PIC32MZ2025DAR169-I/6J - 200MHz MCU, 2MB Flash, 169-LFBGA | Microchip
Teilenummer: PIC32MZ2025DAR169-I/6J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $17.2 | $172,00 |
| 100 | $15.4 | $1.540,00 |
| 250 | $14.1 | $3.525,00 |
| 500 | $13.25 | $6.625,00 |
PIC32MZ2025DAR169-I/6J Übersicht
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals (ADC, timers, communication interfaces, GPIO) into a single chip. MCUs form the lowest tier of embedded compute hierarchy: MCU -> microcontroller -> embedded processor -> semiconductor IC, and they sit beneath microprocessors (MPUs) in raw performance but above discrete logic in integration. The PIC32MZ DA family specifically bridges MCU and MPU tiers by adding an LCD controller, 2D graphics processor and large stacked DDR2 memory on-chip.
Key features of the PIC32MZ2025DAR169 include 32-bit MIPS32 microAptiv core running up to 200 MHz, 2MB Flash program memory (2M x 8), 640KB SRAM, integrated DDR2 memory controller, hardware 2D Graphics Processor and Display Controller, 12-bit 18 MSPS ADC with up to 45 analog input channels, CAN, HS USB, and an industrial operating temperature grade (-40C to +85C).
The architecture pairs a deterministic MIPS32 Harvard core with a dedicated graphics pipeline and 32-bit DDR2 external memory interface, eliminating the need for an external MPU and reducing BOM cost in graphical HMI designs. The 18 MSPS ADC supports simultaneous touch and analog sensing, enabling resistive-touch GUIs without an external touch ASIC.
Typical applications include industrial HMI panels, graphical touch displays, home automation controllers, medical device interfaces, automotive infotainment entry-level displays, and POS terminals that require on-board graphics rendering at MPU-like performance.
When designing with this part, allocate PCB area for the 169-ball LFBGA (11x11 mm) and follow Microchip's DDR2 routing guidelines - the stacked-DDR2 footprint requires controlled-impedance matched-length traces. Use MPLAB Harmony 3 for peripheral and graphics driver support.
This page synthesizes distributor pricing, drop-in alternative inventory, and practical design guidance drawn from Microchip application notes and reference designs - insights not consolidated on the manufacturer product page alone.
Drop-in-Alternativen für PIC32MZ2025DAR169-I/6J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2025DAR169-I/6J (gleiche Bauform und Footprint) – abweichend in Graphics Controller, Operating Temperature, USB, Core Architecture, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2025DAR169T-I/6J
✅ Drop-In✓ Auf Lager
$12.95 / Stück
Datenblatt ansehen →PIC32MZ2025DAR169-V/6J
✅ Drop-In✓ Auf Lager
$12.95 / Stück
Datenblatt ansehen →PIC32MZ2025DAR169T-V/6J
✅ Drop-In✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →PIC32MZ2025DAH169T-I/6J
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ2025DAG169T-I/6J
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ2025DAB169T-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.62 / Stück
Datenblatt ansehen →PIC32MZ2025DAR169-I/6J Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR) |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| On-chip Stacked DRAM | Up to 32 MB DDR2 internal addressable |
| External Memory Interface | DDR2 up to 128 MB addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D Graphics Processor + Display Controller |
| Communication Interfaces | CAN, HS USB |
| I/O Lines | 120 |
| Address Bus Width | 24-bit |
| External Data Bus | 16-bit |
| Gehäuse | 169-LFBGA (11x11 mm) |
| Betriebstemperatur | -40C to +85C (Industrial, I-temp) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC32MZ2025DAR169-I/6J 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ2025DAR169-I/6J (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ2025DAR169-I/6J.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ2025DAR169-I/6J ist geeignet für 6 Anwendungs: Industrial HMI Touch Panels, Home Automation Controllers, Medical Device Interfaces, Automotive Infotainment Entry-Level Displays, POS Terminals and Retail Kiosks, Industrial Control Panels with Graphical Display.
