PIC32MZ2064DAB169-I/HF - 32-bit 200MHz PIC32MZ DA MCU 169-LFBGA | Microchip
Teilenummer: PIC32MZ2064DAB169-I/HF ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.58 | $32,58 |
| 10 | $29.95 | $299,50 |
| 100 | $26.5 | $2.650,00 |
| 500 | $23.1 | $11.550,00 |
| 1.000 | $19.95 | $19.950,00 |
PIC32MZ2064DAB169-I/HF Übersicht
A PIC microcontroller (MCU) is a single-chip computer that integrates a CPU core, Flash program memory, SRAM data memory, and a rich peripheral set on a single CMOS die. The PIC32MZ DA family extends traditional MCU simplicity toward MPU-like performance: the MIPS32 microAptiv core executes 32-bit instructions, microMIPS compressed code (up to 35% smaller), and DSP extensions, all behind an MMU. This hierarchy is what allows PIC32 to render as a microcontroller (MCU) -> 32-bit MCU -> MIPS-based MCU -> application-processor class MCU -> embedded SoC, bridging the gap between classic 8-bit PIC microcontrollers and full MPUs.
Key features include 200 MHz CPU with 16 KB I-cache and 4 KB D-cache, 2 MB dual-panel Flash supporting live firmware updates without downtime, 640 KB SRAM with optional 32 MB or 128 MB external DDR2 expansion, an integrated 12-bit 18 MSPS 45-channel ADC, multiple CAN, USB, and Ethernet peripherals, and a graphics LCD controller optimized for GUI applications. The 169-LFBGA package exposes the full peripheral set, including up to 8 UARTs, multiple I2C/SPI, and parallel buses.
Architecturally, the PIC32MZ2064DAB169 uses a superscalar microAptiv core with hardware multiply/divide, single-cycle MAC, and a tightly-coupled prefetch buffer; dual-panel Flash effectively doubles the Flash addressable space by alternating active/update panels, which is critical for safety and OTA scenarios. The integrated MMU and 640 KB SRAM make it suitable for embedded Linux-class workloads and high-bandwidth GUI rendering.
Typical applications include industrial HMI/GUI displays, multi-protocol industrial automation controllers, automotive infotainment clusters, smart energy meter gateways, and high-end medical patient-monitoring displays. The wide peripheral mix (CAN + USB + Ethernet + LCD) consolidates what would otherwise be a 2-chip design into one MCU.
Designers should plan for an external 1.8 V core regulator and a 3.3 V I/O rail; the DDR2 interface (when used) requires controlled-impedance PCB traces and matched-length routing. Live-update firmware design should leverage the dual-panel Flash feature, but designers should plan to switch to the PIC32MZ2064DAL169 for new designs as the B169 variant is being phased toward the lower-cost L169 successor.
This page consolidates real-time distributor stock, web datasheets, drop-in alternatives, and engineering design notes that go beyond what is printed in the Microchip datasheet alone, including a same-package drop-in cross-reference and pinout diagram.
Drop-in-Alternativen für PIC32MZ2064DAB169-I/HF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2064DAB169-I/HF (gleiche Bauform und Footprint) – abweichend in Graphics Controller, Operating Temperature, ADC, Package, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2064DAL169-I/HF
✅ Drop-In✓ Auf Lager
$10.45 / Stück
Datenblatt ansehen →PIC32MZ2064DAA169-I/HF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ2064DAK169-I/HF
✅ Drop-In✓ Auf Lager
$12.8 / Stück
Datenblatt ansehen →PIC32MZ1064DAB169-I/HF
✅ Drop-In✓ Auf Lager
$12.4 / Stück
Datenblatt ansehen →PIC32MZ2064DAB169-I/HF Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 microAptiv (32-bit) |
| Maximum CPU Frequency | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Dual-Panel Flash | Yes (live-update support) |
| ADC | 12-bit, 18 MSPS, 45 channels |
| Memory Management Unit | Yes (MMU) |
| microMISA Mode | Yes (up to 35% code compression) |
| External Memory Bus | DDR2 (32 MB or 128 MB addressable) |
| Operating Voltage | 1.7 V min, 1.8 V typical, 1.9 V max |
| Betriebstemperatur | -40C to +85C (industrial) |
| Gehäuse | 169-LFBGA (11x11 mm) |
| Montageart | Surface Mount |
| Graphics LCD Controller | Yes (integrated) |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
PIC32MZ2064DAB169-I/HF 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ2064DAB169-I/HF (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ2064DAB169-I/HF.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ2064DAB169-I/HF ist geeignet für 6 Anwendungs: Industrial HMI / GUI Display, Automotive Infotainment Cluster, Multi-Protocol Industrial Gateway, Smart Energy Meter Gateway, Medical Patient-Monitoring Display, Point-of-Sale (POS) Terminal.
Industrial HMI / GUI Display
The PIC32MZ2064DAB169's 200 MHz microAptiv core, integrated graphics LCD controller, and 640 KB SRAM make it ideal for driving industrial HMI panels up to WVGA resolution. With 2 MB Flash the part stores large multilingual GUIs and asset libraries, while the 12-bit 18 MSPS ADC handles backlight control and analog sensor input. The integrated MMU plus optional 32/128 MB external DDR2 expansion support emWin, Microchip Graphics Library, or a lightweight embedded GUI stack on a single chip, eliminating the need for a separate MPU.
