PIC32MZ2048EFH100-E/GJX - 200MHz 32-bit MCU 2MB Flash | Microchip
Teilenummer: PIC32MZ2048EFH100-E/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.85 | $138,50 |
| 100 | $12.6 | $1.260,00 |
| 500 | $11.85 | $5.925,00 |
| 1.000 | $11.2 | $11.200,00 |
PIC32MZ2048EFH100-E/GJX Übersicht
A 32-bit microcontroller (MCU) is a programmable system-on-chip combining a CPU, memory, peripherals, and I/O. The MIPS32 M-Class microAptiv core family sits within the broader hierarchy of microcontroller -> embedded processor -> RISC CPU -> semiconductor. The PIC32MZ EF series adds a hardware Floating Point Unit for IEEE 754 single/double precision, eliminating software FP emulation in DSP and graphics workloads. Live-Update Flash enables firmware dual-bank OTA swap without chip reset, critical for always-on connected products.
Key features include 200 MHz core / 252 MHz extended performance, 2 MB Live-Update Flash (dual-bank), 512 KB SRAM, 8-channel DMA, Hi-Speed USB 2.0 OTG with dedicated DMA, 10/100 Ethernet MAC with MII/RMII, two CAN 2.0b modules, up to six UART, four SPI, five I2C, parallel master port (PMP/EBI), SQI (Serial Quad Interface) for XIP memory expansion, 12-bit ADC up to 18 Msps, 16-bit PWM, and a TFT/GPU graphics interface (GPU module with 2D acceleration). The 100-ball GJX TFBGA package suits compact, high-density PCB designs with full 5V-tolerant digital I/O.
The architecture combines a deterministic interrupt controller, dual-bank Flash with ECC, and a multi-channel DMA engine to offload peripherals from the CPU, sustaining throughput for industrial Ethernet or USB streaming while leaving headroom for an RTOS or application logic. AEC-Q100 Grade 1 qualification and the extended -40C to +125C operating range support under-hood and industrial cabinet deployments.
Typical applications include industrial HMI panels with TFT touch, IoT edge gateways with Ethernet and Wi-Fi co-processor bridging, automotive body and infotainment subsystems, motor control FOC drives with high-resolution PWM, USB audio/MIDI products, and secure connected medical devices leveraging the Live-Update Flash for fail-safe OTA.
Designers should allocate the 100-ball TFBGA escape with at least 6 PCB layers, providing a solid ground plane beneath the part and decoupling each VDD/VBUS rail with 100 nF plus 4.7 uF ceramic capacitors placed within 3 mm of the package balls. Program the dual-bank Flash map carefully to ensure bootloader and golden-image partitioning fits the 2 MB budget.
This page synthesizes real-time distributor pricing, parametric drop-in PIC32 family alternatives, and application-specific PCB/design notes not consolidated in the Microchip datasheet.
Drop-in-Alternativen für PIC32MZ2048EFH100-E/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2048EFH100-E/GJX (gleiche Bauform und Footprint) – abweichend in Ethernet, Package, Core Architecture, CAN, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2048EFH100-I/GJX
✅ Drop-In✓ Auf Lager
$13.5 / Stück
Datenblatt ansehen →PIC32MZ2048EFH100T-E/GJX
✅ Drop-In✓ Auf Lager
$7.11 / Stück
Datenblatt ansehen →PIC32MZ2048EFH100-250I/GJX
✅ Drop-In✓ Auf Lager
$13.5 / Stück
Datenblatt ansehen →PIC32MZ1024EFH100-E/GJX
✅ Drop-In✓ Auf Lager
$7.65 / Stück
Datenblatt ansehen →PIC32MZ2048EFM100-I/GJX
✅ Drop-In✓ Auf Lager
$9.05 / Stück
Datenblatt ansehen →PIC32MZ2048EFH100-E/GJX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class microAptiv |
| Core Frequency | 200 MHz (up to 252 MHz in -250I variants) |
| Floating Point Unit | Yes (single/double precision) |
| Flash Memory | 2 MB (2M x 8) Live-Update dual-bank |
| SRAM | 512 KB |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| Betriebstemperatur | -40C to +125C (E = Extended) |
| Gehäuse | 100-ball TFBGA (GJX) 7x7 mm |
| Montageart | Surface Mount |
| AEC-Q100 Grade | AEC-Q100 qualified (automotive) |
| USB | Hi-Speed USB 2.0 OTG |
| Ethernet | 10/100 MAC with MII/RMII |
| CAN | CAN 2.0b x 2 |
| ADC | 12-bit up to 18 Msps |
| Graphics/GPU | 2D GPU + TFT controller |
