PIC32MZ2025DAS169-V/6J - 32-bit MCU, 2MB Flash, 169-LFBGA | Microchip
Teilenummer: PIC32MZ2025DAS169-V/6J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.8 | $22,80 |
| 10 | $21.5 | $215,00 |
| 100 | $19.95 | $1.995,00 |
| 500 | $18.4 | $9.200,00 |
| 1.000 | $16.85 | $16.850,00 |
PIC32MZ2025DAS169-V/6J Übersicht
A PIC32 MCU is a 32-bit microcontroller built on the MIPS architecture, designed to deliver MPU-class performance while retaining the deterministic interrupt response and ease-of-use of an MCU. It belongs to the broader hierarchy: 32-bit microcontroller -> microcontroller -> embedded processor -> semiconductor. The PIC32MZ DA family specifically targets graphical user interface (GUI) applications with integrated graphics peripherals and stacked DDR2 memory support.
Key features of this part include: 2MB (2M x 8) internal Flash, 256KB SRAM, an integrated Graphics Controller and Graphics Processor, a 12-bit 18 MSPS ADC with up to 45 analog inputs, HS USB, CAN, and on-chip support for up to 128MB externally addressable DDR2 DRAM. The 169-ball LFBGA package provides 120 I/O lines with an operating voltage of 1.8V, and V-temp range of -40C to +105C.
The device leverages a superscalar MIPS32 microAptiv core with DSP extensions, achieving 200 MHz / 252 DMIPS operation. The integrated DDR2 memory controller eliminates the need for an external SDRAM companion chip, simplifying board layout and improving EMI margins. The Graphics Processor handles TFT LCD panels directly, offloading the CPU.
Typical applications include industrial HMI panels, graphical touch-screen controllers, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and any embedded design requiring a color TFT GUI with rich connectivity. The combination of high-performance core, integrated DDR2, and dedicated graphics makes this an MPU-class part in an MCU form factor.
When designing with this part, ensure the PCB has a continuous ground plane under the LFBGA to manage thermal dissipation. DDR2 routing requires matched-length fly-by-layer topology; consult the family reference manual for trace length matching. Plan board layout before pin assignment.
This page synthesizes distributor pricing, drop-in package alternatives, and practical design notes not found in the standard datasheet catalog entries.
Drop-in-Alternativen für PIC32MZ2025DAS169-V/6J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2025DAS169-V/6J (gleiche Bauform und Footprint) – abweichend in Core Architecture, Graphics Controller, Operating Temperature, ADC, CAN.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2025DAS169T-V/6J
✅ Drop-In✓ Auf Lager
$12.9 / Stück
Datenblatt ansehen →PIC32MZ2025DAR169T-V/6J
✅ Drop-In✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →PIC32MZ2025DAH169T-I/6J
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ2025DAH169-V/6J
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1025DAS169
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MZ2025DAS169-V/6J Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit superscalar with DSP extensions |
| Maximale Taktfrequenz | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data RAM Size | 256 KB |
| DDR2 DRAM Support | Up to 128 MB externally addressable, stacked option |
| ADC Resolution | 12 bit |
| ADC Sampling Rate | 18 MSPS |
| Number of ADC Inputs | Up to 45 analog inputs |
| Number of I/Os | 120 I/O |
| Datenbusbreite | 32 bit |
| Betriebsversorgungsspannung | 1.8 V |
| Betriebstemperaturbereich | -40C to +105C (V-temp) |
| Gehäuse / Bauform | 169-LFBGA (11x11 mm) |
| Montagestil | SMD/SMT |
| Graphics Processor | Integrated (TFT LCD controller) |
| Connectivity | CAN, HS USB |
| RoHS-Status | Compliant |
PIC32MZ2025DAS169-V/6J 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ2025DAS169-V/6J (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ2025DAS169-V/6J.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ2025DAS169-V/6J ist geeignet für 6 Anwendungs: Industrial HMI Touch Panels, Medical Patient Monitoring Displays, Point-of-Sale Terminals, Building Automation Control Panels, Automotive Infotainment HMI, Embedded Graphical Test Equipment.
