R7F7016493AFP-C#BA1 - RH850/F1KM-S4 240MHz 4MB MCU | Renesas
Teilenummer: R7F7016493AFP-C#BA1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $17.57 | $17,57 |
| 10 | $15.8 | $158,00 |
| 100 | $13.95 | $1.395,00 |
| 500 | $12.4 | $6.200,00 |
| 1.000 | $11.05 | $11.050,00 |
R7F7016493AFP-C#BA1 Übersicht
A 32-bit MCU (microcontroller) is a single-chip processor that integrates CPU core, volatile and non-volatile memory, peripherals, and analog interfaces on one die. The RH850 family is Renesas' mainstream automotive-grade 32-bit architecture built around a Harvard-style RISC core with hardware-assisted safety features. Within the family hierarchy, the RH850/F1KM-S4 sits under RH850/F1K -> RH850/F1x -> RH850 -> Renesas 32-bit automotive MCU. Compared with consumer-grade ARM Cortex-M MCUs, RH850 devices emphasize functional safety (lockstep, ECC, MPU) and automotive qualification to AEC-Q100.
Key features include a 240 MHz core, 4 MB Flash with background operation support, 12-bit ADC, multiple CAN-FD controllers, LIN/UART/SPI/I2C, PWM timers for motor control, and integrated safety mechanisms such as ECC on Flash/SRAM, watchdog timers, and a memory protection unit. The wide supply range 3.0 V to 5.5 V makes it tolerant of automotive 12 V battery transients when paired with a system-basis chip.
Architecturally, the RH850/F1KM-S4 uses the RH850G3KH core with variable-length instructions, dedicated DSP extensions, and a low-latency interrupt controller. The 4 MB Flash uses dual-bank layout to support in-field firmware updates without downtime. The 176-pin LFQFP exposes the full peripheral set including up to 6 CAN channels, multiple SENT interfaces, and motor-control PWMs.
Typical applications include automotive body control modules (BCM), power sliding doors, tailgate/liftgate controllers, seat control units, and electric power steering (EPS) peripherals. It is also used in HVAC blowers and lighting ECUs where real-time deterministic control and AEC-Q100 qualification are required.
When designing with this part, budget enough PCB area for the 176-pin LFQFP and route all decoupling capacitors close to VDD/VSS pairs. Plan firmware size with headroom for OTA-capable dual-bank operation and reserve one CAN-FD channel for diagnostics.
This page synthesizes distributor availability across Mouser, DigiKey, Octopart, and LCSC, plus a Renesas cross-reference result and a comparison with other RH850/F1KM members, to help sourcing engineers quickly qualify substitutes and confirm pin/pin replacements.
Drop-in-Alternativen für R7F7016493AFP-C#BA1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit R7F7016493AFP-C#BA1 (gleiche Bauform und Footprint) – abweichend in ADC, Package, Mounting Type, Communication Interfaces, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
R7F7016493AFP-C#KA1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R7F7017093AFP-C#BA1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R5F56318CDFP#V0
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$16.0781 / Stück
Datenblatt ansehen →R5F5631BCDFP
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.05 / Stück
Datenblatt ansehen →R7F7016493AFP-C#BA1
✅ Drop-In✓ Auf Lager
$11.05 / Stück
Datenblatt ansehen →R7F7016493AFP-C#BA1 Grenzwerte & elektrische Eigenschaften
| Core Architecture | RH850G3KH (RH850 RISC) |
| Product Family | RH850/F1KM-S4 |
| CPU Width | 32-bit |
| Core Count | Single-core |
| Maximale Taktfrequenz | 240 MHz |
| Program Memory | 4 MB Flash (4M x 8) |
| Supply Voltage Range | 3.0 V to 5.5 V |
| Betriebstemperaturbereich | -40 C to +105 C |
| Gehäuse | 176-LFQFP |
| Montageart | Surface Mount |
| Anzahl der Pins | 176 |
| Package Series | LFQFP (QFP) |
| ADC | 12-bit (integrated) |
| CAN Channels | Multiple CAN / CAN-FD controllers |
| Communication Interfaces | UART, SPI, I2C, LIN, SENT |
| RoHS-Status | Compliant |
| Lead Free | Yes |
| Application Domain | Automotive body and chassis ECUs |
R7F7016493AFP-C#BA1 lfqfp (qfp) Pinbelegungsleitfaden
Pinbelegung für R7F7016493AFP-C#BA1 (lfqfp (qfp)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für R7F7016493AFP-C#BA1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
R7F7016493AFP-C#BA1 ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Power Liftgate / Sliding Door Controller, Seat Control Unit, HVAC Blower and Damper ECU, Automotive Lighting ECU, Chassis Sensor Cluster / EPS Peripheral.
Automotive Body Control Module (BCM)
The R7F7016493AFP-C#BA1's 240 MHz core and multi-channel CAN-FD controllers make it ideal for body control modules that aggregate door, lighting, wiper, and access functions. Its AEC-Q100 Grade 2 rating at +105 C meets engine-bay-adjacent placement requirements, and 4 MB Flash holds the full LIN/CAN gateway stack plus diagnostics. The 176-LFQFP exposes enough GPIO for digital switch inputs, PWM-driven LED matrices, and external power-MOSFET gate drivers.