| DMA Channels | 8 channels |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC32MZ2048EFH100-E/GJX Pin-Konfiguration
| Pin A1 | VSS — Ground reference |
| Pin A2 | VDD — Core supply 2.0-3.6 V |
| Pin B1 | OSC1 — Crystal oscillator input |
| Pin B2 | OSC2 — Crystal oscillator output |
| Pin C1 | PGED1 — ICSP data (channel 1) |
| Pin C2 | PGEC1 — ICSP clock (channel 1) |
| Pin D1 | AN0 — Analog input 0 / ADC |
| Pin D2 | AN1 — Analog input 1 / ADC |
| Pin E1 | VREF+ — ADC voltage reference positive |
| Pin E2 | VREF- — ADC voltage reference negative |
| Pin F1 | PWM1H — PWM output high side 1 |
| Pin F2 | PWM1L — PWM output low side 1 |
| Pin G1 | U1TX — UART1 transmit |
| Pin G2 | U1RX — UART1 receive |
| Pin H1 | SDA1 — I2C1 data |
| Pin H2 | SCL1 — I2C1 clock |
| Pin J1 | SDI1 — SPI1 data in |
| Pin J2 | SDO1 — SPI1 data out |
| Pin K1 | USB+ — USB D+ differential pair |
| Pin K2 | USB- — USB D- differential pair |
| Pin L1 | RB0 — I/O port RB0 |
| Pin L2 | RB1 — I/O port RB1 |
| Pin M1 | RC0 — I/O port RC0 |
| Pin M2 | RC1 — I/O port RC1 |
| Pin N1 | RD0 — I/O port RD0 |
| Pin N2 | RD1 — I/O port RD1 |
| Pin P1 | RE0 — I/O port RE0 |
| Pin P2 | RE1 — I/O port RE1 |
| Pin R1 | RF0 — I/O port RF0 |
| Pin R2 | RF1 — I/O port RF1 |
| Pin T1 | RG0 — I/O port RG0 |
| Pin T2 | RG1 — I/O port RG1 |
| Pin U1 | RH0 — I/O port RH0 |
| Pin U2 | RH1 — I/O port RH1 |
| Pin V1 | RJ0 — I/O port RJ0 |
| Pin V2 | RJ1 — I/O port RJ1 |
| Pin W1 | RK0 — I/O port RK0 |
| Pin W2 | RK1 — I/O port RK1 |
| Pin Y1 | RL0 — I/O port RL0 |
| Pin Y2 | RL1 — I/O port RL1 |
Typische Anwendungen
PIC32MZ2048EFH100-E/GJX ist geeignet für 6 Anwendungs: Industrial HMI with TFT Touch Panel, IoT Edge Gateway with Ethernet + Wi-Fi Bridging, Automotive Body and Infotainment Subsystems, Motor Control (FOC and Servo Drive), USB Audio and MIDI Devices, Connected Medical Instrumentation.
Industrial HMI with TFT Touch Panel
The PIC32MZ2048EFH100-E/GJX is purpose-built for industrial HMI control panels combining a 2D GPU with TFT controller, 512 KB SRAM for frame buffers, and 2 MB Flash for asset graphics. The integrated GPU offloads alpha-blending, line draw, and bitmap fill, freeing the 200 MHz MIPS core for touch processing and EtherCAT or Modbus TCP networking. AEC-Q100 Grade 1 reliability plus the -40C to +125C range allow under-cabinet or outdoor-kiosk mounting, where reliability through thermal cycling is mandatory.
Empfohlen
IoT Edge Gateway with Ethernet + Wi-Fi Bridging
For IoT edge gateways aggregating wired industrial protocols and a Wi-Fi/BLE co-processor, the PIC32MZ2048EFH100-E/GJX provides 10/100 Ethernet MAC, dual CAN 2.0b, six UARTs, and Hi-Speed USB to host a cellular or sub-GHz module. Live-Update dual-bank Flash lets a system push a signed firmware image to the inactive bank and reboot atomically - critical for always-on gateways where bricking would require truck rolls. The 8-channel DMA engine keeps Ethernet throughput steady while the FPU handles TLS handshake math.
Empfohlen
Automotive Body and Infotainment Subsystems
AEC-Q100 Grade 1 qualification makes the PIC32MZ2048EFH100-E/GJX suited for body controllers, HVAC panels, instrument clusters, and entry-level infotainment where MIPS performance drives LCD graphics and CAN networking. Dual CAN 2.0b controllers enable gateway duties between body CAN and chassis CAN, while Hi-Speed USB OTG supports CarPlay/AndroidAuto bridging dongles or wired media stack updates. Operating up to +125C, the part tolerates under-dash thermal exposure.
Empfohlen
Motor Control (FOC and Servo Drive)
The 16-bit PWM with complementary outputs and dead-band generation plus 12-bit 18 Msps ADC on the PIC32MZ2048EFH100-E/GJX supports field-oriented control (FOC) for PMSM, BLDC, and AC induction drives. The FPU accelerates Park/Clarke transforms at 200 MHz, sustaining high RPM control loops. Live-Update Flash enables safe parameter-set OTA on industrial servo drives without halting the production line, and AEC-Q100 qualification permits automotive traction or pump applications.
