PIC32MZ2064DAB169-I/HF - 32-bit 200MHz PIC32MZ DA MCU 169-LFBGA | Microchip
부품 번호: PIC32MZ2064DAB169-I/HF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.58 | $32.58 |
| 10 | $29.95 | $299.50 |
| 100 | $26.5 | $2,650.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $19.95 | $19,950.00 |
PIC32MZ2064DAB169-I/HF 개요
A PIC microcontroller (MCU) is a single-chip computer that integrates a CPU core, Flash program memory, SRAM data memory, and a rich peripheral set on a single CMOS die. The PIC32MZ DA family extends traditional MCU simplicity toward MPU-like performance: the MIPS32 microAptiv core executes 32-bit instructions, microMIPS compressed code (up to 35% smaller), and DSP extensions, all behind an MMU. This hierarchy is what allows PIC32 to render as a microcontroller (MCU) -> 32-bit MCU -> MIPS-based MCU -> application-processor class MCU -> embedded SoC, bridging the gap between classic 8-bit PIC microcontrollers and full MPUs.
Key features include 200 MHz CPU with 16 KB I-cache and 4 KB D-cache, 2 MB dual-panel Flash supporting live firmware updates without downtime, 640 KB SRAM with optional 32 MB or 128 MB external DDR2 expansion, an integrated 12-bit 18 MSPS 45-channel ADC, multiple CAN, USB, and Ethernet peripherals, and a graphics LCD controller optimized for GUI applications. The 169-LFBGA package exposes the full peripheral set, including up to 8 UARTs, multiple I2C/SPI, and parallel buses.
Architecturally, the PIC32MZ2064DAB169 uses a superscalar microAptiv core with hardware multiply/divide, single-cycle MAC, and a tightly-coupled prefetch buffer; dual-panel Flash effectively doubles the Flash addressable space by alternating active/update panels, which is critical for safety and OTA scenarios. The integrated MMU and 640 KB SRAM make it suitable for embedded Linux-class workloads and high-bandwidth GUI rendering.
Typical applications include industrial HMI/GUI displays, multi-protocol industrial automation controllers, automotive infotainment clusters, smart energy meter gateways, and high-end medical patient-monitoring displays. The wide peripheral mix (CAN + USB + Ethernet + LCD) consolidates what would otherwise be a 2-chip design into one MCU.
Designers should plan for an external 1.8 V core regulator and a 3.3 V I/O rail; the DDR2 interface (when used) requires controlled-impedance PCB traces and matched-length routing. Live-update firmware design should leverage the dual-panel Flash feature, but designers should plan to switch to the PIC32MZ2064DAL169 for new designs as the B169 variant is being phased toward the lower-cost L169 successor.
This page consolidates real-time distributor stock, web datasheets, drop-in alternatives, and engineering design notes that go beyond what is printed in the Microchip datasheet alone, including a same-package drop-in cross-reference and pinout diagram.
드롭인 대체품: PIC32MZ2064DAB169-I/HF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2064DAB169-I/HF (동일 폼 팩터 및 풋프린트) — 차이점: Graphics Controller, Operating Temperature, ADC, Package, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ2064DAL169-I/HF
✅ 드롭인✓ 재고 있음
$10.45 / 개
데이터시트 보기 →PIC32MZ2064DAA169-I/HF
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ2064DAK169-I/HF
✅ 드롭인✓ 재고 있음
$12.8 / 개
데이터시트 보기 →PIC32MZ1064DAB169-I/HF
✅ 드롭인✓ 재고 있음
$12.4 / 개
데이터시트 보기 →PIC32MZ2064DAB169-I/HF 최대 정격 & 전기적 특성
| Core | MIPS32 microAptiv (32-bit) |
| Maximum CPU Frequency | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Dual-Panel Flash | Yes (live-update support) |
| ADC | 12-bit, 18 MSPS, 45 channels |
| Memory Management Unit | Yes (MMU) |
| microMISA Mode | Yes (up to 35% code compression) |
| External Memory Bus | DDR2 (32 MB or 128 MB addressable) |
| Operating Voltage | 1.7 V min, 1.8 V typical, 1.9 V max |
| 동작 온도 | -40C to +85C (industrial) |
| 패키지 | 169-LFBGA (11x11 mm) |
| 실장 유형 | Surface Mount |
| Graphics LCD Controller | Yes (integrated) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
PIC32MZ2064DAB169-I/HF 169-lfbga (11x11 mm) 핀 구성 가이드
PIC32MZ2064DAB169-I/HF(169-lfbga (11x11 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ2064DAB169-I/HF.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ2064DAB169-I/HF 적합 용도: 6 애플리케이션s: Industrial HMI / GUI Display, Automotive Infotainment Cluster, Multi-Protocol Industrial Gateway, Smart Energy Meter Gateway, Medical Patient-Monitoring Display, Point-of-Sale (POS) Terminal.
Industrial HMI / GUI Display
The PIC32MZ2064DAB169's 200 MHz microAptiv core, integrated graphics LCD controller, and 640 KB SRAM make it ideal for driving industrial HMI panels up to WVGA resolution. With 2 MB Flash the part stores large multilingual GUIs and asset libraries, while the 12-bit 18 MSPS ADC handles backlight control and analog sensor input. The integrated MMU plus optional 32/128 MB external DDR2 expansion support emWin, Microchip Graphics Library, or a lightweight embedded GUI stack on a single chip, eliminating the need for a separate MPU.
