PIC32MZ2025DAR169T-I/6J - 200MHz 32-bit MCU 2MB Flash | Microchip
Teilenummer: PIC32MZ2025DAR169T-I/6J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $17.2 | $172,00 |
| 100 | $15.85 | $1.585,00 |
| 500 | $14.3 | $7.150,00 |
| 1.000 | $12.95 | $12.950,00 |
PIC32MZ2025DAR169T-I/6J Übersicht
A 32-bit microcontroller (MCU) is a single-chip computer integrating a CPU core, memory, and programmable peripherals. PIC32MZ DAR devices belong to the MIPS32 microAptiv MCU family, which sits in the broader category of 32-bit microcontrollers, embedded processors, and finally semiconductors. The "DAR" suffix specifically denotes the Graphics integrated family with stacked DDR2 DRAM support, distinguishing it from the DAA (lower pin count) and DAB (audio) sub-families.
Key features include a 12-bit ADC module capable of 18 MSPS with up to 45 analog inputs, a 32-bit data bus, 120 I/O pins, integrated CAN and High-Speed USB, and an operating voltage of 1.8 V. The LFBGA-169 package provides 0.80 mm terminal pitch and a seated height of 1.56 mm, making it suitable for compact, high-density PCB designs typical of graphical embedded products.
The PIC32MZ2025DAR169T-I/6J uses a single-core MIPS32 microAptiv architecture manufactured on CMOS process technology. The T-suffix indicates tape and reel packaging for high-volume assembly lines, while the I-temp suffix specifies an industrial temperature range of -40C to +85C for harsh-environment deployments.
Typical applications include industrial HMI panels, automotive infotainment displays, medical patient monitors, smart-home control hubs, and graphical IoT gateways. The integrated DDR2 controller and graphics peripherals dramatically reduce BOM cost and PCB complexity compared to MCU-plus-external-GPU designs.
When designing with this MCU, use a 4-layer PCB with dedicated ground and power planes for the DDR2 signals. Validate DDR2 trace length matching to the JEDEC DDR2 specification; failure to match impedances causes intermittent display corruption that is difficult to debug. The 169-ball BGA requires X-ray inspection or BGA rework capability at the assembly stage.
Drop-in-Alternativen für PIC32MZ2025DAR169T-I/6J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2025DAR169T-I/6J (gleiche Bauform und Footprint) – abweichend in Graphics Controller, Operating Temperature, ADC, External Memory Support, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2025DAR169-I/6J
✅ Drop-In✓ Auf Lager
$13.25 / Stück
Datenblatt ansehen →PIC32MZ2025DAR169T-V/6J
✅ Drop-In✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →PIC32MZ2025DAH169T-I/6J
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ2025DAG169T-I/6J
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ2025DAR169T-I/6J Grenzwerte & elektrische Eigenschaften
| Core Processor | MIPS32 microAptiv |
| Core Size | 32-Bit Single-Core |
| Maximale Taktfrequenz | 200 MHz |
| Program Memory Size | 2 MB (2M x 8) FLASH |
| Data RAM Size | 640 KB |
| External Memory Support | Stacked DDR2 DRAM 32 MB or 128 MB |
| ADC Resolution | 12 bit |
| ADC Sampling Rate | 18 MSPS |
| Number of Analog Inputs | Up to 45 |
| Datenbusbreite | 32 bit |
| Number of I/Os | 120 |
| Betriebsversorgungsspannung | 1.8 V |
| Betriebstemperaturbereich | -40C to +85C (Industrial) |
| Gehäuse / Bauform | 169-LFBGA (11x11 mm) |
| Montagestil | SMD/SMT |
| Graphics Controller | Integrated |
| Graphics Processor | Integrated |
| Connectivity | CAN, High-Speed USB |
| Terminal Pitch | 0.80 mm |
| Seated Height | 1.56 mm |
| JESD30 Code | S-PBGA-B169 |
| RoHS-Status | Compliant |
PIC32MZ2025DAR169T-I/6J 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ2025DAR169T-I/6J (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ2025DAR169T-I/6J.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ2025DAR169T-I/6J ist geeignet für 6 Anwendungs: Industrial HMI Control Panels, Automotive Infotainment Displays, Medical Patient Monitoring, Smart Home Touchscreen Hubs, Graphical IoT Gateways, Point-of-Sale Terminals.