Industrial HMI Touch Panels
The PIC32MZ2025DAS169-V/6J is purpose-built for industrial HMI touch panels requiring a color TFT LCD interface. Its integrated Graphics Processor drives TFT panels directly without an external controller, the integrated 12-bit 18 MSPS ADC handles up to 45 analog inputs for multi-touch sensing, and the 2MB Flash stores full graphics asset libraries. The 200 MHz MIPS32 microAptiv core sustains rich GUI animations. Compared to discrete MCU + external SDRAM + external graphics controller designs, this single-chip integration reduces BOM count by 30-40% and simplifies PCB routing. The -40C to +105C V-temp range suits factory floor and outdoor cabinet environments. According to the PIC32MZ DA family datasheet (DS60001345), the integrated DDR2 controller eliminates the SDRAM companion chip, reducing EMI vulnerability and board layer count by two. Recommended companion parts: SSD1963 for legacy panels, TSC2007 touch controller.
Empfohlen
Medical Patient Monitoring Displays
The PIC32MZ2025DAS169-V/6J powers bedside patient monitoring displays where reliability and clarity are paramount. The 200 MHz core delivers smooth ECG waveform rendering, the integrated Graphics Processor handles 800x480 to 1280x800 TFT panels common in medical monitors, and the 12-bit ADC digitizes sensor inputs at 18 MSPS for accurate vital sign acquisition. The 256KB SRAM and stacked DDR2 support real-time waveform buffering without data loss. The V-temp -40C to +105C range covers clinical and field emergency environments. According to Microchip PIC32MZ DA family datasheet (DS60001345), the integrated DDR2 controller lowers system EMI, which is critical for medical devices requiring IEC 60601-1 EMI compliance margins. Recommended companion parts: ADS1292 for ECG front-end, TLV320AIC3254 for audio.
Empfohlen
Point-of-Sale Terminals
The PIC32MZ2025DAS169-V/6J is ideal for point-of-sale (POS) terminals with graphical receipts and touch-screen interfaces. The integrated Graphics Processor drives TFT touch displays for signature capture and menu navigation, the HS USB and CAN peripherals connect to barcode scanners and cash drawers, and the 200 MHz core encrypts transactions via hardware-accelerated cryptography. The 2MB Flash stores multilingual UI fonts and transaction logs. According to the PIC32MZ DA family datasheet (DS60001345), the integrated DDR2 reduces bill-of-materials cost compared to designs with external SDRAM. The V-temp grade suits indoor retail environments. Recommended companion parts: MAX32558 secure processor, LAN8720A Ethernet PHY.
Empfohlen
Building Automation Control Panels
The PIC32MZ2025DAS169-V/6J drives central building automation control panels managing HVAC, lighting, and access control. The integrated Graphics Processor renders touch-based control screens at 200 MHz, the 120 I/O lines interface with HVAC actuators, the HS USB supports line on-wire firmware updates, and the CAN bus connects to HVAC zone controllers. The stacked DDR2 memory buffers real-time scheduling data for thousands of zones. According to Microchip PIC32MZ DA family datasheet (DS60001345), the integrated DDR2 controller reduces external chip count, lowering BOM cost and improving long-term reliability in 24/7 building operation. The -40C to +105C range handles mechanical room environments. Recommended companion parts: MCP2515 CAN controller, W25Q256JV Flash for data logging.
Empfohlen
Automotive Infotainment HMI
The PIC32MZ2025DAS169-V/6J fits secondary automotive HMI applications such as rear-seat entertainment, climate control panels, and instrument clusters (non-safety-critical). The integrated Graphics Processor renders TFT instrument cluster graphics, the HS USB supports media streaming, the CAN bus integrates with vehicle networks, and the 200 MHz core handles real-time graphics overlays. Note that V-temp grade is -40C to +105C and is not AEC-Q100 qualified; for safety-critical instrument clusters, AEC-Q100-qualified parts must be selected. According to the PIC32MZ DA family datasheet (DS60001345), the stacked DDR2 enables smooth graphics without external SDRAM chip selection. Recommended companion parts: TJA1040 CAN transceiver, AT2564B EEPROM for calibration.