추천
Automotive Infotainment Cluster
With dual-panel Flash supporting OTA updates and a 32-bit 200 MHz core for real-time graphics, the 169-LFBGA PIC32MZ2064DAB169 is well suited for low-end automotive infotainment clusters. Its 169-LFBGA (11x11) footprint fits behind the LCD module while the CAN, USB, and Ethernet peripherals interface directly with body controllers and head units. Designers should note the B169 is being phased toward the L169 successor; new programs are encouraged to migrate now to ease long-term supply.
추천
Multi-Protocol Industrial Gateway
The PIC32MZ2064DAB169 integrates CAN, USB, Ethernet, UART, I2C, and SPI peripherals on a single die, enabling it to consolidate multi-protocol industrial gateways without external PHY or controller chips. The 640 KB SRAM plus optional 128 MB DDR2 expansion provides the buffer depth for protocol translation stacks (Modbus, EtherCAT, PROFINET bridges). The wide 1.7-1.9 V core supply tolerance tolerates noisy industrial 24 V-derived rails when paired with a Microchip MCP16311 or equivalent buck regulator.
추천
Smart Energy Meter Gateway
The PIC32MZ2064DAB169's 45-channel 12-bit 18 MSPS ADC and Ethernet/USB-HOST/USB-OTG peripheral set enable it to aggregate multiple smart-meter inputs and bridge them to a backhaul network. The 2 MB dual-panel Flash supports secure OTA firmware updates mandated by utility-grade metering standards, while the MMU enables TLS/IP stacks with proper memory isolation. Operating from -40C to +85C and supplied in 169-LFBGA, it meets the environmental and mechanical envelope of utility cabinet deployments.
추천
Medical Patient-Monitoring Display
With 640 KB SRAM, an integrated graphics LCD controller, and a 12-bit 18 MSPS 45-channel ADC, the PIC32MZ2064DAB169 can run a multi-parameter patient monitor display on a single chip. The MIPS32 microAptiv DSP extensions enable on-chip FFT/SpO2 algorithms without external DSP, while the DDR2 expansion allows larger waveform buffers. Designers should validate IEC 60601 EMI/EMC margins at the PCB level and leverage the dual-panel Flash for safe clinical firmware rollouts.
추천
Point-of-Sale (POS) Terminal
The PIC32MZ2064DAB169's peripheral mix (USB host/device, Ethernet, UARTs, I2C, SPI) covers everything a compact POS terminal needs to drive a touchscreen, a thermal printer, a card reader, and a network uplink. The 200 MHz MIPS32 microAptiv core runs GUI stacks plus TLS for payment processing, while the 2 MB Flash stores localized strings and asset files. The integrated graphics controller avoids a discrete LCD controller chip, keeping the BOM small.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2064DAB169-I/HF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ2064DAL169-I/HF | PIC32MZ2064DAA169-I/HF | PIC32MZ2064DAK169-I/HF | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Dual-Panel Flash | Yes | Yes | Yes | Yes | Yes |
| Recommended Status | Mature (recommended to migrate to L169) | Recommended for new designs | Active | Recommended for future designs | Active, lower Flash |
주요 차별점
- Recommended drop-in successor available in the same footprint (vs PIC32MZ2064DAL169-I/HF)
- Dual-panel Flash for live OTA updates (vs PIC32MZ1064DAB169-I/HF)
- Microchip-unique MIPS32 microAptiv core with microMIPS (vs PIC32MZ2064DAA169-I/HF)
설계 노트
The PIC32MZ2064DAB169 requires a 1.8 V core supply (1.7-1.9 V tolerance) plus a 3.3 V I/O rail. Use a low-noise Microchip MCP16311 buck regulator for the 1.8 V rail, and an MCP1702 or equivalent LDO for the 3.3 V rail. Decoupling: 100 nF + 10 uF ceramic on each power pin pair. Place the 1.8 V regulator physically close to the core pins to minimize IR drop on the BGA power balls.
The 169-LFBGA package exposes the die to the ball grid; thermal dissipation is through the inner balls and PCB copper. At 200 MHz full-load, expect roughly 0.5-1 W device consumption; provide at least 4 thermal via arrays under the BGA center for heat transfer to inner copper layers. Avoid placing the LFBGA on a single-layer PCB; a minimum 4-layer stack-up with a solid ground plane is strongly recommended.
Microchip recommends a 4-layer PCB with controlled-impedance traces for the DDR2 interface (when used). Matched-length routing is required for DDR2 DQ/DQS/CLK groups; use the Microchip IBIS models and DDR2 layout checklist from the PIC32MZ DA family datasheet. Leave at least 6 mil trace-to-pad clearance on BGA breakouts and use laser-drilled microvias for the inner rows.
Microchip is phasing the PIC32MZ2064DAB169 toward the PIC32MZ2064DAL169; new programs should migrate to the L169 variant to avoid long-term supply risk. Per the Microchip product page, B169 is being replaced; do not start new designs on B169 without a migration plan. Verify the dual-panel Flash firmware-update procedure before committing to OTA use; mis-coordination between panels can brick the device.
규정 준수 정보
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is an industrial-grade MCU. Industrial -40C to +85C operating range. LFBGA package - follow Microchip PCB layout checklist for BGA breakouts and DDR2 routing.