Industrial HMI Touch Panels
The PIC32MZ2025DAR169-I/6J is purpose-built for industrial HMI panels that demand MPU-class graphics with MCU simplicity. Its integrated 2D Graphics Processor and Display Controller drive TFT panels up to WXGA without an external GPU. The 18 MSPS 12-bit ADC with 45 analog inputs supports 4-wire resistive touch sensing simultaneously with analog signal acquisition, eliminating an external touch controller. On-chip stacked DDR2 (up to 32 MB) provides framebuffer memory on-die, reducing PCB complexity versus external SDRAM designs. The 169-LFBGA 11x11 mm footprint fits standard 3.5" to 7" panel carrier boards, while the industrial -40C to +85C temperature grade handles factory floor environments. Engineers pairing it with Microchip's MPLAB Harmony 3 graphics suite (Aria graphics library) shorten GUI development cycles significantly.
Empfohlen
Home Automation Controllers
Smart-home gateways and controllers benefit from the PIC32MZ2025DAR169-I/6J's combination of HS USB for host connectivity, CAN for HVAC and lighting bus integration, and graphics processor for local touchscreen UI. The 200 MHz MIPS32 microAptiv core runs Zigbee/Thread stacks concurrently with the graphics pipeline, while 640KB SRAM plus up to 32 MB DDR2 accommodates large ZCL/CoAP buffers and framebuffers. The 120 GPIO lines support multi-zone sensor aggregation. Compared to Cortex-M4 alternatives in similar packages, the PIC32MZ2025DAR169 adds the on-chip DDR2 which removes external SDRAM cost and routing complexity - a meaningful BOM saving in high-volume home automation products.
Empfohlen
Medical Device Interfaces
Patient-monitoring bedside displays and portable diagnostic interfaces rely on the PIC32MZ2025DAR169-I/6J's deterministic MIPS32 core for real-time waveform rendering combined with the integrated graphics pipeline for high-fidelity GUI overlays. The 12-bit 18 MSPS ADC captures multi-lead ECG, SpO2 plethysmography, and capnography waveforms simultaneously with 45 input channels supporting 12+ physiological channels. On-chip stacked DDR2 framebuffer memory eliminates external RAM latency, critical for artifact-free waveform rendering. Industrial temperature grade suits clinical environments. IEC 62304 software lifecycle tools from Microchip (MPLAB Harmony) support FDA submission workflows. The MCU + integrated GPU architecture simplifies medical device BOM by replacing MPU + external GPU + SDRAM stacks.
Empfohlen
Automotive Infotainment Entry-Level Displays
Entry-level automotive infotainment clusters and rear-seat entertainment displays leverage the PIC32MZ2025DAR169-I/6J's integrated graphics pipeline, CAN bus, and HS USB for media connectivity. The 200 MHz core drives mid-resolution TFT clusters and HVAC-control displays without external GPU. The 18 MSPS ADC reads multiple rotary encoder channels and HVAC sensors concurrently. The 169-LFBGA 11x11 mm footprint fits space-constrained dashboard PCBs. For AEC-Q100 Grade 2/3 requirements, engineers typically select the -V (V-temp) suffix variant of the same family. The on-chip DDR2 reduces PCB area versus external SDRAM designs - a significant advantage in the thermally constrained automotive head-unit environment where every mm matters.
Empfohlen
POS Terminals and Retail Kiosks
Retail POS terminals and self-service kiosks benefit from the PIC32MZ2025DAR169-I/6J's combination of HS USB for payment peripherals, CAN for vending-machine bus integration, and integrated 2D graphics for colorful touch-based product catalogs. The 200 MHz MIPS32 core runs secure payment libraries concurrently with the graphics pipeline, while 640KB SRAM plus stacked DDR2 supports transactional buffers and high-resolution product imagery. The 12-bit 18 MSPS ADC reads barcode-scanner and weight-scale analog inputs. The 169-LFBGA footprint supports compact POS terminal form factors. Compared to discrete MPU + external MCU architectures, the integrated GPU + DDR2 design saves 20-30% PCB real estate, enabling thinner countertop terminals.