Industrial HMI Control Panels
The PIC32MZ2025DAR169T-I/6J is well-suited for industrial human-machine interface (HMI) panels requiring rich graphical touch displays with real-time control responsiveness. Its integrated Graphics Controller and Graphics Processor offload rendering of buttons, gauges, and trend charts from the 200 MHz CPU, leaving ample MIPS for PLC logic and Modbus/TCP communication. The 12-bit 18 MSPS ADC with 45 channels supports direct connection to temperature, pressure, and flow sensors without external signal conditioning. The 169-ball LFBGA package's 0.80 mm pitch allows compact panel layouts where PCB real estate is constrained behind the LCD. Designers should pair this MCU with a 4.3 to 7 inch TFT LCD and the Microchip MPLAB Harmony 3 graphics suite to accelerate development.
Empfohlen
Automotive Infotainment Displays
The PIC32MZ2025DAR169T-I/6J can drive secondary automotive infotainment displays such as climate-control panels, seat-control modules, and instrument-cluster sub-displays. The V-temp variant (PIC32MZ2025DAR169T-V/6J) extends operating temperature to +105C required for cabin electronics near HVAC vents. The 120 GPIO pins support multiple capacitive touch interfaces, rotary encoder inputs, and CAN-FD communication with the central head unit. The hardware graphics controller drives WSVGA (1024x600) panels smoothly at 60 Hz with minimal CPU load. Designers must ensure the DDR2 trace layout complies with JEDEC DDR2 impedance and length-matching rules, as signal integrity issues at automotive temperature extremes are a common root cause of intermittent display corruption.
Empfohlen
Medical Patient Monitoring
The PIC32MZ2025DAR169T-I/6J powers portable patient monitoring devices such as infusion pump displays, pulse-oximeter screens, and handheld ultrasound control units. The 200 MHz MIPS32 core executes real-time waveform DSP (ECG/PPG filtering) while the integrated graphics controller renders vital-signs dashboards on color TFT panels. Its 45 ADC channels sample multiple bioelectric signals with the 12-bit 18 MSPS converter providing sufficient resolution for diagnostic-grade measurements. Industrial -40C to +85C temperature rating supports use in emergency vehicles and outdoor triage scenarios. Designers should validate the IEC 60601-1 EMI/EMC compliance margins because the integrated DDR2 controller can radiate harmonics that interfere with adjacent medical signal chains.
Empfohlen
Smart Home Touchscreen Hubs
The PIC32MZ2025DAR169T-I/6J is ideal for wall-mounted smart home control hubs combining lighting, HVAC, and security control on a single capacitive-touch color display. The High-Speed USB and CAN interfaces connect to peripheral subsystems while Ethernet MAC (via external PHY) enables cloud connectivity for remote management. The hardware graphics controller smoothly renders animated icons, weather widgets, and live security camera feeds pulled over IP. The 640 KB SRAM plus 128 MB external DDR2 supports smooth page transitions and multi-pane dashboards. Designers should add an external RTC with battery backup and WDT supervisory circuit to ensure the hub recovers gracefully from firmware lockups during long-term continuous operation.
Empfohlen
Graphical IoT Gateways
The PIC32MZ2025DAR169T-I/6J serves as the central processor for industrial IoT gateways that aggregate sensor data, perform edge analytics, and present local dashboards. The 200 MHz core runs lightweight MQTT brokers and edge-inference models while the integrated graphics drives a status panel showing connectivity, throughput, and alarms. The 120 GPIO plus CAN, USB, and multiple UART/SPI/I2C peripherals support a wide mix of fieldbus and sensor interfaces. Compared to MCU-plus-external-GPU solutions, integrating the graphics controller reduces BOM by $5-$10 and shrinks PCB area. Designers should use the Microchip Trust Platform for hardware crypto acceleration and secure boot to harden the gateway against supply-chain firmware tampering.