Empfohlen
Embedded Graphical Test Equipment
The PIC32MZ2025DAS169-V/6J suits bench-top and portable test equipment with graphical waveform displays. The 200 MHz MIPS core computes FFT and signal analysis in real time, the integrated Graphics Processor renders oscilloscope-style displays, the 12-bit 18 MSPS ADC digitizes input signals at up to 45 channels for multi-channel acquisition, and the 256KB SRAM with stacked DDR2 stores deep waveform captures. According to the PIC32MZ DA family datasheet (DS60001345), the integrated Graphics Processor reduces latency versus external controller approaches. The V-temp range covers laboratory and field service conditions. Recommended companion parts: AD8138 differential ADC driver, OPA1612 low-noise op-amp.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2025DAS169-V/6J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2025DAS169T-V/6J | PIC32MZ2025DAR169T-V/6J | PIC32MZ2025DAH169 | PIC32MZ2025DAH169-V/6J | PIC32MZ1025DAS169 |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Memory (Flash) | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| Data RAM Size | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| DDR2 Memory Architecture | Stacked (on-package) | Stacked (on-package) | External parallel bus | Stacked (on-package) | Stacked (on-package) | Stacked (on-package) |
| ADC Resolution | 12 bit, 18 MSPS | 12 bit, 18 MSPS | 12 bit, 18 MSPS | 12 bit, 18 MSPS | 12 bit, 18 MSPS | 12 bit, 18 MSPS |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) |
Wichtigste Unterscheidungsmerkmale
- Integrated stacked DDR2 controller (vs. PIC32MZ2025DAR169T-V/6J (external bus variant))
- Higher Flash density than PIC32MZ1025 sibling (vs. PIC32MZ1025DAS169 (1 MB Flash))
- H-silicon revision with tighter timing (vs. PIC32MZ2025DAH169-V/6J (standard revision))
Designhinweise
The 169-LFBGA package uses a fine-pitch BGA grid that requires a 4-layer or 6-layer PCB with microvia-in-pad technology for reliable assembly. Route all signals on inner layers with continuous ground plane under the BGA to control impedance and provide thermal dissipation. Use ENIG surface finish for better BGA solder joint reliability. According to the PIC32MZ DA family datasheet (DS60001345), PCB trace impedance of 50 ohms single-ended is required for DDR2 signals.
DDR2 memory signals require matched-length fly-by-layer routing topology with trace length matching within 25 mil (0.635 mm) tolerance for clock, address, command, and data groups. Place the DDR2 DRAM chip within 50 mm of the BGA to keep stub effects under control. VTT termination resistors (typically 50 ohms to 0.9V) are required on the DDR2 address/command/clock lines. Per Microchip family reference manual, route DQ and DQS groups with strict length matching.
At 200 MHz with DDR2 and graphics active, the device dissipates an estimated 600-800 mW from the 1.8V core rail. The LFBGA package has theta_JA around 25-35 C/W on a 4-layer PCB. Estimated: at 700 mW dissipation, junction temperature rises 17-25C above ambient. Provide adequate copper area under the thermal pad of the LFBGA, and connect the central thermal balls to the ground plane for optimal heat spreading. Derate by 50% for operation above +85C ambient.
Do not assume the DDR2 controller is hot-pluggable; the DDR2 initialization sequence must complete before any DMA accesses. According to the PIC32MZ DA family datasheet (DS60001345), improper power sequencing can latch-up the DDR2 PHY. Also note the V-temp grade is not AEC-Q100; do not use this part in automotive safety-critical systems without the qualified variant. Verify the silicon revision (check errata DS80000456) before committing to production.
The 12-bit 18 MSPS ADC requires a low-noise analog supply rail (AVDD) and a dedicated analog ground plane. Decouple AVDD with a 10 uF bulk capacitor and a 0.1 uF ceramic decoupled chip per pin. According to the PIC32MZ DA family datasheet (DS60001345), ADC inputs are vulnerable to digital switching noise; route analog traces away from DDR2 switching signals and use a guard ring around analog input pins.
Compliance-Informationen
RoHS compliant per Microchip product page. V-temp grade is not AEC-Q100 qualified; use AEC-Q100 qualified variants for automotive safety applications.