Empfohlen
Industrial Control Panels with Graphical Display
PLC HMI panels, variable-frequency drive keypads, and motor-controller operator panels use the PIC32MZ2025DAR169-I/6J for its deterministic 200 MHz core (for real-time industrial protocol stacks like EtherCAT or Modbus TCP) combined with the integrated graphics pipeline (for TFT status displays and trending graphs). The 18 MSPS ADC reads motor current, voltage, and temperature sensors at 45 channels simultaneously - supporting multi-axis motor control. The on-chip DDR2 simplifies PCB layout in EMC-sensitive industrial environments by removing external SDRAM traces that radiate noise. Industrial -40C to +85C temperature grade handles cabinet-mounted deployments. Compared to PIC32MX parts, the PIC32MZ2025DAR169 quadruples graphics performance and adds the ADC speed required for modern motor control loops.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2025DAR169-I/6J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2025DAR169T-I/6J | PIC32MZ2025DAR169-V/6J | PIC32MZ2025DAR169T-V/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ2025DAG169T-I/6J |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv 32-bit, 200 MHz | MIPS32 microAptiv 32-bit, 200 MHz | MIPS32 microAptiv 32-bit, 200 MHz | MIPS32 microAptiv 32-bit, 200 MHz | MIPS32 microAptiv 32-bit, 200 MHz | MIPS32 microAptiv 32-bit, 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Stacked DDR2 | Up to 32 MB (R variant) | Up to 32 MB (R variant) | Up to 32 MB (R variant) | Up to 32 MB (R variant) | H variant - different density | G variant - different density |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | V-temp (-40C to +105C) | V-temp (-40C to +105C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Packaging Format | Tray | Tape and Reel | Tray | Tape and Reel | Tape and Reel | Tape and Reel |
Wichtigste Unterscheidungsmerkmale
- On-chip stacked DDR2 up to 32 MB eliminates external SDRAM (vs. PIC32MX795F512L (external SDRAM required))
- Hardware 2D Graphics Processor + Display Controller (vs. PIC32MX795F512L (no GPU, software-rendered UI))
- Industrial temperature grade -40C to +85C standard (vs. Commercial-grade PIC32MZ DA variants)
Designhinweise
Estimated: the 169-ball LFBGA at 11x11 mm uses 0.8 mm ball pitch, requiring NSMD (non-solder mask defined) pads with 0.40 mm pad diameter. Microvia (0.1 mm laser-drilled) stackup recommended for breakout - 4-layer FR-4 minimum with continuous ground plane beneath the BGA. Route DDR2 traces with 50-ohm controlled impedance (single-ended) and 100-ohm differential for clock, matching lengths within 50 mils across the DDR2 byte group.
Estimated: at 200 MHz CPU and full peripheral activity the PIC32MZ2025DAR169-I/6J typically dissipates ~1.2 W. The 169-LFBGA has a typical theta_JA of 22 C/W on a 4-layer JEDEC test board (per Microchip family data), producing ~25C rise above ambient - well within industrial limits. Place thermal vias (0.3 mm pitch array) directly under the package center balls for improved dissipation.
The DDR2 interface requires source-synchronous clock forwarding. Place the on-chip stacked DDR2 routing on inner layers with continuous GND reference plane above to suppress EMI. Keep DDR2 traces away from the 45 analog ADC inputs (AIN pins) to avoid digital switching noise coupling into analog measurements - allocate separate PCB regions for digital DDR2 and analog input traces.
Do not omit the decoupling capacitor array: 100 nF X7R per power pin pair, plus bulk 4.7 uF and 10 uF tantalum near the package. The MPLAB Harmony 3 configuration bits must match the actual oscillator used - mismatch causes erratic USB or CAN bus enumeration. The 45 analog inputs share an ADC and require input charge-sharing RC snubbers on fast signals to avoid cross-channel contamination.
Compliance-Informationen
Standard -I suffix industrial grade is not AEC-Q100 qualified; for AEC-Q100 select -V suffix variants. RoHS and lead-free per Microchip product page.