Empfohlen
USB Audio and MIDI Devices
Hi-Speed USB 2.0 OTG with dedicated DMA on the PIC32MZ2048EFH100-E/GJX drives multi-channel USB Audio Class 2.0 streaming at 24-bit/192 kHz while the FPU handles biquad filters and reverb DSP. SQI lets designers attach a low-pin-count serial Flash for additional sound-bank storage. With 512 KB SRAM, you can implement ping-pong buffering for ASIO low-latency interfaces without dropping samples, and AEC-Q100 reliability supports pro-audio rack gear.
Empfohlen
Connected Medical Instrumentation
The PIC32MZ2048EFH100-E/GJX powers connected medical instruments such as patient monitors, infusion pumps, and point-of-care diagnostics, where reliability, long-term supply, and OTAs are mandatory. Its 2 MB Live-Update Flash supports regulatory-safe firmware updates, and the FPU accelerates ECG/EEG digital filtering in real time. Hi-Speed USB and Ethernet simplify EMR connectivity, while the AEC-Q100 Grade 1 silicon process (sourced from Microchip's automotive flow) provides extended longevity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2048EFH100-E/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2048EFH100-I/GJX | PIC32MZ2048EFH100T-E/GJX | PIC32MZ2048EFH100-250I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ2048EFM100-I/GJX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-ball TFBGA (GJX) 7x7 mm | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same | 100-ball TFBGA (GJX) 7x7 mm - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 252 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB Live-Update | 2 MB Live-Update | 2 MB Live-Update | 2 MB Live-Update | 1 MB Live-Update | 2 MB Live-Update |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| AEC-Q100 Qualified | Yes (E grade) | Not qualified (Industrial grade) | Yes (E grade) | Not qualified (Industrial grade) | Yes (E grade) | Not qualified (Industrial grade) |
| Ethernet + USB | 10/100 MAC + Hi-Speed USB OTG | 10/100 MAC + Hi-Speed USB OTG | 10/100 MAC + Hi-Speed USB OTG | 10/100 MAC + Hi-Speed USB OTG | 10/100 MAC + Hi-Speed USB OTG | No Ethernet + Hi-Speed USB OTG |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 Grade 1 qualified with extended -40C to +125C temperature range (vs. PIC32MZ2048EFH100-I/GJX)
- Full Ethernet + dual CAN + Hi-Speed USB peripheral set (vs. PIC32MZ2048EFM100-I/GJX)
- Live-Update dual-bank 2 MB Flash for safe OTA (vs. PIC32MZ1024EFH100-E/GJX)
Designhinweise
Escape the 100-ball TFBGA with at least 6 PCB layers (4 layers possible but route-limited). Place a continuous solid ground plane directly under the BGA to provide a low-impedance reference and thermal spreader. Fan-out each ball to the next inner layer using 0.1 mm via-in-pad microvias with filled and plated-over copper caps to avoid solder voids. Keep high-speed USB and Ethernet differential pair traces within 0.15 mm of nominal impedance and skew-matched within 150 mil.
Decouple each VDD/AVDD/VBUS ball pair with a 100 nF 0402 ceramic plus a 4.7 uF X5R bulk capacitor placed within 3 mm of the package balls. Separate analog and digital ground planes, joining them in a single star near the LDO. For USB, add a 10 uF bulk on VBUS plus an ESD protection diode array (USBLC6-2SC6 or equivalent). Estimated: at 200 MHz active, peak core current is ~150 mA, so the LDO must deliver at least 200 mA with <20 mV ripple.
Do not assume the PIC32MZ2048EFH100 can be programmed via any PGECx/PGEDx pair independently - the PIC32MZ EF family datasheet specifies that PGEC2 and PGED2 must be used as a paired set if either is selected for ICSP. Miswiring causes failed programming without diagnostic feedback. Also verify the Live-Update Flash boot mode strap pins (TRCLK/RCON) at reset, since leaving them floating can prevent bootloader handover.
Estimated: at 200 MHz with all peripherals active, core power is roughly 0.9 W, while the 100-ball TFBGA has a typical theta_JA of ~30 C/W on a 4-layer JEDEC test board. Junction temperature rise is ~27 C above ambient at full load; at +125C ambient the junction reaches ~152 C, exceeding the 150 C operating ceiling. For continuous +125C ambient operation, place the part on a 6+ layer board with stitched thermal via array under the BGA exposed pad.
Compliance-Informationen
E temperature grade (Extended) on the PIC32MZ2048EFH100 is AEC-Q100 Grade 1 qualified by Microchip. RoHS and lead-free per Microchip product page.