Empfohlen
Automotive Infotainment Cluster
With dual-panel Flash supporting OTA updates and a 32-bit 200 MHz core for real-time graphics, the 169-LFBGA PIC32MZ2064DAB169 is well suited for low-end automotive infotainment clusters. Its 169-LFBGA (11x11) footprint fits behind the LCD module while the CAN, USB, and Ethernet peripherals interface directly with body controllers and head units. Designers should note the B169 is being phased toward the L169 successor; new programs are encouraged to migrate now to ease long-term supply.
Empfohlen
Multi-Protocol Industrial Gateway
The PIC32MZ2064DAB169 integrates CAN, USB, Ethernet, UART, I2C, and SPI peripherals on a single die, enabling it to consolidate multi-protocol industrial gateways without external PHY or controller chips. The 640 KB SRAM plus optional 128 MB DDR2 expansion provides the buffer depth for protocol translation stacks (Modbus, EtherCAT, PROFINET bridges). The wide 1.7-1.9 V core supply tolerance tolerates noisy industrial 24 V-derived rails when paired with a Microchip MCP16311 or equivalent buck regulator.
Empfohlen
Smart Energy Meter Gateway
The PIC32MZ2064DAB169's 45-channel 12-bit 18 MSPS ADC and Ethernet/USB-HOST/USB-OTG peripheral set enable it to aggregate multiple smart-meter inputs and bridge them to a backhaul network. The 2 MB dual-panel Flash supports secure OTA firmware updates mandated by utility-grade metering standards, while the MMU enables TLS/IP stacks with proper memory isolation. Operating from -40C to +85C and supplied in 169-LFBGA, it meets the environmental and mechanical envelope of utility cabinet deployments.
Empfohlen
Medical Patient-Monitoring Display
With 640 KB SRAM, an integrated graphics LCD controller, and a 12-bit 18 MSPS 45-channel ADC, the PIC32MZ2064DAB169 can run a multi-parameter patient monitor display on a single chip. The MIPS32 microAptiv DSP extensions enable on-chip FFT/SpO2 algorithms without external DSP, while the DDR2 expansion allows larger waveform buffers. Designers should validate IEC 60601 EMI/EMC margins at the PCB level and leverage the dual-panel Flash for safe clinical firmware rollouts.
Empfohlen
Point-of-Sale (POS) Terminal
The PIC32MZ2064DAB169's peripheral mix (USB host/device, Ethernet, UARTs, I2C, SPI) covers everything a compact POS terminal needs to drive a touchscreen, a thermal printer, a card reader, and a network uplink. The 200 MHz MIPS32 microAptiv core runs GUI stacks plus TLS for payment processing, while the 2 MB Flash stores localized strings and asset files. The integrated graphics controller avoids a discrete LCD controller chip, keeping the BOM small.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2064DAB169-I/HF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2064DAL169-I/HF | PIC32MZ2064DAA169-I/HF | PIC32MZ2064DAK169-I/HF | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Dual-Panel Flash | Yes | Yes | Yes | Yes | Yes |
| Recommended Status | Mature (recommended to migrate to L169) | Recommended for new designs | Active | Recommended for future designs | Active, lower Flash |
Wichtigste Unterscheidungsmerkmale
- Recommended drop-in successor available in the same footprint (vs. PIC32MZ2064DAL169-I/HF)
- Dual-panel Flash for live OTA updates (vs. PIC32MZ1064DAB169-I/HF)
- Microchip-unique MIPS32 microAptiv core with microMIPS (vs. PIC32MZ2064DAA169-I/HF)
Designhinweise
The PIC32MZ2064DAB169 requires a 1.8 V core supply (1.7-1.9 V tolerance) plus a 3.3 V I/O rail. Use a low-noise Microchip MCP16311 buck regulator for the 1.8 V rail, and an MCP1702 or equivalent LDO for the 3.3 V rail. Decoupling: 100 nF + 10 uF ceramic on each power pin pair. Place the 1.8 V regulator physically close to the core pins to minimize IR drop on the BGA power balls.
The 169-LFBGA package exposes the die to the ball grid; thermal dissipation is through the inner balls and PCB copper. At 200 MHz full-load, expect roughly 0.5-1 W device consumption; provide at least 4 thermal via arrays under the BGA center for heat transfer to inner copper layers. Avoid placing the LFBGA on a single-layer PCB; a minimum 4-layer stack-up with a solid ground plane is strongly recommended.
Microchip recommends a 4-layer PCB with controlled-impedance traces for the DDR2 interface (when used). Matched-length routing is required for DDR2 DQ/DQS/CLK groups; use the Microchip IBIS models and DDR2 layout checklist from the PIC32MZ DA family datasheet. Leave at least 6 mil trace-to-pad clearance on BGA breakouts and use laser-drilled microvias for the inner rows.
Microchip is phasing the PIC32MZ2064DAB169 toward the PIC32MZ2064DAL169; new programs should migrate to the L169 variant to avoid long-term supply risk. Per the Microchip product page, B169 is being replaced; do not start new designs on B169 without a migration plan. Verify the dual-panel Flash firmware-update procedure before committing to OTA use; mis-coordination between panels can brick the device.
Compliance-Informationen
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is an industrial-grade MCU. Industrial -40C to +85C operating range. LFBGA package - follow Microchip PCB layout checklist for BGA breakouts and DDR2 routing.