Empfohlen
Power Liftgate / Sliding Door Controller
In liftgate and sliding-door ECUs the R7F7016493AFP-C#BA1 drives multiple brush or stepper motors while reading Hall sensors, anti-pinch switches, and CAN-FD commands. The 12-bit ADC sample rate and dedicated motor-control PWM timers handle the closed-loop spindle control required by anti-pinch regulations, and the 4 MB Flash stores LUTs for damping curves. The +105 C ambient rating is essential because the controller often lives next to the motor housing.
Empfohlen
Seat Control Unit
The 176-pin LFQFP version of the R7F7016493AFP-C#BA1 supports a seat module's mix of CAN-FD, LIN, and switch-scan I/O plus memory for occupant position profiles. Designers use the device's encoder interfaces for seat-rail Hall sensors and its PWM channels to drive pneumatic or motorized lumbar pumps. Flash ECC plus watchdog timers satisfy ISO 26262 ASIL-B hardware elements in the seat-adjustment path.
Empfohlen
HVAC Blower and Damper ECU
HVAC modules benefit from the R7F7016493AFP-C#BA1's deterministic RH850 interrupt latency, which keeps blower PWM phase-locked to the cabin temperature control loop. With LIN transceivers integrated indirectly through external PHY, the MCU can also serve rear-seat climate nodes. The 240 MHz headroom plus 4 MB Flash stores adaptive climate-control algorithms and OTA-capable dual-bank firmware images.
Empfohlen
Automotive Lighting ECU
LED matrix and adaptive headlamp ECUs leverage the R7F7016493AFP-C#BA1's high-resolution PWM timers and CAN-FD bandwidth to drive thousands of LEDs with per-pixel diagnostics. The 176-pin LFQFP package exposes sufficient pins for separate matrix segments and the device's operational -40 C to +105 C supports headlamp modules that see direct engine-bay heat. AEC-Q100 plus ECC on Flash/SRAM is mandatory because these ECUs run functional-safety diagnostics.
Empfohlen
Chassis Sensor Cluster / EPS Peripheral
Although not a primary EPS microcontroller, the R7F7016493AFP-C#BA1 fits as a chassis sensor cluster, CAN-FD aggregator, and steering-angle-sensor interface in distributed EPS architectures. Its +105 C ambient rating and CAN-FD bandwidth handle the high-rate sensor data fusion required for ADAS perception hints. Flash ECC plus dual-bank update enable ASIL-C software workflows.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für R7F7016493AFP-C#BA1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | R7F7016493AFP-C#KA1 | R7F7017093AFP-C#BA1 | R5F56318CDFP#V0 | R5F5631BCDFP |
|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFQFP | 176-LFQFP - same | 176-LFQFP - same | 176-LFQFP - same | 176-LFQFP - same |
| Core Architecture | RH850G3KH | RH850G3KH | RH850G3KH | RXv2 | RXv1 (RX63N) |
| Maximum Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 100 MHz |
| Supply Voltage | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Automotive Qualification | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 | Not AEC-Q100 | Not AEC-Q100 |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C | -40 C to +85 C |
Wichtigste Unterscheidungsmerkmale
- 240 MHz RH850G3KH core with 4 MB Flash for body ECU scale (vs. R5F5631BCDFP)
- AEC-Q100 Grade 2 qualification with RH850 functional-safety hooks (vs. R5F56318CDFP#V0)
- Same-die family extension with identical pin map (vs. R7F7017093AFP-C#BA1)
Designhinweise
Route at least 10 uF bulk + 100 nF high-frequency ceramic pairs for each VDD/VSS pair on the R7F7016493AFP-C#BA1, keeping trace length below 3 mm to suppress the RH850 core's instantaneous current steps. The 5 V rail must come from an automotive-qualified LDO or PMIC tolerating load-dump up to 40 V. Estimated: with eight GPIO switching at 10 MHz simultaneously, dynamic current can reach 250 mA, so power-trace width should be at least 1.5 mm on outer layers.
The 176-LFQFP package dissipates up to about 1.0 W in continuous operation; with theta_JA near 35 C/W on a four-layer 2 oz board, junction-to-ambient rise is roughly 35 C above ambient. Derate to 80 % of the 240 MHz capability if the device is enclosed with no airflow, and use copper-filled thermal land patterns tied to VSS pins.
Match the 176-LFQFP land pattern 1:1 with the reference design in the RH850/F1KM-S4 hardware manual; pad dimensions of approximately 0.5 mm x 0.3 mm with 0.1 mm solder-mask dams are recommended. Place all decoupling capacitors within one ball-pitch of their respective VDD pins and avoid routing high-speed signals under the package body to preserve signal integrity.
Failing to strap the mode-select pins to the correct logic level causes the R7F7016493AFP-C#BA1 to enter serial-programming or boundary-scan modes instead of normal execution; verify each reset bootstrap configuration before connecting battery. Additionally, misconfiguring the Flash access window can introduce wait states that halve execution throughput.
For CAN-FD lines, keep the bus within 30 mm of the MCU and use a 120 ohm differential termination at both ends; add a TVS diode and common-mode choke for automotive transient compliance per IEC 62228-3. Route SENT and LIN away from PWM outputs to minimize coupling into analog sensor inputs, and ground-reference the analog VREF pin to a clean 4.7 uF RC filter.
Compliance-Informationen
AEC-Q100 Grade 2 qualification applies to the RH850/F1KM-S4 group per the Renesas datasheet. Halo: not stated; halogen status unknown in the supplied distributor text and labelled [DATA_NEEDED] where it would otherwise appear in specs.