Empfohlen
Point-of-Sale Terminals
The PIC32MZ2025DAR169T-I/6J powers compact point-of-sale (POS) terminals requiring a color touchscreen, barcode scanner interface, receipt printer control, and secure payment data handling. The hardware graphics controller renders product catalogs and transaction confirmations smoothly while the 200 MHz MIPS32 core handles encrypted payment flows and TCP/IP communication with the backend. The 45 ADC inputs support multi-button keypads and battery monitoring for mobile POS units. The integrated High-Speed USB enables connection to PIN pads and external readers. Designers should use the hardware crypto engine and secure-boot features to maintain PCI PTS compliance for payment terminals, and must validate thermal management as the LFBGA package can reach high junction temperatures in enclosed retail enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2025DAR169T-I/6J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2025DAR169-I/6J | PIC32MZ2025DAR169T-V/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ2025DAG169T-I/6J |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash / SRAM | 2 MB / 640 KB | 2 MB / 640 KB | 2 MB / 640 KB | 2 MB / 640 KB | 2 MB / 640 KB |
| External DRAM | 128 MB stacked DDR2 | 128 MB stacked DDR2 | 128 MB stacked DDR2 | 32 MB stacked DDR2 | 32 MB or 128 MB stacked DDR2 |
| Temperature Range | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| ADC / Channels | 12-bit 18 MSPS / up to 45 | 12-bit 18 MSPS / up to 45 | 12-bit 18 MSPS / up to 45 | 12-bit 18 MSPS / up to 45 | 12-bit 18 MSPS / up to 45 |
| I/O Count | 120 | 120 | 120 | 120 | 120 |
Wichtigste Unterscheidungsmerkmale
- Integrated Graphics Controller + DDR2 interface in single MCU (vs. PIC32MZ1025DAR169T-I/6J)
- Industrial temperature grade with full graphics pipeline (vs. PIC32MZ2025DAR169T-V/6J)
- 169-ball LFBGA exposes maximum peripheral set (vs. PIC32MZ2025DAB169T-I/HF (64-pin TQFP))
Designhinweise
Use a 4-layer PCB with continuous ground plane directly under the LFBGA-169 footprint. According to the Microchip PIC32MZ2025DA hardware guidance, all BGA balls require microvia-in-pad or dog-bone fan-out routing; standard through-via fan-out creates insufficient routing channels for the 0.80 mm pitch. Estimate: at 0.80 mm pitch with 4-layer stack-up, expect 8-12 routing channels between adjacent rows using 100 um trace/space rules.
DDR2 signals routed from the PIC32MZ2025DAR169T-I/6J to the external stacked DDR2 must follow JEDEC DDR2 trace-length matching rules: data/byte-group skew within 25 mil (0.635 mm), address/control within 100 mil (2.54 mm), and target differential impedance of 100 ohm (USB) and 50 ohm single-ended (DDR2). Estimated: total trace-length matching budget at 200 MHz DDR2 clock is ~125 ps, demanding precise stack-up control.
The 169-LFBGA package has a theta_JA of approximately 18-22 C/W (estimated, depends on PCB copper area and airflow). At full 200 MHz CPU plus graphics controller load, expect 0.8-1.2 W dissipation. On a 4-layer PCB with 4 thermal vias under the center balls, junction temperature rise stays under 25 C above ambient; without thermal vias, junction can exceed 50 C rise and trigger thermal throttling.
Do not power the PIC32MZ2025DAR169T-I/6J from a single 3.3 V rail - the device requires a separate 1.8 V core supply derived from an internal LDO or external switching regulator. Bypass all VDD/VSS pairs with 100 nF ceramic capacitors placed within 3 mm of each ball pair. Failure to follow Microchip's decoupling topology causes erratic operation during graphics controller bursts.
Compliance-Informationen
RoHS compliant per Microchip product page. I-temp grade is not AEC-Q100 qualified; AEC-Q100 qualification is not listed for this part number. The V-temp variant may be considered for non-safety-critical automotive applications but is not formally Q100 qualified per the Microchip product page.