics controller renders real-time waveforms (ECG, plethysmograph) and numeric vital-sign displays with hardware-accelerated vector rendering, freeing CPU cycles for alarm processing and trend analysis. DDR2 support enables storing 24-hour Holter-style trend buffers on-chip without external storage. The integrated CAN interface connects to hospital bed-side bus networks, while HS USB supports firmware updates and data export. The system integrator must still certify IEC 60601-1 at the device level; the MCU itself does not carry medical certification.
Empfohlen
IoT Gateways with Local Display
IoT edge gateways benefit from the PIC32MZ1064DAH169-I/6J's combination of HS USB, CAN, and 200 MHz processing for protocol translation, sensor fusion, and local HMI rendering. The graphics controller drives a small status TFT (3.5-5 inch) showing network diagnostics, sensor trends, and configuration menus without an external GPU or MPU. The 640 KB SRAM and external DDR2 support host MQTT message buffers and TLS session state for secure cloud uplinks. The 200 MHz MIPS32 microAptiv core runs lightweight TLS 1.3 handshakes in software for low-rate telemetry, offloading heavy crypto to a companion secure element. The integrated 12-bit ADC monitors battery and power-rail health for predictive maintenance.
Empfohlen
High-Resolution Touch Screen Kiosks
Self-service kiosks (ticketing, parking, retail POS) leverage the PIC32MZ1064DAH169-I/6J's 169-LFBGA package and integrated graphics to drive 7-inch WVGA capacitive touchscreens with smooth pinch-zoom and gesture handling. The hardware JPEG decoder accelerates splash-screen and promotional video frame decoding, reducing boot time by ~30% versus software decode. The HS USB interface supports touch controller and barcode scanner peripherals, while the 12-bit ADC interfaces with weight scales and coin acceptors in payment kiosks. The DDR2 controller maps external memory for graphical asset caches (multilingual fonts, branding assets) without forcing a larger MPU. Industrial temperature rating ensures reliable operation in enclosed outdoor kiosks.
Empfohlen
Smart Home Control Panels
Premium smart-home wall panels use the PIC32MZ1064DAH169-I/6J as a single-chip solution combining touchscreen HMI, Z-Wave/Zigbee proxy logic (via companion radio), and cloud connectivity. The integrated graphics controller renders animated icons, lighting scenes, and security camera thumbnails at smooth 30 fps, while the 200 MHz core handles TLS-secured MQTT messaging. The DDR2 controller accommodates video thumbnail caches and scene-transition animations without external memory pressure. The 12-bit ADC interfaces with ambient light sensors for automatic backlight dimming and with analog thermostats for legacy HVAC compatibility. CAN and HS USB provide hard-wired backbone connectivity in luxury residential installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1064DAH169-I/6J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2064DAH169-I/6J | PIC32MZ1064DAH169T-I/6J | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ2064DAS169-I/6J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 2 MB | 1 MB | 1 MB | 1 MB | 2 MB + 32 MB stacked DDR2 |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB + 32 MB stacked DDR2 |
| DDR2 Support | External up to 128 MB | External up to 128 MB | External up to 128 MB | External up to 128 MB | External up to 128 MB | External up to 128 MB + 32 MB on-chip stacked |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| ADC | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs | 12-bit 18 MSPS, 45 inputs |
Wichtigste Unterscheidungsmerkmale
- Integrated graphics controller eliminates external GPU (vs. PIC32MX795F512L-80I/BG)
- 1 MB vs 2 MB Flash trade-off with same footprint (vs. PIC32MZ2064DAH169-I/6J)
- Single-chip MCU+DRAM vs MPU+external DDR design (vs. STM32F769NI)
- B-revision silicon offers improved errata coverage (vs. PIC32MZ1064DAA169-I/HF)
Designhinweise
The 169-LFBGA package at 11x11 mm uses a 13x13 ball grid with 0.8 mm pitch. PCB layout must employ via-in-pad (VIP) technology with filled-and-capped microvias under each BGA ball to escape the inner rows. The DDR2 data byte lanes (DQ0-DQ15, DQ16-DQ31) require matched-length routing within 25 mil tolerance and 50 ohm controlled impedance to a 100 ohm differential for DQS pairs. Reference plane continuity under the BGA must be uninterrupted to maintain signal integrity for the parallel DDR2 interface; avoid power-plane splits crossing the DDR escape region.
Estimated: At 200 MHz operation with peripheral activity, the PIC32MZ1064DAH169-I/6J dissipates approximately 1.5-1.7 W typical and 2.1 W peak. The 169-LFBGA package has junction-to-ambient thermal resistance of approximately 28 C/W on a 4-layer JEDEC test board (per Microchip package thermal data), resulting in a 50C junction rise above ambient at typical load. For sealed enclosures with limited airflow, design thermal vias under the center thermal balls and ensure the PCB thermal pad is connected to an inner copper plane. The device includes an on-die thermal sensor readable via the ADC for software thermal management.
Do not confuse the PIC32MZ1064DAH169 (169-LFBGA) with the PIC32MZ1024EFH064 (64-QFN); they share the PIC32MZ branding but are pin-incompatible and target different application segments. The 169-LFBGA variant includes the integrated graphics controller and DDR2 controller; the 64-QFN EF-series does not. Also note that the -I (industrial) and -E (extended) temperature grades share the same datasheet but the -Q1 suffix denotes AEC-Q100 automotive qualification - ordering -E does not imply automotive grade. Always check the full ordering code (e.g. PIC32MZ1064DAH169-I/6J) before PCB assembly.
The PIC32MZ1064DAH169-I/6J requires three separate supply rails: a 1.8-3.6 V main VDD for I/O and core, a separate 1.8 V VCAP for the internal regulator, and a 1.2-1.8 V DDR2 reference voltage. Decoupling requires at minimum one 10 uF bulk capacitor per rail plus 100 nF and 10 nF ceramics adjacent to each supply pin. The DDR2 VTT termination voltage (typically 0.9 V) requires its own LDO regulator with peak transient capability of 2 A; the Microchip MCP1725 or equivalent is recommended. Power-on-reset timing requires the 1.8 V rail to stabilize before the DDR2 reference voltage to prevent latch-up.
The parallel RGB display interface and DDR2 bus require careful SI simulation. Use the IBIS model from Microchip (PIC32MZ1064DAH169.ibs) together with your PCB stackup to validate signal quality at the second DDR2 DIMM or display connector. The HS USB D+/D- traces require 90 ohm differential impedance and a common-mode choke (such as the ACM2012 series) for EMI compliance. The HS USB reference clock must be routed with ground shielding and length-matched to within 50 mil of the D+/D- pair to maintain duty-cycle balance.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified in standard -I variant - order -Q1 suffix for AEC-Q100 grade.